JPH054619U - Surface acoustic wave device - Google Patents
Surface acoustic wave deviceInfo
- Publication number
- JPH054619U JPH054619U JP048667U JP4866791U JPH054619U JP H054619 U JPH054619 U JP H054619U JP 048667 U JP048667 U JP 048667U JP 4866791 U JP4866791 U JP 4866791U JP H054619 U JPH054619 U JP H054619U
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- surface acoustic
- package
- wave element
- wave device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L2224/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
Abstract
(57)【要約】
【構成】弾性表面波素子４をパッケージ３に実装した弾
性表面波装置において、パッケージ３と弾性表面波素子
４との取付面間に空隙１３を設け、かつパッケージ３に
取り付けられた板バネ６，７の押圧力で弾性表面波素子
４の両端部を固定してある。
【効果】パッケージを封止する時に起きる変形歪あるい
は温度変化による変形歪が弾性表面波素子に伝達しなく
なり、悪影響を与えなくなる。従って、弾性方面波装置
の製造時に生じる電気的特性のバラッキが少くなり、歩
留向上を図ることができる。さらに経時特性の劣化を低
減でき、長時間安定な弾性表面波装置を得られる。
(57) [Summary] [Construction] In a surface acoustic wave device having a surface acoustic wave element 4 mounted on a package 3, a gap 13 is provided between mounting surfaces of the package 3 and the surface acoustic wave element 4, and the surface acoustic wave element is mounted on the package 3. Both ends of the surface acoustic wave element 4 are fixed by the pressing force of the leaf springs 6 and 7. [Effect] The deformation strain that occurs when the package is sealed or the deformation strain due to the temperature change is not transmitted to the surface acoustic wave element and does not have an adverse effect. Therefore, variations in electrical characteristics that occur during the manufacture of the elastic surface acoustic wave device are reduced, and the yield can be improved. Further, deterioration of characteristics over time can be reduced, and a surface acoustic wave device that is stable for a long time can be obtained.
Description
【０００１】[0001]
本考案は弾性表面波装置に関し、特にパッケージ内に弾性表面波素子を固定し た構造をもつ弾性表面波装置に関する。 The present invention relates to a surface acoustic wave device, and more particularly to a surface acoustic wave device having a structure in which a surface acoustic wave element is fixed in a package.
【０００２】[0002]
従来のこの種の弾性表面波装置は、図２に示すように、弾性表面波素子４の裏 面全体をエポキシ系あるいはシリコン系の接着剤１５にて、パッケージ１２に固 定されている。 In this type of conventional surface acoustic wave device, as shown in FIG. 2, the entire back surface of the surface acoustic wave element 4 is fixed to a package 12 with an epoxy-based or silicon-based adhesive 15.
【０００３】[0003]
上述した従来の弾性表面波装置では、弾性表面波素子４裏全面が接着されてい るため、パッケージを封止するときに起きる変形歪あるいは温度変化によるスト レス等の変形歪の直接影響を受け、弾性表面波素子４の単体の電気的特性が大き く変化するという欠点がある。またこの変形歪の影響は、経時特性も劣化させる 原因となる。 In the above-described conventional surface acoustic wave device, since the entire back surface of the surface acoustic wave element 4 is adhered, it is directly affected by the deformation strain that occurs when the package is sealed or the stress caused by the temperature change. There is a drawback in that the electrical characteristics of the surface acoustic wave element 4 alone change significantly. In addition, the influence of this deformation strain causes deterioration of the characteristics over time.
【０００４】[0004]
本考案の弾性表面波装置は、弾性表面波素子をパッケージに実装した弾性表面 波装置において、前記パッケージと前記弾性表面波素子との取付面間に空隙を設 け、かつ前記パッケージに取り付けられた板バネの押圧力で前記弾性面波素子の 両端部を固定してあることを特徴とする。 The surface acoustic wave device of the present invention is a surface acoustic wave device in which a surface acoustic wave element is mounted on a package, and a space is provided between the mounting surfaces of the package and the surface acoustic wave element, and the surface acoustic wave device is mounted on the package. Both ends of the surface acoustic wave element are fixed by pressing force of a leaf spring.
【０００５】[0005]
次に、本考案について図面を参照して説明する。 図１（ａ）および（ｂ）は 本考案の一実施例の平面図および縦断面図である。弾性表面波素子５は、パッケ ージ３の凹状部分に裏面との間に空隙１３を介して取付け、板バネ６，７で押圧 して固定する。板バネ６，７は、弾性表面波素子５の両端部に形成された吸収帯 ８の上から押圧している。 Next, the present invention will be described with reference to the drawings. 1 (a) and 1 (b) are a plan view and a vertical sectional view of an embodiment of the present invention. The surface acoustic wave element 5 is attached to the concave portion of the package 3 with a gap 13 between it and the back surface, and is pressed and fixed by the leaf springs 6 and 7. The leaf springs 6 and 7 press from above the absorption bands 8 formed at both ends of the surface acoustic wave element 5.
【０００６】[0006]
以上説明したように本考案によれば、弾性表面波素子をパッケージとの間に空 隙部を設け板バネで弾性表面波素子の両端表面を押圧固定することにより、パッ ケージを封止する時に起きる変形歪あるいは、温度変化による変形歪が弾性表面 波素子に伝達しなくなり、悪影響を与えなくなる。 As described above, according to the present invention, a space is provided between the surface acoustic wave element and the package, and both end surfaces of the surface acoustic wave element are pressed and fixed by the leaf springs to seal the package. Deformation strain that occurs or deformation strain due to temperature change will not be transmitted to the surface acoustic wave element, and will not have a bad influence.
【０００７】 従って、弾性表面波素子の正常時に生じる電気的特性のバラッキが少なくなり 、保留向上を図ることができる。さらに経時特性の変化を低減でき、長時間安定 な弾性表面波素装置を得られる。Therefore, variations in the electrical characteristics of the surface acoustic wave element that occur normally can be reduced, and retention can be improved. Furthermore, changes in characteristics over time can be reduced, and a surface acoustic wave device that is stable for a long time can be obtained.
【図１】（ａ）および（ｂ）はそれぞれ本考案の実施例
の平面図および縦断面図。1A and 1B are a plan view and a vertical sectional view, respectively, of an embodiment of the present invention.
【図２】従来の弾性表面波装置の側面図。FIG. 2 is a side view of a conventional surface acoustic wave device.
１ リード端子 ２ ボンディングワイヤ ３，１２ パッケージ ４ 弾性表面波素子 ５ 交叉指状電極 ６，７ 状バネ ８ 吸収帯 １３ 空隙 １５ 接着剤 DESCRIPTION OF SYMBOLS 1 Lead terminal 2 Bonding wire 3,12 Package 4 Surface acoustic wave device 5 Interdigital electrode 6,7 Spring 8 Absorption band 13 Void 15 Adhesive
Claims (1)
弾性表面波装置において、前記パッケージと前記弾性表
面波素子との取付面間に空隙を設け、かつ前記パッケー
ジに取り付けられた板バネの押圧力で前記弾性面波素子
の両端部を固定してあることを特徴とする弾性表面波装
置。Claims for utility model registration: 1. A surface acoustic wave device having a surface acoustic wave element mounted on a package, wherein a gap is provided between mounting surfaces of the package and the surface acoustic wave element. A surface acoustic wave device characterized in that both ends of the surface acoustic wave element are fixed by a pressing force of an attached leaf spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP048667U JPH054619U (en) | 1991-06-27 | 1991-06-27 | Surface acoustic wave device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP048667U JPH054619U (en) | 1991-06-27 | 1991-06-27 | Surface acoustic wave device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH054619U true JPH054619U (en) | 1993-01-22 |
Family
ID=12809683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP048667U Pending JPH054619U (en) | 1991-06-27 | 1991-06-27 | Surface acoustic wave device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH054619U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08162897A (en) * | 1994-12-06 | 1996-06-21 | Nec Corp | Surface acoustic wave device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63263811A (en) * | 1987-04-21 | 1988-10-31 | Murata Mfg Co Ltd | Surface wave device |
-
1991
- 1991-06-27 JP JP048667U patent/JPH054619U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63263811A (en) * | 1987-04-21 | 1988-10-31 | Murata Mfg Co Ltd | Surface wave device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08162897A (en) * | 1994-12-06 | 1996-06-21 | Nec Corp | Surface acoustic wave device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19971028 |