JPH0556857B2 - - Google Patents
Info
- Publication number
- JPH0556857B2 JPH0556857B2 JP3341186A JP3341186A JPH0556857B2 JP H0556857 B2 JPH0556857 B2 JP H0556857B2 JP 3341186 A JP3341186 A JP 3341186A JP 3341186 A JP3341186 A JP 3341186A JP H0556857 B2 JPH0556857 B2 JP H0556857B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- value
- voltage
- difference
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 235000012431 wafers Nutrition 0.000 claims description 32
- 239000004065 semiconductor Substances 0.000 claims description 31
- 238000009713 electroplating Methods 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 description 7
- 239000010949 copper Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3341186A JPS62190722A (ja) | 1986-02-17 | 1986-02-17 | 半導体ウエハ−の電気メツキ用電圧モニタ− |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3341186A JPS62190722A (ja) | 1986-02-17 | 1986-02-17 | 半導体ウエハ−の電気メツキ用電圧モニタ− |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62190722A JPS62190722A (ja) | 1987-08-20 |
| JPH0556857B2 true JPH0556857B2 (enExample) | 1993-08-20 |
Family
ID=12385846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3341186A Granted JPS62190722A (ja) | 1986-02-17 | 1986-02-17 | 半導体ウエハ−の電気メツキ用電圧モニタ− |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62190722A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4434013B2 (ja) * | 2002-05-07 | 2010-03-17 | ユニバーシティ オブ サザン カリフォルニア | 適合接触マスクめっきを用いてめっき工程を行っている際に堆積の品質を測定する方法および装置 |
| US10297421B1 (en) | 2003-05-07 | 2019-05-21 | Microfabrica Inc. | Plasma etching of dielectric sacrificial material from reentrant multi-layer metal structures |
| JP4795075B2 (ja) * | 2006-03-31 | 2011-10-19 | 古河電気工業株式会社 | 電気めっき装置 |
-
1986
- 1986-02-17 JP JP3341186A patent/JPS62190722A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62190722A (ja) | 1987-08-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |