KR100206860B1 - Plastic type charge couple device package and its manufacturing method - Google Patents
Plastic type charge couple device package and its manufacturing method Download PDFInfo
- Publication number
- KR100206860B1 KR100206860B1 KR1019910022694A KR910022694A KR100206860B1 KR 100206860 B1 KR100206860 B1 KR 100206860B1 KR 1019910022694 A KR1019910022694 A KR 1019910022694A KR 910022694 A KR910022694 A KR 910022694A KR 100206860 B1 KR100206860 B1 KR 100206860B1
- Authority
- KR
- South Korea
- Prior art keywords
- state image
- image pickup
- solid
- pickup device
- lead frame
- Prior art date
Links
- 229920003023 plastic Polymers 0.000 title claims abstract description 48
- 239000004033 plastic Substances 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 238000005538 encapsulation Methods 0.000 claims abstract description 20
- 238000003384 imaging method Methods 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 24
- 239000007787 solid Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 239000002775 capsule Substances 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 230000035699 permeability Effects 0.000 claims description 6
- 238000009966 trimming Methods 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 abstract description 7
- 238000002834 transmittance Methods 0.000 abstract description 7
- 239000011521 glass Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
본 고안은 플라스틱 타입 고체 촬상소자 패키지 구조 및 그 제조방법에 관한 것으로, 종래의 세라믹을 이용하여 제작하던 패키지를 저가이며 성형성이 우수한 투명플라스틱으로 제작함과 아울러 그 내부의 소자를 빛의 투과성이 뛰어난 겔 타입의 인캡슐레이션물질로 인캡슐레이션하여 저가의 양산성이 뛰어난 플라스틱 타입고체 촬상소자 패키지를 쉽게 상품화시킬 수 있도록 구성한 것이며, 또 상기 인캡슐레이션을 구형상의 타원체로 형성하여 투과되는 빛을 집속시키는 렌즈역할을 하게 함으로써 투명플라스틱이 가지는 빛의 투과성 문제를 어느정도 보와시킨 것임을 특징으로 하고있다.The present invention relates to a plastic type solid-state image pickup device package structure and a method of manufacturing the same. The present invention is to manufacture a package made of a conventional ceramic using a transparent plastic having low moldability and excellent moldability, and to transmit light inside the device. It is composed to encapsulate with excellent gel type encapsulation material so that it is easy to commercialize plastic type solid-state imaging device package which is excellent in mass production at low cost. In addition, the encapsulation is formed into a spherical ellipsoid to transmit light. It is characterized by the fact that it acts as a lens that focuses to some extent to solve the problem of the light transmittance of transparent plastics.
또한, 외부의 몰드형상도 그 표면을 내부의 인캡슐레이션 형상과 같이 둥글게 형성하여 렌즈 역할을 하게 함으로써 빛의 투과성을 가일층 높인 플라스틱 타입 고체 촬상소자가 제공되어 있다.In addition, a plastic type solid-state imaging device is further provided in which the external mold shape is formed to be rounded like the encapsulation shape of the inside to act as a lens to further increase light transmittance.
Description
제1도는 종래의 일반적인 세라믹 타입 고체 촬상소자 패키지의 구성을 보이는 단면도.1 is a cross-sectional view showing the configuration of a conventional general ceramic type solid-state image sensor package.
제2도는 본 발명에 의한 플라스틱 타입 고체 촬상소자 패키지의 구성을 보이는 단면도.2 is a cross-sectional view showing the configuration of a plastic type solid-state image sensor package according to the present invention.
제3도 및 제4도는 본 발명의 다른 실시에를 도시한 도면으로서 외부몰드형태가 둥글게 형성된 플라스틱 타입고체 촬상소자 패키지의 단면도.3 and 4 are views showing another embodiment of the present invention, a cross-sectional view of a plastic type solid-state imaging device package in which the outer mold is rounded.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
11 : 고체촬상소자(CCD : Charge Couple Device)11: Solid State Imaging Device (CCD: Charge Couple Device)
11a : 본드패드(Bond Pad) 12 : 리드프레임(Lead Frame)11a: Bond Pad 12: Lead Frame
12a, 12b : 내. 외부리드 13 : 접착제12a, 12b: mine. Outer Lead 13: Adhesive
14 : 금속와이어 15 : 캡슐(Capsule)14 metal wire 15 capsule
16 : 투명플라스틱(Clear Plastic)16: Clear Plastic
본 발명은 플라스틱 타입 고체촬상소자(CCD : Charge Couple Device) 패키지 및 그 제조방법에 관한 것으로, 특히 저가의 투명플라스틱(Clear Plastic)을 이용하여 패키지를 제작하고, 그 내부의 소자를 빛의 투과성이 뛰어난 겔 타입(Gel Type)의 물질로 인캡슐레이션(Encapsulation)함과 아울러 렌즈(Lense)의 역할을 하도록 구형상의 타원체로 형성하여 빛의 투과성을 높임으로써 저가이면서도 양산성이 뛰어난 고체 촬상소자 패키지 제작에 적합하도록 한 플라스틱 타입 고체 촬상소자 패키지 및 그 제조방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a plastic type charge imaging device (CCD) package and a method of manufacturing the same. Particularly, a package is manufactured by using a low-cost transparent plastic, and the inside of the device has a light permeability. Manufacture of solid-state imaging package with excellent low-cost and high-volume mass by forming encapsulation with excellent gel type material and forming spherical ellipsoid to act as lens to increase light transmittance The present invention relates to a plastic type solid-state image sensor package and a method of manufacturing the same.
일반적으로 알려지고 있는 종래의 세라믹 타입(Ceramic Type)고체 촬상소자(CCD : Charge Couple Device) 패키지(Package)는 제1도에 도시한 바와 같이 복수개의 본드패드(Bond Pad)(1a) 가 구비된 고체촬상소자(1)와, 그 고체촬상소자(1)가 안착되는 캐비티(Cavity)(2a)가 구비됨과 아울러 상측에는 노출공(2b)이 형성된 패키지본체(2)와, 그 패키지본체(2)의 노출공(2b)에 탑재되는 글라스리드(Glass Lid)(3)와, 상기 고체촬상소자(1)의 본드패드(1a)와 패키지 본체(2)에 형성된 메탈라인(Metal Line) (4)을 전기적으로 접속 연결시키는 금속와이어(5)와, 기판(도시되지 않음)과의 접속을 위한 리드프레임(6)으로 구성되어 있다.Conventionally known ceramic type (CCD) charge couple device (CCD) packages are provided with a plurality of bond pads 1a as shown in FIG. A solid state image pickup device 1, a cavity 2a on which the solid state image pickup device 1 is mounted, and a package body 2 having an exposed hole 2b formed thereon, and the package body 2 Glass lead (3) mounted in the exposed hole (2b) of the (2)), the metal pad (4) formed in the bond pad (1a) and the package body (2) of the solid-state imaging device (4) (4) ) Is composed of a metal wire 5 for electrically connecting and connecting a lead wire 6 to a substrate (not shown).
도면 중 미설명 부호 7은 고체촬상소자(1)를 부착 고정하기 위한 접착제를 보인 것이고, 8은 글라스리드(3)를 밀봉시키기 위한 저융점 실런트를 보인 것이다.In the figure, reference numeral 7 shows an adhesive for attaching and fixing the solid state image pickup device 1, and 8 shows a low melting point sealant for sealing the glass lid 3.
이와같이 구성되는 종래의 고체 촬상소자 패키지는 통상, 세리믹을 이용하여 그린테이프포밍(Green Tape Forming)을 하고, 텅스텐 (W)등의 도전성 금속으로 스크린 프린팅(Screen Printing)하여 복수개의 메탈라인(4)을 형성한 후, 다층의 레이어(Layer)를 소성하고, 양측으로 노출된 메탈라인(4)에 리드프레임(6)을 브레이징(Brazing) 접합한 다음 금속(Ni/Au)도금을 행하는 순서로 제작된 패키지본체(2)의 캐비티(2a)에 고체촬상소자(1)를 접착제(7)로 부착고정하여, 그 고체촬상소자(1)의 본드패드(1a)와, 패키지본체(2)의 메탈라인(4)을 금속와이어(5)를 이용하여 전기적으로 접속연결시키는 와이어본딩(Wire Bonding)공정을 수행한 다음 패키지본체(2)의 상측 노출공(2b)에 글라스리드(3)를 탑재하여 저융점실런트(Sealent)(8)로 밀봉(Sealing)하는 공정의 순서로 제작된다.The conventional solid-state imaging device package configured as described above is typically green tape formed using a ceramic and screen printed with a conductive metal such as tungsten (W) to form a plurality of metal lines 4. ), The multilayered layers are fired, the lead frame 6 is brazed to the metal lines 4 exposed on both sides, and metal (Ni / Au) plating is performed in this order. The solid state image pickup device 1 is attached and fixed to the cavity 2a of the manufactured package body 2 with an adhesive 7, and the bond pads 1a of the solid state image pickup device 1 and the package body 2 After performing a wire bonding process of electrically connecting the metal line 4 to the metal wire 5 by using the metal wire 5, the glass lead 3 is mounted in the upper exposed hole 2b of the package body 2. It is produced in the order of the process of sealing with a low melting sealant (Sealent) (8).
그러나, 상기한 바와같은 종래의 세라믹 타입 고체 촬상소자 패키지는 상기한 바와같이 원재료인 알루미나(Alumina)를 이용하여 고온고압의 복잡한 제조공정을 거쳐 패키지본체(2)를 제작한 후 다이어태치공정 및 와이어본딩공정을 수행하고, 패키지의 상측 노출공(2b)에 글라스리드(3)를 탑재하여 저융점실런트(8)로 밀봉하는 제조공정의 순서로 제작되므로 제조원가가 상승하게 되고, 제작시간이 길어지며, 대량생산 뿐만아니라 개발을 위한 소량생산에도 적절하게 부응하지 못하는 결함이 있었다. 또한, 저융점실런트(8)를 이용하여 패키지본체(2)와 글라스리드(3)를 밀봉시키는 구조이므로 완전한 밀봉이 어렵고, 이러한 이유로 패키지의 신뢰성이 저하되는 결함이 있었다.However, the conventional ceramic type solid-state image sensor package as described above is a die-attach process and wire after fabricating the package body (2) through a complicated manufacturing process of high temperature and high pressure using alumina (raw material) as described above Since the manufacturing process is performed in the manufacturing process of performing the bonding process and mounting the glass lead 3 in the upper exposed hole 2b of the package and sealing it with the low melting point sealant 8, the manufacturing cost increases and the production time becomes long. There was also a flaw that could not adequately respond to mass production as well as small production for development. In addition, since the structure of sealing the package body 2 and the glass lead 3 using the low melting point sealant 8, it is difficult to completely seal, and for this reason, there is a defect that the reliability of the package is lowered.
한편, 종래의 세라믹 타입 고체 촬상소자 패키지는 패키지본체(2)의 사이즈가 일정하게 정해져 제작되므로 좀더 큰 칩을 사용하게 되면, 충분한 와이어본딩 영역이 제공되지 않아 패키지 제작에 한계가 있는 것이었다.On the other hand, the conventional ceramic type solid-state image pickup device package is made of a fixed size of the package body (2), if a larger chip is used, there is a limit in the manufacture of the package because the sufficient wire bonding area is not provided.
이를 감안하여 창안한 본 발명의 목적은 고체 촬상소자의 패키지를 저가의 투명플라스틱으로 제작함과 아울러 그 내부의 소자를 빛의 투과성이 뛰어난 겔 타입(Gel Type)의 물질로 인캡슐레이션(Encapsulation)하여 저가의 플라스틱 타입 고체 촬상소자 패키지를 대량 생산할 수 있도록 한 플라스틱 타입 고체 촬상소자 패키지 및 그 제조방법을 제공함에 있다.In view of this, an object of the present invention is to manufacture a package of a solid-state imaging device with a low-cost transparent plastic and encapsulate the inside of the device with a gel type material having excellent light permeability. The present invention provides a plastic type solid-state image sensor package and a method of manufacturing the same to enable mass production of a low-cost plastic type solid-state image sensor package.
본 발명의 다른 목적은 내부의 인캡슐레이션 모양을 둥글게 형성하여 투과되는 빛을 접속하는 렌즈(Lens) 역할을 하게 함으로써 약하게 투과된 빛을 보완시킨 플라스틱 타입 고체 촬상소자 패키지 및 그 제조방법을 제공함에 있다.It is another object of the present invention to provide a plastic type solid-state image pickup device package and a method of manufacturing the same, in which the encapsulation shape is rounded to serve as a lens for connecting the transmitted light to compensate for the weakly transmitted light. have.
본 발명의 또다른 목적은 패키지 외부에 몰딩된 투명플라스틱의 표면을 내부의 인캡슐레이션과 같이 둥글게 형성하여 렌즈 역할을 하게 함으로써 투과되는 빛의 산란을 줄여 빛의 투과성을 가일층 높인 플라스틱 타입 고체 촬상소자 패키지 및 그 제조방법을 제공함에 있다.Another object of the present invention is to form a round surface of the transparent plastic molded on the outside of the package, such as encapsulation inside, to act as a lens to reduce the scattering of the transmitted light to further enhance the light transmission of the plastic type solid-state imaging device The present invention provides a package and a method of manufacturing the same.
상기와 같은 본 발명의 목적은 소잉(Sawing)공정에 의해 개개로 분리된 고체 촬상소자를 복수개의 내.외부리드가 구비된 리드프레임에 접착제를 이용하여 부착 고정하는 다이어태치공정과, 다이어태치된 소자의 본드패드와 리드프레임의 내부리드를 금속와이어를 이용하여 전기적으로 접속 연결시키는 와이어본딩공정과, 와이어본딩공정이 끝난 소자를 빛의 투과성이 뛰어난 겔 타입의 물지로 둥글게 인캡슐레이션하는 공정과, 인캡슐레이션된 소자와 리드프레임의 외부리드를 포함하는 일정부위를 투명플라스틱으로 밀폐시키는 몰딩공정과, 통상적인 트리밍/포밍공정을 포함하여 제작함을 특징으로 하는 플라스틱 타입 고체 촬상소자 패키지 및 그 제조방법을 제공함으로써 달성되는 것이다.An object of the present invention as described above is a die attach process for attaching and fixing a solid-state imaging device individually separated by a sawing process, using an adhesive to a lead frame provided with a plurality of inner and outer leads, A wire bonding process of electrically connecting the bond pads of the device and the inner lead of the lead frame using metal wires, and a process of encapsulating the device after the wire bonding process with a gel-type material having excellent light permeability, and And a plastic type solid-state imaging device package comprising a molding process for sealing a portion including an encapsulated element and an external lead of a lead frame with a transparent plastic, and a conventional trimming / forming process. It is achieved by providing a manufacturing method.
이하에서는 이러한 본 발명을 첨부한 도면의 바람직한 실시예를 들어 좀더 상세히 설명하겠다.Hereinafter, a preferred embodiment of the accompanying drawings of the present invention will be described in more detail.
제2도는 본 발명에 플라스틱 타입 고체 촬상소자 패키지의 일실시예를 도시한 단면도로서 이에 도시한 바와같이 본 발명에 의한 플라스틱 타입 고체 촬상소자 패키지는 복수개의 본드패드(11a)가 구비된 고체촬상소자(11)와, 그 고체촬상소자(11)가 탑재되는 리드프레임(12)과, 그 리드프레임(12)에 고체촬상소자(11)를 부착 고정하기 위한 접착제(13)와, 다이어태치된 고체촬상소자(11)와 상기 리드프레임(12)을 전기적으로 접속 연결시키기 위한 복수개의 금속와이어(14)와, 와이어본딩된 고체촬상소자(11)를 인캡슐레이션 하기 위한 겔 타입(Gel Type)이 내장된 캡슐(Capsule)(15)과, 인캡슐레이션된 고체촬상소자(11)와 리드프레임(12)을 포함하는 일정부위를 몰딩하기 위한 투명플라스틱(16)으로 구성되어 있다.2 is a cross-sectional view showing an embodiment of a plastic type solid-state image pickup device package according to the present invention. As shown in the drawing, the plastic type solid-state image pickup package according to the present invention includes a solid state image pickup device having a plurality of bond pads 11a. (11), a lead frame (12) on which the solid state image pickup device (11) is mounted, an adhesive (13) for attaching and fixing the solid state image pickup device (11) to the lead frame (12), and a die attached solid A plurality of metal wires 14 for electrically connecting the image pickup device 11 and the lead frame 12 and a gel type for encapsulating the wire-bonded solid-state image pickup device 11 are provided. It consists of a built-in capsule (15), a transparent plastic 16 for molding a predetermined portion including the encapsulated solid state image pickup device 11 and the lead frame (12).
상기 리드프레임(12)은 고체촬상소자(11)의 본드패드(11a)와 금속와이어(14)로 연결되는 복수개의 내부리드(12a)와 그 내부리드(12a)의 양측에 연장형성된 외부리드(12b)로 구성되어 있으며, 상기 내부리드(12a)의 상측에 접착제(13)를 이용하여 고체촬상소자(11)를 부착고정하도록 되어있다.The lead frame 12 includes a plurality of inner leads 12a connected to the bond pads 11a of the solid state image pickup device 11 and the metal wires 14 and external leads extending on both sides of the inner leads 12a. 12b), and the solid state imaging element 11 is attached and fixed to the upper side of the inner lead 12a using an adhesive 13.
또한, 상기 고체촬상소자(11)를 인캡슐레이션하기 위한 겔 타입의 캡슐(15)에는 클리어 몰드 컴파운드(Clear Mold Compound)나 또는 유동성의 인캡슐레이션 물질을 내장시켜 그 외부의 투명플라스틱(16)에 의해 약하게 투과된 빛을 보완하는 역할을 하도록 되어 있는 바, 통상 그 모양을 구형상의 타원체로 형성하여 렌즈역할을 하게 함으로써 약하게 투과된 빛을 집속시킬 수 있도록 구성함이 바람직하다.In addition, a gel-type capsule 15 for encapsulating the solid state image pickup device 11 may include a clear mold compound or a fluid encapsulation material, thereby forming a transparent plastic 16 outside thereof. It is preferable to constitute a role to complement the weakly transmitted light by forming a spherical ellipsoid to act as a lens, so that the weakly transmitted light can be focused.
이때, 내부와 외부에 사용되는 몰드 및 인캡슐레이션 물질의 굴절율은 내부가 외부보다 크게 함이 바람직하며, 이와같이 구성되는 패키지는 그 상면과, 양측면 및 저면의 다듬질 정도를 달리하는 바, 상면은 미러폴리싱 금형을 사용하여 클리어하게 하고, 그외 사이드 및 저면은 거칠게 하여 빚의 투과율을 달리함이 바람직하다.In this case, the refractive index of the mold and the encapsulation material used for the inside and outside of the inside is preferably larger than the outside, and the package configured as described above is different from the degree of finishing of the upper surface, both sides and the bottom surface, the upper surface is a mirror It is preferable to make it clear using a polishing metal mold | die, and to make other side and bottom surface rough, and to change the transmittance | permeability of debt.
이와같이 구성된 본 발명에 의한 플라스틱 타입 고체 촬상소자 패키지의 제조공정을 살펴보면 다음과 같다.Looking at the manufacturing process of the plastic type solid-state image sensor package according to the present invention configured as described above are as follows.
즉, 본 발명에 의한 플라스틱 타입 고체 촬상소자 패키지는 소잉공정에 의해 개개로 분리된 고체촬상소자(11)를 복수개내의 내.외부리드(12a)(12b)가 구비된 리드프레임(12)에 접착제(13)를 이용하여 부착고정하는 다이어태치공정과, 다이어태치된 소자(11)의 본드 패드(11a)와 리드프레임(12)의 내부리드(12a)를 금속와이어(14)를 이용하여 전기적으로 접속연결시키는 와이어본딩공정과, 와이어본딩된 소자(11)의 주위에 빛의 투과성이 뛰어난 겔 타입의 물질이 내장된 캡슐(15)을 형성하는 인캡슐레이션공정과, 인캡슐레이션된 소자(11)와 상기 리드프레임(12)의 이웃리드(12b)를 포함하는 일정부위를 투명플라스틱(16)으로 몰딩하는 몰딩공정과, 통상적인 트리밍/포밍공정의 순으로 제작되는 바, 이때 상기 캡슐(15)은 구형상의 타원체로 형성하여 렌즈역할을 하게 함으로써 약하게 투과된 빛을 집속시킬 수 있도록 제작함이 바람직하다.That is, the plastic type solid-state image sensor package according to the present invention is adhesively bonded to the lead frame 12 provided with internal and external leads 12a and 12b in a plurality of solid state image pickup devices 11 separated by a sawing process. A die attach process for attaching and fixing using (13), the bond pad 11a of the die-attached element 11 and the inner lead 12a of the lead frame 12 electrically using a metal wire 14; A wire bonding process for connecting and encapsulating, an encapsulation process for forming a capsule 15 containing a gel-type material having excellent light permeability around the wire bonded element 11, and an encapsulated element 11. ) And a molding process for molding a predetermined portion including the neighboring lead (12b) of the lead frame 12 with a transparent plastic 16, and in the order of a conventional trimming / forming process, wherein the capsule (15) ) Forms a spherical ellipsoid to act as a lens As it is preferable to manufacture so as to focus the light transmitted through a weakly.
이상에서 상세히 설명한 바와같이 본 발명에 의한 플라스틱 타입 고체 촬상소자 패키지는 종래의 세라믹을 이용하여 제작하였던 패키지를 투명플라스틱으로 대체함과 아울러 패키지 내부에 위치한 고체 촬상소자의 주위에 빛 투과성이 뛰어난 겔 타입의 인캡슐레이션 물질이 내장된 캡슐을 형성하여 투명플라스틱의 빛투과성 문제를 어느정도 보완함으로써 저가의 양산성이 뛰어난 플라스틱 타입 고체 촬상소자 패키지를 쉽게 상품화 시킬 수 있는 효과가 있다.As described in detail above, the plastic type solid-state image sensor package according to the present invention replaces a package manufactured by using a conventional ceramic with a transparent plastic, and also has a gel type having excellent light transmittance around the solid-state image sensor positioned inside the package. It is possible to easily commercialize a low-cost mass-produced plastic type solid-state imaging device package by forming a capsule in which the encapsulation material is embedded to partially compensate for the light transmittance problem of the transparent plastic.
또한, 종래에 비해 패키지 제조공정을 단순화 및 단축시킬 수 있고, 패키지 제작의 한계를 극복할 수 있는 등의 여러 효과가 있다.In addition, there are various effects, such as simplifying and shortening the package manufacturing process as compared with the related art, and overcoming the limitations of the package manufacturing.
제3도 및 제4도는 본 발명에 의한 플라스틱 타입 고체 촬상소자 패키지의 다른 실시예를 보이는 단면도로서 이에 도시한 바와같이 이러한 다른 실시예는 고체촬상소자(11')를 리드프레임(12')에 부착고정하고, 와이어본딩 공정을 행하여 인캡슐레이션한 후, 투명플라스틱(16')으로 몰딩함에 있어서 그 투명플라스틱(16')의 표면을 내부의 인캡슐레이션 형상과 같이 구형상으로 제작하여 빛의 투과성을 가일층 높인 것으로 그외 패키지의 구조, 제조공정 및 효과는 상술한 일실시예와 동일 유사하나, 이러한 다른 실시예에 의한 플라스틱 타입 고체 촬상소자 패키지는 외부의 몰딩 형태를 구형상으로 둥글게 형성하여, 빛을 집속시키는 렌즈의 역할을 하게 함으로써 빛의 투과성을 가일층 높일 수 있는 효과가 있는 것이다.3 and 4 are cross-sectional views showing another embodiment of the plastic type solid-state image pickup package according to the present invention. As shown therein, this alternative embodiment has a solid state image pickup element 11 'attached to the lead frame 12'. After fixing and attaching and encapsulating by wire bonding process, when molding into transparent plastic 16 ', the surface of the transparent plastic 16' is made into a spherical shape like the encapsulation shape inside, The structure, manufacturing process and effect of the other package is further similar to the above-described embodiment, but the plastic type solid-state image pickup device according to this embodiment is formed by roundly forming an external molding in a spherical shape. By acting as a lens that focuses the light, there is an effect that can further increase the light transmittance.
이때에도 내부와 외부에 사용되는 몰드 및 인캡슐레이션 물질의 굴절률은 내부가 외부보다 크게 하는 것이 바람직하다.In this case, it is preferable that the refractive index of the mold and the encapsulation material used inside and outside is made larger than the inside.
즉, 투명플라스틱(16')의 굴절률을 A라 하고 인캡슐레이션물질의 굴절률을 B라 할때 통상 굴절률비가 1보다 항상 크게 형성함이 바람직하다.That is, when the refractive index of the transparent plastic 16 'is A and the refractive index of the encapsulation material is B, the normal refractive index ratio It is desirable to form always larger than 1.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019910022694A KR100206860B1 (en) | 1991-12-11 | 1991-12-11 | Plastic type charge couple device package and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019910022694A KR100206860B1 (en) | 1991-12-11 | 1991-12-11 | Plastic type charge couple device package and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR930014844A KR930014844A (en) | 1993-07-23 |
| KR100206860B1 true KR100206860B1 (en) | 1999-07-01 |
Family
ID=19324592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019910022694A KR100206860B1 (en) | 1991-12-11 | 1991-12-11 | Plastic type charge couple device package and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100206860B1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3651577B2 (en) * | 2000-02-23 | 2005-05-25 | 三菱電機株式会社 | Imaging device |
-
1991
- 1991-12-11 KR KR1019910022694A patent/KR100206860B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR930014844A (en) | 1993-07-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5264393A (en) | Solid state image pickup device and method of manufacturing the same | |
| US7274094B2 (en) | Leadless packaging for image sensor devices | |
| JP3630447B2 (en) | Manufacturing method of solid-state imaging device | |
| US5122861A (en) | Solid state image pickup device having particular package structure | |
| US7553688B2 (en) | Methods for packaging image sensitive electronic devices | |
| US7755030B2 (en) | Optical device including a wiring having a reentrant cavity | |
| US5534725A (en) | Resin molded charge coupled device package and method for preparation thereof | |
| US6825551B1 (en) | Method for packaging a semiconductor chip containing sensors and resulting package | |
| JPH0621414A (en) | Solid-state image sensing device and its manufacture thereof | |
| KR20040033193A (en) | Semiconductor Package For Image Sensor And Making Method | |
| JPH0653462A (en) | Resin-sealed solid-state image sensing element package and its manufacture | |
| KR100206860B1 (en) | Plastic type charge couple device package and its manufacturing method | |
| JPH02229453A (en) | Semiconductor device and manufacture thereof | |
| JPH065726A (en) | Semiconductor device using resin hollow package | |
| KR200265306Y1 (en) | Multichip Package | |
| KR940006183Y1 (en) | Plastic ccd semiconductor package | |
| KR100692779B1 (en) | PCB united-type image sensor package | |
| JPH02231761A (en) | Semiconductor device | |
| JPH0745803A (en) | Solid-state image pickup device | |
| KR0128257Y1 (en) | Ccd package | |
| JPH02203561A (en) | Manufacture of semiconductor device | |
| JPH02201960A (en) | Semiconductor device | |
| JPH0745802A (en) | Solid-state image pickup device | |
| KR0132439Y1 (en) | Glass lid loading structure of resin molded type semiconductor package | |
| JPH02260463A (en) | Semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| FPAY | Annual fee payment |
Payment date: 20050318 Year of fee payment: 7 |
|
| LAPS | Lapse due to unpaid annual fee |