JPH0548223A - Printed-circuit board - Google Patents
Printed-circuit boardInfo
- Publication number
- JPH0548223A JPH0548223A JP20088091A JP20088091A JPH0548223A JP H0548223 A JPH0548223 A JP H0548223A JP 20088091 A JP20088091 A JP 20088091A JP 20088091 A JP20088091 A JP 20088091A JP H0548223 A JPH0548223 A JP H0548223A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed
- printed circuit
- measurement
- patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、電子機器製造分野にお
ける回路実装精度の管理手段を備えたプリント基板に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board provided with a circuit mounting accuracy control means in the field of electronic device manufacturing.
【0002】[0002]
【従来の技術】従来、プリント基板の製造段階または購
入受け入れ段階における回路パターンの精度管理につい
ては、製造されたプリント基板現品の評価対象とするパ
ターンの大きさ(幅、長さ、太さ、直径等)を精密測定
し、その数値を、別に書面等に記録させた基準とすべき
寸法数値と対比させて精度を確認し、良否の判定を行な
う方法が一般的に採られていた。2. Description of the Related Art Conventionally, regarding the accuracy control of a circuit pattern at the manufacturing stage of a printed circuit board or the purchase acceptance stage, the size (width, length, thickness, diameter) of the pattern to be evaluated of the actual printed circuit board is evaluated. Etc.), the numerical value is compared with a dimensional numerical value that should be used as a reference and recorded on a separate document, etc. to confirm the accuracy, and the quality is judged.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、上記従
来の精度管理方法では、製造または購入受け入れ段階に
おいて、評価すべきプリント基板現品と、対比評価の基
準とすべき寸法数値等を記録した書面等が同時に確保さ
れていなければならない。一般に、製造および物流過程
において、現品と書面が同時添付の形で確保されること
は、それぞれの形態のちがいからの保管、移動に対する
物理的制約等からも徹底が困難であり、このため、現品
の実測寸法値とあらかじめ定められた基準寸法値の対
比、評価に徹底を欠き、精度上不備のものが後工程に流
れ出し、実装品質不良の原因ともなっていた。However, in the above-mentioned conventional quality control method, at the manufacturing or purchase acceptance stage, the printed circuit board actual product to be evaluated and the document or the like on which the dimensional numerical value or the like to be the standard for comparison evaluation are recorded. Must be secured at the same time. Generally, in the manufacturing and distribution process, it is difficult to ensure that the actual product and the document are attached in the form of attachment at the same time due to physical restrictions on storage and movement due to differences in each form. The actual measurement dimension value and the predetermined reference dimension value were not thoroughly evaluated and lacked in thorough evaluation, and those with insufficient accuracy flowed out to the subsequent process, which was a cause of poor mounting quality.
【0004】本発明は、このような従来の問題を解決す
るものであり、評価対象であるプリント基板現品の実測
値と、対比すべき基準数値の情報を同時に確保できるよ
うにしたプリント基板を提供することを目的とする。The present invention solves such a conventional problem, and provides a printed circuit board capable of simultaneously securing the measured value of the actual printed circuit board to be evaluated and the reference numerical value to be compared. The purpose is to do.
【0005】[0005]
【課題を解決するための手段】本発明は、上記目的を達
成するために、製造されたプリント基板現品の周辺部
に、大きさ精度管理用として特定した1ないし数種類の
測定用代表パターンとその寸法値を形成したものであ
る。SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides one or several kinds of representative patterns for measurement, which are specified for size accuracy control, on the peripheral portion of a manufactured printed circuit board and its parts. The dimensional values are formed.
【0006】[0006]
【作用】したがって、本発明によれば、製造および購入
受け入れ段階の評価時に、プリント基板周辺部に形成さ
れた測定用代表パターンとその寸法値とから、測定すべ
きパターンの識別と対比評価の基準とすべき数値の認識
とを即座に行なうことができるという効果を有する。Therefore, according to the present invention, at the time of evaluation at the manufacturing and purchase acceptance stage, the standard of the pattern to be measured and the comparison evaluation are determined from the representative pattern for measurement formed on the peripheral portion of the printed circuit board and its dimension value. This has the effect that the numerical value to be recognized can be recognized immediately.
【0007】[0007]
【実施例】図1は本発明の一実施例の構成を示すもので
ある。図1において、1は回路実装用のプリント基板、
2a,2b,2c,2dはプリント基板1の表面に形成
された部品半田付用、接続用等の一般の回路パターン、
3a,3b,3c,3dは回路パターン2a,2b,2
c,2dの大きさの精度評価用として特定され、プリン
ト基板1表面の周辺部の余剰スペース部分に形成された
測定用代表パターンであり、一般の回路パターン2a,
2b,2c,2dと同一製造工程の銅箔腐食法で作り込
まれている。4a,4b,4c,4dは測定用代表パタ
ーン3a,3b,3c,3dの近傍に形成されて、その
大きさ(幅、長さ、太さ、直径等)を表わす基準寸法値
であり、測定用代表パターン3a,3b,3c,3d等
と同一の銅箔腐食法またはシルク印刷法等により形成さ
れている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows the configuration of an embodiment of the present invention. In FIG. 1, 1 is a printed circuit board for circuit mounting,
2a, 2b, 2c and 2d are general circuit patterns for soldering and connecting components formed on the surface of the printed circuit board 1,
3a, 3b, 3c and 3d are circuit patterns 2a, 2b and 2
c, 2d is a representative pattern for measurement, which is specified for accuracy evaluation of the size, and is formed in a surplus space portion on the peripheral portion of the surface of the printed circuit board 1.
2b, 2c and 2d are manufactured by the same copper foil corrosion method as the manufacturing process. 4a, 4b, 4c and 4d are reference dimension values which are formed in the vicinity of the measurement representative patterns 3a, 3b, 3c and 3d and which represent the size (width, length, thickness, diameter, etc.) of the measurement patterns. The representative patterns 3a, 3b, 3c, 3d, etc. are formed by the same copper foil corrosion method or silk printing method.
【0008】このように、上記実施例によれば、測定、
評価されるべきプリント基板1の現品の表面の周辺部
に、測定用として特定された代表パターン3a〜3d
と、この代表パターン3a〜3dの大きさ(幅、長さ、
太さ、直径等)の基準寸法値4a〜4dが、直接形成表
記されているため、製造または購入受け入れ段階におい
て、評価担当者は、測定、評価対象とすべき代表パター
ン3a〜3dの認識を容易に行なうことができるととも
に、現品の寸法測定と同時に基準寸法値4a〜4dを確
認することができる。これにより、現品測定値と基準寸
法値の対比評価を即座に完了することができるという効
果を有する。As described above, according to the above embodiment, measurement,
On the peripheral portion of the surface of the actual product of the printed circuit board 1 to be evaluated, the representative patterns 3a to 3d specified for measurement are used.
And the size of the representative patterns 3a to 3d (width, length,
Since the reference dimension values 4a to 4d (thickness, diameter, etc.) are directly formed and written, the person in charge of evaluation recognizes the representative patterns 3a to 3d to be measured and evaluated at the manufacturing or purchase acceptance stage. This can be easily performed, and the reference dimension values 4a to 4d can be confirmed simultaneously with the dimension measurement of the actual product. Thereby, there is an effect that the comparison evaluation of the actual product measured value and the reference dimension value can be completed immediately.
【0009】[0009]
【発明の効果】本発明は、上記実施例から明らかなよう
に、製造されたプリント基板現品の周辺部に、大きさ精
度管理用として特定した1ないし数種類の測定用代表パ
ターンとその寸法値を形成したものであり、製造および
購入受け入れ段階の評価時に、プリント基板周辺部に形
成された測定用代表パターンとその寸法値とから、測定
すべきパターンの識別と対比評価の基準とすべき数値の
認識を即座に行なうことができるという効果を有する。As is apparent from the above embodiments, the present invention provides one or several kinds of representative patterns for measurement specified for size accuracy control and their dimensional values on the periphery of the manufactured printed circuit board. It is formed, and at the time of evaluation at the manufacturing and purchase acceptance stage, the numerical value to be used as a standard for identification and comparison evaluation of the pattern to be measured from the representative pattern for measurement formed on the peripheral part of the printed circuit board and its dimension value. This has the effect that recognition can be performed immediately.
【図1】本発明の一実施例を示すプリント基板の平面図FIG. 1 is a plan view of a printed circuit board showing an embodiment of the present invention.
1 プリント基板 2a,2b,2c,2d 部品半田付用等の一般の回路
パターン 3a,3b,3c,3d 大きさ精度評価用として特定
した測定用代表パターン 4a,4b,4c,4d 測定用代表パターンの大きさ
を表記した基準寸法値1 Printed circuit boards 2a, 2b, 2c, 2d General circuit patterns for soldering components 3a, 3b, 3c, 3d Measurement representative patterns 4a, 4b, 4c, 4d Measurement representative patterns specified for size accuracy evaluation Standard dimension value indicating the size of
Claims (1)
用として特定した1ないし数種の測定用代表パターンと
その寸法値を形成したプリント基板。1. A printed circuit board on which one or several kinds of representative patterns for measurement specified for controlling the size accuracy of a circuit pattern and their dimension values are formed in the peripheral portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20088091A JPH0548223A (en) | 1991-08-09 | 1991-08-09 | Printed-circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20088091A JPH0548223A (en) | 1991-08-09 | 1991-08-09 | Printed-circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0548223A true JPH0548223A (en) | 1993-02-26 |
Family
ID=16431779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20088091A Pending JPH0548223A (en) | 1991-08-09 | 1991-08-09 | Printed-circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0548223A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5669220A (en) * | 1979-11-08 | 1981-06-10 | Tokuyama Soda Co Ltd | Purification of aqueous solution of alkaline metallic salt |
-
1991
- 1991-08-09 JP JP20088091A patent/JPH0548223A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5669220A (en) * | 1979-11-08 | 1981-06-10 | Tokuyama Soda Co Ltd | Purification of aqueous solution of alkaline metallic salt |
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