JPH0541519Y2 - - Google Patents
Info
- Publication number
- JPH0541519Y2 JPH0541519Y2 JP16694188U JP16694188U JPH0541519Y2 JP H0541519 Y2 JPH0541519 Y2 JP H0541519Y2 JP 16694188 U JP16694188 U JP 16694188U JP 16694188 U JP16694188 U JP 16694188U JP H0541519 Y2 JPH0541519 Y2 JP H0541519Y2
- Authority
- JP
- Japan
- Prior art keywords
- case
- circuit board
- printed circuit
- insulating plate
- filling material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 12
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Description
本考案は、放電灯点灯装置に関する。 The present invention relates to a discharge lamp lighting device.
従来、電子部品を実装したプリント基板をケー
スに収納し、充填材料を注入する場合、完成時の
コネクタ位置を固定し、充填時に充填材料がコネ
クタには付着しないようにするため、プリント基
板をケース底面に密着させる必要があり、第６図
のようにクリツプなどの治具１０を用いてプリン
ト基板１１をケース１２に固定して充填材料１３
を注入していた。
Conventionally, when a printed circuit board with electronic components mounted on it is housed in a case and filling material is injected, the printed circuit board is placed in the case in order to fix the connector position when completed and to prevent the filling material from adhering to the connector during filling. It is necessary to attach the printed circuit board 11 to the bottom of the case 12 using a jig 10 such as a clip as shown in FIG.
was injected.
従来の技術にあつては、充填材料を注入すると
き、上述のように治具を用いる必要があり、充填
作業が面倒で、高価なものになるという課題を有
していた。
本考案はかかる点に鑑みて為されたものであ
り、その目的とするところは、充填材料の注入工
程において、治具を用いることなく安価な構成で
作業可能なものにすることにある。
In the conventional technique, when injecting the filling material, it is necessary to use a jig as described above, and the filling operation is troublesome and expensive. The present invention has been devised in view of these points, and its purpose is to provide an inexpensive structure that allows the filling material injection process to be performed without using any jigs.
本考案は、上記目的を達成するために、電子部
品を実装したプリント基板と、前記電子部品およ
びプリント基板と収納するケースと、前記プリン
ト基板とケースとの間に介在せる絶縁板と、前記
ケース内に注入した充填材料とを備え、前記絶縁
板はばね性を有し前記電子部品をケース内側面に
押さえる作用をするようにしたものである。
In order to achieve the above object, the present invention provides a printed circuit board on which electronic components are mounted, a case for storing the electronic components and the printed circuit board, an insulating plate interposed between the printed circuit board and the case, and the case. The insulating plate has a spring property and functions to press the electronic component against the inner surface of the case.
絶縁板は、ばね性を持たせることにより、新た
な部品、治具等を用いることなく充填材料を注入
でき、作業性がよく、安価に充填材料を注入でき
る。
By giving the insulating plate a spring property, the filling material can be injected without using new parts, jigs, etc., and the filling material can be injected with good workability and at low cost.
本考案の実施例を図面により詳細に説明する。
第１図において、プリント基板１には電子部品２
を実装し、この電子部品２とプリント基板１とを
ケース３に収納する。絶縁板４は、厚さ0.35mmの
ポリエステルフイルムを用い、第２図のように、
断面略コ字状としてその一片５を外方に屈曲させ
て延設部６の端面７をケース３の内側面に当接
し、屈曲部８を電子部品２に当接するようにし、
プリント基板１上に実装された電子部品２をケー
ス３底面に密着させるようにしている。
絶縁板４のプリント基板１を押さえる応力を第
３図により説明する。角度θ11，θ21はケース３に
収納前の角度で角度θ12，θ22はケース３に収納後
の角度である。ケース収納後、角度θ22は角度θ21
へ戻る応力が働き、点b′はケース３の内側面に押
しつけられる。ケース３の内側面に接する点b′c
を底辺にした第４図のような、三角形a′b′cは点
a′を頂点に角度θ12を構成する。角度θ12とθ11との
間には、θ12＞θ11の関係が成立し、∠b′a′cは∠
bacに戻ろうとする。このとき、点a′は点ａに近
付く方向に移動するため点a′でプリント基板１の
上の電子部品２をケース３の底面側へ押しつける
ようにして作用する。この状態で、充填材料９を
注入し、硬化させて第５図に示すような放電灯点
灯装置を得る。
Embodiments of the present invention will be described in detail with reference to the drawings.
In FIG. 1, a printed circuit board 1 has an electronic component 2.
is mounted, and the electronic component 2 and printed circuit board 1 are housed in a case 3. The insulating plate 4 is made of polyester film with a thickness of 0.35 mm, as shown in Fig. 2.
The piece 5 is bent outward so that the end face 7 of the extension part 6 comes into contact with the inner surface of the case 3, and the bent part 8 comes into contact with the electronic component 2.
An electronic component 2 mounted on a printed circuit board 1 is brought into close contact with the bottom surface of a case 3. The stress exerted by the insulating plate 4 on the printed circuit board 1 will be explained with reference to FIG. The angles θ 11 and θ 21 are the angles before being stored in the case 3, and the angles θ 12 and θ 22 are the angles after being stored in the case 3. After storing the case, angle θ 22 becomes angle θ 21
A stress returns to the point b', which presses the point b' against the inner surface of the case 3. Point b′c in contact with the inner surface of case 3
The triangle a′b′c, as shown in Figure 4 with , as its base, is a point.
Construct an angle θ 12 with a' as the vertex. The relationship θ 12 > θ 11 holds between angles θ 12 and θ 11 , and ∠b′a′c is ∠
Trying to get back to bac. At this time, since point a' moves in a direction approaching point a, point a' acts to press the electronic component 2 on the printed circuit board 1 toward the bottom side of the case 3. In this state, a filling material 9 is injected and hardened to obtain a discharge lamp lighting device as shown in FIG.
本考案は上述のように構成したから、充填材料
の注入工程において、新たな部品、治具を用いる
ことなく作業性の良い安価な放電灯点灯装置が得
られるという効果を奏するものである。
Since the present invention is configured as described above, an inexpensive discharge lamp lighting device with good workability can be obtained without using new parts or jigs in the filling material injection process.
第１図は本考案の一実施例の充填材料注入工程
の縦断面図、第２図は同上の絶縁板の斜視図、第
３図および第４図はそれぞれ同上の絶縁板の作用
説明図、第５図は本考案の一実施例の斜視図、第
６図は従来例の充填材料注入工程の縦断面図であ
る。
１はプリント基板、２は電子部品、３はケー
ス、４は絶縁板、９は充填材料である。
FIG. 1 is a longitudinal cross-sectional view of the filling material injection process according to an embodiment of the present invention, FIG. 2 is a perspective view of the same insulating plate, and FIGS. 3 and 4 are explanatory diagrams of the operation of the same insulating plate, respectively. FIG. 5 is a perspective view of an embodiment of the present invention, and FIG. 6 is a longitudinal sectional view of a conventional filling material injection process. 1 is a printed circuit board, 2 is an electronic component, 3 is a case, 4 is an insulating plate, and 9 is a filling material.
Claims (1)
部品およびプリント基板を収納するケースと、前
記プリント基板とケースとの間に介在せる絶縁板
と、前記ケース内に注入した充填材料とを備え、
前記絶縁板はばね性を有し前記電子部品をケース
内側面に押さえる作用をして成る放電灯点灯装
置。 A printed circuit board with electronic components mounted thereon, a case for storing the electronic components and the printed circuit board, an insulating plate interposed between the printed circuit board and the case, and a filling material injected into the case,
In the discharge lamp lighting device, the insulating plate has a spring property and functions to press the electronic component against the inner surface of the case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16694188U JPH0541519Y2 (en) | 1988-12-23 | 1988-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16694188U JPH0541519Y2 (en) | 1988-12-23 | 1988-12-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0287397U JPH0287397U (en) | 1990-07-11 |
| JPH0541519Y2 true JPH0541519Y2 (en) | 1993-10-20 |
Family
ID=31454783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16694188U Expired - Lifetime JPH0541519Y2 (en) | 1988-12-23 | 1988-12-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0541519Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8859436B2 (en) | 1996-05-28 | 2014-10-14 | The Trustees Of Columbia University In The City Of New York | Uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors formed using sequential lateral solidification and devices formed thereon |
-
1988
- 1988-12-23 JP JP16694188U patent/JPH0541519Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8859436B2 (en) | 1996-05-28 | 2014-10-14 | The Trustees Of Columbia University In The City Of New York | Uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors formed using sequential lateral solidification and devices formed thereon |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0287397U (en) | 1990-07-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0541519Y2 (en) | ||
| JPH0343722U (en) | ||
| JPS6132811U (en) | Structure of screwed parts of resin parts | |
| JPS6429871U (en) | ||
| JPH0217878U (en) | ||
| JPS5939938U (en) | Parts positioning device | |
| JPS6114731Y2 (en) | ||
| JPS5835502U (en) | panel retainer | |
| JPS5944097U (en) | Fixing device for electronic parts | |
| JPS64369U (en) | ||
| JPH0229159U (en) | ||
| JPH0184487U (en) | ||
| JPS58116180U (en) | Piece mounting device for component assembly | |
| JPS58104729U (en) | Mounting device for resin containers | |
| JPS61119957U (en) | ||
| JPS60112084U (en) | Printed circuit board connector | |
| JPH0467808U (en) | ||
| JPH02101471U (en) | ||
| JPS60144267U (en) | Locking device for electrical parts | |
| JPS5931219U (en) | Mounting legs for capacitors | |
| JPS58133999U (en) | Small electronic component placement device | |
| JPS61132284U (en) | ||
| JPH01171914U (en) | ||
| JPH01153673U (en) | ||
| JPS58154429U (en) | object detection device |