JPH0541591Y2 - - Google Patents
Info
- Publication number
- JPH0541591Y2 JPH0541591Y2 JP1984149122U JP14912284U JPH0541591Y2 JP H0541591 Y2 JPH0541591 Y2 JP H0541591Y2 JP 1984149122 U JP1984149122 U JP 1984149122U JP 14912284 U JP14912284 U JP 14912284U JP H0541591 Y2 JPH0541591 Y2 JP H0541591Y2
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- support member
- disposed
- cap
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 19
- 210000000078 claw Anatomy 0.000 description 10
- 229910000831 Steel Inorganic materials 0.000 description 4
- 230000007257 malfunction Effects 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000036544 posture Effects 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984149122U JPH0541591Y2 (US07943777-20110517-C00090.png) | 1984-10-02 | 1984-10-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984149122U JPH0541591Y2 (US07943777-20110517-C00090.png) | 1984-10-02 | 1984-10-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6163885U JPS6163885U (US07943777-20110517-C00090.png) | 1986-04-30 |
| JPH0541591Y2 true JPH0541591Y2 (US07943777-20110517-C00090.png) | 1993-10-20 |
Family
ID=30707310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984149122U Expired - Lifetime JPH0541591Y2 (US07943777-20110517-C00090.png) | 1984-10-02 | 1984-10-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0541591Y2 (US07943777-20110517-C00090.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4164764B2 (ja) | 2004-05-31 | 2008-10-15 | オムロン株式会社 | 収納ケースの組立方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57169644A (en) * | 1981-04-14 | 1982-10-19 | Nippon Denso Co Ltd | Semiconductor type pressure sensor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58129167U (ja) * | 1982-02-24 | 1983-09-01 | 三菱電機株式会社 | 磁気センサ− |
-
1984
- 1984-10-02 JP JP1984149122U patent/JPH0541591Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57169644A (en) * | 1981-04-14 | 1982-10-19 | Nippon Denso Co Ltd | Semiconductor type pressure sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6163885U (US07943777-20110517-C00090.png) | 1986-04-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6227877B1 (en) | Electrical contact | |
| US6116949A (en) | Electrostatic protection cover for electrical connector | |
| EP1523229A3 (en) | Assembly of an electronic component with spring packaging | |
| US7147510B2 (en) | Socket for installing electronic parts | |
| EP1694104A1 (en) | Surface-mounting type electronic circuit unit | |
| US6156587A (en) | Method of attaching solid state imaging device | |
| US6375476B1 (en) | LGA package socket | |
| US5463531A (en) | PCMCIA electronics housing | |
| WO2011015667A1 (en) | One-piece shielding hood with one or more pins | |
| JPH0541591Y2 (US07943777-20110517-C00090.png) | ||
| US9118150B2 (en) | Electrical connector and electrical connector assembly used thereof | |
| JPH11288751A (ja) | プリント配線基板への端子の取付構造 | |
| JPH0231803Y2 (US07943777-20110517-C00090.png) | ||
| KR101473477B1 (ko) | 인쇄회로 기판의 모듈 실장 구조 | |
| US4881903A (en) | Terminal connector of small electric devices | |
| JP3220106B2 (ja) | コネクタ保護カバー | |
| JPH0338845Y2 (US07943777-20110517-C00090.png) | ||
| JP2866465B2 (ja) | 電子部品 | |
| JPH0615416Y2 (ja) | チツプ型ソケツト | |
| EP1777999A1 (en) | Circuit board providing coplanarity of solders and high soldering reliability for semiconductor component | |
| JP3116367B2 (ja) | 光送／受信用モジュール | |
| JP3099492B2 (ja) | 複合電子部品 | |
| JPH0631752Y2 (ja) | 受光装置 | |
| JP2595652B2 (ja) | プリント基板の機器への装着構造 | |
| JPH0770343B2 (ja) | コネクタ |
