JPH0548006A - Semiconductor device - Google Patents

Abstract

PURPOSE:To form a chip shape of an LCD driver slender, to reduce a common impedance of an LCD power source uniformly, to improve a display quality of the LCD, to simultaneously eliminate a wiring region and to reduce a chip size. CONSTITUTION:An output terminal 1 is disposed t one longitudinal side by a slender LCD driver, a control terminal 2 is disposed at the other long side, and two or more power source terminals 3 for supplying the same current or voltage value are so disposed as to hold both short sides or the terminal 2 from both sides. Thus, a wiring region to the power source or the terminal 1 is reduced, and the entire semiconductor device can be reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to arrangement of signal input / output terminals and power supply terminals of a semiconductor device.

[0002]

2. Description of the Related Art FIG. 2 shows an arrangement of signal input / output terminals and power supply terminals of a conventional semiconductor device having a plurality of driving elements for driving current or voltage. The output terminal 1 corresponding to each drive element is arranged in parallel with three or four sides of the semiconductor device, and the power supply terminal 3 and the control terminal 2 are arranged on one side.

[0003]

However, in the above-mentioned prior art, the wiring from the output terminal of the semiconductor device to the driven element is long and there is a large difference in the wiring length.
(Chip on flex) and the problem that a large area is required for patterning the substrate. Further, there is a problem that the wiring of the power supply wiring increases the wiring resistance and affects the driving ability of the driving element.

Therefore, the present invention solves such a problem, and an object of the present invention is to reduce the area of the wiring routing region from the driving element to the output terminal and to reduce the wiring resistance of the power source for driving. An object of the present invention is to provide a semiconductor device that does not affect the driving ability of the element.

[0005]

The semiconductor device of the present invention comprises:
A plurality of drive elements that drive current or voltage, an output terminal corresponding to the drive element, a plurality of power supply terminals that supply at least one current value or a voltage value to the drive element, and a plurality of controls that control the drive element A terminal, the output terminal is arranged on one side of the long side, the control terminal is arranged on another side of the long side, and each power supply terminal for supplying the same current value or the same voltage value is Two or more are provided on each of the short side or the long side so as to sandwich the control terminal.

[0006]

1 is a layout diagram of signal input / output terminals and power supply terminals of a semiconductor device according to an embodiment of the present invention. The outputs of the drive element groups 4 driven by current or voltage are connected to the corresponding output terminals 1. The output terminal 1 is arranged parallel to one long side of the semiconductor device. Two or more power supply terminals 3 for supplying a current or voltage to the drive element group are provided on both short sides of the semiconductor device for each current and voltage value, and are arranged on both short sides. The control terminal 2 for controlling the drive element group 4 is arranged on the other long side where the output terminal 1 of the semiconductor device is not arranged.

FIG. 3 is another layout of signal input / output terminals and power supply terminals of the semiconductor device according to the embodiment of the present invention.
The power supply terminal 3 is arranged on the same long side as the control terminal 2 so as to sandwich the control terminal 2.

Drive element group 4 driven by current or voltage
Are arranged in the semiconductor device in an orderly manner corresponding to the output terminals 1, and are electrically connected from the driving elements to the corresponding output terminals by metal wiring. Since the driving elements and the output terminals correspond to each other in an orderly manner, this metal wiring can be the shortest and the wiring area can be minimized. Further, the length of the metal wiring from each drive element to the corresponding output terminal becomes uniform, and the resistance of each metal wiring and the wiring capacitance also become uniform. A plurality of drive power supply wirings supplied to the drive element group 4 are wired so as to penetrate the drive element group 4, and are connected to the power supply terminals 3 arranged on both short sides or both long sides of the control terminal side. As the number of drive element groups 4 increased, the power supply wiring needed to have a lower resistance, the wiring width increased and the wiring area increased. In the embodiment of the present invention, the power supply terminal 3
Since it can be connected to the drive element group 4 at the shortest distance from, the semiconductor device having a smaller area for drawing the power supply wiring can be realized. As a result, it is possible to reduce the resistance of the power supply wiring without increasing the width of the power supply wiring. Further, since power is supplied from both sides of the drive element group 4, the resistance is further reduced, and at the same time, the power supply wiring resistance for each drive element is made uniform. Be done.

Consider a case where the semiconductor device of the present invention is used for driving a liquid crystal display device. The liquid crystal display element has the characteristic of a capacitive load, and the difference in driving ability appears in the rounding of the driving waveform. Due to this waveform rounding, the effective voltage applied to the liquid crystal display element changes and appears as light and shade of the display, which significantly deteriorates the display quality. According to the semiconductor device of the present invention, since the resistance of the liquid crystal driving power source is lowered, the driving waveform is not rounded, and a liquid crystal display device of higher image quality that does not depend on the display pattern can be realized. Further, by uniforming the resistance of the power supply and the output wiring, it is possible to prevent partial deterioration of the image quality due to the difference in the wiring resistance value. When a liquid crystal display device is driven by a plurality of semiconductor devices, lowering the resistance and making the power supply wiring uniform have a great effect in reducing the difference in shade of the liquid crystal display portion corresponding to the driven semiconductor device. Further, as the screen size of the liquid crystal display device increases, the capacitive load of the liquid crystal display element increases, and the effect of the present invention becomes more remarkable. When viewed from the mounting surface, since the output terminals 1 are arranged in order in the long side direction of the semiconductor device,
Wiring to the drive electrode of the liquid crystal is possible without difficulty, and the wiring area can be reduced. Further, since the semiconductor device itself is elongated, the mounting area of the driving semiconductor device in the liquid crystal driving device becomes small, and a liquid crystal display device having a small parting region can be realized.

FIG. 4 is a pattern diagram when the semiconductor device shown in FIG. 1 of the present invention is mounted on a flexible tape.
4 is a flexible tape, 5 is a power supply electrode drawn from the power supply terminal 3, 6 is a semiconductor device, 7 is a control electrode drawn from the control terminal 2, 8 is a hole (sprocket) for tape feeding, and 9 is an output terminal 1 It is an output electrode drawn from. The output terminal 1 to the output electrode 9 are wired without being routed on the flexible tape, and the wiring area thereof is extremely small. The power supply electrode 5 is drawn out from both short sides of the semiconductor device and is formed in the longitudinal direction of the flexible tape. FIG. 5 is a diagram in which the semiconductor device of the present invention is mounted on a flexible tape and connected to a plurality of substrates.
Reference numeral 10 is a flexible tape on which the semiconductor device of the present invention is mounted, 13 is a substrate on which the flexible tape is mounted, 11 is power wiring on the substrate, and 12 is a control electrode on the substrate, which is connected to the control electrode of the flexible tape. Although not shown in FIG. 5, the output electrode 9 is connected to an electrode on the glass of the liquid crystal display device. The power supply electrode 5 on the flexible tape is connected to the power supply wiring of the substrate under the flexible tape on both sides of the tape. As a result, the power supply wiring of the substrate becomes more linear, and the wiring area of the substrate can be reduced and the wiring resistance of the substrate can be reduced at the same time.

[0011]

As described above, according to the invention, the output terminal is arranged on one side of the long side and the control terminal is arranged on the other side of the long side, and the same current value or the same voltage value is set. By arranging two or more power supply terminals on each short side or on the long side so as to sandwich the control terminal, the wiring area to the power supply or the output terminal is reduced, and the entire semiconductor device is reduced. be able to. This makes it easy to increase the number of outputs of the driving element, and when used as a driving element of a liquid crystal display device, it is possible to control a larger screen liquid crystal display device with a small number of driving semiconductor devices, and at the same time reduce the cost of the semiconductor device and mount it. The cost can also be reduced. Further, since the output terminal is arranged on one side of the long side, the lead-out area of the wiring to the drive electrode on the glass of the liquid crystal drive device is small, and the parting-off portion of the liquid crystal display device can be made small.

The power supply wiring can be efficiently routed, and the power supply terminals due to the semiconductor device are suppressed as much as possible by providing the power supply terminals on both short sides, and the power supply wiring resistance for each drive element is made uniform. be able to. A liquid crystal display device using this semiconductor device can remarkably improve the display quality.

When the semiconductor device of the present invention is mounted on a flexible tape, it is sealed with resin to protect the semiconductor device.
Due to the elongated shape, biaxial stress is exerted, and low-stress mounting becomes possible as compared with the conventional technology. As a result, it is possible to provide a highly reliable liquid crystal display device that is resistant to cracking after mounting and characteristic changes due to stress.

As described above, the semiconductor device of the present invention has various excellent effects.

[Brief description of drawings]

FIG. 1 is a layout diagram of signal input / output terminals and power supply terminals showing an embodiment of the present invention.

FIG. 2 is a layout diagram of signal input / output terminals and power supply terminals showing an example of a conventional technique.

FIG. 3 is a layout diagram of signal input / output terminals and power supply terminals showing another embodiment of the present invention.

FIG. 4 is a pattern diagram in which the semiconductor device of the present invention is mounted on a flexible tape.

FIG. 5 is a pattern diagram of a substrate on which a plurality of semiconductor devices of the present invention are mounted.

[Explanation of symbols]

 1 Output Terminal 2 Control Terminal 3 Power Supply Terminal 4 Drive Element Group 5 Flexible Tape Power Supply Electrode 6 Semiconductor Device 7 Flexible Tape Control Terminal 8 Flexible Tape Feed Hole 9 Flexible Tape Output Electrode 10 Flexible Tape 11 Power Supply Wiring on Board 12 Board Upper control electrode 13 Substrate

Claims (1)

[Claims] 1. A plurality of driving elements for driving current or voltage, an output terminal corresponding to the driving element, a plurality of power supply terminals for supplying at least one current value or voltage value to the driving element, and the driving element. It has a plurality of control terminals for controlling, the output terminal is arranged on one side of the long side, the control terminal is arranged on another side of the other long side, and each of the same current value or the same voltage value is supplied. 2 power supply terminals on each short side or on the long side sandwiching the control terminal
A semiconductor device characterized by arranging more than one.