JPH054274Y2 - - Google Patents

Description

[Detailed description of the invention] Industrial application field This invention is a process for manufacturing predetermined chip parts from laminated ceramic raw sheet members, etc., in which the ceramic member attached to the adhesive sheet is cut into predetermined dimensions in advance. This invention relates to a device for separating chip parts, which separates the chip parts into individual chip parts after the chips have been subdivided.

Prior Art For example, to explain the conventional example of the manufacturing process of a multilayer ceramic capacitor for each step shown in FIGS. 3A to 3D, first, as shown in FIG. Prepare multiple sheets of...
On each raw ceramic sheet 1, 1..., a plurality of internal electrodes 2, 2... are formed in advance by screen printing, etc.
Form a coating. Then, the ceramic raw sheets 1, 1... are laminated, but the uppermost layer and the lowermost ceramic raw sheets 1a, 1b... are thick ones without forming the internal electrodes 2, 2... is used for protection. Incidentally, cutting markers 3, 3 are placed on the surface of the top layer or the bottom layer of raw ceramic sheets 1a, 1b at the four corners of the periphery by appropriate means.
Mark... By laminating a plurality of raw ceramic sheets 1, 1, . . . 1a, 1b as described above, a ceramic laminate 4 shown in FIG. 3B is obtained, and the ceramic laminate 4 is integrated by hot pressing. Thereafter, as shown in FIG. 3C, using a cutting blade (not shown), the integrated ceramic laminate 4 is cut into lattice shapes as shown by the dashed arrows in the figure to be finely divided. This cutting of the ceramic laminate 4 is performed by cutting the ceramic raw sheet 1 of the uppermost layer.
The cutting is performed along the cutting markers 3, 3, . . . displayed on the top a. The inner part of the cutting markers 3, 3..., that is, the central part of the ceramic laminate 4, is the desired part to be used as a capacitor element, and conversely, the outer part of the cutting markers 3, 3..., that is, the central part of the ceramic laminate 4 The peripheral portion of the ceramic laminate 4 is an undesired portion that is not used as a capacitor element and is discarded. The capacitor element 5 shown in FIG. 3 D obtained as described above is fired at a high temperature of, for example, 1000° C. or higher, and then the internal electrodes 2, 2, . . . of the capacitor element 5 are exposed as shown in FIG. 4. External electrodes 6, 6 made of Ag paste are adhered to both end surfaces 5a, 5a, and the internal electrodes 2, 2... and external electrodes 6, 6 are electrically connected to form a chip type electronic component. Multilayer ceramic capacitor 7 is commercialized.

By the way, in the step of cutting the ceramic laminate 4 in manufacturing the multilayer ceramic capacitor 7, as shown in FIGS. In addition, it is attached to the surface 8a on an adhesive sheet 8 made of a durable resin material, and is placed on a stage 9 having a plurality of suction holes 10, 10, . . . opened on the upper surface 9a. The ceramic laminate 4 is positioned and fixed on the stage 9 via the adhesive sheet 8 by vacuum suction from .
In this state, as described above, using a cutting blade (not shown), the ceramic laminate is cut in a grid pattern as shown by the broken line arrows in FIGS. 6 and 7 to be finely divided. The capacitor elements 5, 5, etc. thus finely divided are individually peeled off from the adhesive sheet 8 and supplied to a subsequent process.

Problems to be Solved by the Invention Incidentally, during the cutting process of the ceramic laminate 4, the ceramic laminate 4 obtained by finely dividing the ceramic laminate 4 as shown in FIGS. 6 and 7. The inner parts of the cutting markers 3, 3..., i.e., the capacitor elements 5, 5... whose central parts are subdivided, and the outer parts, i.e., the peripheral parts, of the cutting markers 3, 3... of the ceramic laminate 4. It consists of chip parts 5b, 5b, . . . which are obtained by subdividing the chip.
Since the chip parts 5b, 5b... are not used as the capacitor elements 5, 5..., the capacitor elements 5, 5... made by subdividing the ceramic laminate 4 and the chip parts 5b, 5b... are placed on the adhesive sheet 8. When individually peeling from
The chip parts 5b, 5b, . . . must be separated while being distinguished from the capacitor elements 5, 5, .

Conventionally, the above-mentioned peeling work has been performed manually, which has made the work complicated and significantly reduced work efficiency.

Means to Solve the Problems The present invention is to cut chip parts of raw ceramic sheet laminates by making vertical and horizontal lattice-like cuts with the adhesive sheet attached to the back side. or a lower stage that adsorbs and fixes the chip parts except for a part thereof, and an upper stage that presses and clamps the chip parts of the raw ceramic sheet laminate placed on the lower stage from above except for the peripheral parts. and a movable member having a notch with a Γ-shaped cross section at the lower end, the notch is lowered toward the stage on the side of the upper and lower stages, and the peripheral part protruding from the upper and lower stages is pressed. After bending the chip part from the cut part, the chip part in the bent peripheral part is loosely fitted into the notch part and the cut surface is pressed, so that it sticks out from the adhesive sheet and the chip part in the peripheral part is peeled off. Disclosed is a chip component separation device characterized by:

Function: The ceramic chips cut into a lattice shape while attached to the adhesive sheet are held between the upper and lower stages except for the periphery, and are then transferred to a peeling blade having a notch with a Γ-shaped cross section at the lower end. Therefore, after the peripheral portion is pressed and bent from the cut portion, the cut surface of the peripheral portion is pressed by the notch portion to peel the peripheral portion from the adhesive sheet.

Embodiment An embodiment of an apparatus for separating chip parts made of laminated ceramic according to the present invention will be described below with reference to FIGS. 1a to 1g. In FIG. 1a, 4 is an assembly of chip parts made of a laminate of raw ceramic sheets (hereinafter referred to as a ceramic laminate), 8 is an adhesive sheet, 11 is a lower stage, 12 is an upper stage,
13 is a peeling blade. The ceramic laminate 4 has an adhesive sheet 8 of approximately the same size on the back side as before.
is pasted, and the central part 4a (desired part to become a capacitor element) and peripheral part 4b (undesired part to be discarded) are subdivided while being pasted, and the central part 4a and peripheral part 4b are separated. The boundary 4c is cut. The lower stay 11 has a mounting surface that is approximately the same size as the center portion 4a of the ceramic laminate 4, and a plurality of vacuum suction holes (not shown) are opened in the mounting surface, so that the ceramic laminate 4 can be mounted on the lower stay 11. It is adsorbed and placed except for the peripheral part 4b. Upper stage 12
The ceramic laminate 4, which has been adsorbed and placed on the lower stage 11, is pressed and held, except for the peripheral portion 4b. The peeling blade 13 has a notch 13 at the lower end with a Γ-shaped cross section and a width l that is approximately the same as the thickness of the ceramic laminate 4.
It consists of a rod-shaped member with a
1 and 12, cut out the notch 13a on the upper stage 1.
Move up and down towards 2.

The operation of the present invention based on the above configuration will be described below. First, as shown in FIG. 1a, a ceramic laminate 4
The central part 4a of the upper and lower stages 11 and 12 is sandwiched and positioned and fixed.
The protruding peripheral portion 4b is pressed from above with the tip of the peeling blade 13. At this time, the peeling blade 13 is substantially in contact with the side of the upper stage 12, and the notch portion 13a is directed toward the upper stage 12 side. When the peeling blade 13 is lowered in this state, the peripheral part 4b of the ceramic laminate 4 is bent from the boundary 4c with the central part 4a, as shown in FIGS. 1b and 1c. Next, when the peeling blade 13 is further lowered, as shown in FIG. Begin to. Then, the peeling blade 13 is further lowered so that the upper end surface of the notch 13a comes into close contact with the cut surface of the boundary 4c as shown in FIG. 1e, and then the peeling blade 13 is lowered. As shown in f, the peripheral portion 4b is displaced and peeled off from the adhesive sheet 8, as shown in FIG.

Next, other embodiments of the above embodiments are shown in Fig. 2 a to f.
is shown below with reference to. In FIG. 2a, 4 is a ceramic laminate, 8 is an adhesive sheet, 14 is a lower stage, 15 is an upper stage, and 16 is a peeling blade.
The ceramic laminate 4 has an adhesive sheet of approximately the same size adhered to the back side, and is subdivided into a central portion 4a and a peripheral portion 4b while being adhered. The boundary 4c is cut. The lower stage 14 has a mounting surface that is slightly larger than the center portion 4a of the ceramic laminate 4 and has a curvature R formed around its periphery, and a plurality of vacuum suction holes (not shown) are opened in the mounting surface. and
The ceramic laminate 4 is adsorbed and placed except for a part of the peripheral portion 4b (including the boundary 4c). The upper stage 15 presses and holds the ceramic laminate 4, which has been adsorbed and placed on the lower stage 14, except for the peripheral portion 4b. The peeling blade 16 is a rod-shaped member with a notch 16a at its lower end that has a Γ-shaped cross section and a width l that is approximately the same as the thickness of the ceramic laminate 4. It moves up and down toward stage 15.

The operation of the present invention based on the above configuration will be described below. First, as shown in FIG. 2a, a ceramic laminate 4
The central part 4a of the upper and lower stages 14 and 15 is sandwiched and positioned and fixed.
The protruding peripheral portion 4b is pressed from above with the tip of the peeling blade 16 with the notch 16a facing the upper stage 15 side. When the peeling blade 16 is lowered in this state, as shown in FIG. do. Next, when the peeling blade 16 is further lowered, the second
As shown in Figure c, the area near the boundary 4c begins to peel off from the adhesive sheet 8, and further, as shown in Figure 2d, the peripheral part 4b begins to loosely fit into the notch 16a. Then, the peeling blade 16 is further lowered,
As shown in FIG. 2e, after the upper end surface of the notch 16a comes into close contact with the cut surface of the boundary 4c, when the peeling blade 16 is lowered, as shown in FIG. 2f,
The peripheral portion 4b shifts and peels off from the adhesive sheet 8.

According to the above embodiment, as shown in FIG. 2b,
When the peripheral part 4b of the ceramic laminate 4 bends from the boundary 4c with the central part 4a, it follows the above-mentioned curvature R, so that the adhesive sheet 8 can be prevented from tearing due to bending. Moreover, at this time, as shown in Figure 2c,
Since the area near the boundary 4c peels off first than the adhesive sheet 8, it is easy to peel off even if the adhesive strength is strong.

Further, the peripheral portions 4b on four sides of the rectangular ceramic laminate 4 may be peeled off at once, or the two opposing sides may be peeled off in two steps.

Effects of the invention According to the invention, in the manufacturing process of ceramic capacitors, when a ceramic laminate chip assembly adhered to an adhesive sheet is separated into individual parts, peeling of the peripheral part is automated and work efficiency is improved. improves.

[Brief explanation of the drawing]

FIGS. 1a to 1g are side sectional views of main parts of an embodiment of the chip component separation device according to the present invention in the order of operation, and FIGS. 2a to 2f are other side sectional views of the chip component separation device according to the present invention. Third sectional side view of main parts in order of operation showing the embodiment
Figures A to D are process diagrams showing each process in manufacturing a general multilayer ceramic capacitor, Figure 4 is a sectional view showing an example of a multilayer ceramic capacitor, and Figure 5
Figures 7 to 7 are for explaining a conventional example of the manufacturing process of chip parts, and Figure 5 is a perspective view showing the state in which a raw ceramic sheet laminate is adhered to an adhesive resin sheet, and Figure 6 5 is a partial sectional view showing a state in which the pasting shown in FIG. 5 is completed, and FIG. 7 is a plan view of FIG. 6. 4... Ceramic laminate (chip parts assembly),
4b...Peripheral part, 8...Adhesive sheet, 11,1
4...lower stage, 12,15...upper stage,
13, 16...Peeling blade (movable mechanism for peeling), 13
a, 16a...notch portion.

Claims (1)

[Scope of utility model registration request] A lower stage that adsorbs and fixes the chip parts of the ceramic material, which are divided by cutting into predetermined dimensions vertically and horizontally with the adhesive sheet attached to the back side, and the upper stage that is fixed on the lower stage. It consists of an upper stage that presses and clamps the chip component from above, and a movable peeling mechanism with a notch formed at the lower end, and the adhesive sheet on which the chip component is pasted protrudes from the sides of the upper and lower stages. The protruding portion is pressed by the movable mechanism to open the notch in the chip component and the sheet is bent, and the chip component is loosely fitted into the notch and the notch surface is pressed to separate each chip component. A device for separating chip parts, which is characterized by separating chip parts from an adhesive sheet.