JPH0555821A - Microstrip antenna and its manufacture - Google Patents

Abstract

PURPOSE:To reduce the cost of a microstrip antenna by removing the complexity and cost in crease in the manufacture process which are defects in the antenna conventionally manufactured by joining two dielectric bases with each other while positioning them, inserting a feeding pin between them and then connecting by soldering. CONSTITUTION:A thin conductive layer is vapor-deposited on the inwall of a through-hole 28 penetrated from a radiation patch 20 up to the lower face of the 1st dielectric base 22 to set up the through-hole 28 as the 1st through-hole 29. The 1st land 30 is formed on the peripheral edge of the lower aperture of the 1st through-hole 20, a through-hole 31 penetrated from a center line pattern 26 up to the upper face of the 2nd dielectric base 27 is set up as the 2nd through-hole 32 and the 2nd land 33 is formed on the peripheral edge of the upper aperture of the 2nd through-hole 32.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improved microstrip antenna and a method of manufacturing the same.

[0002]

2. Description of the Related Art A microstrip antenna having characteristics such as small size, light weight, and thin shape is suitable as a mobile antenna used in a communication system in which an artificial satellite is used as a relay station and is mounted on an aircraft or a land mobile vehicle. Further, circularly polarized waves that do not require polarization tracking are suitable for the radio waves used in the communication system, and in order to operate the circularly polarized waves in the microstrip antenna, power is supplied to the radiation patch from two points via a 90 ° hybrid circuit. The most common method is to do so.

FIG. 3 is a cross-sectional view showing the structure of a conventional microstrip antenna. A first dielectric substrate 1 is a radiation patch 2 composed of a conductor pattern such as copper foil formed by etching on both upper and lower surfaces and a first radiation patch 2. The second dielectric substrate 5 has the second ground layer 6 and the line pattern 7 on the upper and lower surfaces, respectively. The line pattern 7 is, for example, the output end of the 90 ° hybrid circuit pattern. Through holes 1a and 5a are formed through the respective dielectric substrates 1 and 5 in the thickness direction, and the first and second substrates 1 and 5 are positioned so that the through holes 1a and 5a communicate with each other. After the ground conductor layer 3 and the second ground conductor layer 6 are joined with a conductive adhesive, the power feeding pin 8 is inserted into the through holes 1a and 5a, and the upper and lower ends of the pin 8 are respectively radiated and the line pattern 7 is formed. And the solder 10 electrically and mechanically.

However, in addition to the complicated manufacturing process of the conventional microstrip antenna, when mounted on an aircraft, cracks easily occur in the solder part due to severe environmental conditions, which is equivalent to soldering work. There is a problem that requires the skill of. Further, this makes it difficult to avoid cost increase.

It is also apparent that the number of manufacturing steps is significantly increased when the conventional microstrip antenna is applied to the array antenna.

[0006]

It is an object of the present invention to complicate the manufacturing process, which is a drawback of a microstrip antenna that is conventionally manufactured by joining two dielectric substrates while aligning them and then inserting a power feed pin for solder connection. It is an object of the present invention to provide a microstrip antenna and a method for manufacturing the same, in which cost reduction and cost reduction are achieved.

[0007]

SUMMARY OF THE INVENTION To achieve the above object, the present invention provides a first dielectric substrate having a radiation patch on the upper surface and a ground conductor layer on the lower surface, and a line pattern on the lower surface having a ground conductor layer. And a second dielectric substrate having the above, and a first through hole penetrating from the radiation patch to the lower surface of the first dielectric substrate in a microstrip antenna in which the respective ground conductor layers are joined to each other. At the same time, a first land is formed on the lower edge of the opening of the first through hole, and a second through hole penetrating from the center line pattern to the upper surface of the second dielectric substrate is formed and the second land is formed. A second land is formed around the upper opening of the through hole, and the ground conductor layer and the first through hole on the lower surface of the first dielectric substrate are connected to the ground on the upper surface of the second dielectric substrate. That allowed to solidify the molten solder to the body layer and the first and second through-holes in communication with the second through hole and each state joined in alignment since the filling has the respective characteristics.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will now be described in detail with reference to the embodiments shown in the accompanying drawings.

1 and 2 are cross-sectional views showing a manufacturing procedure and a completed state of the microstrip antenna according to the present invention. The first embodiment has a radiation patch 20 on the upper surface and a first ground conductor layer 21 on the lower surface. The structure in which the second dielectric substrate 27 having the second ground conductor layer 25 on the upper surface and the center line pattern 26 on the lower surface is bonded to the dielectric substrate 22 is similar to the above conventional example. However, according to the configuration of the present invention, a thin conductor layer is vapor-deposited on the inner wall of the through hole 28 penetrating from the radiation patch 20 to the back surface of the first dielectric substrate 22 (a region where the ground conductor layer 21 does not exist). As a first through hole 29 and a circular first land 30 is formed on the lower edge of the opening of the first through hole 29, and from the center line pattern 26 to the upper surface of the second dielectric substrate 27. Perseverance In that the through-hole 31 to form a second land 33 of the circular upper opening peripheral edge of the second through-hole 32 with a second through hole 32 which is characteristic.

Further, in the present invention, each through hole 2
9 and 32 are aligned so that they are in communication with each other, and then the ground conductor layer 21 and the second conductor are formed on the lower surface of the first dielectric substrate 22.
The ground conductor layer 25 on the upper surface of the dielectric substrate 27 is joined and integrated with a conductive adhesive. At this time, the respective lands 30, 33 are also in close contact with each other, and at this point the radiation patch 20
And the line pattern 26 are electrically connected to each other.
As shown in FIG. 5, a molten solder 35 is poured into the through holes 29 and 32 communicating with each other from above to solidify the molten solder 35, so that a strong joining state can be realized.

The shapes of the lands 30 and 33 do not necessarily have to be circular, and various shapes can be envisioned. However, the lands 30 and 33 have substantially the same shape so that they can be adhered to each other when they are joined. The thickness of each earth conductor layer 21,
The thickness is set equal to 25.

The through holes 29 and 32 are formed in through holes 28 and 31 which are preformed at predetermined positions of the respective substrates when the conductor patterns are formed on both surfaces of the respective dielectric substrates 22 and 27 by vapor deposition or the like. Since it can be formed by applying a conductor simultaneously to the above, there is no fear of increasing the manufacturing process.

As described above, according to the present invention, the connection between the radiation patch and the center line pattern is completed only by pouring the molten solder into the communicating through holes and solidifying the molten solder. This eliminates the need for solder connection and simplifies the manufacturing process to reduce costs, and also prevents damage to the solder joint even under severe environmental conditions such as when mounted on an aircraft.

[0014]

As described above, according to the present invention, there are drawbacks of the microstrip antenna which is conventionally manufactured by joining two dielectric substrates while aligning them and then inserting a power feed pin to make a solder connection. It is possible to reduce the cost by eliminating the complication of the manufacturing process and the cost increase.

[Brief description of drawings]

FIG. 1 is a sectional view showing a manufacturing procedure of a microstrip antenna of the present invention.

FIG. 2 is a cross-sectional view showing a completed state of the microstrip antenna shown in FIG.

FIG. 3 is a cross-sectional view showing a configuration of a conventional microstrip antenna.

[Explanation of symbols]

20 ... Radiating patch, 21 ... First earth conductor layer,
22 ... 1st dielectric board, 25 ... 2nd earth conductor layer, 26 ... Center line pattern, 27 ... 2nd
Dielectric substrate, 28 ... through hole, 29 ... through hole, 30 ... land, 31 ... through hole, 32 ...
-Through hole, 33 ... Circular land, 35 ...
Molten solder

Claims (2)

[Claims] 1. A first dielectric substrate having a radiation patch on an upper surface and a ground conductor layer on a lower surface, and a second dielectric substrate having a ground conductor layer on an upper surface and a line pattern on a lower surface. A microstrip antenna in which the respective ground conductor layers are joined to each other, a first through hole penetrating from the radiation patch to the lower surface of the first dielectric substrate is formed, and a bottom of the first through hole is formed. A first land is formed on the peripheral edge of the side opening, a second through hole is formed to penetrate from the center line pattern to the upper surface of the second dielectric substrate, and a second through hole is formed on the peripheral edge of the upper opening of the second through hole. A microstrip antenna characterized by forming a land. 2. The ground conductor layer and the first through hole on the lower surface of the first dielectric substrate are aligned with and bonded to the ground conductor layer and the second through hole on the upper surface of the second dielectric substrate, respectively. A method for manufacturing a microstrip antenna, comprising: filling molten solder into the first and second through holes that are in communication with each other and then solidifying the molten solder.