JPH0545666U - Camera with wiring board - Google Patents

Abstract

(57) [Abstract] [Purpose] The present invention relates to a camera having a wiring board in which wiring boards are arranged along internal structures, and it is possible to eliminate the need for soldering a bonding pattern.
The purpose is to significantly improve the mounting efficiency compared to the past. In a camera having a wiring board in which wiring boards are arranged along an internal structure, the wiring board has at least three wiring surfaces in different directions, and these three wiring surfaces are provided. However, it is formed into a predetermined shape by pressing a sheet-shaped base material against a mold. The three wiring surfaces of the wiring board are formed so as to cover the pair of roof surfaces of the pentaprism and the intermediate surface connecting the roof surfaces.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a camera, and more particularly to a camera having a wiring board formed by arranging the wiring board along an internal structure.

[0002]

[Prior Art]

 Generally, a conventional camera uses a flexible printed board that can be bent as a wiring board. By using this flexible printed board, a plurality of wiring surfaces are arranged along the internal structure. It is possible to do so easily, and the efficiency of implementation is improved.

FIG. 5 and FIG. 6 show a flexible print substrate 13 arranged on the upper side of the pentagonal prism 11. FIG. 5 shows a developed state and FIG. 6 shows an assembled state. The flexible printed circuit board 13 connects the pair of roof surface wiring surfaces 17 and 18 arranged along the pair of roof surfaces 15 and 16 of the pentaprism 11 and the roof surfaces 15 and 16 of the pentaprism 11. The wiring surface 25 for the intermediate surface is provided so as to cover the intermediate surface 21, and the wiring surface 25 covers both ends of the upper surface of the camera outward from the pair of wiring surfaces 17 and 18 for the roof surface. , 26 are formed.

The wiring surface 23 for the intermediate surface is integrally connected to one wiring surface 18 for the roof surface, and a solder bridge joining pattern 27 is formed at the open end thereof. The joint pattern 27 is connected to the joint pattern 29 of the solder bridge formed on the other wiring surface 17 for the roof surface by soldering.

In these figures, reference numeral 31 is a wiring pattern, and reference numeral 33 is a mounting component such as an IC.

[0006]

[Problems to be solved by the device]

 However, in a camera having such a conventional wiring board, the bonding pattern 27 of the wiring surface 23 for the intermediate surface, which is provided to improve the mounting efficiency, is changed to the bonding pattern formed on the wiring surface 17 for the roof surface. Since the connection is made by soldering to No. 29, a large number of man-hours are required for soldering, and there is a possibility that problems such as disconnection may occur due to defective soldering.

Further, in the camera having such a wiring board, since the bonding patterns 27 and 29 are soldered, the wiring density in the bonding patterns 27 and 29 cannot be made higher than a predetermined value, and the intermediate surface is not formed. There is a problem that the number of wirings on the wiring surface 23 for use is limited and the mounting efficiency is reduced.

The present invention solves the conventional problems described above, and a camera having a wiring board which can eliminate the soldering of the bonding pattern and can significantly improve the mounting efficiency compared with the conventional camera. The purpose is to provide.

[0009]

[Means for Solving the Problems]

 A camera having a wiring board according to claim 1 is a camera having a wiring board arranged along an internal structure, wherein the wiring board has at least three wiring surfaces in different directions. In addition to these, the three wiring surfaces are integrally formed by pressing one sheet-shaped base material against a die at ridge lines intersecting with each other to form a predetermined shape.

A camera having a wiring board according to a second aspect is the camera according to the first aspect, wherein the three wiring surfaces of the wiring board cover a pair of roof surfaces of the pentaprism and an intermediate surface connecting the roof surfaces. It has been formed.

[0011]

[Action]

 In the camera having the wiring board according to claim 1, at least three wiring surfaces arranged along the internal structure are formed into a predetermined shape by pressing a sheet-shaped base material against a mold. To be done.

In the camera having the wiring board according to the second aspect, the three wiring surfaces of the wiring board are formed so as to cover the pair of roof surfaces of the pentaprism and the intermediate surface connecting the roof surfaces.

[0013]

【Example】

 Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a first embodiment of a camera having a wiring board according to the present invention. In the figure, reference numeral 41 denotes a wiring board arranged along an upper side of a pentaprism 43.

The wiring board 41 is formed three-dimensionally, and has a pair of roof surface wiring surfaces 47 and 48 arranged along the pair of roof surfaces 45 and 46 of the pentaprism 43 and the pentagonal prism 43. Intermediate wiring surface 53 arranged so as to cover the intermediate surface 51 connecting the roof surfaces 45 and 46.

A wiring surface 59 covering the upper surface 57 of the internal structure 55 on the rewinding side of the camera and an internal structure on the winding side of the camera from the pair of roof side wiring surfaces 47, 48 outward. A wiring surface 65 is formed to cover the upper surface 63 of 61.

In the figure, reference numeral 67 is a wiring pattern, reference numeral 69 is a mounting component such as an IC, and reference numeral 71 is a third reflecting surface of the pentaprism 43. In this embodiment, however, each of the wiring surfaces 47, 48, 53, 59, 65 described above is formed into a predetermined shape by pressing one sheet-shaped base material against the mold.

That is, the sheet-shaped substrate is prepared by, for example, adding a filler, glass fiber, and a flame retardant to a thermoplastic polyester resin, kneading the mixture, and then continuously extruding it to form a main body portion. Manufactured.

The addition of a filler or the like improves heat resistance as a substrate, improves dimensional stability, and imparts flame retardancy. Then, while applying an epoxy adhesive to the main body of the sheet-shaped substrate, the copper foil is continuously laminated while being heat-pressed with a hot roll laminator, after which aging processing is performed. For example, the conductive circuit is formed by the subtractive method.

After that, as shown in FIG. 2A, an upper mold 75 having a concave portion 73 having a shape corresponding to the roof surfaces 45 and 46 and the intermediate surface 51 of the penta prism 43, and the penta mold A heated sheet-shaped base material 81 is arranged between the roof surfaces 45 and 46 of the prism 43 and the lower mold 79 on which the convex portion 77 having a shape corresponding to the intermediate surface 51 is formed. ), The sheet-like base material 81 is heated and pressed, and further, as shown in (c), the sheet-like base material 81 is taken out from between the pair of molds 75 and 79, whereby three-dimensional wiring is obtained. The substrate 41 is obtained.

Since the thermoplastic polyester resin containing glass fibers usually has a heat distortion temperature of 170 ° C. to 210 ° C., the sheet-shaped substrate is heated to a temperature of 170 ° C. or higher in the heating / pressurizing step. It is pressurized in the state.

Therefore, in the camera having the above-mentioned wiring board, the wiring board 41 has at least three wiring surfaces 47, 48, 53 which are different in direction from each other, and these three wiring surfaces 47, 48, 53 are provided. Since 48 and 53 are integrally connected to each other at the ridge lines intersecting each other by pressing one sheet-shaped base material 81 against the mold, and are molded into a predetermined shape, soldering of the bonding pattern may be unnecessary. In addition to being able to do so, it is possible to greatly improve the mounting efficiency compared to the past.

That is, in the camera having the above-described wiring board, the wiring surface 53 for the intermediate surface is completely integrated with the wiring surfaces 47, 48 for the roof surface. Surface does not need to be soldered to the wiring surface for the roof surface via the bonding pattern, a large number of man-hours for soldering is unnecessary, and disconnection due to defective soldering can be eliminated. ..

Further, since it is not necessary to solder the joining pattern, it is possible to significantly increase the number of wirings on the intermediate wiring surface, and it is possible to improve mounting efficiency.

FIG. 3 shows a second embodiment of the present invention. In this embodiment, a third reflecting surface wiring surface 83 is formed so as to cover the upper part of the third reflecting surface 71 of the pentaprism 43. Has been done.

The third reflecting surface wiring surface 83 is formed with the roof surface wiring surfaces 47 and 48 and the intermediate surface wiring surface 53 by pressing the sheet-shaped base material 81 against the molds 75 and 79. Sometimes they are integrally formed at the same time as these.

Although the camera having the wiring board configured as described above can obtain substantially the same effect as that of the first embodiment, in this embodiment, the third upper surface of the third reflecting surface 71 is covered. Since the wiring surface 83 for three reflecting surfaces is formed, the area of the wiring surface is larger than that of the first embodiment, and the mounting efficiency can be improved, and the strength of the wiring board can be improved. Becomes

FIG. 4 shows a third embodiment of the present invention. In this embodiment, a wiring board 87 is arranged in the upper right corner of the figure of the internal structure 85 of the camera having a rectangular parallelepiped shape. .. The wiring board 87 is composed of an upper wiring surface 89, a front wiring surface 91 and a side wiring surface 93. These three wiring surfaces 89, 91 and 93 are formed as a single sheet as in the above-described embodiment. The base material is molded into a predetermined shape by pressing it into a mold.

In the figure, reference numeral 95 indicates a finder, reference numeral 97 indicates a distance measuring window, and reference numeral 99 indicates a lens. Even in the camera having the wiring board configured as described above, it is possible to obtain almost the same effects as those of the first embodiment.

[0029]

[Effect of the device]

 As described above, in the camera having the wiring board according to claim 1, at least three wiring surfaces arranged along the internal structure press one sheet-shaped base material against the mold. Since they are integrally connected by the ridge lines intersecting with each other and molded into a predetermined shape, soldering of the bonding pattern can be eliminated and the mounting efficiency can be significantly improved as compared with the conventional case.

In the camera having the wiring board according to the second aspect, the three wiring surfaces of the wiring board are formed so as to cover the pair of roof surfaces of the pentaprism and the intermediate surface connecting the roof surfaces. Therefore, in particular, there is an advantage that soldering of the bonding pattern in the vicinity of the pentaprism can be made unnecessary and the mounting efficiency can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view showing a first embodiment of a camera having a wiring board according to the present invention.

FIG. 2 is an explanatory diagram showing heating and pressure molding of the wiring board of FIG.

FIG. 3 is a perspective view showing a second embodiment of a camera having a wiring board according to the present invention.

FIG. 4 is a perspective view showing a third embodiment of a camera having a wiring board according to the present invention.

FIG. 5 is an explanatory view showing a state in which a wiring board of a conventional camera is developed.

6 is a perspective view showing a state where the wiring board of FIG. 5 is assembled.

[Explanation of symbols]

 41 wiring board 43 penta prism 45,46 roof surface 47,48 roof surface wiring surface 51 intermediate surface 53 intermediate surface wiring surface 81 sheet-like substrate

Claims (2)

[Scope of utility model registration request] 1. A camera having a wiring board in which wiring boards are arranged along an internal structure, wherein the wiring board has at least three wiring surfaces in different directions, and A camera having a wiring board, wherein a wiring surface is integrally formed by pressing a sheet-shaped base material against a die at ridge lines intersecting with each other to form a predetermined shape. 2. The three wiring surfaces of the wiring substrate are formed so as to cover a pair of roof surfaces of the pentaprism and an intermediate surface connecting the roof surfaces.
A camera having the wiring board described.