JPH0555609A - Optical module - Google Patents

Optical module

Info

Publication number
JPH0555609A
JPH0555609A JP21864391A JP21864391A JPH0555609A JP H0555609 A JPH0555609 A JP H0555609A JP 21864391 A JP21864391 A JP 21864391A JP 21864391 A JP21864391 A JP 21864391A JP H0555609 A JPH0555609 A JP H0555609A
Authority
JP
Japan
Prior art keywords
optical
optical module
stem
mounting
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21864391A
Other languages
Japanese (ja)
Other versions
JP3182171B2 (en
Inventor
Hiroatsu Aoki
弘淳 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP21864391A priority Critical patent/JP3182171B2/en
Publication of JPH0555609A publication Critical patent/JPH0555609A/en
Application granted granted Critical
Publication of JP3182171B2 publication Critical patent/JP3182171B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Light Receiving Elements (AREA)

Abstract

PURPOSE:To improve long-term reliability by reducing the fluctuation of the optical output after mounting, concerning the optical module used for optical communication system. CONSTITUTION:An optical module 1 is provided where main optical parts such as a light emitting element 4, a condensing lens 6, etc., are provided on a stem 2 and are sealed, a recess 15 is made in the mounting face of the stem 2 in the case of mounting the optical module 1 on a printed board.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、光通信システムに使用
される光モジュールに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical module used in an optical communication system.

【0002】近年、光通信システムの高速化、大容量、
長距離化が急速に進められるに伴い、光モジュールにお
いて長期信頼度が要求されている。そのため、光モジュ
ールの実装後の光出力変動を少なくする必要がある。
In recent years, optical communication systems have become faster, have a large capacity,
With the rapid progress of long distance, optical modules are required to have long-term reliability. Therefore, it is necessary to reduce the fluctuation of the optical output after mounting the optical module.

【0003】[0003]

【従来の技術】図3に、従来の光モジュールの構成断面
図を示す。図3において、光モジュール1は、取付穴2
aが形成された板状のステム2上に基板3が銀ろう等に
よりろう付けされている。この基板3上には発光素子4
が支持されており、その後方には発光素子4の発光状態
をモニタする受光素子5が設けられ、前方には集光レン
ズ6を支持するホルダ7が設けられる。そして、これを
覆うようにハウジング8がステム2上に銀ろう等でろう
付けされる。
2. Description of the Related Art FIG. 3 is a sectional view showing the structure of a conventional optical module. In FIG. 3, the optical module 1 has a mounting hole 2
The substrate 3 is brazed with silver brazing or the like on the plate-shaped stem 2 having a formed therein. The light emitting element 4 is provided on the substrate 3.
Is provided, a light receiving element 5 for monitoring the light emitting state of the light emitting element 4 is provided behind it, and a holder 7 for supporting the condenser lens 6 is provided at the front. Then, the housing 8 is brazed on the stem 2 with silver solder or the like so as to cover it.

【0004】ハウジング8には、支持体9が設けられて
おり、支持体9にガラス窓10が設けられて密閉され
る。光ファイバ11には、フェルール12が設けられ、
発光素子4からの出射光が集光レンズ6を介して光ファ
イバ11の端面に入射するように光軸合せが行われると
共に、フェルール12は支持体9に固定される。
The housing 8 is provided with a support 9, and the support 9 is provided with a glass window 10 to be hermetically sealed. The optical fiber 11 is provided with a ferrule 12,
The optical axis is aligned so that the light emitted from the light emitting element 4 enters the end face of the optical fiber 11 via the condenser lens 6, and the ferrule 12 is fixed to the support 9.

【0005】このような光モジュール1がプリント基板
等に取付穴2aによりネジで固定される。
Such an optical module 1 is fixed to a printed circuit board or the like with a mounting hole 2a by a screw.

【0006】[0006]

【発明が解決しようとする課題】ところで、ステム2に
基板3やハウジング8の取り付けの際の機械的歪によ
り、または、光モジュール1のプリント基板等への取り
付けの際に異物等によりステム2に反りや凹凸を生じ
る。特に光モジュール1の小型化に伴いステム2が薄く
なると特に顕著となる。
By the way, the stem 2 is attached to the stem 2 by mechanical strain when the substrate 3 or the housing 8 is attached to the stem 2, or by a foreign substance or the like when the optical module 1 is attached to a printed circuit board or the like. Warpage or unevenness occurs. In particular, it becomes particularly noticeable as the stem 2 becomes thinner as the optical module 1 becomes smaller.

【0007】この状態でプリント基板にネジで締め付け
て固定すると、応力が受光素子4等の主要光学部品を固
定している半田等に生じる。これにより、光軸ずれ等の
光出力に変動を生じたり、半田のクリープ現象等を誘発
して長期信頼度を低下させるという問題がある。
If the printed circuit board is tightened and fixed with screws in this state, stress is generated in the solder or the like fixing the main optical components such as the light receiving element 4. As a result, there is a problem in that the optical output such as an optical axis shift fluctuates or a solder creep phenomenon or the like is induced to lower long-term reliability.

【0008】そこで、本発明は上記課題に鑑みなされた
もので、実装後の光出力の変動を低減し、長期信頼度を
向上させる光モジュールを提供することを目的とする。
Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to provide an optical module that reduces fluctuations in optical output after mounting and improves long-term reliability.

【0009】[0009]

【課題を解決するための手段】上記課題は、プリント基
板に取り付けられる基台上に取着されたハウジング内
で、該基台上に設けられた発光部からの照射光を光導波
管を介して光出力する光モジュールにおいて、前記基台
の前記プリント基板への取り付け面に、所定大きさの凹
部を形成することにより解決される。
SUMMARY OF THE INVENTION The above-mentioned problems can be solved by the following: in a housing mounted on a base mounted on a printed circuit board, irradiation light from a light emitting portion provided on the base is passed through an optical waveguide. In an optical module that outputs light as a result, the problem can be solved by forming a recess of a predetermined size on the mounting surface of the base to the printed circuit board.

【0010】[0010]

【作用】上述のように、基台の取り付け面に凹部が形成
されている。従って、基台に反りや凹凸が生じていて
も、該基台のプリント基板への取り付け周辺のみが強制
されて撓むこととなり、光学部品が設けられている部分
の撓みが少ない。
As described above, the recess is formed on the mounting surface of the base. Therefore, even if the base is warped or uneven, only the periphery of the mounting of the base on the printed circuit board is forced to bend, and the portion where the optical components are provided is less likely to bend.

【0011】これにより、光モジュール実装後の光出力
の変動を低減させることが可能となり、変形による半田
のクリープ等も生じることなく長期信頼度を向上させる
ことが可能となる。
As a result, it is possible to reduce the fluctuation of the optical output after mounting the optical module, and it is possible to improve the long-term reliability without causing solder creep due to deformation.

【0012】[0012]

【実施例】図1に、本発明の一実施例の構成図を示す。
なお、図3と同一の構成部分には同一の符号を付す。
DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a block diagram of an embodiment of the present invention.
The same components as those in FIG. 3 are designated by the same reference numerals.

【0013】図1において光モジュール1は、取付穴2
aが形成された基台であるステム2の下面には、該取付
穴2a近辺まで最大限に凹部15が形成され、上面には
基板3が銀ろう等でろう付けにより取着される。このス
テム2は、例えばコバルト、ステンレス、銅タングステ
ンのような放熱(熱伝導度)良好な材質で形成され、内
部の温度上昇を防止するものである。なお、凹部15は
少なくともハウジング(後述する)の取着部分より大に
形成されるのが望ましい。
In FIG. 1, the optical module 1 has a mounting hole 2
On the lower surface of the stem 2 which is the base on which the a is formed, the recess 15 is formed to the maximum in the vicinity of the mounting hole 2a, and the substrate 3 is attached to the upper surface by brazing with silver solder or the like. The stem 2 is formed of a material having good heat dissipation (heat conductivity) such as cobalt, stainless steel, and copper tungsten, and prevents the internal temperature from rising. The recess 15 is preferably formed to be larger than at least a mounting portion of a housing (described later).

【0014】基板3上には発光部である発光素子4が支
持されており、その後方には発光素子4の発光状態をモ
ニタする受光部5が設けられる。発光素子4の前方には
集光レンズ6を内設したホルダ7が、該基板3上に半田
付け等ににより取着される。また、基板3を覆うように
ハウシング8がステム2上に銀ろう等でろう付けにより
取着される。ハウジング8には支持体9が設けられてお
り、支持体9にはガラス窓10が設けられて密閉され
る。光ファイバ11にはフェルール12が設けられ、発
光素子4からの出射光が集光レンズ6を介して光ファイ
バ11の端子に入射するように光軸合わせが行われると
共に、フェルール12は支持体9に固定される。
A light emitting element 4, which is a light emitting portion, is supported on the substrate 3, and a light receiving portion 5 for monitoring the light emitting state of the light emitting element 4 is provided behind it. A holder 7 having a condenser lens 6 therein is attached to the front of the light emitting element 4 on the substrate 3 by soldering or the like. A housing 8 is attached to the stem 2 by brazing with silver solder or the like so as to cover the substrate 3. The housing 8 is provided with a support 9, and the support 9 is provided with a glass window 10 to be hermetically sealed. A ferrule 12 is provided in the optical fiber 11, and the optical axis is aligned so that the light emitted from the light emitting element 4 enters the terminal of the optical fiber 11 through the condenser lens 6, and the ferrule 12 is supported by the support 9 Fixed to.

【0015】そして、プリント基板16(図2参照)上
に、上記光モジュール1を載置し、取付穴2aよりネジ
(図示せず)を締め付けることにより取り付けられるも
のである。
Then, the optical module 1 is mounted on the printed board 16 (see FIG. 2), and the optical module 1 is mounted by tightening screws (not shown) through the mounting holes 2a.

【0016】次に、図2に、図1のステムを説明するた
めの図を示す。図2は、光学部品の取り付け等によりス
テム2が+方向(図面方向)に例えば50μm反ってい
る場合を示したもので、図2(A)は本発明の場合であ
り、図2(B)は図3のような従来の場合である。な
お、ステム2は、現状の製造において平面度が±50μ
mで反る場合が多く、また、ハウジング8等をろう付け
することで+方向に反る場合が多い。
Next, FIG. 2 shows a diagram for explaining the stem of FIG. FIG. 2 shows a case where the stem 2 is warped in the + direction (direction of the drawing) by, for example, 50 μm due to attachment of optical components, and FIG. 2 (A) is the case of the present invention, and FIG. Is a conventional case as shown in FIG. The stem 2 has a flatness of ± 50μ in the current manufacturing process.
In many cases, it will warp in m, and in many cases it will warp in the + direction by brazing the housing 8 and the like.

【0017】図2(A)において、ステム2の凹部15
が形成された取り付け面をプリント基板16上に載置し
た場合、凹部15のエッジAが該プリント基板16に当
接する。従って、該プリント基板16に取付穴2aより
ネジでステム2を締め付ける場合、該ステム2は取付穴
2a周辺のみでエッジAを支点としてXの量の撓みを生
じるだけである。この撓みは、ハウジング8内に設けら
れている発光素子4や集光レンズ6等の主要光学部品に
応力を与えず、これら位置関係に影響を与えない。すな
わち、光軸ずれを生じることなく光ファイバ11からの
光出力の変動を防止することができるものである。この
場合、凹部15の深さは、撓み量Xより大きく設定され
るべきものである。
In FIG. 2A, the recess 15 of the stem 2
When the mounting surface on which is formed is placed on the printed circuit board 16, the edge A of the concave portion 15 contacts the printed circuit board 16. Therefore, when the stem 2 is fastened to the printed circuit board 16 with the screw from the mounting hole 2a, the stem 2 causes only the amount of X bending around the mounting hole 2a with the edge A as a fulcrum. This bending does not give stress to the main optical components such as the light emitting element 4 and the condenser lens 6 provided in the housing 8, and does not affect the positional relationship between them. That is, it is possible to prevent the fluctuation of the optical output from the optical fiber 11 without causing the optical axis shift. In this case, the depth of the recess 15 should be set to be larger than the bending amount X.

【0018】一方、図2(B)において、凹部15が形
成されていない場合、取付穴2aにおけるネジの締め付
けにより、ステム2はプリント基板16と当接するB点
を支点としてYの量の撓みが該ステム全体に生じること
による。前述のようにステム2が50μmで反っている
場合にはネジの締め付けにより光軸がずれて光ファイバ
11からは光出力がされないという状態を生じる。
On the other hand, in FIG. 2B, when the concave portion 15 is not formed, the stem 2 is bent by the amount of Y with the point B at which it abuts the printed circuit board 16 as a fulcrum by tightening the screw in the mounting hole 2a. By occurring throughout the stem. As described above, when the stem 2 is warped by 50 μm, the optical axis is deviated due to the tightening of the screw, and the optical output is not output from the optical fiber 11.

【0019】なお、上記実施例では、ステム2の反りを
+方向(図2の図面方向)の場合を説明しているが、−
方向(図面と逆方向)に反っていても、ネジの締め付け
によるステム2の撓み量は同じであり、同様の効果を有
するものである。
In the above embodiment, the case where the warp of the stem 2 is in the + direction (the drawing direction of FIG. 2) has been described.
Even if it is warped in the direction (the direction opposite to the drawing), the amount of bending of the stem 2 due to the tightening of the screw is the same, and the same effect is obtained.

【0020】[0020]

【発明の効果】以上のように本発明によれば、基台のプ
リント基板への取り付け面に凹部を設けることにより、
光モジュール取り付けの際の基台の撓みを減少させるこ
とができることから、実装後の光出力の変動を低減する
ことができると共に、長期に亘って高信頼度を維持する
ことができる。
As described above, according to the present invention, by providing the concave portion on the mounting surface of the base to the printed circuit board,
Since the bending of the base at the time of mounting the optical module can be reduced, it is possible to reduce the fluctuation of the optical output after mounting and also to maintain the high reliability for a long time.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例の構成図である。FIG. 1 is a configuration diagram of an embodiment of the present invention.

【図2】図1のステムを説明するための図である。FIG. 2 is a diagram for explaining the stem of FIG.

【図3】従来の光モジュールの構成断面図である。FIG. 3 is a sectional view showing the configuration of a conventional optical module.

【符号の説明】[Explanation of symbols]

1 光モジュール 2 ステム 2a 取付穴 4 発光素子 5 受光素子 6 集光レンズ 8 ハウジング 9 支持体 11 光ファイバ 15 凹部 16 プリント基板 1 Optical Module 2 Stem 2a Mounting Hole 4 Light-Emitting Element 5 Light-Receiving Element 6 Condensing Lens 8 Housing 9 Support 11 Optical Fiber 15 Recess 16 Printed Circuit Board

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 H01L 33/00 H 8934−4M ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H01L 33/00 H 8934-4M

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 プリント基板(16)に取り付けられる
基台(2)上に取着されたハウジング(8)内で、該基
台(2)上に設けられた発光部(4)からの照射光を光
導波管(11)を介して光出力する光モジュールにおい
て、 前記基台(2)の前記プリント基板(16)への取り付
け面に、所定大きさの凹部(15)を形成することを特
徴とする光モジュール。
1. Irradiation from a light emitting part (4) provided on a base (2) in a housing (8) mounted on the base (2) attached to a printed circuit board (16). In an optical module for outputting light through an optical waveguide (11), a recess (15) having a predetermined size is formed on a mounting surface of the base (2) to the printed board (16). Characteristic optical module.
【請求項2】 前記凹部(15)は、前記ハウジング
(8)の取着部分より大に形成することを特徴とする請
求項1記載の光モジュール。
2. The optical module according to claim 1, wherein the recessed portion (15) is formed to be larger than a mounting portion of the housing (8).
JP21864391A 1991-08-29 1991-08-29 Optical module Expired - Fee Related JP3182171B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21864391A JP3182171B2 (en) 1991-08-29 1991-08-29 Optical module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21864391A JP3182171B2 (en) 1991-08-29 1991-08-29 Optical module

Publications (2)

Publication Number Publication Date
JPH0555609A true JPH0555609A (en) 1993-03-05
JP3182171B2 JP3182171B2 (en) 2001-07-03

Family

ID=16723167

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21864391A Expired - Fee Related JP3182171B2 (en) 1991-08-29 1991-08-29 Optical module

Country Status (1)

Country Link
JP (1) JP3182171B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0631164A1 (en) * 1993-06-23 1994-12-28 Hitachi, Ltd. Optical element module
JP2011018824A (en) * 2009-07-10 2011-01-27 Kyocera Corp Package for storing optical semiconductor element, and optical semiconductor device
US8179681B2 (en) 2008-11-10 2012-05-15 Fujitsu Limited Module structure
JP6602479B1 (en) * 2018-02-09 2019-11-06 三菱電機株式会社 Optical module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11100193B2 (en) 2018-12-07 2021-08-24 Samsung Electronics Co., Ltd. Dataflow accelerator architecture for general matrix-matrix multiplication and tensor computation in deep learning

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0631164A1 (en) * 1993-06-23 1994-12-28 Hitachi, Ltd. Optical element module
US8179681B2 (en) 2008-11-10 2012-05-15 Fujitsu Limited Module structure
JP2011018824A (en) * 2009-07-10 2011-01-27 Kyocera Corp Package for storing optical semiconductor element, and optical semiconductor device
JP6602479B1 (en) * 2018-02-09 2019-11-06 三菱電機株式会社 Optical module
US11862930B2 (en) 2018-02-09 2024-01-02 Mitsubishi Electric Corporation Optical module having restriction body fixed to stem and having a linear thermal expansion coefficient smaller than that of the stem

Also Published As

Publication number Publication date
JP3182171B2 (en) 2001-07-03

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