JPH0550217A - Reflow soldering device - Google Patents
Reflow soldering deviceInfo
- Publication number
- JPH0550217A JPH0550217A JP1335491A JP1335491A JPH0550217A JP H0550217 A JPH0550217 A JP H0550217A JP 1335491 A JP1335491 A JP 1335491A JP 1335491 A JP1335491 A JP 1335491A JP H0550217 A JPH0550217 A JP H0550217A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- furnace
- high temperature
- gas
- reflow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Tunnel Furnaces (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【0001】〔発明の目的〕[Object of the Invention]
【0002】[0002]
【産業上の利用分野】本発明は、基板上にソルダペース
トを介し部品を搭載した部品搭載基板を、リフロー炉内
の高温気体で加熱することによりはんだ付けを行うリフ
ローはんだ付け装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reflow soldering apparatus for soldering a component mounting board having components mounted on the board via a solder paste by heating with a high temperature gas in a reflow furnace. ..
【0003】[0003]
【従来の技術】図2または図3に示されるように、従来
のリフローはんだ付け装置は、リフロー炉1の内部に、
送風機2を中心に、この送風機2によって発生した気流
を炉内で循環する案内板3と、その循環中の気流を加熱
するヒータ4とを左右対称形に設けている。2. Description of the Related Art As shown in FIG. 2 or 3, a conventional reflow soldering apparatus has
Centering around the blower 2, a guide plate 3 for circulating the airflow generated by the blower 2 in the furnace and a heater 4 for heating the circulating airflow are provided symmetrically.
【0004】そうして、基板上にソルダペーストを介し
部品を搭載した部品搭載基板Wを、図示しないコンベヤ
により紙面に直交する方向に搬送して、炉内の中央部へ
搬入し、炉内で循環中の高温気体によりリフローはんだ
付けした後、炉内から搬出するようにしている。この従
来のリフロー炉内では、基板Wのほぼ全面にわたり、上
方から高温気体を吹付けている。Then, the component mounting board W, on which the components are mounted via the solder paste, is conveyed in a direction orthogonal to the paper surface by a conveyor (not shown), and is carried into the central portion of the furnace to be set in the furnace. After reflow soldering with high temperature gas in circulation, it is carried out from the furnace. In this conventional reflow furnace, high temperature gas is blown from almost above the entire surface of the substrate W.
【0005】[0005]
【発明が解決しようとする課題】この従来のリフローは
んだ付け装置では、基板Wに吹付けられる高温気体と基
板表面から反射して放散する気体とが相互に干渉し、高
温気体の流れがスムーズでないため、基板Wの昇温が遅
く、かつ不均一になる問題がある。In this conventional reflow soldering apparatus, the high-temperature gas sprayed on the substrate W and the gas reflected and diffused from the substrate surface interfere with each other, and the flow of the high-temperature gas is not smooth. Therefore, there is a problem that the temperature rise of the substrate W is slow and non-uniform.
【0006】さらに、炉内に窒素ガス等の不活性ガスを
吹込んで、炉内に不活性ガス雰囲気を形成する不活性ガ
ス雰囲気炉においては、基板Wに吹付けられた不活性ガ
スが、基板Wに当たってから四方に反射拡散するため、
コンベヤ方向(図2または図3の紙面に直交する方向の
基板搬入口部5および反対側の図示しない基板搬出口
部)にも強い不活性ガス漏出流が生じ、この基板搬入口
部5および基板搬出口部(図示せず)では、狭い通路で
あるから上記ガス流により乱流が発生し、その結果、こ
の基板搬入口部5および基板搬出口部にて乱流による外
気の巻込み現象が生じ、炉内酸素濃度が上昇し、はんだ
付け時の酸化防止に支障が生ずる問題がある。Furthermore, in an inert gas atmosphere furnace in which an inert gas such as nitrogen gas is blown into the furnace to form an inert gas atmosphere in the furnace, the inert gas blown onto the substrate W is Since it reflects and diffuses in four directions after hitting W,
A strong inert gas leak flow also occurs in the conveyor direction (the substrate loading port 5 in the direction orthogonal to the paper surface of FIG. 2 or FIG. 3 and the substrate loading port not shown on the opposite side), and this substrate loading port 5 and the substrate At the carry-out port (not shown), because of the narrow passage, a turbulent flow is generated by the gas flow. This causes the oxygen concentration in the furnace to rise, which causes a problem in preventing oxidation during soldering.
【0007】本発明は、このような点に鑑みなされたも
ので、高温気体が基板への吹付部分でスムーズに移動し
得る構造とすることにより、基板の昇温速度や均一性を
向上させ、さらに、不活性ガス雰囲気炉にあっては、基
板搬入出口部における乱流の発生を押さえて、乱流の外
気巻込による炉内酸素濃度の上昇を防止することを目的
とするものである。The present invention has been made in view of the above points, and has a structure in which high-temperature gas can smoothly move in a portion sprayed on a substrate, thereby improving the temperature rising rate and uniformity of the substrate, Further, the purpose of the inert gas atmosphere furnace is to suppress the generation of turbulent flow at the substrate loading / unloading port and prevent the increase of oxygen concentration in the furnace due to the entrainment of turbulent air into the outside air.
【0008】〔発明の構成〕[Configuration of Invention]
【0009】[0009]
【課題を解決するための手段】請求項1に記載の発明
は、ソルダペーストを介し部品を搭載した基板Wをコン
ベヤ21によりリフロー炉11内に搬入し、このリフロー炉
内の高温気体によりリフローはんだ付けするリフローは
んだ付け装置において、リフロー炉11内の片側に、基板
搬送方向に対しほぼ直角方向であって、かつ基板面に対
し片方斜めから高温気体を吹付ける傾斜ノズル16を設け
たものである。According to a first aspect of the present invention, a substrate W on which components are mounted is carried into a reflow furnace 11 by a conveyor 21 through a solder paste, and reflow soldering is performed by a high temperature gas in the reflow furnace. In the reflow soldering device to be attached, one side in the reflow furnace 11 is provided with an inclined nozzle 16 that is a direction substantially perpendicular to the substrate transfer direction and blows a high temperature gas obliquely from one side to the substrate surface. ..
【0010】請求項2に記載の発明は、請求項1の高温
気体を不活性ガスとしたものである。According to a second aspect of the invention, the high temperature gas of the first aspect is an inert gas.
【0011】[0011]
【作用】請求項1に記載の発明は、傾斜ノズル16から基
板面に対し片方斜めから高温気体を吹付けることによ
り、この高温気体の流れを一方通行としたから、基板W
に吹付けられる高温気体と、基板Wから反射放散する高
温気体とが相互に干渉しないでスムーズに流れる。According to the first aspect of the present invention, the high temperature gas is made to flow in one direction by blowing the high temperature gas from the inclined nozzle 16 to the surface of the substrate obliquely from one side.
The high-temperature gas blown onto the substrate W and the high-temperature gas reflected and diffused from the substrate W flow smoothly without interfering with each other.
【0012】請求項2に記載の発明は、基板搬送方向に
対しほぼ直角方向であって、かつ基板面に対し片方斜め
から高温の不活性ガスを吹付けるから、基板Wから反射
した不活性ガスは、コンベヤ21の周囲を旋回するように
炉内を循環し、基板搬入側および搬出側へ流れることが
少ない。According to the second aspect of the present invention, since the high temperature inert gas is blown to the substrate surface in a direction substantially at right angles to the substrate transfer direction and is oblique to one side of the substrate surface, the inert gas reflected from the substrate W is reflected. Circulates in the furnace so as to rotate around the conveyor 21, and rarely flows to the substrate loading side and the unloading side.
【0013】[0013]
【実施例】以下、本発明を図1に示される実施例を参照
して詳細に説明する。The present invention will be described in detail below with reference to the embodiment shown in FIG.
【0014】リフロー炉11の内底部に送風機12を設け、
この送風機12の周囲からリフロー炉11の一側の内壁に沿
って、送風機12で発生した気流を炉内の上方に案内する
案内板13を設け、この案内板13により炉内に区画形成さ
れた気流上昇通路14に、気流を加熱するヒータ15を設け
る。A blower 12 is provided at the inner bottom of the reflow furnace 11,
A guide plate 13 for guiding the air flow generated by the blower 12 upward in the furnace is provided along the inner wall of the reflow furnace 11 from the periphery of the blower 12, and the guide plate 13 divides and forms the inside of the furnace. A heater 15 for heating the airflow is provided in the airflow rising passage 14.
【0015】このリフロー炉11内の片側に設けられた気
流上昇通路14の上端部に、部品搭載基板Wの搬送方向
(図1紙面に直交する方向)に対しほぼ直角方向(紙面
方向)であって、かつ基板面に対し片方斜めから高温気
体を吹付ける傾斜ノズル16を連続的に設ける。At the upper end of the air flow rising passage 14 provided on one side in the reflow furnace 11, a direction substantially perpendicular to the conveying direction of the component mounting substrate W (direction orthogonal to the paper surface of FIG. 1) (paper surface direction). In addition, the inclined nozzle 16 that blows the high temperature gas obliquely from one side to the substrate surface is continuously provided.
【0016】リフロー炉11の底部には窒素ガス等の不活
性ガスを炉内に注入するためのガス注入口17を設ける。A gas injection port 17 for injecting an inert gas such as nitrogen gas into the furnace is provided at the bottom of the reflow furnace 11.
【0017】前記部品搭載基板Wは、基板上にソルダペ
ーストを介し部品を搭載したもので、リフロー炉本体に
対し紙面に直交する方向に設けられた基板搬入口部18か
らこの基板Wをリフロー炉11内に搬入し、この炉内の高
温気体によりソルダペーストを溶融してリフローはんだ
付けを行い、基板搬入口部18とは反対側の基板搬出口部
(図示せず)から外部に搬出する。The component mounting substrate W is one in which components are mounted on the substrate via solder paste, and this substrate W is reflowed from a substrate loading port 18 provided in a direction orthogonal to the plane of the reflow furnace main body. Then, the solder paste is melted by the high temperature gas in the furnace and reflow soldering is performed, and the solder paste is carried out from a substrate carry-out port (not shown) opposite to the substrate carry-in port 18.
【0018】この基板Wを搬送するコンベヤ21は、紙面
に直交する方向に設けられた左右一対の水平レールに沿
って、それぞれエンドレスチェン等の回行体を設け、こ
の回行体から突設されたピン22によって基板Wの左右部
を係止して搬送するものである。The conveyor 21 for transporting the substrate W is provided with traveling bodies such as endless chains along a pair of left and right horizontal rails provided in a direction orthogonal to the plane of the drawing, and is projected from the traveling body. The left and right parts of the substrate W are locked by the pins 22 and transported.
【0019】次に、この図1に示された実施例の作用を
説明する。Next, the operation of the embodiment shown in FIG. 1 will be described.
【0020】部品搭載基板Wをコンベヤ21によりリフロ
ー炉11内へ搬入し、炉内で傾斜ノズル16から吹出される
高温気体を基板Wに吹付けることにより、その高温気体
の熱により部品搭載基板Wのソルダペーストを溶融して
リフローはんだ付けし、炉内から搬出する。The component mounting substrate W is carried into the reflow furnace 11 by the conveyor 21, and the high temperature gas blown out from the inclined nozzle 16 is blown onto the substrate W in the furnace, so that the heat of the high temperature gas causes the component mounting substrate W to be heated. Melt the solder paste and reflow solder it, and carry it out from the furnace.
【0021】高温気体は、傾斜ノズル16から基板面に対
し片方斜めから吹付けるので、この高温気体の流れが一
方通行となり、基板面に吹付けられる高温気体と、基板
面から反射して送風機12に循環する気体とが相互に干渉
しないでスムーズに流れる。このように高温気体の流れ
がスムーズとなるから、基板Wの昇温速度が大きく、基
板全面が均一に昇温する。Since the high temperature gas is sprayed from the inclined nozzle 16 obliquely to one side of the substrate surface, the flow of this high temperature gas is one-way, and the high temperature gas blown to the substrate surface and the blower 12 which is reflected from the substrate surface. The gas that circulates in the air flows smoothly without interfering with each other. Since the flow of the high-temperature gas becomes smooth in this way, the rate of temperature rise of the substrate W is large, and the entire surface of the substrate is uniformly heated.
【0022】また、ガス注入口17から炉内に窒素ガス等
の不活性ガスを注入して、炉内に不活性ガス雰囲気を形
成する場合は、傾斜ノズル16から高温の不活性ガスを噴
出する。すなわち、基板搬送方向(図1紙面に直交する
方向)に対しほぼ直角方向(紙面方向)であって、かつ
基板面に対し片方斜めから高温の不活性ガスを吹付ける
から、基板Wに吹付けられ基板Wから反射した不活性ガ
スは、コンベヤ21の周囲を旋回するように炉内を循環
し、コンベヤ方向(図2または図3の紙面に直交する基
板搬入側および基板搬出側)へ流れることが少ない。When an inert gas such as nitrogen gas is injected into the furnace from the gas inlet 17 to form an inert gas atmosphere in the furnace, a high temperature inert gas is jetted from the inclined nozzle 16. .. That is, since a high temperature inert gas is blown from a direction substantially perpendicular to the substrate conveyance direction (direction orthogonal to the paper surface of FIG. 1) (paper surface direction) and diagonally from one side to the substrate surface, it is blown onto the substrate W. The inert gas reflected from the substrate W circulates in the furnace so as to swirl around the conveyor 21 and flows in the conveyor direction (the substrate loading side and the substrate unloading side orthogonal to the paper surface of FIG. 2 or FIG. 3). Less is.
【0023】したがって、リフロー炉11の基板搬入口部
18および反対側の基板搬出口部において強い不活性ガス
流が生じないので、その基板搬入出口部(狭い通路)で
従来発生していた乱流が発生せず、乱流による外気の巻
込み現象もない。よって、外気巻込みに起因して炉内酸
素濃度が上昇することもなく、はんだ付け時の酸化防止
機能が保たれる。Therefore, the substrate inlet of the reflow furnace 11
Since a strong inert gas flow does not occur at 18 and the substrate outlet on the opposite side, the turbulent flow that was conventionally generated at the substrate inlet / outlet (narrow passage) does not occur, and the entrainment phenomenon of outside air due to turbulent flow Nor. Therefore, the oxygen concentration in the furnace does not rise due to the inclusion of the outside air, and the function of preventing oxidation during soldering is maintained.
【0024】[0024]
【発明の効果】請求項1に記載の発明によれば、リフロ
ー炉内の片側に、基板搬送方向に対しほぼ直角方向であ
って、かつ基板面に対し片方斜めから高温気体を吹付け
る傾斜ノズルを設けたから、この傾斜ノズルから基板面
に吹付けられた高温気体と、基板面から反射した気体と
を相互に干渉させないで、一方向にスムーズに炉内循環
させることができる。このため、基板の昇温速度や温度
均一性を向上できる。According to the first aspect of the present invention, the inclined nozzle which blows the high temperature gas on one side in the reflow furnace at a substantially right angle to the substrate transfer direction and from one side obliquely to the substrate surface. Since the high temperature gas sprayed from the inclined nozzle to the substrate surface and the gas reflected from the substrate surface do not interfere with each other, the high temperature gas can be smoothly circulated in the furnace in one direction. Therefore, the temperature rising rate and temperature uniformity of the substrate can be improved.
【0025】請求項2に記載の発明によれば、基板搬送
方向に対しほぼ直角方向であって、かつ基板面に対し片
方斜めから高温の不活性ガスを吹付けることにより、不
活性ガス雰囲気炉にあって炉内酸素濃度の上昇を防止で
きる。すなわち、基板面で反射された不活性ガス流が基
板搬送方向(基板搬入側および基板搬出側)に向かう強
い流れを作らないことにより、狭い基板搬入口部および
基板搬出口部での乱流の発生を押さえて、乱流による炉
内への外気巻込に起因する炉内酸素濃度の上昇を防止で
きる。According to the second aspect of the present invention, a high temperature inert gas is blown onto the surface of the substrate at a substantially right angle to the substrate transfer direction, and an inert gas atmosphere furnace is provided. Therefore, the oxygen concentration in the furnace can be prevented from increasing. That is, since the inert gas flow reflected on the substrate surface does not create a strong flow in the substrate transport direction (substrate loading side and substrate unloading side), turbulent flow in the narrow substrate loading port and substrate loading port is generated. By suppressing the generation, it is possible to prevent the increase in the oxygen concentration in the furnace due to the entrainment of outside air into the furnace due to the turbulent flow.
【図1】本発明の一実施例を示すリフローはんだ付け装
置の断面図である。FIG. 1 is a cross-sectional view of a reflow soldering device showing an embodiment of the present invention.
【図2】従来のリフローはんだ付け装置の一例を示す断
面図である。FIG. 2 is a sectional view showing an example of a conventional reflow soldering device.
【図3】従来のリフローはんだ付け装置の他の例を示す
断面図である。FIG. 3 is a cross-sectional view showing another example of a conventional reflow soldering device.
W 部品搭載基板 11 リフロー炉 16 傾斜ノズル 21 コンベヤ W component mounting board 11 Reflow furnace 16 Inclined nozzle 21 Conveyor
───────────────────────────────────────────────────── フロントページの続き (72)発明者 藤井 護 東京都練馬区東大泉一丁目19番43号 株式 会社タムラ製作所内 (72)発明者 安部 可伸 東京都練馬区東大泉一丁目19番43号 株式 会社タムラ製作所内 (72)発明者 外野 一夫 東京都練馬区東大泉一丁目19番43号 株式 会社タムラ製作所内 (72)発明者 内田 俊也 東京都練馬区東大泉一丁目19番43号 株式 会社タムラ製作所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Mamoru Fujii 1-1943 Higashi Oizumi, Nerima-ku, Tokyo 1-1943 Tamura Corporation (72) Inventor Yoshinobu Abe 1-1943 Higashi Oizumi, Nerima-ku, Tokyo No. 19 Tamura Manufacturing Co., Ltd. (72) Inventor Kazuo Tono 1-1943 Higashi Oizumi, Nerima-ku, Tokyo 1-43 Tamura Manufacturing Co., Ltd. (72) Toshiya Uchida 1-1943 Higashi Oizumi, Nerima-ku, Tokyo Stock Company Tamura Factory
Claims (2)
板をコンベヤによりリフロー炉内に搬入し、このリフロ
ー炉内の高温気体によりリフローはんだ付けするリフロ
ーはんだ付け装置において、 リフロー炉内の片側に、基板搬送方向に対しほぼ直角方
向であって、かつ基板面に対し片方斜めから高温気体を
吹付ける傾斜ノズルを設けたことを特徴とするリフロー
はんだ付け装置。1. A reflow soldering apparatus in which a substrate on which components are mounted via a solder paste is carried into a reflow furnace by a conveyor, and reflow soldering is performed by high-temperature gas in the reflow furnace. A reflow soldering device, characterized in that an inclined nozzle is provided which is substantially perpendicular to the carrying direction and which blows hot gas from one side obliquely to the substrate surface.
とする請求項1記載のリフローはんだ付け装置。2. The reflow soldering device according to claim 1, wherein the high temperature gas is an inert gas.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1335491A JP3007700B2 (en) | 1991-02-04 | 1991-02-04 | Reflow soldering equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1335491A JP3007700B2 (en) | 1991-02-04 | 1991-02-04 | Reflow soldering equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0550217A true JPH0550217A (en) | 1993-03-02 |
JP3007700B2 JP3007700B2 (en) | 2000-02-07 |
Family
ID=11830770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1335491A Expired - Fee Related JP3007700B2 (en) | 1991-02-04 | 1991-02-04 | Reflow soldering equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3007700B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0598367A1 (en) * | 1992-11-17 | 1994-05-25 | Matsushita Electric Industrial Co., Ltd. | Reflow apparatus and method |
EP1176629A2 (en) * | 2000-07-28 | 2002-01-30 | Planner Plc. | Method of and apparatus for heating a substrate |
US6770996B2 (en) | 1999-12-20 | 2004-08-03 | Denso Corporation | Rotary electric machine with stator elastic support structure |
-
1991
- 1991-02-04 JP JP1335491A patent/JP3007700B2/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0598367A1 (en) * | 1992-11-17 | 1994-05-25 | Matsushita Electric Industrial Co., Ltd. | Reflow apparatus and method |
US5524812A (en) * | 1992-11-17 | 1996-06-11 | Matsushita Electric Industrial Co., Ltd. | Reflow apparatus and method |
EP0753370A1 (en) * | 1992-11-17 | 1997-01-15 | Matsushita Electric Industrial Co., Ltd. | Reflow apparatus and method |
US5715990A (en) * | 1992-11-17 | 1998-02-10 | Matsushita Electric Industrial Co., Ltd. | Reflow apparatus and method |
US6770996B2 (en) | 1999-12-20 | 2004-08-03 | Denso Corporation | Rotary electric machine with stator elastic support structure |
EP1176629A2 (en) * | 2000-07-28 | 2002-01-30 | Planner Plc. | Method of and apparatus for heating a substrate |
EP1176629A3 (en) * | 2000-07-28 | 2004-04-07 | Planner Plc. | Method of and apparatus for heating a substrate |
Also Published As
Publication number | Publication date |
---|---|
JP3007700B2 (en) | 2000-02-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3638415B2 (en) | Gas atmosphere soldering equipment | |
US5567151A (en) | Reflow furnaces with hot air blow type heaters | |
US5358166A (en) | Reflow soldering apparatus | |
JPH0550217A (en) | Reflow soldering device | |
JP4041628B2 (en) | Heating device and heating method | |
JPS63177960A (en) | Reflow soldering device | |
JP2502826B2 (en) | Reflow soldering method for printed circuit boards | |
JP3072913B2 (en) | Inert gas atmosphere reflow soldering equipment | |
JP2847020B2 (en) | Reflow soldering equipment | |
JPH0629658A (en) | Heating equipment | |
JP3495204B2 (en) | Method of cooling electronic components in printed wiring board heating device | |
JP4368672B2 (en) | Circuit board heating apparatus and method, and reflow furnace equipped with the heating apparatus | |
JPH1168303A (en) | Reflow soldering device | |
JP3445349B2 (en) | Reflow equipment | |
JP2005175286A (en) | Heating device, reflow furnace having the same and heating method of circuit substrate, | |
JP3969975B2 (en) | Reflow soldering equipment | |
JP2000114710A (en) | Reflow soldering device | |
KR910003176Y1 (en) | Reflow soldering device | |
JP2502827B2 (en) | Reflow soldering equipment | |
JPH06194052A (en) | Inactive gas atmosphere furnace | |
JP3406005B2 (en) | Reflow device and reflow method | |
JP2823999B2 (en) | Low oxygen atmosphere soldering equipment | |
JPH06188556A (en) | Reflowing device | |
JPH02137666A (en) | Reflow soldering device and heating method | |
JP3432688B2 (en) | Conveyor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |