JPH0543240B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an ultrasonic probe in which an odd number of ultrasonic transducer arrays are arranged two-dimensionally and bilaterally symmetrically.

(Prior Art) Various proposals have been made for ultrasonic probes that improve the resolution in the slice direction. for example,
An array in which an odd number of ultrasonic transducer arrays are arranged as shown in FIG. 5 is known. Figure 5 shows the ultrasonic probe
- It is a configuration diagram when viewed from the Z plane. In the figure,
The ultrasonic probe 1 has the array pitch (arrangement) direction in the X direction (perpendicular to the plane of the paper), the ultrasonic transducer arrays 2, 3, and 4 in the Y direction with slight gaps between them, and the Z direction in the It is designed to transmit and receive ultrasonic waves. The ultrasonic transducer array 2 includes a common electrode 2 fixed from the top surface to the side surface of the array element.
a, a signal electrode 2b fixed to the lower surface, a common lead 2c for taking out the common electrode 2a, and a signal electrode 2b.
It has a signal lead 2d to be taken out and a backing material 2e. Further, the ultrasonic transducer array 3 also has a common electrode 3a, a signal electrode 3b, and a common electrode 3a with the same configuration as above.
It has a common lead 3c, a signal lead 3d, and a backing material 3e. The ultrasonic transducer array 4 also includes a common electrode 4a, a signal electrode 4b, a common lead 4c, a signal lead 4d, and a backing material 4e.
and has. Each common lead 2c, 3c and 4c is connected together to a reference point of the circuit. signal lead 2d
and 4d are connected together to the same wave transmitting/receiving section, and the signal lead 2d is connected to a different wave transmitting/receiving section. Such a configuration is configured for each element (each channel) of the array arranged in the X direction. Although not shown, a semi-cylindrical acoustic lens (long in the X direction) is usually installed on the common electrode side with an acoustic matching layer bonded thereto.

In the above configuration, X-direction scanning using only the ultrasound transducer array 3 in response to changes in the region of interest;
Alternatively, scanning in the X direction by all of the ultrasonic transducer arrays 2, 3, and 4 is performed. That is, the aperture in the Y direction is varied in response to changes in the region of interest, and the same scanning as in the known linear array type ultrasound probe is performed in the X direction. This improves the resolution in the Y direction from the shallow region to the deep region.

The method of arranging such an array of ultrasonic transducers is
Since it is easy to create a symmetrical configuration when viewed from the Y-Z plane, it is easy to synthesize waveforms.

(Problems to be Solved by the Invention) However, in conventional ultrasonic probes, the common electrode and the signal electrode are taken out individually by the common lead and the signal lead, so the number of leads is There is a problem in that the number of components increases and the configuration becomes complicated. Further, from the viewpoint of electrical insulation, the distance between adjacent elements in the Y direction cannot be made very small, so there is a problem that a dead area occurs over a wide range.

The present invention has been made in view of these points, and its purpose is to realize an ultrasonic probe that has a simple configuration and has a narrow dead area in the Y direction.

(Means for Solving the Problems) The ultrasonic probe of the present invention that achieves the above object has the following features:
An odd number of ultrasonic transducer arrays with Y-Z cross-sectional shapes such as trapezoids are installed symmetrically in the Y direction with the Z axis as the center on the X-Y plane, and are formed between adjacent elements in the Y direction. The groove is filled with a conductive filler to connect the common electrode, and the common electrode is taken out from the ultrasonic transducer array at the end of the Y direction, using a printed board with signal leads in a parallel pattern of the same pitch as the array. Each signal electrode is taken out individually.

(Example) Hereinafter, the present invention will be described in detail with reference to the drawings.

1 and 2 are configuration diagrams showing an ultrasonic probe according to an embodiment of the present invention, and FIG. 1 is a Y-Z
The cross-sectional view, FIG. 2 is a cross-sectional view taken along line AA (cross-sectional view taken along line X-Z) in FIG. In FIGS. 1 and 2, the ultrasonic transducer 11 has a Y axis with the Z axis as the axis of symmetry.
The configuration is such that three ultrasonic transducer arrays 12, 13, and 14 are placed as close as possible in the direction. Each ultrasonic transducer array has a trapezoidal shape on the Y-Z plane.
A large number of elements are arranged in the X direction at a pitch t (as shown in FIG. 3 in a perspective view). The ultrasonic transducer arrays 12, 13, and 14 have common electrodes 12a, 13a, and 14a fixed from the top surface to both side surfaces, and a signal electrode 12 fixed to the bottom surface.
b, 13b and 14b. Each common electrode has grooves 15 and 16 formed between the ultrasound transducer arrays.
They are connected by filling conductive adhesive or solder 17 and 18, respectively, and taken out through common leads 19 and 20 (the common electrode and the common lead are connected by conductive adhesive or solder). The common leads 19 and 20 are integrated with printed boards 21 and 23, respectively, which will be described later, with insulating spacers 24 and 25 interposed therebetween. Common electrodes 19 and 20 are therefore taken out in the same direction as the printed circuit board signal leads. The printed boards 21, 22 and 23 are each provided with signal leads in a parallel pattern with a pitch T (26 is the signal lead of the printed board 22). The printed board 22 is installed on the Z-axis, that is, on the center line of the ultrasonic transducer array 13, and the printed boards 21 and 23 are installed in symmetrical positions with respect to the printed board 22. This installation requires printed boards 21 and 22.
and 23 are placed in the X-Z plane (the printed board is approximately perpendicular to the signal electrode surface), and the signal electrodes 12b, 13b, and 14b and the signal leads of each printed board are bonded with conductive adhesive, Connected using solder or the like. Backing materials 27 and 28 are installed between printed boards 21 and 22 and between 22 and 23, respectively, and are bonded to each printed board and each signal electrode. Although not shown, the ultrasonic transducer array 11
A matching layer is bonded on top and an acoustic lens is installed. The bonding of the backing material to each signal electrode and each printed board, and the bonding of the spacer, printed board, and common lead are performed using an insulating adhesive.

In the above configuration, the ultrasonic transducers are arranged close to each other in the Y direction, the grooves between adjacent elements are filled with a conductive member, and the common electrodes of each ultrasonic transducer arranged in the Y direction are integrated. Since the electrode is taken out from the end via the common lead, the dead area is narrowed and the number of common leads is reduced. or,
Since the signal electrodes are taken out through parallel patterned signal leads formed on the printed board, there is no need to prepare a bundle of signal leads.

Such an ultrasonic probe has a first, a second and a third
A piezoelectric material (a substantially rectangular parallelepiped member whose Y-Z plane is trapezoidal and whose long axis is in the X direction. A common electrode is fixed from the top surface to the side surface, and a signal electrode is fixed to the bottom surface),
Printed boards 21, 22 and 23 on which signal leads in a parallel pattern of a predetermined pitch are formed, backing materials 27 and 28, and spacers 24 and 25.
Then, common leads 19 and 20 are prepared and made in the following steps (each symbol has the same meaning as in FIG. 1).

(1) Glue the prints 21 and 22 on both sides of the backing material 27, aligning their pitches.

(2) Second piezoelectric material (later ultrasonic transducer array 13)
Align the center axis (longitudinal direction) of the signal electrode with the pitch direction of the signal leads of the printed board 22, glue the second piezoelectric material to the backing material 27 (using an insulating adhesive), and connect the signal electrode of the second piezoelectric material to the printed board. 22
Connect the signal leads (using conductive adhesive, solder, etc.).

(3) First piezoelectric material (later ultrasonic transducer array 12)
to the backing material 27 (using insulating adhesive), and connect the signal electrode of the first piezoelectric material and the printed board 21.
Connect the signal leads (using conductive adhesive, solder, etc.). The above bonding is performed by bringing the first piezoelectric material as close as possible to the second piezoelectric material.

(4) After bonding the printed board 23 to the backing material 28, the backing material 28 is bonded to the printed board 22 and the second piezoelectric material (both using an insulating adhesive). At this time, the pitches of the signal leads on the printed boards 21, 22, and 23 are made to match.

(5) Third piezoelectric material (later ultrasonic transducer array 14)
to the backing material 28 (using insulating adhesive), and connect the signal electrode of the third piezoelectric material and the printed board 23.
Connect the signal leads (using conductive adhesive, solder, etc.). The above bonding is performed by bringing the third piezoelectric material as close as possible to the second piezoelectric material.

(6) Fill the groove formed between the first and second piezoelectric materials and the groove formed between the second and third piezoelectric materials with conductive members, and arrange them in the Y direction of each piezoelectric material. Electrically connect (integrate) common electrodes.

(7) Glue insulating spacers 24 and 25 to the non-backing material sides of printed boards 21 and 23, respectively (using an insulating adhesive).

(8) First, second and third at a predetermined pitch in the X direction.
The piezoelectric material is simultaneously diced to form ultrasonic transducer arrays 12, 13, and 14.

(9) Connect common leads 19 and 20 to the common electrode.

(10) A matching layer is adhered on top of the ultrasonic transducer arrays 12, 13, and 14, and an acoustic lens is placed on top of the matching layer.

In this way, an ultrasonic probe in which an array of ultrasonic transducers is arranged in a plane is manufactured.

Note that the present invention is not limited to the above embodiments. The shape in the Y-Z plane is not a trapezoid, but a shape with right-angled or circular arc notches on both sides, as shown in a or b in Figure 4 (each symbol is used with the same meaning as in Figure 1). It may be of. Also, the number of ultrasonic transducer arrays arranged in the Y direction is 5, 7,...
may be an odd number.

(Effects of the Invention) As explained above, according to the ultrasonic probe of the present invention, an odd number of ultrasonic transducer arrays are arranged in the Z-Y plane.
The ultrasonic transducer arrays are arranged symmetrically in the Y direction with the axis as the center, the common electrodes are connected by filling the grooves formed between the arrays adjacent in the Y direction, and the common electrodes are taken out from the end of the ultrasonic transducer array in the Y direction. Since each signal electrode is taken out individually using a printed board having signal leads in a parallel pattern with the same pitch as the array, the configuration can be simplified.
It is also possible to narrow the dead area in the Y direction.

[Brief explanation of the drawing]

FIGS. 1 and 2 are block diagrams showing an embodiment of the present invention, FIG. 3 is a block diagram showing an ultrasonic transducer array in an embodiment of the present invention, and FIGS. 4 a and b are block diagrams showing an embodiment of the present invention. FIG. 5 is a block diagram showing an ultrasonic transducer array in another embodiment, and FIG. 5 is a block diagram showing a conventional example. 11... Ultrasonic transducer, 12, 13, 14...
Ultrasonic transducer array, 12a, 13a, 14a...
... Common electrode, 12b, 13b, 14b ... Signal electrode, 15, 16 ... Groove, 17, 18 ... Conductive member, 19, 20, ... Common lead, 21, 22,
23... Printed board, 19, 20... Common lead, 26... Signal lead, 27, 28... Backing material.

Claims (1)

[Claims] 1. An ultrasonic probe comprising ultrasonic transducers arranged two-dimensionally in the X-Y plane and variable aperture in the Y direction while performing a predetermined scan in the X direction, comprising: An odd number of K elements (K = 3, 5,...) are installed symmetrically in the Y direction around the axis, and the adjacent elements in the Y direction form a groove, and the width of the groove is the same as the ultrasonic wave transmission/reception wave surface. An ultrasonic transducer array with an end face shape that opens wide on the side and narrows as the backing material side touches, a conductive filling material that fills the groove and connects common electrodes adjacent in the Y direction, and an ultrasonic transducer array with the same pitch as the array. K with parallel pattern signal leads
The printed circuit boards are arranged approximately perpendicularly to the signal electrode surface and symmetrically in accordance with the pitch of the array, and a means for taking out each signal electrode through the signal lead, and a An ultrasonic probe comprising means for taking out a common electrode from a sonic transducer array via a common lead.