JPH0553294A - Substrate negative plate formation device - Google Patents

Abstract

PURPOSE:To form a negative film for substrate internal layer data consisting principally of power source data. CONSTITUTION:This device includes an area setting means 11 which sets an area including an exposure object range on a substrate, a negative aperture track data generating means 12 which generates negative aperture track data for exposure on a part except a positive part to be exposed in the rectangular area, and a positive-negative inverting means 13 which forms the negative film with the aperture track data and performs the positive-negative inverting process of the film.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used in a substrate original image producing apparatus for producing an original image film for a printed circuit board or a semiconductor integrated circuit board by an exposure method.

[0002]

2. Description of the Related Art Conventionally, when an original image film is produced by a photo plotter of a printed circuit board, the identification number of an aperture for original image exposure corresponding to a component terminal of the printed circuit board and a land shape of a through hole is prepared on the photo plotter side. Where to expose (inside component terminals, through-hole lands, signal line patterns, and wide power supply patterns)
In case of land, combination of identification number and land position coordinate, in case of signal line pattern, combination of aperture identification number corresponding to signal line width and start and end coordinates of signal line, wide power supply pattern Automatically generates an appropriate aperture locus (set of line segments) that completely covers the inside, and creates NC data for the photoplotter as a combination of the identification number of each aperture and the start and end points of the line. It is done by outputting to (usually magnetic tape) and applying it to a photoplotter.

[0003]

The above-mentioned conventional method has a drawback in that a layer occupying most of the power source solid pattern has a large exposed portion, and it takes too much time to prepare an original image film by a photoplotter.

Specific examples will be described in detail below. Now, consider the case of creating an original image of the printed circuit board shown in FIG. In FIG. 4, the portion painted black on the substrate 20 is the positive portion and actually the copper foil portion 21.
Reference numeral 2 is an inner layer contact land. The other portion is the negative portion and actually corresponds to the non-conductive portion. Figure 5
FIG. 4 is an explanatory diagram of a shape of an inner layer contact land 22. As shown in FIG. 5, the contact land 22 has a negative portion and a positive portion mixed therein.

FIG. 6 is an explanatory view showing that it is difficult to create an original image as shown in FIG. 4 by the conventional method. In the conventional method, as shown in FIG. 6, the copper foil portion 2
Since the exposure for 1 and the exposure for the contact land 22 are performed independently, the exposure of the copper foil portion 21 exposes the negative portion of the contact land 22, resulting in the creation of the original image of the overall exposure. .. Also,
It is difficult to create data for exposing only the portion other than the contact land 22 in the copper foil portion 21 because the contour of the land is circular. Therefore, in the conventional method, it is necessary to perform processing so that the exposures of the original images do not overlap each other, and as a result, the creation time becomes long.

An object of the present invention is to provide a substrate original image producing apparatus of a system capable of producing an original image film at high speed by eliminating the above-mentioned drawbacks.

[0007]

According to the present invention, there is provided a substrate original image producing apparatus having means for producing an original image film of a substrate by an exposure method, and area setting means for setting an area including an exposure target range on the substrate, Original image aperture locus data generation means for generating original image aperture locus data for exposure in a portion other than the positive portion to be exposed in the area, and an original image film is created from the original image aperture locus data, and positive / negative reversal processing is performed. Positive / negative reversal processing means.

Further, in the invention, it is preferable that the substrate is a printed circuit board.

Further, in the invention, it is preferable that the substrate is a semiconductor integrated circuit substrate.

[0010]

The original image aperture locus data generating means generates the original image aperture locus data for exposure with respect to the portion excluding the positive portion to be exposed. That is, in this case, even if a negative original image is simultaneously output for the positive portion to be exposed, the result is the same, and a positive negative inverted original image film is produced. Then, the positive-negative inverted original image film is subjected to positive-negative inversion processing by the positive-negative inversion processing means, whereby an intended original-image film can be produced.

Therefore, without going through complicated processing steps,
The target original film can be obtained by a simple processing step, and the processing speed can be increased.

[0012]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a block diagram showing an embodiment of the present invention, showing a printed circuit board original image producing apparatus.

This embodiment is a feature of the present invention in a printed circuit board original image producing apparatus 10 equipped with means for producing an original image film of a printed circuit board by an exposure method.
Area setting means 11 for setting a rectangular set area including an exposure target range on a printed circuit board, and an original image for generating original image aperture locus data for exposure with respect to a portion of the rectangular set area excluding a positive portion to be exposed. It includes an aperture locus data generation means 12 and a positive / negative reversal processing means 13 for producing an original image film by the original image aperture locus data and performing a positive / negative reversal processing.

Next, the operation of this embodiment will be described with reference to FIGS. Here, FIG. 2 is an explanatory view of the area setting means and the original image aperture locus data generation means,
3 and 4 are explanatory views of the positive / negative reversal processing means.

First, the area setting means 11 sets a rectangular set area 23 to be exposed as shown in FIG.

Next, as shown in FIG. 2, the contact land 22 is created by the original image aperture locus data creating means 12.
The positive / negative inversion aperture of and the original image aperture locus data are created using it. This is a complete reversal of the final negative and positive negatives. Therefore, copper foil part 2
Even if the negative original image is output for 1, the result is consistent with FIG.

Next, by the positive / negative reversal processing means 13,
By subjecting the entire original image created by the positive negative inversion shown in FIG. 2 to the positive negative inversion process, a desired original image film is created as shown in FIG.

Although the above description has been directed to the printed circuit board, the present invention can be applied to the semiconductor integrated circuit board in the same manner.

[0020]

As described above, according to the present invention,
Since the original image film is created by creating the positive image inverted trajectory image data of the original image and performing the positive negative image inversion process, there is an effect that the original image film of the power supply inner layer can be produced at high speed.

[Brief description of drawings]

FIG. 1 is a block diagram showing an embodiment of the present invention.

FIG. 2 is an explanatory diagram of an area setting unit and an original image aperture locus data generating unit.

FIG. 3 is an explanatory view of the positive / negative reversal processing means.

FIG. 4 is a diagram showing an example of an original image of a printed circuit board.

FIG. 5 is an explanatory diagram of a shape of an inner layer contact land.

FIG. 6 is an explanatory diagram of a conventional method.

[Explanation of symbols]

 10 Printed Circuit Board Original Image Generation Device 11 Area Setting Means 12 Original Image Aperture Trajectory Data Generation Means 13 Positive / Negative Inversion Processing Means 20 Substrate 21 Copper Foil Part 22 Contact Land 23 Rectangular Assembly Area

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H05K 3/00 E 6921-4E

Claims (3)

[Claims] 1. A substrate original image producing apparatus comprising means for producing an original image film of a substrate by an exposure method, an area setting means for setting an area including an exposure target area on the substrate, and a positive film to be exposed in the area. An original image aperture locus data generation unit that generates original image aperture locus data for exposure with respect to a portion excluding a portion, and a positive / negative reversal processing unit that forms an original image film from the original image aperture locus data and performs positive / negative reversal processing. Substrate original image creation device characterized by. 2. The substrate is a printed circuit board.
Substrate original image creation device described in. 3. The substrate original image creating apparatus according to claim 1, wherein the substrate is a semiconductor integrated circuit substrate.