JPH0552080B2 - - Google Patents

Description

[Detailed Description of the Invention] [Summary] The present invention introduces air taken into the air intake chamber from the front of the housing into the printed wiring board storage chamber above the air intake chamber, and directs the air that has become high temperature in the printed wiring board storage chamber into the air intake chamber. In the heat dissipation structure of an electronic device that exhausts the air from the upper exhaust chamber to the rear of the housing, it is possible to efficiently dissipate heat from the heat generating components in the printed wiring board housing area while preventing the component mounting space from being reduced by the heatsink. In order to achieve this, the heat generated from the heat-generating components is guided to the top of the printed wiring board and then to the front side of the housing, and the heat generated in the exhaust chamber at the top of the printed wiring board storage area is heated via a heat transfer connecting member. It was designed to lead to the vessel.

[Industrial application field]

The present invention relates to a heat dissipation structure for an electronic device, and more specifically, the present invention relates to a heat dissipation structure for an electronic device, and more specifically, air introduced from the front of a housing into an air intake chamber is guided into a printed wiring board housing chamber above the housing, and the air that has become high temperature in the printed wiring board housing chamber is removed from the air intake chamber. This invention relates to an improvement in the heat dissipation structure of an electronic device that discharges heat from an upper exhaust chamber to the rear of a housing.

[Conventional technology]

FIG. 3 shows a conventional heat dissipation structure of electronic devices such as communication devices and information devices. Referring to this figure, a housing 1 of an electronic device includes a printed wiring board accommodating section 3 for accommodating a plurality of printed wiring boards 2 vertically, and heat sinks provided above and below the printed wiring board accommodating section 3, respectively. A shielding block 4 is provided. The inside of the heat shield block 4 has an air intake chamber 6 opened to the front surface of the housing 1 and the bottom surface of the printed wiring board accommodating portion 3 at the upper part of the heat shield block 4, and an air intake chamber 6 at the bottom of the heat shield block 4, which is formed by a heat shield plate 5. The exhaust chamber 7 is divided into an exhaust chamber 7 that opens to the upper surface of the printed wiring board accommodating portion 3 and the rear surface of the housing 1 . Therefore,
The air that enters the printed wiring board accommodating part 3 at the upper part of the housing 1 through the air intake chamber 6 from the front of the housing 1 is heated by the heat generating parts 8 of the integrated circuit elements (for example, LSI elements, etc.) mounted on the printed wiring board 2. It becomes high temperature and is discharged from the exhaust chamber 7 in the upper part of the printed wiring board storage section 3 to the rear of the housing 1.

However, in general, the heat dissipation from the heat generating component 8 is insufficient with only the above-mentioned air flow. The heat generated from the heat generating component 8 is radiated by the heat pipe 10 by projecting the heat radiation fin 11 as a heat radiator attached to the outside from the opening provided in the front plate 3a of the printed wiring board accommodating portion 3 of the housing 1. A heat dissipation structure is adopted in which heat is guided to the heat dissipation fins 11 and radiated from the heat dissipation fins 11 to the front outside of the housing 1.

[Problem that the invention seeks to solve]

In the heat dissipation structure of the electronic device described above, the heat dissipation fins 11 restrict the mounting of components on the printed wiring board 2, and the mounting of operating components such as switches on the front plate 3a of the printed wiring board housing section 3 is restricted. There was a problem that the In addition, since the outside air on the front side of the housing 1 becomes high temperature due to heat radiation from the heat radiation fins 11, the high temperature air is taken into the air intake chamber 6 in the upper part of the printed wiring board storage section 3. A problem has arisen in that heat dissipation from the heat generating components in the housing block 3 located above is insufficient.

Therefore, the present invention makes it possible to efficiently radiate heat from the heat-generating components in the printed wiring board accommodating section while preventing the component mounting space from being reduced by the radiator by effectively utilizing the space in the exhaust chamber. The purpose is to provide a heat dissipation structure for electronic devices.

[Means for solving problems]

According to the present invention, the air introduced into the air intake chamber from the front of the housing is guided into the printed wiring board housing chamber at the upper part of the air intake chamber, and the air that has become hot in the printed wiring board housing chamber is passed from the upper exhaust chamber to the rear of the housing. In a heat dissipation structure for an electronic device that discharges heat to a printed wiring board that is housed in a vertical position in a printed wiring board storage chamber, a rear housing that guides heat generated from heat generating components on the printed wiring board to the upper part of the printed wiring board. A heat transfer member is installed to guide the heat to the front side of the housing, a heat radiator is installed in the exhaust chamber above the printed wiring board housing chamber, and the heat transfer member and the heat radiator are connected and detached on the front side of the housing using a heat transfer connecting member. A heat dissipation structure for an electronic device is provided, which is characterized in that the heat dissipation structure is capable of being connected.

[Effect]

In the heating structure for an electronic device according to the present invention,
The heat generated from the heat-generating components on the printed wiring board is guided to the top of the printed wiring board by the heat transfer member, then to the front side of the housing, and then to the printed wiring board housing part via the heat transfer connecting member. The heat is guided to the radiator in the upper exhaust chamber, and the heat is radiated from the radiator into the exhaust chamber. The heat radiator is provided in an exhaust chamber that is not used for mounting circuit components, etc., and is not subject to restrictions on component mounting, so the heat radiating area of the heater can be increased. On the other hand, there is no need to provide a radiator at the front end of the printed wiring board or the front surface of the printed wiring board accommodating portion, and the area for mounting components on the printed wiring board or the front surface of the printed wiring board accommodating portion increases.

In addition, since the heat led to the front side of the housing by the heat transfer member is led to the radiator in the exhaust chamber via the heat transfer connecting member, it is possible to prevent the outside temperature from rising on the front side of the housing. can. Therefore, the temperature of the air taken into the printed wiring board accommodating section from the front of the housing can be kept low, and heat can be efficiently dissipated. Moreover, since the temperature in the exhaust chamber increases due to heat radiation from the radiator, the flow rate of air passing through the printed wiring board housing section increases, and the heat radiation effect from the heat generating components increases.

Furthermore, since the heat transfer member and the radiator are removably connected by the heat transfer connecting member, the work of inserting and removing the printed wiring board from the printed wiring board housing section is done by removing the heat transfer connecting member. It can be done easily.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 and FIG. 2 show an embodiment of the present invention. Referring to these figures, the housing 21 of the electronic device includes a printed wiring board accommodating section 23 for accommodating a plurality of printed wiring boards 22 vertically.
and heat shielding blocks 24 provided above and below the printed wiring board accommodating portion 23, respectively.
The inside of the heat shield block 24 has an air intake chamber 26 opened to the front surface of the housing 21 and the bottom surface of the printed wiring board accommodating portion 23 at the upper part of the heat shield block 24, and an air intake chamber 26 opened to the bottom surface of the printed wiring board accommodating part 23 at the upper part of the heat shield block 24, by means of a heat shield plate 25. It is divided into an exhaust chamber 27 that opens to the upper surface of the printed wiring board housing section 23 and the rear surface of the housing 21 . Therefore, the air entering from the front of the housing 21 through the air intake chamber 26 and into the printed wiring board accommodating section 23 above the housing 21 generates heat from the integrated circuit elements (for example, LSI elements, etc.) mounted on the printed wiring board 22. It is heated by the parts 28 and reaches a high temperature, and the temperature is discharged from the exhaust chamber 27 in the upper part of the printed wiring board housing section 23 to the housing 2.
It is discharged behind 1.

A heat transfer member 29 is attached to the printed wiring board 22 for guiding the heat generated from the heat generating components 28 to the upper part of the printed wiring board 22 and then to the front side of the housing 21. In this embodiment, the heat transfer member 29 includes a heat transfer block 30 attached to the heat generating component 28 and a vertical heat transfer block 30 attached to the heat transfer block 30 and arranged vertically parallel to the printed wiring board 22. It includes a pipe 31, a horizontal heat pipe 32 arranged almost horizontally along the upper end of the printed wiring board 22, and a heat transfer block 33 connecting the horizontal heat pipe 32 and the vertical heat pipe 31. Since the vertical heat pipe 31 exhibits the maximum heat transport ability, the diameter of the vertical heat pipe 31 can be reduced. Therefore, it becomes possible to increase the mounting density of circuit components on the printed wiring board 22.

Exhaust chamber 27 above the printed wiring board storage chamber 23
A mounting block 34 provided therein has a heat radiator 35 having a heat pipe 36 and a heat radiating fin 37.
is fixed. Here, the heat pipe 36
The front end of is located outside the front side of the housing 21,
The rear end of the heat pipe 36 is located inside the exhaust chamber 27, and the heat radiation fins 37 are connected to the heat pipe 36.
It is attached to the rear end side.

A heat transfer member 29 is provided on the outside of the front side of the housing 21.
A heat transfer connecting member 38 is provided to removably connect the horizontal heat pipe 32 of the radiator 35 to the heat pipe 36 of the radiator 35. The heat transfer connecting member 38 is provided with two holes 38a for receiving the heat pipes 32, 36.
6 is adapted to be fixed within the hole 38a by a screw 39.

The heat pipe 36 of the radiator 35 may be arranged horizontally, but in this embodiment, the heat pipe 36 extends obliquely upward from the middle part toward the rear end, so that the heat transport efficiency is improved. Strength increases;
Efficient heat dissipation becomes possible.

In the heat dissipation structure of the electronic device having the above configuration, the heat generated from the heat generating component 28 on the printed wiring board 22 is guided to the upper part of the printed wiring board 22 by the heat transfer member 29 and then to the outside of the front side of the housing 21. It is further guided to the heat radiator 35 in the exhaust chamber 27 at the upper part of the printed wiring board housing section 23 via the heat transfer connecting member 38, and from the heat radiator 35 to the exhaust chamber 27.
Heat is radiated inside.

The radiator 35 is provided in the exhaust chamber 27 which is not used for mounting circuit components, etc., and is not subject to restrictions on component mounting. Therefore, the heat radiating area of the radiator 35 can be increased to improve heat radiation efficiency. become able to.

On the other hand, a heat sink 35 is provided at the front end portion of the printed wiring board 22 and the front surface 23a of the printed wiring board housing section 23.
Since it is not necessary to provide a component mounting area of the printed wiring board 22 and the front surface 23a of the printed wiring board accommodating portion 23, the component mounting area is increased.

The heat guided to the front side of the housing 21 by the heat transfer member 29 is guided to the radiator 35 in the exhaust chamber 27 via the heat transfer connecting member 38, so that the outside temperature on the front side of the housing 21 increases. can be prevented.
Therefore, the temperature of the air taken into the printed wiring board accommodating portion 23 from the front of the housing 21 can be kept low, and heat can be efficiently dissipated. Moreover, since the temperature in the exhaust chamber 27 above the printed wiring board housing section 23 rises due to heat radiation from the radiator 35,
The flow velocity of the air passing through the printed wiring board accommodating portion 23 can be increased, and the heat dissipation effect for the printed wiring board 22 can be enhanced.

Note that if the surface of the heat transfer connecting member 38 is covered with a heat insulating material such as plastic, an increase in the outside temperature on the front side of the housing 21 can be more reliably prevented.

Furthermore, the horizontal heat pipe 32 of the heat transfer member 29
and the heat pipe 36 of the radiator 35 are removably connected by a heat transfer connecting member 38.
The work of inserting and removing the printed wiring board 22 into and out of the printed wiring board storage section 23 is performed by the heat transfer connecting member 38.
This can be easily done by removing the

Although the illustrated embodiments have been described above, the present invention is not limited to the embodiments described above. For example, the vertical heat pipe 31 and the horizontal heat pipe 32 in the heat transfer member may be formed integrally, and the inside thereof may be communicated with each other.
Further, in place of the heat pipes 31, 32, 36, etc., rods having good thermal conductivity such as copper may be used. Furthermore, the heat transfer connecting member may be provided inside the front plate 23a of the housing.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, the heat generated from the heat generating components in the printed wiring board accommodating portion of the housing is guided to the upper part of the printed wiring board and then to the front side of the housing, and further heat transfer is performed. The heat can be guided to the radiator in the exhaust chamber at the top of the printed wiring board accommodating part through the connection member for the printed wiring board, and the heat can be radiated from the radiator into the exhaust chamber. This makes it possible to provide a heat generating structure for an electronic device that can efficiently radiate heat from the heat generating components within the plate accommodating section.

[Brief explanation of drawings]

FIG. 1 is a longitudinal cross-sectional view of a main part of a heat dissipation structure for an electronic device showing an embodiment of the present invention, FIG. 2 is a front view of a main part of a heating structure of an electronic device shown in FIG. 1, and FIG. 3 is a conventional FIG. 2 is a vertical cross-sectional view of a main part showing a heat dissipation structure of an electronic device. In the figure, 21 is a housing, 22 is a printed wiring board, 23 is a printed wiring board housing part, 26 is an air intake chamber, 27 is an exhaust chamber, 28 is a heat generating component, 29 is a heat transfer member, 35 is a radiator, and 38 is a Each connection member for heat transfer is shown.

Claims (1)

[Claims] 1. Air introduced from the front of the housing 21 into the air intake chamber 26 is transferred to the printed wiring board storage chamber 23 above the air intake chamber 26.
In a heat dissipation structure for an electronic device in which air that has become high temperature in a printed wiring board storage chamber 23 is discharged to the rear of the housing 21 from an upper exhaust chamber 27, the air is placed vertically in the printed wiring board storage chamber 23. A heat transfer member 29 is attached to the housed printed wiring board 22 to guide the heat generated from the heat-generating components 28 on the printed wiring board 22 to the upper part of the printed wiring board 28 and then to the front side of the housing 21. Exhaust chamber 27 above wiring board storage chamber 23
A heat radiator 35 is provided inside, and a heat transfer member 29 and a heat radiator 3 are provided on the front side of the housing 21.
5 are detachably connected to each other by a heat transfer connecting member 38.