JPH0555590U - Circuit board unit - Google Patents
Circuit board unitInfo
- Publication number
- JPH0555590U JPH0555590U JP10704991U JP10704991U JPH0555590U JP H0555590 U JPH0555590 U JP H0555590U JP 10704991 U JP10704991 U JP 10704991U JP 10704991 U JP10704991 U JP 10704991U JP H0555590 U JPH0555590 U JP H0555590U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- radiator
- printed circuit
- electronic component
- board unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Accessory Devices And Overall Control Thereof (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】
【構成】 発熱する電子部品１と電子部品１から発せら
れた熱を放熱する放熱器２と放熱器２の直下または周辺
に複数のプレス穴６を設けたプリント回路基板３から構
成される。
【効果】 プリント回路基板上の放熱器の直下または周
辺に複数のプレス穴を設けたことで捨て基板が不要にな
り、放熱器の放熱効果を下げることなく、捨て基板を切
り離す工程や切り離し場所の外観検査などが不要となり
回路基板ユニットの組立工数の削減ができる。また、捨
て基板が不要となることでプリント回路基板の金型が単
純になり金型代の削減ができる。
(57) [Summary] [Structure] Electronic component 1 that generates heat, radiator 2 that dissipates heat generated from electronic component 1, and printed circuit board 3 that has a plurality of press holes 6 immediately below or around radiator 2. Composed of. [Effect] By disposing a plurality of press holes just below or around the radiator on the printed circuit board, the waste board becomes unnecessary, and the process of separating the waste board and the place where the waste board is separated can be performed without lowering the heat dissipation effect of the heat sink. It eliminates the need for visual inspection and reduces the number of circuit board unit assembly steps. Further, since the waste board is not required, the mold of the printed circuit board is simplified and the mold cost can be reduced.
Description
【０００１】[0001]
本考案は、電子部品と放熱器及びプリント回路基板からなる回路基板ユニット に関するものである。 The present invention relates to a circuit board unit including an electronic component, a radiator and a printed circuit board.
【０００２】[0002]
図２は、従来の回路基板ユニットの外観図である。図２において、１は発熱す る電子部品、２は電子部品１から発せられた熱を放熱する放熱器、３は電子部品 １及び放熱器２を実装するプリント回路基板、４は半田槽を流す時に部品面への 半田の噴流を防ぐためのプリント回路基板３に設けられた捨て基板、５は電子部 品１を放熱器２に固定するための電子部品固定ネジである。 FIG. 2 is an external view of a conventional circuit board unit. In FIG. 2, 1 is an electronic component that generates heat, 2 is a radiator that radiates the heat generated from the electronic component 1, 3 is a printed circuit board on which the electronic component 1 and the radiator 2 are mounted, and 4 is a solder bath. At times, the waste board 5 provided on the printed circuit board 3 for preventing the jet of solder to the component surface is an electronic component fixing screw for fixing the electronic component 1 to the radiator 2.
【０００３】[0003]
従来の回路基板ユニットは以上のように構成されているので、図２に示すよう に、放熱器２の放熱効果を上げるためにプリント回路基板３の放熱器２の直下ま たは周辺に通風用の穴を設ける場合、半田槽を流す時に通風用の穴から部品面へ の半田の噴流を防ぐためにプリント回路基板３に捨て基板４を設け、半田槽を流 した後捨て基板４を切り離していた。従って、捨て基板４を切り離す工程や切り 離し場所の外観検査などの組立工数の増大、捨て基板４を設けるためにプリント 回路基板の金型が複雑になり金型代が高価になるという問題を有していた。 Since the conventional circuit board unit is configured as described above, as shown in FIG. 2, in order to improve the heat dissipation effect of the radiator 2, it is necessary to ventilate the printed circuit board 3 directly below or around the radiator 2. When the holes are provided, the waste circuit board 4 is provided on the printed circuit board 3 in order to prevent the flow of solder from the ventilation holes to the component surface when the solder tank is flowed, and the waste circuit board 4 is separated after the solder tank is flowed. . Therefore, there is a problem that the number of assembling steps such as the step of separating the waste board 4 and the visual inspection of the separation place is increased, and the mold of the printed circuit board becomes complicated to provide the waste board 4, and the mold cost becomes expensive. Was.
【０００４】 そこで本考案はこのような問題点を解決するもので、その目的とするところは 、組立工数とプリント回路基板の金型代を削減し高性能を維持した安価な回路基 板ユニットを提供するところにある。Therefore, the present invention solves such a problem, and an object thereof is to reduce the number of assembling steps and the die cost of the printed circuit board and to provide an inexpensive circuit board unit which maintains high performance. It is in the place of providing.
【０００５】[0005]
本考案の回路基板ユニットは、発熱する電子部品と前記電子部品から発せられ た熱を放熱する放熱器と前記電子部品及び前記放熱器を実装するプリント回路基 板からなる回路基板ユニットにおいて、前記プリント回路基板上の前記放熱器の 直下または周辺に複数のプレス穴を設けたことを特徴とする。 The circuit board unit of the present invention is a circuit board unit comprising an electronic component that generates heat, a radiator that radiates heat generated by the electronic component, and a printed circuit board that mounts the electronic component and the radiator. A plurality of press holes are provided directly below or around the radiator on the circuit board.
【０００６】[0006]
以下、本考案について、実施例に基づき詳細に説明する。 Hereinafter, the present invention will be described in detail based on embodiments.
【０００７】 図１は本考案の実施例における回路基板ユニットを示す外観図であって、６は 放熱器２の放熱効果を上げるために放熱器２の直下及び周辺に配置されたプリン ト回路基板３に設けられた通風用のプレス穴である。プレス穴６の大きさ・形状 は、半田槽を流す時にプレス穴６から部品面への半田の噴流が起こらない範囲内 とし、プレス穴６の個数・配置は従来の放熱効果を維持する範囲で任意に設定で きる。またプレス穴の大きさ・形状は、パターン設計等の制約により個々に設定 できる。本実施例ではプレス穴を直径５ｍｍの円形にして複数配置しているが、 楕円形・長方形などのスリットでも構わない。FIG. 1 is an external view showing a circuit board unit according to an embodiment of the present invention. Reference numeral 6 is a printed circuit board arranged immediately below and around the radiator 2 in order to enhance the heat radiation effect of the radiator 2. It is a press hole for ventilation provided in 3. The size and shape of the press holes 6 should be within a range that does not cause a jet of solder from the press holes 6 to the component surface when flowing the solder bath. The number and arrangement of the press holes 6 should be within the range that maintains the conventional heat dissipation effect. It can be set arbitrarily. Also, the size and shape of the press hole can be set individually due to restrictions such as pattern design. In this embodiment, a plurality of press holes are formed in a circle having a diameter of 5 mm and a plurality of press holes are arranged.
【０００８】 図１のように、放熱器２の放熱効果を上げるためにプリント回路基板３の放熱 器２の直下または周辺に通風用の穴として複数のプレス穴を設けたことで、捨て 基板を設けなくても、半田槽を流す時に部品面への半田の噴流を防ぐことが可能 となる。また捨て基板を切り離す工程や切り離し場所の外観検査などの組立工数 が不要となる。As shown in FIG. 1, in order to enhance the heat dissipation effect of the radiator 2, a plurality of press holes are provided as holes for ventilation in the printed circuit board 3 immediately below or around the radiator 2, so that the discarded board can be disposed. Even if the solder bath is not provided, it is possible to prevent the jet flow of the solder onto the component surface when the solder bath is flowed. It also eliminates the need for assembly steps such as the process of separating the discarded substrates and the visual inspection of the separation site.
【０００９】 このように本実施例によれば、プリント回路基板上の放熱器の直下または周辺 に複数のプレス穴を設けたことで、放熱器の放熱効果を下げることなく、組立工 数とプリント回路基板の金型代の削減が可能となる。As described above, according to this embodiment, since a plurality of press holes are provided immediately below or around the radiator on the printed circuit board, the number of assembling steps and printing can be performed without lowering the heat radiation effect of the radiator. It is possible to reduce the die cost of the circuit board.
【００１０】[0010]
以上述べたように本考案によれば、プリント回路基板上の放熱器の直下または 周辺に複数のプレス穴を設けたことで捨て基板が不要になり、放熱器の放熱効果 を下げることなく、捨て基板を切り離す工程や切り離し場所の外観検査などが不 要となり回路基板ユニットの組立工数の削減ができる。また、捨て基板が不要と なることでプリント回路基板の金型が単純になり金型代の削減ができる。 As described above, according to the present invention, since a plurality of press holes are provided immediately below or around the radiator on the printed circuit board, the waste board is not required, and the heat dissipation effect of the radiator is not reduced, and the waste board is discarded. This eliminates the need for the process of separating the boards and the visual inspection of the separation place, thus reducing the number of assembly steps for the circuit board unit. In addition, since the waste board is not required, the mold of the printed circuit board can be simplified and the mold cost can be reduced.
【図面の簡単な説明】[Brief description of drawings]
【図１】本考案の回路基板ユニットの一実施例を示す外
観図。FIG. 1 is an external view showing an embodiment of a circuit board unit of the present invention.
【図２】従来の回路基板ユニットを示す外観図。FIG. 2 is an external view showing a conventional circuit board unit.
１ 電子部品 ２ 放熱器 ３ プリント回路基板 ４ 捨て基板 ５ 電子部品固定ネジ ６ プレス穴 1 Electronic Component 2 Heat Sink 3 Printed Circuit Board 4 Discarded Board 5 Electronic Component Fixing Screw 6 Press Hole
Claims (2)
られた熱を放熱する放熱器と前記電子部品及び前記放熱
器を実装するプリント回路基板からなる回路基板ユニッ
トにおいて、前記プリント回路基板上の前記放熱器の直
下または周辺に複数のプレス穴を設けたことを特徴とす
る回路基板ユニット。1. A circuit board unit comprising an electronic component that generates heat, a radiator that radiates heat generated from the electronic component, and a printed circuit board on which the electronic component and the radiator are mounted. A circuit board unit, wherein a plurality of press holes are provided immediately below or around the radiator.
2にしたことを特徴とする請求項１記載の回路基板ユニ
ット。2. The area of the press hole according to claim 1 is 7 to 50 mm.
2. The circuit board unit according to claim 1, wherein the circuit board unit is 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10704991U JPH0555590U (en) | 1991-12-25 | 1991-12-25 | Circuit board unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10704991U JPH0555590U (en) | 1991-12-25 | 1991-12-25 | Circuit board unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0555590U true JPH0555590U (en) | 1993-07-23 |
Family
ID=14449222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10704991U Pending JPH0555590U (en) | 1991-12-25 | 1991-12-25 | Circuit board unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0555590U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1596641A2 (en) * | 2004-05-14 | 2005-11-16 | ORION ELECTRIC CO., Ltd. | Printed circuit board with improved heat dissipation efficiency |
-
1991
- 1991-12-25 JP JP10704991U patent/JPH0555590U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1596641A2 (en) * | 2004-05-14 | 2005-11-16 | ORION ELECTRIC CO., Ltd. | Printed circuit board with improved heat dissipation efficiency |
| EP1596641A3 (en) * | 2004-05-14 | 2007-12-19 | ORION ELECTRIC CO., Ltd. | Printed circuit board with improved heat dissipation efficiency |
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