JPH0548352U - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH0548352U JPH0548352U JP106506U JP10650691U JPH0548352U JP H0548352 U JPH0548352 U JP H0548352U JP 106506 U JP106506 U JP 106506U JP 10650691 U JP10650691 U JP 10650691U JP H0548352 U JPH0548352 U JP H0548352U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor pellet
- frame
- light
- wiring board
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】
【目的】 封止枠に充填する封止材の量に多少のバラツ
キがあっても封止枠に囲まれた封止材溜のレンズ作用を
略均一化して半導体ペレットの受光面に到達する光に強
弱が起こらないようにして、半導体ペレットの受光面の
受光感度を略均一化した半導体装置を提供する。
【構成】 受光素子の受光面を有する半導体ペレット４
を配線基板１上に配置し該半導体ペレット４の電極７を
前記配線基板１上の電極８に接続し、その接続部の外側
に前記半導体ペレット４の周囲を囲む封止枠12を設け、
該封止枠12内に前記受光面が受光可能な光を透過させる
封止材５を充填して前記半導体ペレット４を前記封止材
５にて被覆するものであって、前記封止枠12は前記配線
基板１と接合される下部の開口面より上部の開口面が狭
いテーパ状に形成した。
(57) [Abstract] [Purpose] Even if there is some variation in the amount of encapsulant filled in the encapsulating frame, the lens action of the encapsulant reservoir surrounded by the encapsulating frame is made substantially uniform, and Provided is a semiconductor device in which the intensity of light reaching a light receiving surface does not occur and the light receiving sensitivity of a light receiving surface of a semiconductor pellet is substantially uniform. [Structure] Semiconductor pellet 4 having a light-receiving surface of a light-receiving element
Is disposed on the wiring board 1, the electrode 7 of the semiconductor pellet 4 is connected to the electrode 8 on the wiring board 1, and a sealing frame 12 surrounding the periphery of the semiconductor pellet 4 is provided outside the connection portion.
The sealing frame 12 is filled with a sealing material 5 that transmits light that can be received by the light receiving surface, and the semiconductor pellets 4 are covered with the sealing material 5. Is formed in a tapered shape in which the upper opening surface is narrower than the lower opening surface joined to the wiring board 1.
Description
【０００１】[0001]
この考案は、樹脂、金属、セラミック等の配線基板上に受光素子の受光面を有 する半導体ペレットを直付けする構造の半導体装置に関するものである。 The present invention relates to a semiconductor device having a structure in which a semiconductor pellet having a light receiving surface of a light receiving element is directly attached on a wiring board made of resin, metal, ceramic or the like.
【０００２】[0002]
一般に、この種の半導体装置としては、例えば図２に示すように樹脂、金属、 セラミック等の配線基板１上に受光素子の受光面を有する半導体ペレット４（以 下、単に半導体ペレットと略す）を直接接着して搭載し、半導体ペレット４の電 極７と配線基板１上の電極８とをワイヤーボンディングして接続する。２は樹脂 、金属、セラミック等で形成した封止枠で配線基板１上に接着剤により固着され 、ワイヤーボンディングによる接続部（半導体ペレット４の電極７と配線基板１ 上の電極８）の周囲に略均一の高さで配置される。半導体ペレット４とワイヤー ボンディングによる接続部（半導体ペレット４の電極７と配線基板１上の電極８ ）は封止枠２の枠内に配置され、この封止枠２の枠内に液状の封止材５を図示し ないディスペンサ（供給機）を用いて略一定の量づつ自動的に充填する。この封 止材５は半導体ペレット４の受光面が受光可能な光を透過させる材料を選んであ る。封止枠２は封止材５の流れを防止し、硬化する封止材５が半導体ペレット４ とワイヤーボンディングによる接続部を被覆して封止枠２に囲まれた封止材溜を 形成する。３は図示しないリモートコントロール装置の一部を構成し、制御用の 光信号として、赤外線を送出する発光素子で、この発光素子３からの赤外線は封 止材５を透過して半導体ペレット４の受光面に到達し、半導体ペレット４の受光 面は制御用の光信号を受光して発光素子３と半導体ペレット４の間に光結合回路 が構成される。 Generally, as a semiconductor device of this type, for example, as shown in FIG. 2, a semiconductor pellet 4 (hereinafter simply referred to as a semiconductor pellet) having a light receiving surface of a light receiving element on a wiring substrate 1 made of resin, metal, ceramic or the like is used. The electrode 7 of the semiconductor pellet 4 and the electrode 8 on the wiring board 1 are connected by wire bonding. Reference numeral 2 denotes a sealing frame made of resin, metal, ceramic or the like, which is fixed on the wiring board 1 by an adhesive and surrounds the connection portion (the electrode 7 of the semiconductor pellet 4 and the electrode 8 on the wiring board 1) by wire bonding. They are arranged at a substantially uniform height. The semiconductor pellet 4 and the connection portion by wire bonding (the electrode 7 of the semiconductor pellet 4 and the electrode 8 on the wiring board 1) are arranged in the frame of the sealing frame 2, and the liquid sealing is performed in the frame of the sealing frame 2. The material 5 is automatically filled in a substantially constant amount using a dispenser (not shown). The sealing material 5 is made of a material that transmits light that can be received by the light receiving surface of the semiconductor pellet 4. The encapsulation frame 2 prevents the encapsulation material 5 from flowing, and the encapsulation material 5 that hardens covers the semiconductor pellet 4 and the connection portion by wire bonding to form an encapsulation material reservoir surrounded by the encapsulation frame 2. .. Reference numeral 3 is a part of a remote control device (not shown), which is a light emitting element that sends out infrared rays as an optical signal for control. The infrared rays from this light emitting element 3 pass through the sealing material 5 and are received by the semiconductor pellet 4. After reaching the surface, the light receiving surface of the semiconductor pellet 4 receives an optical signal for control to form an optical coupling circuit between the light emitting element 3 and the semiconductor pellet 4.
【０００３】[0003]
ところで、封止枠２内への封止材５の充填はディスペンサ（供給機）を用いて 自動的に行われているが、ディスペンサ（供給機）が封止材５を封止枠２内に供 給する量に多少のバラツキがあり、図３の（ａ）に示すように封止枠２内に封止 材５の量を多めに充填して半導体ペレット４上に充分な盛り上がりのある封止材 溜を形成すると、封止材５は封止枠２に対して盛り上がり封止枠２に囲まれた封 止材溜は凸レンズの作用を持つ。図３の（ｂ）に示すように封止枠２内に封止材 ５の量を少なめに充填して半導体ペレット４上に盛り上がりの少ない封止材溜を 形成すると、封止材５は封止枠２に対して凹んで封止枠２に囲まれた封止材溜は 凹レンズの作用を持つ。このようにディスペンサ（供給機）が封止材５を封止枠 ２内に供給する量のバラツキから、封止枠２に充填する封止材５の量がバラツイ て、封止枠２に囲まれた封止材溜が凸レンズまたは凹レンズの作用を持つと半導 体ペレット４の受光面に到達する光に強弱が起こり半導体ペレット４の受光面の 受光感度にバラツキが発生するという問題があり改良がのぞまれていた。 By the way, the filling of the sealing material 5 into the sealing frame 2 is automatically performed using a dispenser (supply machine), but the dispenser (supply machine) places the sealing material 5 in the sealing frame 2. There is some variation in the amount to be supplied, and as shown in FIG. 3 (a), a large amount of the sealing material 5 is filled in the sealing frame 2 so that the semiconductor pellet 4 has a sufficient protrusion. When the sealing material reservoir is formed, the sealing material 5 rises up with respect to the sealing frame 2 and the sealing material reservoir surrounded by the sealing frame 2 acts as a convex lens. As shown in FIG. 3 (b), when the sealing frame 2 is filled with a small amount of the sealing material 5 to form a sealing material reservoir on the semiconductor pellet 4 with less swelling, the sealing material 5 is sealed. The encapsulant reservoir which is recessed with respect to the stop frame 2 and surrounded by the encapsulation frame 2 has a function of a concave lens. As described above, the amount of the sealing material 5 to be filled in the sealing frame 2 varies due to the variation in the amount of the sealing material 5 supplied into the sealing frame 2 by the dispenser (supply device). If the encapsulating material reservoir has the function of a convex lens or a concave lens, the light reaching the light receiving surface of the semiconductor pellet 4 will have a different intensity, and the light receiving sensitivity of the light receiving surface of the semiconductor pellet 4 will vary. I was hoping.
【０００４】 この考案は封止枠に充填する封止材の量に多少のバラツキがあっても封止枠に 囲まれた封止材溜のレンズ作用を略均一化して半導体ペレットの受光面に到達す る光に強弱が起こらないようにして、半導体ペレットの受光面の受光感度を略均 一化した半導体装置を提供することを目的とする。According to this invention, even if there is some variation in the amount of the sealing material filled in the sealing frame, the lens action of the sealing material reservoir surrounded by the sealing frame is made substantially uniform, and the light receiving surface of the semiconductor pellet is It is an object of the present invention to provide a semiconductor device in which the intensity of light that reaches it is prevented from occurring and the light receiving sensitivity of the light receiving surface of the semiconductor pellet is substantially equalized.
【０００５】[0005]
本考案では、受光素子の受光面を有する半導体ペレットを配線基板の表面に配 置し該半導体ペレットの電極を前記配線基板上の電極に接続し、その接続部の外 側に前記半導体ペレットの周囲を囲む封止枠を設け、該封止枠内に前記受光面が 受光可能な光を透過させる封止材を充填して前記半導体ペレットを前記封止材に て被覆するものであって、前記封止枠は前記配線基板と接合される下部の開口面 より上部の開口面が狭いテーパ状に形成して半導体装置を構成した。 In the present invention, a semiconductor pellet having a light receiving surface of a light receiving element is arranged on the surface of a wiring board, the electrode of the semiconductor pellet is connected to the electrode on the wiring board, and the periphery of the semiconductor pellet is provided outside the connection part. A sealing frame surrounding the semiconductor pellet is filled with a sealing material that transmits light that can be received by the light receiving surface, and the semiconductor pellet is covered with the sealing material. The sealing frame was formed in a taper shape in which the upper opening surface was narrower than the lower opening surface to be joined to the wiring board to form a semiconductor device.
【０００６】[0006]
本考案の半導体装置では、受光素子の受光面を有する半導体ペレットの周囲を 囲む封止枠を配線基板と接合される下部の開口面より上部の開口面が狭いテーパ 状に形成したので、封止枠内に少なめに封止材を充填しても封止枠内には半導体 ペレット上に充分な盛り上がりのある封止材溜ができるので、封止枠に充填する 封止材の量は封止枠内に少なめに充填すればよく封止枠に囲まれた封止材溜のレ ンズ作用は略均一化される。 In the semiconductor device of the present invention, the sealing frame surrounding the periphery of the semiconductor pellet having the light-receiving surface of the light-receiving element is formed in a taper shape in which the upper opening surface is narrower than the lower opening surface to be joined to the wiring board. Even if a small amount of the sealing material is filled in the frame, a sufficient amount of sealing material can be accumulated on the semiconductor pellets in the sealing frame. The lens action of the encapsulant reservoir surrounded by the encapsulating frame can be made substantially uniform by filling the inside of the frame with a small amount.
【０００７】[0007]
以下本考案の実施例を図面に従って説明する。図１の（ａ）は本考案の半導体 装置の縦断面図、図１の（ｂ）は（ａ）に使用される配線基板の概略の構造を示 す上面図である。 Embodiments of the present invention will be described below with reference to the drawings. 1A is a vertical cross-sectional view of a semiconductor device of the present invention, and FIG. 1B is a top view showing a schematic structure of a wiring board used in FIG.
【０００８】 図１（ｂ）に示すように樹脂、金属、セラミック等の配線基板１の表面には四 角い半導体ペレット４の各辺を略平行に囲む封止枠12が設けられている。図１（ ａ）に示すように配線基板１の上に受光素子の受光面を有する半導体ペレット４ を直接接着して搭載し、半導体ペレット４の電極７と配線基板１上の電極８とを ワイヤーボンディングして接続する。12は樹脂、金属、セラミック等で形成した 封止枠で配線基板１上に接着剤により固着され、ワイヤーボンディングによる接 続部（半導体ペレット４の電極７と配線基板１上の電極８）の周囲を覆うように 配置される。封止枠12は下部の接合面より上部の開口面６が狭いテーパ状に形成 されている。半導体ペレット４とワイヤーボンディングによる接続部（半導体ペ レット４の電極７と配線基板１上の電極８）は封止枠12の枠内に配置され、この 封止枠12の枠内に温めて溶解させた封止材５を図示しないディスペンサ（供給機 ）を用いて略一定の量づつ自動的に充填する。この封止材５は半導体ペレット４ の受光面が受光可能な光を透過させる材料を選んである。封止枠12は封止材５の 流れを防止し、温度の低下とともに硬化する封止材５が半導体ペレット４とワイ ヤーボンディングによる接続部を被覆して封止枠12に囲まれた封止材溜を形成す る。図２で説明したのと同様に、図示しないディスペンサ（供給機）が封止材５ を封止枠12内に供給する量に多少のバラツキがあるので、図１の実施例ではディ スペンサ（供給機）の供給が封止枠12内に少なめに封止材５を充填しているが、 封止枠12は下部の接合面より上部の開口面６が狭いテーパ状に形成されているの で封止枠内には半導体ペレット上に充分な盛り上がりのある封止材溜ができる。 ディスペンサ（供給機）が封止枠12内に封止材５を多く充填する場合でも、封止 材５の表面は封止枠12の上部の開口面６から低い位置となり封止枠12に対して凹 みを形成する。そのためディスペンサ（供給機）から封止枠12内に供給される封 止材５の量に多少のバラツキがあっても、封止枠12に囲まれた封止材溜は凹レン ズの作用に統一される。３は図示しないリモートコントロール装置の一部を構成 し、制御用の光信号として、赤外線を送出する発光素子で、この発光素子３から の赤外線は封止材５を透過して半導体ペレット４の受光面に到達し、半導体ペレ ット４の受光面は制御用の光信号を受光して発光素子３と半導体ペレット４の間 に光結合回路が構成される。一方、図１の実施例では、封止枠12に囲まれた封止 材溜は、ディスペンサ（供給機）が封止材５を封止枠２内に供給する量のバラツ キによらず凹レンズの作用を持つから、半導体ペレット４の受光面に到達する光 の強さは略同様となり、半導体ペレット４の受光面の受光感度は均一化される。As shown in FIG. 1B, a sealing frame 12 is provided on the surface of the wiring board 1 made of resin, metal, ceramics or the like so as to surround each side of the rectangular semiconductor pellet 4 substantially in parallel. As shown in FIG. 1A, a semiconductor pellet 4 having a light receiving surface of a light receiving element is directly adhered and mounted on a wiring board 1, and an electrode 7 of the semiconductor pellet 4 and an electrode 8 on the wiring board 1 are wired. Bond and connect. 12 is a sealing frame made of resin, metal, ceramic or the like, which is fixed on the wiring board 1 with an adhesive and surrounds the connection portion (the electrode 7 of the semiconductor pellet 4 and the electrode 8 on the wiring board 1) by wire bonding. It is arranged so as to cover. The sealing frame 12 is formed in a tapered shape in which the upper opening surface 6 is narrower than the lower bonding surface. The connection between the semiconductor pellet 4 and the wire bonding (the electrode 7 of the semiconductor pellet 4 and the electrode 8 on the wiring board 1) is placed in the frame of the sealing frame 12, and is heated in the frame of the sealing frame 12 and melted. The sealing material 5 thus prepared is automatically filled in a substantially constant amount by using a dispenser (not shown). The sealing material 5 is made of a material that transmits light that can be received by the light receiving surface of the semiconductor pellet 4. The encapsulating frame 12 prevents the encapsulating material 5 from flowing, and the encapsulating material 5 that hardens with a decrease in temperature covers the semiconductor pellet 4 and the connection portion by wire bonding and is enclosed by the encapsulating frame 12. Form a timber pool. As described with reference to FIG. 2, there is some variation in the amount of the sealing material 5 supplied into the sealing frame 12 by the dispenser (supply device) not shown, so that in the embodiment of FIG. The sealing material 5 is slightly filled in the sealing frame 12, but since the sealing frame 12 has a taper shape in which the upper opening surface 6 is narrower than the lower joining surface. In the encapsulation frame, an encapsulant reservoir with a sufficient rise can be formed on the semiconductor pellet. Even when the dispenser (supply machine) fills the sealing frame 12 with a large amount of the sealing material 5, the surface of the sealing material 5 is located lower than the opening surface 6 at the top of the sealing frame 12 and To form a recess. Therefore, even if there is some variation in the amount of the sealing material 5 supplied from the dispenser (supply machine) into the sealing frame 12, the sealing material reservoir surrounded by the sealing frame 12 does not function as a concave lens. Be unified. Reference numeral 3 is a part of a remote control device (not shown), which is a light emitting element that sends out infrared rays as an optical signal for control. The infrared rays from this light emitting element 3 pass through the sealing material 5 and are received by the semiconductor pellet 4. Upon reaching the surface, the light receiving surface of the semiconductor pellet 4 receives an optical signal for control to form an optical coupling circuit between the light emitting element 3 and the semiconductor pellet 4. On the other hand, in the embodiment shown in FIG. 1, the encapsulating material reservoir surrounded by the encapsulating frame 12 is a concave lens regardless of the variation in the amount of the encapsulating material 5 supplied into the encapsulating frame 2 by the dispenser. The light intensity reaching the light receiving surface of the semiconductor pellet 4 is substantially the same, and the light receiving sensitivity of the light receiving surface of the semiconductor pellet 4 is made uniform.
【０００９】[0009]
以上説明したように、本考案の半導体装置では、受光素子の受光面を有する半 導体ペレットの周囲を囲む封止枠を配線基板と接合される下部の開口面より上部 の開口面が狭いテーパ状に形成したので、封止枠内に少なめに封止材を充填して も封止枠内には半導体ペレット上に充分な盛り上がりのある封止材溜ができるの で、封止枠に充填する封止材の量は封止枠内に少なめに充填しても差支えなく、 封止枠に囲まれた封止材溜のレンズ作用は凹レンズに統一できる。したがって、 封止枠に囲まれた封止材溜は、ディスペンサ（供給機）が封止材を封止枠内に供 給する量のバラツキによらず、半導体ペレットの受光面に到達する光の強さは略 同様となり、半導体ペレットの受光面の受光感度は均一化される等優れたもので ある。 As described above, in the semiconductor device of the present invention, the sealing frame surrounding the periphery of the semiconductor pellet having the light receiving surface of the light receiving element has a tapered shape in which the upper opening surface is narrower than the lower opening surface joined to the wiring board. Since it is formed in the sealing frame, even if the sealing frame is filled with a small amount of sealing compound, there will be a sufficient swelling of the sealing medium on the semiconductor pellets in the sealing frame. There is no problem even if the amount of the encapsulating material is small in the encapsulating frame, and the lens action of the encapsulating material reservoir surrounded by the encapsulating frame can be unified to the concave lens. Therefore, the encapsulant reservoir surrounded by the encapsulation frame is not affected by the variation in the amount of the encapsulant dispensed by the dispenser into the encapsulation frame. The strengths are almost the same, and the light receiving sensitivity of the light receiving surface of the semiconductor pellet is uniform, which is excellent.
【図１】本考案の一実施例を示し、図１の（ａ）は本考
案の縦断面図、図１の（ｂ）は（ａ）に使用される配線
基板の概略の構造を示す上面図である。1 shows an embodiment of the present invention, FIG. 1 (a) is a vertical sectional view of the present invention, and FIG. 1 (b) is a top view showing a schematic structure of a wiring board used in (a). It is a figure.
【図２】従来例を示し、図２の（ａ）は従来例の縦断面
図、図２の（ｂ）は（ａ）に使用される配線基板の概略
の構造を示す上面図である。2 shows a conventional example, FIG. 2 (a) is a vertical cross-sectional view of the conventional example, and FIG. 2 (b) is a top view showing a schematic structure of a wiring board used in FIG. 2 (a).
【図３】課題を説明するための従来例の状況を示す図
で、図３の（ａ）と（ｂ）は従来例の縦断面図である。FIG. 3 is a diagram showing a situation of a conventional example for explaining a problem, and FIGS. 3A and 3B are vertical sectional views of the conventional example.
１ 配線基板 ３ 発光素子 ４ 半導体ペレット ５ 封止材 ６ 開口面 ７ 半導体ペレットの電極 ８ 配線基板の表面の電極 10 配線基板の裏面の電極 12 封止枠 DESCRIPTION OF SYMBOLS 1 Wiring board 3 Light emitting element 4 Semiconductor pellet 5 Encapsulating material 6 Opening surface 7 Semiconductor pellet electrode 8 Electrode on front surface of wiring board 10 Electrode on back surface of wiring board 12 Sealing frame
Claims (1)
トを配線基板上に配置し該半導体ペレットの電極を前記
配線基板上の電極に接続し、その接続部の外側に前記半
導体ペレットの周囲を囲む封止枠を設け、該封止枠内に
前記受光面が受光可能な光を透過させる封止材を充填し
て前記半導体ペレットを前記封止材にて被覆するもので
あって、前記封止枠は前記配線基板と接合される下部の
開口面より上部の開口面が狭いテーパ状に形成したこと
を特徴とする半導体装置。1. A semiconductor pellet having a light-receiving surface of a light-receiving element is arranged on a wiring board, an electrode of the semiconductor pellet is connected to an electrode on the wiring board, and the periphery of the semiconductor pellet is surrounded outside the connection portion. A sealing frame is provided, the sealing frame is filled with a sealing material that transmits light that can be received by the light receiving surface, and the semiconductor pellet is covered with the sealing material. A semiconductor device, wherein the frame has a tapered shape in which an upper opening surface is narrower than a lower opening surface joined to the wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP106506U JPH0548352U (en) | 1991-11-29 | 1991-11-29 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP106506U JPH0548352U (en) | 1991-11-29 | 1991-11-29 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0548352U true JPH0548352U (en) | 1993-06-25 |
Family
ID=14435317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP106506U Pending JPH0548352U (en) | 1991-11-29 | 1991-11-29 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0548352U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004055847A (en) * | 2002-07-19 | 2004-02-19 | Matsushita Electric Works Ltd | Circuit-sealing structure and fire detector |
| CN106257652A (en) * | 2015-06-16 | 2016-12-28 | 台达电子企业管理（上海）有限公司 | Package module |
-
1991
- 1991-11-29 JP JP106506U patent/JPH0548352U/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004055847A (en) * | 2002-07-19 | 2004-02-19 | Matsushita Electric Works Ltd | Circuit-sealing structure and fire detector |
| CN106257652A (en) * | 2015-06-16 | 2016-12-28 | 台达电子企业管理（上海）有限公司 | Package module |
| US10123428B2 (en) | 2015-06-16 | 2018-11-06 | Delta Electronics (Shanghai) Co., Ltd. | Package module |
| US10314178B2 (en) | 2015-06-16 | 2019-06-04 | Delta Electronics (Shanghai) Co., Ltd. | Package module |
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