JPH054508U - Integrated circuit package - Google Patents

Abstract

(57) [Summary] [Structure] A ground terminal 2 having a thickness greater than that of the lead terminal 1 is provided between the plurality of lead terminals 1 arranged in parallel with the periphery of the package body 3. is there. [Effect] Crosstalk between terminals can be reduced more than ever before.

Description

[Detailed description of the device]

[0001]

[Industrial application]

 The present invention relates to an integrated circuit package, and more particularly to a high frequency integrated circuit package.

[0002]

[Prior Art]

 In the conventional integrated circuit package, as shown in FIG. 4, all lead terminals 1 arranged in the peripheral portion of the package body 3 have the same shape and size.

[0003]

[Problems to be solved by the device]

 In this conventional integrated circuit package, it is not possible to sufficiently suppress the signal wraparound due to the electromagnetic coupling between the adjacent lead terminals 1 in the high frequency range, and the crosstalk resulting from this causes noise on the signal and power supply. There is a problem. In order to suppress such noise, even if the lead terminal for grounding is interposed between the lead terminals for signal and power supply, the shape and size of all lead terminals 1 are the same. The effect of suppressing electromagnetic coupling between terminals is not sufficient.

[0004]

[Means for Solving the Problems]

 In the integrated circuit package of the present invention, a ground terminal having a thickness greater than the thickness of the lead terminal is provided between a plurality of lead terminals arranged in parallel with the peripheral portion of the package body.

[0005]

【Example】

 The present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an embodiment of the present invention. A ground terminal 2 is provided between signal or power supply lead terminals 1 arranged in the periphery of the package body 3, and the thickness of the ground terminal 2 is larger than that of the lead terminal 1. The ground terminal 2 is connected to the ground wiring 8 when it is mounted on the printed board 4, as shown in FIG. 5 and 6 are side cross-sectional views illustrating the electric field distribution between terminals in this embodiment and the conventional integrated circuit package, respectively. In FIG. 5, most of the electric force lines emitted from the lead terminals 1 passing through the air are absorbed by the ground terminal 2, and the electric force lines connecting between the lead terminals 1 are smaller than those in FIG. The binding capacity is reduced.

FIG. 3 is a characteristic diagram illustrating a comparison of crosstalk between terminals in this embodiment and a conventional integrated circuit package. A ground terminal is interposed between two lead terminals each having a length of 1.5 mm at intervals of 3.8 mm, and the thickness of the ground terminal is 0. Comparing the characteristic 5 in the case of 5 mm (conventional) and the characteristic 6 in the case of 2 mm (the present embodiment), it was possible to improve the characteristic of the present embodiment by about 8 dB at the use center frequency of 2.5 GHz.

[0008]

[Effect of the device]

 As described above, according to the present invention, by providing the ground terminal having a larger thickness than this between the signal or power supply lead terminals, the crosstalk between the terminals can be reduced as compared with the conventional case. ..

[Brief description of drawings]

FIG. 1 is a perspective view of an embodiment of the present invention.

FIG. 2 is a partial perspective view showing a state in which the integrated circuit package shown in FIG. 1 is mounted on a printed board.

FIG. 3 is a characteristic diagram comparing crosstalk between an embodiment of the present invention and a conventional integrated circuit package.

FIG. 4 is a perspective view of a conventional integrated circuit package.

5 is a cross-sectional view showing a state of an electric field between the lead terminals of FIG.

6 is a cross-sectional view showing a state of an electric field between the lead terminals of FIG.

[Explanation of symbols]

 1 lead terminal 2 ground terminal 3 package body 4 printed board 8 ground wiring

Claims (1)

Claims for utility model registration 1. A ground terminal having a thickness greater than the thickness of the lead terminals is provided between a plurality of lead terminals arranged in parallel with the periphery of the package body. An integrated circuit package characterized by the following.