JPH0552730U - Optical fiber temperature sensor - Google Patents

Optical fiber temperature sensor

Info

Publication number
JPH0552730U
JPH0552730U JP11047791U JP11047791U JPH0552730U JP H0552730 U JPH0552730 U JP H0552730U JP 11047791 U JP11047791 U JP 11047791U JP 11047791 U JP11047791 U JP 11047791U JP H0552730 U JPH0552730 U JP H0552730U
Authority
JP
Japan
Prior art keywords
optical fiber
temperature sensor
emitting element
fiber temperature
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11047791U
Other languages
Japanese (ja)
Inventor
美喜男 渡辺
明弘 宮地
明 伊藤
勇 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tohoku Electric Power Co Inc
Takaoka Electric Mfg Co Ltd
Original Assignee
Tohoku Electric Power Co Inc
Takaoka Electric Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohoku Electric Power Co Inc, Takaoka Electric Mfg Co Ltd filed Critical Tohoku Electric Power Co Inc
Priority to JP11047791U priority Critical patent/JPH0552730U/en
Publication of JPH0552730U publication Critical patent/JPH0552730U/en
Pending legal-status Critical Current

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  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

(57)【要約】 【目的】 光ファイバ温度センサにおいて、固定を容易
にして、温度測定を安定にして、温度測定誤差を小さく
する。 【構成】 光ファイバ1の端面に発光素子2をシリコ−
ン樹脂3で全体を覆うように取り付け、エポキシ系樹脂
4で光ファイバ1の軸方向に垂直な断面を四角形状にす
るように覆い、エポキシ系樹脂4をフッ素樹脂5で覆
う。
(57) [Summary] [Objective] In an optical fiber temperature sensor, fixing is facilitated, temperature measurement is stabilized, and temperature measurement error is reduced. [Structure] A light-emitting element 2 is provided on the end face of an optical fiber 1 in a silicone.
The resin 3 is attached so as to cover the entire surface, the epoxy resin 4 is covered so that the cross section of the optical fiber 1 perpendicular to the axial direction is formed into a square shape, and the epoxy resin 4 is covered with the fluororesin 5.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial application]

本考案は、光ファイバ温度センサに関する。 The present invention relates to an optical fiber temperature sensor.

【0002】[0002]

【従来の技術】[Prior Art]

光ファイバ温度センサは、従来、図2に示すように、被覆を取り除いた光ファ イバ1の先端にガリウムひ素などの半導体材料からなる発光素子2を取り付けて 、発光素子2の全体をシリコ−ン樹脂3で覆い、さらにエポキシ系樹脂4で覆っ ている。 In the conventional optical fiber temperature sensor, as shown in FIG. 2, a light emitting element 2 made of a semiconductor material such as gallium arsenide is attached to the tip of the optical fiber 1 with the coating removed, and the entire light emitting element 2 is sealed. It is covered with resin 3 and further covered with epoxy resin 4.

【0003】 測定器から光ファイバ1を通じて送られてきた光は、発光素子2に達すると、 この発光素子2は別の光を発生する。この光は、発光素子2の温度変化にともな い波長が変化する。この光は、光ファイバ1を通して測定器に送られる。測定器 は、この光の波長変化を読み取り温度を求めることができる。When the light sent from the measuring instrument through the optical fiber 1 reaches the light emitting element 2, the light emitting element 2 emits another light. The wavelength of this light changes as the temperature of the light emitting element 2 changes. This light is sent to the measuring instrument through the optical fiber 1. The measuring instrument can read the wavelength change of this light and obtain the temperature.

【0004】[0004]

【考案が解決しようとする課題】[Problems to be solved by the device]

しかしながら、従来の光ファイバ温度センサは、断面が円形状のため、被測定 物6の表面温度を測定する場合、接触部が線接触となるので熱伝導が悪くなると ともに、光ファイバ温度センサが移動しやすいために測定が不安定になり、表面 温度の測定値に大きな誤差が出てくる。 However, since the conventional optical fiber temperature sensor has a circular cross section, when the surface temperature of the DUT 6 is measured, the contact portion becomes a line contact, so that the heat conduction deteriorates and the optical fiber temperature sensor moves. The measurement becomes unstable because it is easy to do, and a large error appears in the measured value of the surface temperature.

【0005】 そこで、本考案は光ファイバ温度センサにおいて、熱伝導が良く、温度測定が 安定になるよう光ファイバ温度センサの固定を容易にして、温度測定誤差が小さ くなるようにしたものである。In view of this, the present invention is an optical fiber temperature sensor in which heat conduction is good and the optical fiber temperature sensor is easily fixed so that the temperature measurement is stable, and the temperature measurement error is reduced. .

【0006】[0006]

【課題を解決するための手段】[Means for Solving the Problems]

本考案においては、光ファイバの先端に取り付けられた発光素子の近傍部分に おいて、センサ本体の外形を、光ファイバの軸方向に対して平行な平面状とする 。 In the present invention, in the vicinity of the light emitting element attached to the tip of the optical fiber, the outer shape of the sensor body is a plane shape parallel to the axial direction of the optical fiber.

【0007】[0007]

【作用】[Action]

上記のように構成された本考案の光ファイバ温度センサにおいては、その光フ ァイバの軸方向に対して平行な平面を、被測定物に接触させることによって、接 触部が面接触となるので、熱伝導が良くなるとともに、固定が容易になるために 温度測定が安定になって、温度測定誤差が小さくなる。 In the optical fiber temperature sensor of the present invention configured as described above, since the flat surface parallel to the axial direction of the optical fiber is brought into contact with the object to be measured, the contact portion becomes surface contact. , The heat conduction is improved, and the fixation becomes easy, so the temperature measurement becomes stable and the temperature measurement error is reduced.

【0008】[0008]

【実施例】【Example】

図1は本考案の光ファイバ温度センサの一例である。光ファイバ1の先端は、 光ファイバ1の軸方向に対して直角になるように端面が切断されている。そして 、発光素子2と光ファイバ1は、発光素子2のルミネッセンス光が発光する面と 光ファイバ1の先端の端面が平行になるように、シリコ−ン樹脂3aで接着する 。そしてさらに発光素子2全体を保護するため、シリコーン樹脂3で発光素子2 の全体を覆っている。さらに補強するために、エポキシ系樹脂4で覆い、しかも 、そのエポキシ系樹脂4は光ファイバ1の軸方向に垂直な断面を四角形状にし、 そのエポキシ系樹脂4の外側をフッ素樹脂5で覆う。この光ファイバ温度センサ は、光ファイバ1の軸方向に平行な平面を被測定物6の表面に接触させて、被測 定物6の表面の温度を測定する。 FIG. 1 is an example of the optical fiber temperature sensor of the present invention. The end face of the optical fiber 1 is cut so that it is perpendicular to the axial direction of the optical fiber 1. Then, the light emitting element 2 and the optical fiber 1 are bonded with the silicone resin 3a so that the surface of the light emitting element 2 where the luminescence light is emitted and the end surface of the tip of the optical fiber 1 are parallel to each other. Further, in order to further protect the entire light emitting element 2, the entire light emitting element 2 is covered with the silicone resin 3. In order to further reinforce, the epoxy resin 4 is covered, and the epoxy resin 4 has a quadrangular cross section perpendicular to the axial direction of the optical fiber 1, and the outside of the epoxy resin 4 is covered with the fluororesin 5. This optical fiber temperature sensor measures the temperature of the surface of the DUT 6 by bringing a plane parallel to the axial direction of the optical fiber 1 into contact with the surface of the DUT 6.

【0009】 これによれば、被測定物に対して面接触のために、熱伝導が良く、固定が容易 になるため、温度測定が安定になって温度測定誤差が小さくなる。なお、断面は 必ずしも四角形状でなくてもよい。According to this, the surface is in contact with the object to be measured, so that the heat conduction is good and the fixing is easy, so that the temperature measurement is stable and the temperature measurement error is reduced. The cross section does not necessarily have to be rectangular.

【0010】[0010]

【考案の効果】[Effect of the device]

本考案によれば、被測定物に対して面接触のために、熱伝導が良く、固定が容 易になるため温度測定が安定になって温度測定誤差が小さくなる。 According to the present invention, because of the surface contact with the object to be measured, the heat conduction is good and the fixing is easy, so that the temperature measurement is stable and the temperature measurement error is reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の光ファイバ温度センサの一例を示す図
である。
FIG. 1 is a diagram showing an example of an optical fiber temperature sensor of the present invention.

【図2】従来の光ファイバ温度センサの一例を示す図で
ある。
FIG. 2 is a diagram showing an example of a conventional optical fiber temperature sensor.

【符号の説明】[Explanation of symbols]

1 光ファイバ 2 発光素子 3a シリコ−ン樹脂 3 シリコ−ン樹脂 4 エポキシ系樹脂 5 フッ素樹脂 6 被測定物 1 Optical Fiber 2 Light Emitting Element 3a Silicone Resin 3 Silicone Resin 4 Epoxy Resin 5 Fluorine Resin 6 DUT

───────────────────────────────────────────────────── フロントページの続き (72)考案者 伊藤 明 愛知県西春日井郡西枇杷島町芳野町3丁目 1番地 株式会社高岳製作所技術開発セン ター内 (72)考案者 長谷川 勇 愛知県西春日井郡西枇杷島町芳野町3丁目 1番地 株式会社高岳製作所技術開発セン ター内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Akira Ito Akira Ichi, Nishi-Kasugai-gun, Nishibiwajima-cho, 3-chome, Yoshino-cho 1-chome, Takadake Manufacturing Co., Ltd. 3-chome, Yoshinocho Takataka Manufacturing Co., Ltd. Technology Development Center

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 光ファイバの先端に取り付けられた発光
素子の近傍部分において、センサ本体の外形を、光ファ
イバの軸方向に対して平行な平面状とした光ファイバ温
度センサ。
1. An optical fiber temperature sensor in which, in the vicinity of a light emitting element attached to the tip of an optical fiber, the outer shape of a sensor body is a flat surface parallel to the axial direction of the optical fiber.
JP11047791U 1991-12-18 1991-12-18 Optical fiber temperature sensor Pending JPH0552730U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11047791U JPH0552730U (en) 1991-12-18 1991-12-18 Optical fiber temperature sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11047791U JPH0552730U (en) 1991-12-18 1991-12-18 Optical fiber temperature sensor

Publications (1)

Publication Number Publication Date
JPH0552730U true JPH0552730U (en) 1993-07-13

Family

ID=14536710

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11047791U Pending JPH0552730U (en) 1991-12-18 1991-12-18 Optical fiber temperature sensor

Country Status (1)

Country Link
JP (1) JPH0552730U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016080457A (en) * 2014-10-15 2016-05-16 アズビル株式会社 Fluorescence temperature sensor
JP2019145741A (en) * 2018-02-23 2019-08-29 日本特殊陶業株式会社 Component for semiconductor manufacturing device, temperature distribution measurement method of component for semiconductor manufacturing device, and temperature distribution measurement device of component for semiconductor manufacturing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016080457A (en) * 2014-10-15 2016-05-16 アズビル株式会社 Fluorescence temperature sensor
JP2019145741A (en) * 2018-02-23 2019-08-29 日本特殊陶業株式会社 Component for semiconductor manufacturing device, temperature distribution measurement method of component for semiconductor manufacturing device, and temperature distribution measurement device of component for semiconductor manufacturing device

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