JPH0547934A - Manufacture of large scale integrated circuit - Google Patents

Abstract

PURPOSE:To provide the manufacturing method of a large scale integrated circuit which can be used when defect exists in a part of a wafer, in the mode where the whole part of a wafer is used. CONSTITUTION:On a wafer for forming an integrated circuit, the following are formed; a plurality of integrated circuit blocks 12-1, 12-2 which have the same function and are provided with the same number of connection points to be connected with the outside, and connection 14 between the same function connection points of each circuit block and a common external connection terminal. Whether the integrated circuit blocks perfectly operate is judged. Regarding integrated circuit blocks except one integrated circuit block whose operation is judged to be superior, connection between the connection points and the external connection terminal is cut off.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a large scale integrated circuit (LSI).
Manufacturing method. In recent years, the degree of integration of LSIs has become larger and larger, and a circuit using a single wafer as a whole has been developed, such as a circuit in which a large number of neuro elements simulating the operation of animal nerve tissue are integrated.

The present invention relates to a manufacturing method suitable for manufacturing an ultra-large scale integrated circuit whose degree of integration has advanced to such a degree.

[0003]

2. Description of the Related Art Conventionally, only those which have passed a functional test performed after forming an integrated circuit on a wafer are used, and those which do not pass the functional test due to a defect at one place are treated as defective products. It was

[0004]

However, in the case of a circuit using one wafer as a whole, even a partial defect of the wafer due to fine dust, scratches, etc., will result in a defective product as a whole. In order to achieve a certain level, the semiconductor manufacturing process requires high reliability, which has been a factor of cost increase.

Therefore, it is an object of the present invention to provide a method of manufacturing a large scale integrated circuit which can be used even if there are defects in the wafer and the defects are limited to a part thereof.

[0006]

The method of manufacturing a large scale integrated circuit according to the present invention which achieves the above-mentioned object includes: i) the same function and the same number of external devices on one integrated circuit forming wafer. And a plurality of integrated circuit blocks having connection points to be connected with each other, and a connection point of each circuit block having the same function and a common external connection terminal are formed, and ii) whether the operation of the integrated circuit block is good or bad. And iii) the integrated circuit blocks other than the one integrated circuit block determined to be good in operation, each step of releasing the connection between the connection point and the external connection terminal. is there.

[0007]

By using only the integrated circuit block that operates well and disconnecting the other circuit blocks, it becomes possible to use even if there is a defect in a part of the wafer.

[0008]

1 is a diagram for explaining a first embodiment of the present invention. On the wafer 10, two circuit blocks 12-1 and 12-2 having the same function are formed symmetrically. An input / output bus 14 for connecting to the outside is provided in the center of the two circuit blocks, and thereby each of the circuit blocks 12-1 and 12-2 and the wiring pad 16 are connected.

As a result of the function test, the circuit block 12-2 has an X mark.
There is a defect as indicated by the mark, which is why circuit block 12
-2 is determined to be defective, the circuit block 12-2
The wiring on the side of is cut with a laser as shown by the cross. What is represented by a broken line is a connector 18 for connection, and wire bonding is performed between the wiring pad 20 provided on the connector 18 and the wiring pad 16 on the wafer 10.

FIG. 2 shows a connector for connecting to the integrated circuit board of FIG.
18 is attached, and the whole is covered with molds 22 and 24. A column (a) is a plan view and a column (b) is a XX sectional view. FIG. 3 is a diagram showing a second embodiment of the present invention, and FIG. 4 is a schematic circuit diagram showing its internal function. Referring to FIG. 4, the input / output gates 30-1 and 30- are respectively connected to the connection lines of the circuit blocks 12-1 and 12-2 to the outside.
2 are inserted, and the common control lines 32-1 and 33 are respectively provided.
Controlled by -2. For the functional test, give H level to the control line 32 for any one circuit block and input / output gate
Make the most of 30 and give L level to others to make them floating.

As for the circuit block which has been operated well as a result of the test, as shown in FIG. 4, the pull-down resistor of the pull-up resistor and the pull-down resistor provided on the control line 32 is cut off to keep it at the H level. For the circuit block of, the pull-up resistor is cut off and kept at the L level.

[0012]

As described above, according to the present invention,
In a large scale integrated circuit that uses the entire wafer,
Provided is a method for manufacturing a large scale integrated circuit which can be used even if a part of a wafer is defective.

[Brief description of drawings]

FIG. 1 is a diagram for explaining a first embodiment of the present invention.

FIG. 2 is a diagram showing a molded integrated circuit to which a connector for connection is attached.

FIG. 3 is a diagram for explaining a second embodiment of the present invention.

4 is a schematic circuit diagram showing internal functions of the integrated circuit board of FIG.

[Explanation of symbols]

 10 ... Wafer 12 ... Circuit block 14 ... I / O bus 16, 20 ... Wiring pad 18 ... Connector for connection

Claims (3)

[Claims] 1. An i) one integrated circuit forming wafer,
Forming a connection between a plurality of integrated circuit blocks having the same function as each other and having the same number of connection points to be connected to the outside and a connection point having the same function of each circuit block and a common external connection terminal, ii. ) Determining whether the operation of the integrated circuit block is good or bad, and iii) performing steps for disconnecting the connection between the connection point and the external connection terminal for integrated circuit blocks other than the one integrated circuit block for which the operation is determined to be good. A method of manufacturing a large-scale integrated circuit, comprising: 2. The method according to claim 1, wherein in step iii), the connection is disconnected by cutting a wire connecting the connection point and the external connection terminal. 3. In the step i), an element for connecting and disconnecting the connection point and the external connection terminal for each connection of the connection point and a control element for simultaneously controlling the connection and disconnection element for each of the circuit blocks are further provided. The method according to claim 1, wherein in step iii) the control element disconnects the connection.