JPH054537U - Electrical wiring board - Google Patents

Abstract

(57) [Summary] (Correction) [Purpose] To prevent the peeling of the electrical wiring layer deposited on the surface of the electrical wiring board when it is divided. [Structure] A plurality of slits 2 or perforations 5 discontinuously
And a V-cut groove 4 is formed on the front surface and / or the back surface of the electric wiring board 1 between the adjacent slits 2 or perforations 5 of the electric wiring board. [Effect] The electric wiring layer does not peel off from the electric wiring board, and the board 1 can be neatly divided.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an electric wiring board (hereinafter, simply referred to as a "board") having a divided structure that is easy to divide.

[0002]

[Prior Art]

 At present, commercially available or proposed substrates have a plurality of slits 2 and a few connecting portions 3 left on the substrate 1 as shown in FIG. 3 in order to easily divide it into a plurality of pieces as needed. The substrate 1 can be divided into a plurality of pieces by bending along these slits 2 into a linearly divided structure. Alternatively, as shown in a sectional view of the substrate 1 in FIG. 4, the substrate 1 has a divided structure in which a V-cut groove 4 is formed, and the substrate 1 can be divided by bending along the V-cut groove 4.

[0003]

[Problems to be solved by the device]

 However, if the structure is divided by the division structure of the slit 2 of FIG. 3, when the substrate 1 is separated at the connection portion 3, the electric wiring layer on the surface of the substrate 1 is peeled off, and a defect such as cutting the electric wiring pattern occurs. It is the cause. Further, in order to make the structure of the V-cut groove 4 of FIG. 4 easy to divide, for example, in the case of a hard substrate 1 made of a material such as glass epoxy resin, the depth of the V-cut groove 4 may be increased. It must be deep. However, the depth of the V-cut groove 4 is difficult to achieve accuracy, and therefore the dividing force is not evenly applied, and it is difficult to apply such a dividing structure to the glass epoxy resin substrate 1. .. The present invention seeks to solve such a drawback.

[0004]

[Means for Solving the Problems]

 Therefore, in this invention, a plurality of slits or perforations are discontinuously formed at predetermined locations on the substrate, and a V-cut groove is formed between these adjacent slits or perforations to eliminate the above-mentioned drawbacks. Settled.

[0005]

[Action]

 Therefore, it is possible to divide the substrate neatly and prevent peeling of the electric wiring layer.

[0006]

【Example】

 An embodiment of this invention will be described below with reference to the drawings. 1 is a plan view of a substrate which is an embodiment of the present invention, and FIG. 2 is a plan view of a substrate which is another embodiment of the present invention. In addition, the same technique and the same portion in the conventional substrate of FIGS. 3 and 4 are denoted by the same reference numerals.

First, the substrate of the first embodiment of the present invention will be described with reference to FIG. In this embodiment, a plurality of slits 2 are linearly provided at a predetermined interval in a substantially central portion of the substrate 1, and a V-cut groove is formed on the front surface and / or the back surface of the connecting portion 3 of the substrate 1 between the adjacent slits 2. 4 has a divided structure.

In the second embodiment shown in FIG. 2, a plurality of perforations 5 are linearly provided at a predetermined interval in the substantially central portion of the substrate 1, and a connecting portion of the substrate 1 between these adjacent slits 2 is formed. 3 has a divided structure in which V-cut grooves 4 are formed on the front surface and / or the back surface.

In each of the above-mentioned embodiments, the divided structure is provided in the substantially central portion of the substrate 1. However, this may be provided at a necessary place according to the size of the substrate 1 and at a predetermined interval. Needless to say.

[0010]

[Effect of the device]

 As described above, since the electric wiring board of the present invention has the plurality of slits or perforations and the V-cut groove formed between the slits or perforations adjacent to each other, the front surface and / or the back surface of the board 1 is covered. Since the attached electrical wiring layer is supposed to be cut in advance, it is possible to prevent peeling of the electrical wiring layer when the substrate is divided, and even if the substrate material is made of glass epoxy resin, There is an excellent effect that the substrate can be divided neatly.

[Brief description of drawings]

FIG. 1 is a plan view of an electric wiring board that is a first embodiment of the present invention.

FIG. 2 is a plan view of an electric wiring board that is a second embodiment of the present invention.

FIG. 3 is a plan view of a conventional electrical wiring board.

FIG. 4 is a cross-sectional view of an electric wiring board having another structure of the related art.

[Explanation of symbols]

 1 Electric wiring board (board) 2 Slit 3 Connection part 4 V cut groove 5 Perforation

Claims (1)

[Claims for utility model registration] [Claim 1] A division in which a plurality of slits or perforations are discontinuously formed at predetermined locations, and V-cut grooves are formed between these adjacent slits or perforations. An electric wiring board having a structure.