JPH0547817A - Molding equipment - Google Patents

Abstract

PURPOSE:To collectively increase the heat-receiving area of a tablet immediately after the start of delivery by a plunger, to augment a heat-receiving area immediately after the start of the delivery of a resin and to heat the tablet substantially sufficiently by forming a cull so that the inside diameter of the cull reaches the specific value times or more of the inner diameter of a pot. CONSTITUTION:A resin 43 obtained by crushing, heating and liquefying a tablet 41 is fed to each cavity 23 through each runner 27 and a gate 28 by the pushing force of a plunger 25 from a cull 26 oppositely faced to pots 24 and sunk, and the cavities 23 are gradually filled with the resin respectively. The cull 26 is formed so that the inside diameter of the cull reaches the fifth again times or more of the inside diameter of the pot 24 at that time. That is, the area of the cull 26 is formed so as to be made larger than that of the projection of the pot 24. Accordingly, the heat-receiving area of the tablet 41 immediately after the start of delivery by the plunger 25 is increased collectively.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to resin molding technology,
A transfer molding technique for transferring a resin as a molding material melted in a pot and a cull region to a cavity through a runner and a gate. For example, it is effective for molding a resin-sealed package in a semiconductor device manufacturing process. Related technology.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, as a transfer molding apparatus for molding a resin-sealed package,
A pot into which a tablet of a molding material is charged, a heating unit that heats and melts the tablet that is charged into the pot, and a plunger that presses the molding material that is inserted into the pot and crushes the tablet to melt the tablet. A cull arranged to face the pot, a runner fluidly connected to the cull, and at least one cavity fluidly connected to the runner. , With the semiconductor pellets and the leads, which are the object of resin sealing, housed in the cavity,
The tablet placed in the pot is melted in the pot and the cull region, and the resin (hereinafter referred to as resin) as a molding material formed by melting the tablet is transferred by the plunger to the cavity through the runner and the gate. In some cavities, a package for resin-sealing semiconductor pellets and leads is molded.

As an example of describing such a transfer molding technique, there is "Electronic Materials, November 1983, Separate Volume," issued by the Industrial Research Institute Co., Ltd., P151 to P157, November 15, 1983.

[0004]

In order to mold a resin-sealed package free from internal voids, microcracks, and deformation of bonding wires, a resin formed by melting the tablet when the tablet is pressed and delivered by a plunger is used. The tablets need to be heated sufficiently to reach the desired viscosity. That is, the predetermined resin viscosity is a viscosity capable of avoiding a phenomenon in which the bonding wire is deformed by the flow of the resin (so-called wire flow phenomenon) when the resin is injected into the cavity, and The viscosity is such that air contained in the tablet itself or air present in the gap between the pot and the tablet can be crushed by applying a final injection pressure inside the cavity.

However, in the transfer molding apparatus as described above, since the tablet put in the pot is structured to be heated from the outer periphery of the pot and the cull, for example, when a large tablet is used. As described above, when the heat receiving area of the tablet with respect to the volume of the tablet becomes small, there is a problem that the tablet is not sufficiently heated.

If the tablet is not sufficiently heated, a resin with high viscosity is fed to the runner and the cavity, which causes deformation of the bonding wire, voids and microcracks inside the package, and also the runner and the cavity. Wear on the contact surface with the resin such as the cavity becomes severe.

An object of the present invention is to provide a molding apparatus capable of heating tablets sufficiently.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0009]

The typical ones of the inventions disclosed in the present application will be outlined below.

That is, a molding in which a pot into which a tablet of a molding material is put, a heating means for heating the tablet put in the pot to melt, and a tablet fitted in the pot and crushing the tablet to melt the tablet A plunger for pumping the material, a cull arranged to face the pot, a runner fluidly connected to the cull, and at least one cavity fluidly connected to the runner. And the inner diameter of the cull is 1.2 times the inner diameter of the pot.
It is characterized in that it is formed to be more than double.

[0011]

According to the above-mentioned means, since the area of the cull is formed large, the heat receiving area of the tablet increases immediately after the start of the delivery by the plunger. Therefore, even if the heat-receiving area of the tablet before heating (immediately after putting the tablet into the pot) is small for the resin formed by heating and melting the tablet, the heat-receiving area immediately after starting to send the resin is large, so the tablet is practically sufficient. It will be heated. As a result, the resin is sufficiently heated and melted so as to have a predetermined viscosity.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an enlarged partial front sectional view showing a main part of a molding apparatus according to an embodiment of the present invention, FIG. 2 is an enlarged partial front sectional view for explaining its operation, and FIG. 4A and 4B are a perspective view and a plan view showing the resin-sealed object and a cross-sectional view taken along line bb, and FIGS. 5A and 5B.
Is a partially omitted enlarged partially plan view showing a state after resin sealing and a sectional view taken along line bb, FIG. 6 is a perspective view showing a mounted state of a finished product, and FIGS. 7, 8 and 9 show the effects thereof. FIG.

In the present embodiment, the molding apparatus according to the present invention is for molding the resin-sealed package of the semiconductor integrated circuit device (hereinafter referred to as DIP / IC) having the resin-sealed dual in-line package. Is configured as a transfer molding device.

In the present embodiment, the resin-sealed object 14 as a work of this transfer molding apparatus is as shown in FIG.
It is configured as shown in (a) and (b),
The resin-sealed object 14 includes the multiple lead frame 1. The multiple lead frame 1 is made of a thin plate made of a copper-based (copper or its alloy) material and is integrally formed by an appropriate means such as punching press working or etching working. In this multiple lead frame 1, a plurality of unit lead frames 2 are arranged side by side in a row in the lateral direction. However, only one unit is shown in the drawing. The unit lead frame 2 is provided with a pair of outer frames 3 each having a positioning hole 3a. Both outer frames 3 are arranged in parallel at a predetermined interval so that the multiple lead frames 1 are continuous. Each is extended in series. A pair of section frames 4 are disposed between the unit lead frames 2 and 2 adjacent to each other so as to be parallel to each other between the outer frames 3 and 3 and are integrally installed. The unit lead frame 2 is formed in a rectangular frame.

In each of the unit lead frames 2, tab suspension leads 7, 7 are arranged at right angles to both outer frames 3 and 3 and are integrally projected, and the tip ends of the tab suspension leads 7, 7 are integrated. A tab 8 formed in a substantially square flat plate shape is disposed between the outer frames 3 and 3 and the section frames 4 and 4 so as to be substantially concentric with the frame and is integrally suspended. The tab 8 is lowered toward the back surface by the thickness of the semiconductor pellet (described later) from the surface of a group of leads 9 described later (so-called tab lowering).

A pair of dam members 5 are arranged between the outer frames 3 and 3 so as to extend at right angles on both sides of the tab suspension lead 7 and are integrally erected.
A plurality of leads 9 are arranged at equal intervals in the longitudinal direction on both dam members 5, 5, and are integrally projected so as to be parallel to each other and orthogonal to the dam member 5. The inner ends of the leads 9 are arranged such that the ends are close to the tabs 8 and surround the tabs 8 to form inner parts 9a located inside the resin-sealed package described later. On the other hand,
The outer extension of each lead 9 has its tip mechanically connected to the section frame 4 and constitutes an outer portion 9b located outside the resin-sealed package described later. Then, the adjacent leads 9 in the dam member 5,
The portion between 9 substantially constitutes a dam 6 that blocks the flow of the resin at the time of molding the package described later.

On the multiple lead frame 1 constructed as described above, pellet bonding work and then wire bonding work are carried out for each unit lead frame 2 (not shown). FIG. 4 (a),
The assembly as the resin-sealed object 14 which is a work as shown in (b) is manufactured. These bonding operations are sequentially carried out for each unit lead frame 2 by laterally pitching multiple lead frames.

First, by pellet bonding work,
In a so-called pre-process in the manufacturing process of a semiconductor device, a pellet 12 as a semiconductor integrated circuit structure in which a bipolar type integrated circuit element (not shown) is formed is formed in a substantially central portion on a tab 8 in each unit lead frame 2. And are fixed to each other via a bonding layer 11 formed of an appropriate material such as silver paste. The silver paste is formed by mixing an epoxy resin adhesive, a curing accelerator, and a solvent with silver powder, and after the pellets are pressed against the silver paste applied onto the lead frame, the silver paste is appropriately applied. The bonding layer 11 is formed by being cured by temperature.

A copper-based, gold-based or aluminum-based material is interposed between the bonding pad 12a of the pellet 12 fixedly bonded to the tab 8 and the inner portion 9a of each lead 9 in the unit lead frame 2. The wire 13 formed and used is bridged by bonding both ends thereof by using a suitable wire bonding device (not shown) such as an ultrasonic pressure bonding type. As a result, the integrated circuit formed in the pellet 12 has bonding pads 12a,
It is electrically drawn out through the wire 13, the inner portion 9a of the lead 9, and the outer portion 9b.

In the multiple lead frame as the work which is the resin-sealed object 14 pelletized and wire-bonded in this way, a package group for resin-sealing each unit lead frame is as follows. Simultaneous molding is performed on a unit lead frame group using the configured transfer molding device.

The transfer molding apparatus 20 according to this embodiment.
Includes a pair of an upper mold 21 and a lower mold 22, which are clamped to each other by a cylinder device or the like (not shown). A plurality of sets of upper mold cavity recesses 23a and lower mold cavity recesses 23b are formed on the mating surface of the upper mold 21 and the lower mold 22, and a pair of members cooperate with each other to form one cavity 23. It is buried in. When the resin-sealed object 14 as the work having the above configuration is used and the resin-sealed package is transfer-molded, each cavity 23 in the upper die 21 and the lower die 22 is a unit of the multiple lead frame 1. The lead frames 2 are arranged so as to correspond to the spaces between the pair of dam members 5 and 5, respectively.

A pot 24 is provided on the mating surface of the upper mold 21 so as to correspond to the plurality of cavities 23, and a cylinder device (not shown) is provided in the pot 24.
The plungers 25 advanced and retracted by the crushing process crush a tablet 41 (which will be described later) as a molding material, and are inserted so that a liquid resin (hereinafter, referred to as a resin) obtained by melting the tablet is fed. There is.

On the mating surface of the lower mold 22, a cull 26 is arranged at a position facing the pot 24 and is sunk.
A plurality of runners 27 are radially arranged so as to be connected to the culls 26 and are respectively buried. The other end of each runner 27 is connected to a plurality of lower cavity recesses 23b, and the runner 27 and the cavity recesses 2 are connected to each other.
A gate 28 is formed at a connection portion with 3b so that the resin can be injected into the cavity 23.

Further, the relief recess 2 is formed on the mating surface of the lower mold 22.
In order to allow the lead frame 9 to escape the thickness of the lead frame, the rectangle 9 is slightly larger than the outer shape of the multiple lead frame 1 and is recessed at a constant depth of a dimension substantially equal to the thickness.

An upper heat block 31 and a lower heat block 32 are provided outside the upper mold 21 and the lower mold 22, respectively, and the upper and lower heat blocks 31, 32 are provided.
An electric heater 33 is laid so as to heat the pots, culls, runners and tablets and resins in the cavities of the upper mold 21 and the lower mold 22. By this heating, the tablets are melted, and the resin formed by melting the tablets is reduced to a predetermined viscosity.

In this embodiment, the cull 26 and the pot 24 are formed so that the inner diameter D of the cull 26 is 1.2 times or more the inner diameter d of the pot 24.

In the transfer molding method in which the transfer molding apparatus 20 is used, a tablet 41 made of epoxy resin or the like (hereinafter referred to as resin) as a molding material is used. As shown in FIG. 3, the tablet 41 is formed by compacting a powdery resin 42 into a cylindrical shape, and has an outer diameter slightly smaller than the inner diameter of the pot 24 of the transfer molding device 20. It is formed so that it is formed, put into a pot 24, and heated and melted.

Next, the operation will be described. At the time of transfer molding, the resin-sealed object 1 according to the above-described structure which is a work
4 is arranged so that the multiple lead frames 1 are housed in the escape recesses 29 that are buried in the lower mold 22, and the pellets 12 of each unit lead frame 2 are housed in each cavity 23. Is set.

Subsequently, the upper mold 21 and the lower mold 22 are clamped, and the tablets 41 are put into the pots 24, respectively. Tablet 41 put in pot 24
Is crushed by the plunger 25. Further, after being placed in the pot 24, the upper and lower heat blocks 31, which are respectively arranged outside the upper mold 21 and the lower mold 22,
Since it is heated by 32, the tablet 41 is melted and liquefied.

Then, the tablet 43 is crushed, and the resin 43 liquefied by being heated is urged by the plunger 25 from the cull 26 facing the pot 24, and each runner 27 and the gate 28. It is sent to each of the cavities 23 through and is filled.

At this time, since the area of the cull 26 is formed larger than the projected area of the pot 24, the heat receiving area of the tablet 41 immediately after the start of the delivery by the plunger 25 becomes large overall. Therefore, the heat-receiving area of the resin 43 formed by heating and melting the tablet 41 before the start of pressure feeding by the plunger 25 (the time from when the tablet is put into the pot 24 until the plunger 25 is slightly pushed down) is compared with the volume of the tablet 41. Even if the size is small, the tablet 41 is substantially sufficiently heated because the heat receiving area is large immediately after the start of the delivery of the resin 43 (at the time when the resin 43 is pushed by the plunger 25 to start the movement). become. As a result, the resin 43 is sufficiently heated and melted so as to have a predetermined viscosity.

After the injection, when the liquid resin 43 is thermoset and the resin-sealed package 15 is molded, the upper mold 21 and the lower mold 22 are opened and the package is ejected by ejector pins (not shown). Fifteen groups are released. In this way, as shown in FIG. 5, the multiple lead frame 1 as a work in which the group of packages 15 is molded is detached from the transfer molding apparatus 20.

Then, as shown in FIG. 5, the tab 8, the pellet 12, the inner portion 9a of the lead 9 and the wire 13 are resin-sealed in the resin-molded package 15 as described above. It will be.

Thereafter, in the lead cutting and forming process, the outer lead frame 3, the section frame 4 and the dam 6 are cut off from the multiple lead frame 1, and the outer portion 9b of each lead 9 is removed as shown in FIG. , Bent downwards.

FIG. 6 shows the DIP manufactured as described above.
The IC 16 and its mounting state are shown. In FIG. 6, the DIP / IC 16 is the outer portion 9b of the lead.
Are respectively inserted into the through holes 18 of the printed wiring board 17, and are electrically and mechanically connected by the solder fillet 19.

By the way, in the conventional transfer molding apparatus in which the size of the cull is equal to the projected area of the pot, when the size of the tablet is large, the heat receiving area from the pot and the cull with respect to the volume of the tablet is small. Therefore, the heating of the tablet becomes insufficient. As a result, the viscosity of the liquid resin formed by melting the tablet increases, and wire flow and voids occur inside the resin-sealed package. Further, if the resin has a high viscosity, the resin contact surfaces such as the runner, the gate, and the cavities are heavily worn, and the life of the molding die is abnormally reduced.

However, in this embodiment, since the inner diameter D of the cull 26 is 1.2 times or more larger than the inner diameter d of the pot 24, the tablet 41 can be sufficiently heated and the resin 43 can be heated. The desired viscosity can be reliably melted.

That is, if the inner diameter D of the cull 26 is set to be larger than the projected area of the pot 24 by setting the inner diameter D of the cull 26 large, the tablet 41 before the resin pressure feeding is heated from the cull 26 The area is the same as the conventional one, but the heat receiving area immediately after the start of resin pressure feeding is
It will be larger than before. That is, the tablet 41 is heated by the heater 33 through the pot 24 and the cull 26 after being put into the pot 24, but in the cylindrical state, the tablet 41 is almost at the contact surface between the pot 24 and the cull 26. It will be heated.

When the plunger 25 is pushed down after being charged, the tablet 41 is crushed as shown in FIG. This contact causes the tablet 26
Therefore, the heat receiving area due to the cull 26 increases due to the large formation of the cull 26. Therefore, the tablet 41
Immediately after the pressure feed of the plunger 25 is started, it becomes a state of being heated in a wide area by the cull 26, so that it quickly melts into the liquid resin 43 having the desired viscosity.

As described above, according to the present embodiment, the tablet 41 is sufficiently heated by the cull 26 immediately after the start of the pressure feeding so that the tablet 41 is melted into the liquid resin 43 having the desired viscosity. It is possible to prevent wire flow and the generation of voids inside the stopper package 15 in advance, and it is also possible to prevent the life of the molding die from being shortened.

FIG. 7 is a graph showing the experimental results obtained by appropriately changing the inner diameter of the cull to find the relationship between the inner diameter of the cull and the number of voids.

The conditions of this experiment are the same as the general conditions such as the inner diameter of the pot, the injection speed of the resin, the injection pressure of the resin, and the like.

In FIG. 7, the horizontal axis represents the ratio of the inner diameter of the cull to the diameter of the tablet. The vertical axis represents the number of voids when the ratio of the inner diameter of the cull to the diameter of the tablet is 1.1: 1 and the number of voids is 1.

According to FIG. 7, it is understood that when the inner diameter D of the cull becomes 1.2 times or more the inner diameter d of the pot, the number of generated voids and the number of generated large voids are significantly reduced. It

FIG. 8 is a graph showing the experimental results obtained by appropriately changing the inner diameter of the cull to find the relationship between the inner diameter of the cull and the wire deformation.

The conditions of this experiment are the same as those shown in FIG. Further, in FIG. 8, the horizontal axis represents the same case as in FIG.

The degree of occurrence of wire deformation on the vertical axis is represented by a value when the ratio of the number of packages in which wire deformation has occurred to the total number of packages is 1 at point A.

According to FIG. 8, when the inner diameter D of the cull is 1.2 times or more the inner diameter d of the pot, the occurrence rate of wire deformation and the number of occurrences when the wire deformation degree is large are significantly reduced. Is understood.

According to the above embodiment, the following effects can be obtained.
The inner diameter D of the cull 26 is smaller than the inner diameter d of the pot 24 by 1.
By setting the size twice or more, the heat receiving area of the tablet 41 immediately after the start of the delivery by the plunger 24 can be comprehensively expanded. Therefore, the plunger 2 for the resin 43 formed by heating and melting the tablet 41 is used.
Even when the heat receiving area before the start of pressure feeding by 5 (from the time when the tablet is put into the pot 24 until the plunger 25 is slightly pushed down) is smaller than the volume of the tablet 41, the delivery of the resin 43 is started ( Immediately after the point when the resin 43 is pushed by the plunger 25 and starts moving, the tablet 4 has a large heat receiving area.
1 can be heated substantially sufficiently.

As described above, since the liquid resin 43 can be sufficiently heated and melted so as to have a predetermined viscosity, the flow of the wire 13 inside the resin-sealed package 15 and the generation of voids can be prevented. Can be prevented.

Since the viscosity of the resin can be lowered, it is possible to prevent the life of the molding die from being shortened.

FIG. 9 is a partially omitted enlarged partial plan sectional view showing a main part of a molding apparatus according to another embodiment of the present invention, and FIGS. 10 and 11 are graphs for explaining the effect. ..

The difference between the second embodiment and the first embodiment is that
A pair of runners 27A are connected to the culls 26A formed on the lower die 22A, and the culls 26A and the respective runners 27 are connected.
The connecting portion with A is formed into a curved surface with a large curvature, and the pot 24 and the cull 26A have an area of the pot 24 and the cull 26A per unit volume (V) of the resin 43 generated from the tablet 41. The ratio (S / V) of the sum (S) of the two is formed to be 0.28 or more.

In the second embodiment, the unit volume (V) of the tablet 41 immediately after the start of the delivery by the plunger.
Since the area (S) of heat received from the pot 24 and the cull 26A per hit is large, the tablet 41 is sufficiently heated and melted so as to become a predetermined liquid resin 43. Therefore, as in the case of the first embodiment, it is possible to prevent the wire flow and the generation of voids inside the resin-sealed package, and it is possible to prevent the life of the molding die from being shortened.

FIG. 11 shows the relationship between the total area (S / V) of the pot and the cull per unit volume of the resin and the void as S / V.
Is a graph showing the experimental results obtained by appropriately changing

In FIG. 10, the horizontal axis represents the value of S / V. The resin volume is the volume when the tablet is melted, and is obtained by the relationship between the weight and the specific gravity. The number of voids on the vertical axis is 1, which is the value at point A of the number of voids per package generated in the molded resin-sealed package.
It is expressed as. Point A shows the experimental result when the ratio between the inner diameter of the cull and the diameter of the tablet is 1.1: 1.

According to FIG. 10, it is understood that when the S / V is 0.28 or more, the number of generated voids is significantly reduced.

FIG. 11 shows the relationship between S / V and wire deformation.
It is a graph which shows the experimental result calculated | required by changing S / V suitably.

The conditions of this experiment are the same as those shown in FIG. In FIG. 11, the horizontal axis represents the value of S / V.

The degree of occurrence of wire deformation on the vertical axis represents the value when the ratio of the number of packages in which wire deformation has occurred to all packages is "1" for point A.

According to FIG. 11, it is understood that the wire deformation occurrence rate is significantly reduced when the S / V is 0.28 or more.

According to the second embodiment, the following effects can be obtained in addition to the effects of the first embodiment. Since the passages of the culls 26A toward the runners 27A are formed so as to become narrower toward the cavities 23, the air existing in the clearance between the tablet 41 and the pot 24 and the culls 26A is removed from the tablet 41a. As the liquefied resin 43 is crushed by the plunger 25, the liquefied resin 43 can be completely pushed out to the runner 27A from the outlet of each passage before it reaches each runner 27A.

According to the above, the air existing in the clearance between the tablet 41 and the pot 24 and the cull 26 A is opened in each cavity 23 without being caught in the liquefied resin 43 pressure-fed to each cavity 23. Since all can be exhausted to the outside of the cavity 23 through the vent (not shown) and the gap of the dam, it is possible to further prevent the voids from being generated in the resin-sealed package 15 molded by the cavity 23. can do.

Since a void can be prevented with a simple structure, an increase in cost can be suppressed.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the pot is not limited to the upper mold and the cull is arranged in the lower mold, but the pot is arranged in the lower mold and the cull is replaced in the upper mold. May be.

The concrete shapes and structures of the upper and lower molds, pots, plungers, runners, gates, cavities, and other constituent elements are not limited to the above-mentioned constructions, but are appropriately selected according to molding conditions and the like. ..

In the above description, the invention made by the present inventor was mainly applied to the transfer molding apparatus of the one-pot system and the multi-pot system, which is the field of application which is the background of the invention, but the invention is not limited thereto. Instead, it can be applied to all transfer molding apparatuses.

Further, the present invention is not limited to the molding apparatus used for molding the DIP / IC resin-sealed package, but is applicable to general molding apparatuses such as molding apparatuses used for other electronic component resin-sealed packages. be able to.

In particular, the present invention can be applied to a transfer molding apparatus in which a plurality of runners are connected to the cull to obtain excellent effects.

[0071]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

The inner diameter of the cull is 1.
By setting it twice as large or more, the heat receiving area of the tablet immediately after the start of the delivery by the plunger can be comprehensively expanded. Therefore, the heat receiving area of the resin formed by heating and melting the tablet before the start of the pressure delivery by the plunger is Even if the volume of the tablet is smaller than that of the tablet, the heat receiving area is large immediately after the start of the delivery of the resin, so that the tablet can be heated substantially sufficiently.

[Brief description of drawings]

FIG. 1 is an enlarged partial front sectional view showing a main part of a transfer molding apparatus according to an embodiment of the present invention.

FIG. 2 is an enlarged partial front sectional view for explaining the operation.

FIG. 3 is a perspective view showing a tablet.

FIG. 4 is a plan view showing a resin-sealed object and a sectional view taken along line bb.

5A and 5B are a partially omitted partially cut enlarged plan view showing a state after resin sealing and a cross-sectional view taken along line bb.

FIG. 6 is a perspective view showing a mounted state of a completed product.

FIG. 7 is a graph showing the effect.

FIG. 8 is a graph showing the effect.

FIG. 9 is a partially omitted enlarged partial plan sectional view showing a main part of a transfer molding apparatus according to another embodiment of the present invention.

FIG. 10 is a graph showing the effect.

FIG. 11 is a graph showing the effect.

[Explanation of symbols]

1 ... Multiple lead frame, 2 ... Unit lead frame, 3
... outer frame, 4 ... section frame, 5 ... dam member, 6 ... dam,
7 ... Tab suspension lead, 8 ... Tab, 9 ... Lead, 9a ... Inner portion, 9b ... Outer portion, 11 ... Bonding layer, 12
... Pellet, 13 ... Wire, 14 ... Resin-sealed object (work), 15 ... Resin-sealed package, 16 ... DIP / IC
(Semiconductor device), 20 ... Transfer molding device, 21 ...
Upper mold, 22, 22A ... Lower mold, 23 ... Cavity, 24
… Pot, 25… Plunger, 26, 26A… Cal, 2
7, 27A ... Runner, 28 ... Gate, 29 ... Lead frame escape recess, 31 ... Upper heat block, 32 ... Lower heat block, 33 ... Heater, 41 ... Tablet, 4
2 ... Powder resin (molding material), 43 ... Liquefied resin (molding material).

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kuji Imagawa 111 Nishiyote-cho, Takasaki, Gunma Prefecture Takasaki Plant, Hitachi, Ltd. (72) Sakae Ogiwara 3-3, Fujihashi, Ome, Tokyo Hitachi 2 Electronics Co., Ltd.

Claims (3)

[Claims] 1. A molding comprising a pot into which a tablet of a molding material is put, a heating means for heating and melting the tablet put in the pot, and a molding which is fitted into the pot and crushes the tablet to melt the tablet. A plunger for pumping the material, a cull arranged to face the pot, a runner fluidly connected to the cull, and at least one fluidly connected to the runner.
A molding apparatus comprising individual cavities, wherein the cull is formed such that its inner diameter is 1.2 times or more the inner diameter of the pot. 2. A molding in which a pot into which a tablet of a molding material is put, a heating means for heating the tablet put in the pot to melt, and a tablet which is fitted in the pot and crushes the tablet to melt the tablet. A plunger for pumping the material, a cull arranged to face the pot, a runner fluidly connected to the cull, and at least one fluidly connected to the runner.
In the molding apparatus including individual cavities, the sum of the pot area and the cull area per unit volume of the molding material produced from the tablet is 0.28 or more in the pot and the cull. A molding device, wherein the molding device is formed to have the following shape. 3. A pot in which a tablet of a molding material is put, a heating means for heating and melting the tablet put in the pot, and a tablet which is fitted in the pot and crushes the tablet to melt the tablet. A plunger for pumping the molding material, a cull arranged to face the pot, a runner fluidly connected to the cull, and at least one fluidly connected to the runner.
A molding apparatus comprising individual cavities, wherein the cull is formed in a curved surface having a large curvature at a connecting portion with the runner.