JPH054448U - Surface mount electronic components - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a surface mount type electronic component which is used for medium and high voltage applications and has no fear of deterioration in withstand voltage characteristics. [Structure] The terminals 5 and 6 were connected to the electrodes 2 and 3 of the dielectric substrate 1 for medium and high voltage by solder 7 and molded with the exterior resin 10. An insulating layer 4 is provided in an annular shape around the electrodes 2 and 3, and the insulating layer 4 prevents the solder 7 from leaking to the side surface of the dielectric substrate 1 during heating.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

  This invention is suitable for electronic parts such as capacitors and varistors, especially for medium and high voltage applications. Regarding the surface mount type.

[0002]

[Background of device]

  In recent years, various surface mount types of electronic parts have been developed because of their ease of assembly. Progress is being made. However, in the field of medium and high voltage applications, Some chips have been put into practical use, but they are very expensive and the rated voltage is 4KV (D Up to C), it is difficult to put into practical use a chip capable of handling a higher voltage.

[0003]

[The purpose of the device]

  Therefore, the object of the present invention is to be a surface mount type, which can be used for medium and high voltage applications, and An object of the present invention is to provide an electronic component that is free from the risk of deterioration in withstand voltage characteristics.

[0004]

[Constitution and function of the device]

  In order to achieve the above object, the electronic component according to the present invention first has electrodes on both sides. Cover the element substrate for medium and high voltage, the terminals soldered to the electrodes, and the element substrate. It is composed of an exterior resin.   For example, to obtain a capacitor, electrodes are provided on the front and back of a dielectric substrate for medium and high voltage, Solder the terminals punched into a predetermined shape from a hoop material such as phosphor bronze to the electrodes. Next , Mold the dielectric substrate with resin including one end of the terminal, and then expose the exposed part of the terminal. The part is bent and positioned on the same plane as the bottom surface of the exterior resin. With this, the exterior resin Thus, a surface mount type medium- and high-voltage capacitor with enhanced external pressure resistance can be obtained.

[0005]   Furthermore, in the present invention, the solder leaks from the peripheral portion of the electrode to the side surface of the element substrate, and Measures were taken to prevent the electrode gap from becoming substantially shorter and the breakdown voltage characteristics from deteriorating. . Specifically, it is necessary to provide an insulating layer such as a resist agent or a glaze agent around the electrodes. The solder was prevented from leaking to the side surface of the element substrate. Alternatively, the electrode periphery of the terminal Bend the part facing to the outside outward to form a gap with the electrode circumference, and I tried to collect solder.

[0006]

【Example】

  Embodiments of an electronic component according to the present invention will be described below with reference to the accompanying drawings.   (Refer to the first embodiment, FIGS. 1, 2 and 3)   The first embodiment shows an example in which the present invention is applied to a capacitor for medium and high voltage. It is composed of a dielectric substrate 1, terminals 5 and 6, and an exterior resin 10. Dielectric substrate 1 is a disk-shaped ceramic material with electrodes 2 and 3 formed on the front and back surfaces. Is made. Further, insulating layers 4 and 4 are provided annularly around the electrodes 2 and 3. ing. The insulating layers 4 and 4 are made of, for example, a solder resist agent or a glassy glaze agent. It is applied to a constant thickness.

[0007]   The terminals 5 and 6 are punched out from the hoop material into a predetermined shape, and the tips are Bend terminal 5 on the surface of electrode 2 and terminal 6 on the surface of electrode 3. And are connected to the electrodes 2 and 3 by solders 7 and 7, respectively. Solder 7,7 is added It melts when heated and leaks from the peripheral parts of the electrodes 2 and 3 to the side surface of the dielectric substrate 1 to form a capacitor. The withstand voltage characteristic may deteriorate. However, in the first embodiment, the electrodes 2, Insulation layers 4 and 4 provided around the circumference of 3 prevent the solder 7 and 7 from leaking to the outside, and have a withstand voltage characteristic. Is not likely to deteriorate.

[0008]   On the other hand, the exterior resin 10 is in a state in which the dielectric substrate 1 and the terminals 5 and 6 are inserted into the mold. And the entire dielectric substrate 1 is molded. Terminals 5 and 6 are exterior resin 10 The outer resin 10 is hardened at the protruding portion in the horizontal direction from the middle step portion. After that, as shown in FIG. 2, it is bent along the side surface and the bottom surface of the exterior resin 10, There is no connection to the land of the printed circuit board. (Second embodiment, see FIG. 4)   The second embodiment basically has the same configuration as that of the first embodiment. Obey The same reference numerals are given. The difference is that the solder 7,7 is dielectric when heated. This is a means for preventing leakage to the side surface of the body substrate 1.

[0009]   That is, the portions 5a and 6a facing the peripheral portions of the electrodes 2 and 3 of the terminals 5 and 6 are slightly outwardly moved. It was bent to form a gap between the electrodes 2 and 3 and the peripheral portions thereof. Solder 7 and 7 should be heated Therefore, leakage to the side surface of the dielectric substrate 1 is prevented.   By the way, it is important to keep the terminal 5 away from the electrode 3 and the terminal 6 away from the electrode 2 as much as possible. It is preferable in terms of pressure characteristics. Therefore, as in the second embodiment, the terminals 5 and 6 are folded outward. Bending is more preferable because it increases the distance from the electrodes 3 and 2 of the other party. It can be said to be a new form. (Third embodiment, see FIG. 5)   In the third embodiment, two dielectric substrates 1 and 1 are stacked to form a medium and high voltage capacitor. Therefore, the tip of the terminal 11 is bent upward 11a (1 piece) and downward 11b (2 pieces). , The upper portion 11a is soldered to the surface electrode 2 of the upper dielectric substrate 1, and the lower portion is 11b is soldered to the front and back electrodes 3 of the lower dielectric substrate 1. Another one The terminal 12 extends straight, and its tip portion is an electrode of the upper and lower dielectric substrates 1 and 1. It is sandwiched between 3 and 2 and soldered.

[0010]   Leakage of solder from the peripheral portions of the electrodes 2 and 3 is the same as in the first embodiment. This is performed by providing the insulating layer 4 on the peripheral portion of the.   A surface mount type shall be used by molding with external resin and bending the terminals 11 and 12. Is the same as in the first and second embodiments. (Other embodiments)   It should be noted that the electronic component according to the present invention is not limited to the above-mentioned embodiment, and its gist Various changes can be made within the range.

[0011]   In particular, for measures to prevent solder leakage, provide an insulating layer and bend the terminals. You may use together with a work.   Also, the terminals 5, 6, 11, and 12 are bent outward in parallel with the bottom surface of the exterior resin 10. It may be a surface mount type. Furthermore, as the type of electronic parts to which the present invention is applied, In addition to the above-mentioned capacitors, there are various types of devices that have electrodes on both sides of the element substrate such as varistor. There are electronic components.

[0012]

[Effect of device]

  As is clear from the above description, according to the present invention, it is provided on both sides of the medium voltage element substrate. The terminal is connected to the electrode and the element substrate is molded with the exterior resin. It is possible to obtain surface-mounted electronic components such as capacitors and varistors. Moreover, Insulating layer is provided on the periphery of the electrode, or the terminals are bent to collect solder. Since the solder is formed, the solder does not leak to the side surface of the element substrate and the withstand voltage characteristic deteriorates. There is no danger of

[Brief description of drawings]

FIG. 1 is a perspective view showing an intermediate product according to a first embodiment of the present invention, in which terminals are connected to a dielectric substrate.

2 is a cross-sectional view of a completed electronic component shown in FIG.

FIG. 3 is a perspective view of the finished product shown in FIG.

FIG. 4 is a sectional view showing a completed electronic component according to a second embodiment of the present invention.

FIG. 5 is a perspective view showing an intermediate product according to a third embodiment of the present invention.

[Explanation of symbols]

1 ... Dielectric substrate 2, 3 ... Electrodes 4 ... Insulating layer 5, 6, 11, 12 ... Terminal 5a, 6a ... Bent portion (solder pool portion) 10 ... Exterior resin

Claims (2)

[Scope of utility model registration request] 1. A medium- and high-voltage element substrate having electrodes on both sides, terminals soldered to the electrodes, and an exterior resin covering the element substrate to prevent leakage of solder to the periphery of the electrodes. A surface-mount type electronic component characterized by being provided with an insulating layer. 2. A medium-high voltage element substrate having electrodes on both sides, a terminal soldered to the electrode, and an exterior resin covering the element substrate, the terminal facing the peripheral portion of the electrode. The surface mount type electronic component is characterized in that the portion is bent outward to form a solder pool.