JPH0547596A - Cr array - Google Patents

Abstract

PURPOSE:To enable a CR array to be formed into an integral structure and lessened in size by a method wherein first capacitor elements and second capacitor elements are provided inside a laminated ceramic block, and first tap electrodes and second tap electrodes are provided, first resistive films and second resistive films, first terminal electrodes and second terminal electrodes, and an earth electrode are provided onto the outer surface of the block. CONSTITUTION:First electrodes 30 and second electrodes 32, earth terminal electrodes 31 and 33, first R films 40 connected to the terminal electrodes 30 on the primary surface 34, second R films 40 connected to first tap electrodes 13 and the terminal electrodes 33, and second tap electrodes 14 are formed on the side edges 28 and 29 of a laminated ceramic block 11. First elements and second elements are provided inside the block 11. First C electrodes and the tap electrodes 13 are connected together through a viahole 15, and third C electrodes and the tap electrodes 14 are connected through a viahole 16. Second and fourth C electrodes are connected in common to the earth terminal electrodes 31 and 33. By this setup, a CR array can be lessened in size and made to deal with mounting of high density.

Description

Detailed Description of the Invention

[0001]

This invention relates to a CR including a plurality of capacitor elements and a plurality of resistor elements.
The present invention relates to an array, and more particularly to an improvement for making such a CR array into an integrated part.

[0002]

2. Description of the Related Art For example, a filter array is inserted between some integrated circuit elements included in a computer and a ground to remove noise in a signal. The filter arrays each include at least one capacitor element and at least one resistor element,
In addition, a plurality of filter circuits, which are commonly grounded, are configured, and each filter circuit is connected to each of a plurality of pins provided in the integrated circuit element.

An example of such a filter array is shown in FIG.
Is shown in. The filter array 1 shown in FIG. 5 comprises a plurality of, for example, eight first capacitor elements 2 and eight second capacitor elements 3, as well as eight first resistor elements 4 and eight second resistors. The container element 5 is provided. One terminal of each of the first capacitor elements 2 is connected to the first resistor element 4
One terminal is connected, and the other terminal of each of the first resistor elements 4 is electrically connected to the first terminal 6.
Also, one terminal of each of the second capacitor elements 3 is connected to one terminal of the second resistor element 5,
The other terminal of each of the second resistor elements 5 is electrically connected to the second terminal 7. The other terminal of each of the first and second capacitor elements 2 and 3 is commonly connected and electrically connected to the ground terminal 8.

[0004]

The filter array 1 shown in FIG. 5 is most typically a capacitor element 2.
And a plurality of discrete components, such as a plurality of capacitor components providing 3 and a plurality of resistor components providing resistor elements 4 and 5. However, when the filter array 1 is configured by combining a plurality of discrete components in this way, not only the mounting area occupied by the filter array 1 becomes large, but also the problem that the work for obtaining the filter array 1 is complicated is encountered. To do.

In order to solve the above problems,
For example, it has been proposed to use an R array in which a plurality of resistance films are printed on an alumina substrate, and dispose capacitor components on this substrate so as to be electrically connected to the corresponding R array. Further, an SOP package in which these substrates and capacitor parts are packaged has been put into practical use. However, even with these latter methods,
It cannot be said that the demand for miniaturization is sufficiently satisfied.

[0006] Therefore, an object of the present invention is to provide a CR array which allows the filter array as described above to be constructed as one component and can be sufficiently miniaturized.

[0007]

A CR array according to the present invention comprises a laminated ceramic block. Inside this block, at least one pair of first and second capacitor electrodes facing each other are formed, respectively, to provide a plurality of first capacitor elements, and at least one pair of first capacitor elements facing each other. The formation of the third and fourth capacitor electrodes respectively provides a plurality of second capacitor elements.
On the other hand, on the outer surface of the block, a plurality of first tap electrodes, a plurality of second tap electrodes, a plurality of first resistance films, a plurality of second resistance films, a plurality of first terminal electrodes, Multiple second
And a ground terminal electrode are formed.

The plurality of first tap electrodes are electrically connected to the respective first capacitor electrodes of the first capacitor element. One end of each of the plurality of first resistance films is electrically connected to each of these first tap electrodes. A first terminal electrode is electrically connected to the other end of each of the first resistance films.

The plurality of second tap electrodes are electrically connected to the respective third capacitor electrodes of the second capacitor element. One end of each second resistance film is electrically connected to each of these second tap electrodes. The other end of each of these second resistance films has a second
Are electrically connected to each other.

Further, the second capacitor electrode of each of the plurality of first capacitor elements and the fourth capacitor electrode of each of the plurality of second capacitor elements are commonly connected by a connection conductor, and this connection is also performed. It is electrically connected to the ground terminal electrode through the conductor.

[0011]

According to the present invention, for example, the circuit provided by the filter array 1 shown in FIG. 5 is constituted by the CR array which is constructed by using one laminated ceramic block and can be handled as one component. be able to.

[0012]

As described above, according to the present invention, the CR array can be downsized, and the equipment using such a CR array can be used for high-density mounting.

In the present invention, the block has a pair of main surfaces parallel to each other and four side surfaces extending in a direction orthogonal to the main surfaces, and the first terminal electrode and the second terminal electrode are provided. And the ground terminal electrode includes a portion extending on any of four side surfaces, and the first tap electrode, the second tap electrode, the first resistance film, and the second resistance film are When formed on one major surface, the CR array according to the present invention can be treated as a surface mountable component. Therefore, it can further contribute to high-density mounting. Thus, when the CR array according to the present invention is a surface mountable component, each of the first tap electrodes and each of the first capacitor electrodes extend at least from the inside of the block to one main surface. Each of the second tap electrodes and each of the third capacitor electrodes are electrically connected by the first inner conductor and are electrically connected by the second inner conductor extending at least from the inside of the block to one main surface. It is preferable that they are connected physically. The above-mentioned first and second inner conductors are provided by, for example, via holes or through holes.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1 to 4 are for explaining one embodiment of the present invention. FIG. 1 is a perspective view showing the appearance of a CR array 10 according to this embodiment. Such a CR array 10 can be advantageously used as a high frequency filter array used in a circuit of a computer or the like.

The CR array 10 includes a laminated ceramic block 11. The block 11 is, as shown in FIG.
It is obtained by laminating a plurality of ceramic sheets 12a to 12f. To obtain each of the ceramic sheets 12a to 12f, a ceramic green sheet containing a dielectric ceramic material and a binder is punched into a predetermined size.

On the ceramic sheet 12a, a plurality of, for example, eight first tap electrodes 13 and eight second tap electrodes 14, respectively, are formed side by side. Via holes 15 and 16 are provided in the first and second tap electrodes 13 and 14, respectively. The tap electrodes 13 and 14 are formed, for example, by printing a conductive paste, and the conductive paste is also applied to the via holes 15 and 16 during the printing.

On the ceramic sheet 12b there is a first capacitor electrode 17 for the first capacitor element.
Are formed in parallel corresponding to the first tap electrode 13, and a third capacitor electrode 18 for the second capacitor element is formed in parallel corresponding to the second tap electrode 14. To be done. First capacitor electrode 1
A via hole 19 corresponding to the via hole 15 is provided in each of 7 and a via hole 20 corresponding to the via hole 16 is provided in each of the third capacitor electrodes 18.
Is provided. Capacitor electrodes 17 and 18 are simultaneously formed by printing, for example, and at the time of printing, conductive paste is also applied to via holes 19 and 20.

On the ceramic sheet 12c, the second capacitor electrode 21 facing the first capacitor electrode 17 and the second capacitor element 3 are provided so as to provide the first capacitor element.
A fourth capacitor electrode 22 facing the capacitor electrode 18 is formed. The second and fourth capacitor electrodes 21 and 22 are commonly connected by the connection conductor 23. The connection conductor 23 extends to both side edges at both ends of the ceramic sheet 12c. Further, on the ceramic sheet 12c, via holes 24 are provided corresponding to the via holes 15 and 19 described above, and corresponding to the via holes 16 and 20 described above,
Via holes 25 are provided. These via holes 2
Around each of 4 and 25, a via hole electrode 26
And 27 are respectively formed. Capacitor electrode 21
And 22 and via-hole electrodes 26 and 27
Are simultaneously formed, for example, by printing, and the conductive paste is also applied in the via holes 24 and 25 at the time of printing.

The first and third capacitor electrodes 17 and 18 are formed on the ceramic sheet 12d, like the above-mentioned ceramic sheet 12b. No via holes are formed in the capacitor electrodes 17 and 18 formed on the ceramic sheet 12d.

On the ceramic sheet 12e, the second and fourth capacitor electrodes 21 and 22 and the connecting conductor 23 are formed as in the above-mentioned ceramic sheet 12c. Via holes and via hole electrodes are not formed in the ceramic sheet 12e.

No electrodes or via holes are formed on the ceramic sheet 12f. These ceramic sheets 12a to 12f are stacked in the order shown in FIG. 2 and then pressed. As a result, the block 11 as shown in FIG. 3 is obtained. Side 28 of block 11
The connection conductor 23 described above is exposed at. Side 28
Although not shown, the side surface 29 facing the connection conductor 23
Is exposed. The block 11 is fired at a temperature of 1200 ° C. to 1300 ° C. in the air to be a sintered body.

It should be noted that in order to obtain the block 11, the first capacitor element is simply provided by a pair of first and second capacitor electrodes 17 and 21, and only a pair of third and fourth capacitor electrodes 18 and 21 are provided. Even if, for example, the ceramic sheets 12b and 12c are not used to provide the second capacitor element by 22, the first and second capacitor electrodes 17 and 21 and the second capacitor electrode 17 and 21, which provide the first capacitor element, are reversed. Ceramic sheets corresponding to the ceramic sheets 12b and 12c may be further laminated to increase the number of pairs of each of the third and fourth capacitor electrodes 18 and 22 which provide the capacitor element.

Next, as shown in FIG. 4, a plurality of, for example, eight first terminal electrodes 30 and two ground terminal electrodes 31 are formed on the side surface 28 of the block 11. Also, on the side surface 29 of the block 11, a plurality of, for example 8
Two second terminal electrodes 32 and two ground terminal electrodes 3
3 is formed. These terminal electrodes 30, 31, 32, 3
3 is preferably formed such that a part of each extends to the main surfaces 34 and 35 of the block 11 which face each other. On one main surface 34 of the block 11, a first land electrode 36 electrically connected to the first terminal electrode 30 and a second land electrode 36 electrically connected to the second terminal electrode 32.
Land electrode 37, a third land electrode 38 electrically connected to the first tap electrode 13, and a fourth land electrode 39 electrically connected to the second tap electrode 14 are formed. .. These electrodes 30-33 and 36
~ 39 are formed by printing a suitable conductive paste and then baking. In addition, these land electrodes 36
To 39 are tap electrodes 13 and 14 and terminal electrodes 30 to 33.
May be formed either before or after formation, and may be omitted.

Next, as shown in FIG. 1, on the main surface 34 of the block 11, so as to extend between each of the first land electrodes 36 and the corresponding one of the third land electrodes 38, The first resistance film 40 is formed, and the second resistance film 41 is formed so as to extend between each of the second land electrodes 37 and the corresponding fourth land electrode 39. These resistance films 40 and 41 are formed, for example, by printing a cermet and then baking it. These resistance films 40 and 41 are trimmed as needed. Further, an overcoat made of, for example, resin may be applied so as to cover the resistance films 40 and 41.

In this way, the CR array 10 is obtained, and this CR array 10 provides the circuit that constitutes the filter array 1 shown in FIG. That is, the first and second capacitor electrodes 17 and 21 provide the first capacitor element 2, and the third and fourth capacitor electrodes 18 and 22 provide the second capacitor element 3. Further, the first resistance film 40 provides the first resistor element 4, and the second resistance film 41 provides the second resistor element 5. The first capacitor electrode 17 is electrically connected to each other through the via holes 19 and 24, and is also electrically connected to the first tap electrode 13 through the via hole 15. A first resistance film 40 is electrically connected to the first tap electrode 13 via a third land electrode 38, and a first resistance film 40 is connected to the first resistance film 40 via a first land electrode 36. One terminal electrode 30 is electrically connected. These first terminal electrodes 30 become the first terminals 6. On the other hand, the third capacitor electrode 18 is electrically connected to each other through the via holes 20 and 25, and the second tap electrode 14 is connected through the via hole 16.
Electrically connected to. A second resistance film 41 is electrically connected to the second tap electrode 14 via a third land electrode 39, and a second resistance film 41 is connected to the second resistance film 41 via a second land electrode 37. The two terminal electrodes 32 are electrically connected. These second terminal electrodes 32 become the second terminals 7.
In addition, the second and fourth capacitor electrodes 21 and 22
Are commonly connected via the connection conductor 23, and
It is electrically connected to the ground terminal electrodes 31 and 33.
These ground terminal electrodes 31 and 33 are connected to the ground terminal 8
Becomes

Such a CR array 10 is, for example,
It can be configured as a chip component having a size of 10 mm × 5 mm × 1 mm.

As shown in FIG. 2, the second capacitor electrode 21 formed on each of the ceramic sheets 12c and 12e is formed to have a continuously extending shape without distinction, and a part of the connecting conductor is formed into a second shape. The capacitor electrode may have a shape that doubles as the capacitor electrode. This is
The same applies to the fourth capacitor electrode 22.

The via holes 15, 19, 24 and the via holes 16, 20, 25 may be replaced with through holes, respectively.

The CR array 10 according to the illustrated embodiment can be surface-mounted. However, the present invention is not limited to surface mountable CR arrays, and therefore, the laminated ceramic block does not have to be in the shape of a rectangular parallelepiped, and the various terminal electrodes may be provided in other than side surfaces of the rectangular parallelepiped block. It may be formed in part.

[Brief description of drawings]

FIG. 1 is a perspective view showing a CR array 10 according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a plurality of ceramic sheets 12a to 12f forming the laminated ceramic block 11 shown in FIG. 1 separately from each other.

FIG. 3 is a view showing the ceramic sheets 12a to 12f shown in FIG.
It is a perspective view which shows the laminated ceramic block 11 obtained by laminating | stacking.

4 is a perspective view showing a state where terminal electrodes 30 to 33 are formed on the outer surface of the laminated ceramic block 11 shown in FIG.

FIG. 5 is a circuit diagram showing a filter array 1 of interest to the present invention.

[Explanation of symbols]

 10 CR Array 11 Multilayer Ceramic Block 12a to 12f Ceramic Sheet 13 First Tap Electrode 14 Second Tap Electrode 15, 16, 19, 20, 24, 25 Via Hole 17 First Capacitor Electrode 18 Third Capacitor Electrode 21 2nd capacitor electrode 22 4th capacitor electrode 23 Connection conductor 28,29 Side surface 30 1st terminal electrode 31,33 Ground terminal electrode 32 2nd terminal electrode 34,35 Main surface 36-39 Land electrode 40 1st Resistance film 41 Second resistance film

Claims (2)

[Claims] 1. A multilayer ceramic block, a plurality of first capacitor elements each having at least one pair of first and second capacitor electrodes facing each other inside the block, and facing each other inside the block. A plurality of second capacitor elements each having at least a pair of third and fourth capacitor electrodes, and electrically connected to the first capacitor electrodes of each of the plurality of first capacitor elements, and A plurality of first tap electrodes formed on the outer surface of the block, and one end of each of the plurality of first tap electrodes being electrically connected, and formed on the outer surface of the block And a plurality of first resistance films electrically connected to the other end of each of the plurality of first resistance films. A plurality of first terminal electrodes formed on the outer surface of the block, and electrically connected to the third capacitor electrodes of each of the plurality of second capacitor elements, and the outer surface of the block A plurality of second tap electrodes formed above, and a plurality of second tap electrodes each having one end electrically connected to each of the plurality of second tap electrodes and formed on the outer surface of the block. Second resistance film, a plurality of second terminal electrodes electrically connected to the other end of each of the plurality of second resistance films, and formed on the outer surface of the block; A connection conductor commonly connecting the second capacitor electrode of each one capacitor element and the fourth capacitor electrode of each of the plurality of second capacitor elements, and electrically connected to the connection conductor And a ground terminal electrode formed on the outer surface of the block.
array. 2. The block has a pair of main surfaces parallel to each other and four side surfaces extending in a direction orthogonal to the main surfaces, the first terminal electrode, the second terminal and the ground terminal. Each of the electrodes includes a portion extending on any one of the four side surfaces, the first and second tap electrodes and the first and second resistance films are formed on one of the main surfaces, Each of the first tap electrodes and each of the first capacitor electrodes are electrically connected by a first internal conductor extending at least from the inside of the block to the one main surface, and the second The tap electrode and the third capacitor electrode are electrically connected to each other by a second internal conductor extending at least from the inside of the block to the one main surface. CR array of.