JPH0541502A - Semiconductor storage device - Google Patents
Semiconductor storage deviceInfo
- Publication number
- JPH0541502A JPH0541502A JP3220871A JP22087191A JPH0541502A JP H0541502 A JPH0541502 A JP H0541502A JP 3220871 A JP3220871 A JP 3220871A JP 22087191 A JP22087191 A JP 22087191A JP H0541502 A JPH0541502 A JP H0541502A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- bit line
- insulating film
- polarization
- readout operation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 6
- 239000003990 capacitor Substances 0.000 claims abstract description 37
- 230000010287 polarization Effects 0.000 abstract description 24
- 238000010586 diagram Methods 0.000 description 5
- 229920006395 saturated elastomer Polymers 0.000 description 1
Landscapes
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、不揮発性半導体記憶装
置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nonvolatile semiconductor memory device.
【0002】[0002]
【従来の技術】従来、キャパシタ絶縁膜として強誘電体
膜を用いたメモリセルは、MOSトランジスタ1個とキ
ャパシタ1個で構成されている。図4に上記トランジス
タ1個とキャパシタ1個で構成されるメモリセルにおけ
る書き込み、読み出し時の分極特性を示す。4はMOS
トランジスタ、6,7はキャパシタ電極、8はキャパシ
タ絶縁膜を示す。2. Description of the Related Art Conventionally, a memory cell using a ferroelectric film as a capacitor insulating film is composed of one MOS transistor and one capacitor. FIG. 4 shows polarization characteristics at the time of writing and reading in the memory cell composed of one transistor and one capacitor. 4 is MOS
Transistors, 6 and 7 are capacitor electrodes, and 8 is a capacitor insulating film.
【0003】書き込み時のキャパシタ絶縁膜8の分極状
態について説明する。最初にキャパシタ電極7側をVc
c/2(V)の電位にしておく。次にキャパシタ電極6
側をVcc(V)(「1」を書き込む場合)または0
(V)(「0」を書き込む場合)にする。この時、図4
(a),(b)に示す様に、「1」を書き込んだ場合
と、「0」を書き込んだ場合とでは、分極の向きが反対
の状態で残留分極電荷がキャパシタに蓄積されることに
なる。The polarization state of the capacitor insulating film 8 during writing will be described. First, the capacitor electrode 7 side is Vc
The potential is set to c / 2 (V). Next, the capacitor electrode 6
The side is Vcc (V) (when writing "1") or 0
(V) (when writing "0"). At this time,
As shown in (a) and (b), the residual polarization charge is accumulated in the capacitor in the state where the polarization directions are opposite between when "1" is written and when "0" is written. Become.
【0004】次に読み出し時のキャパシタ絶縁膜8の分
極状態について説明する。まず、キャパシタ電極6側を
Vcc(V)にする。「1」を読み出す場合、図4
(a),(c)に示す様にキャパシタの分極の向きは反
転しない為、I=(Ps−Pr)/Δt(Psは飽和分
極電荷,Prは残留分極電荷,Δtは反転速度を示
す。)の大きさの電流が流れる。一方、「0」を読み出
す場合、図4(b),(d)にする示す様にキャパシタ
の分極の向きは反転する為、電荷の変動量が大きく、I
=(2Pr+(Ps−Pr))/Δt=(Pr+Ps)
/Δtとなり、流れる電流は「1」を読み出す場合に比
べて大きい。すなわち流れる電流の大小により、
「1」,「0」の読み出しを判別することが可能にな
る。Next, the polarization state of the capacitor insulating film 8 at the time of reading will be described. First, the capacitor electrode 6 side is set to Vcc (V). When reading "1",
As shown in (a) and (c), since the polarization direction of the capacitor is not inverted, I = (Ps-Pr) / Δt (Ps is a saturated polarization charge, Pr is a remanent polarization charge, and Δt is a reversal speed. ) The electric current of the magnitude flows. On the other hand, when "0" is read, the direction of polarization of the capacitor is reversed as shown in FIGS.
= (2Pr + (Ps−Pr)) / Δt = (Pr + Ps)
/ Δt, and the flowing current is larger than that when reading “1”. That is, depending on the magnitude of the flowing current,
It is possible to determine whether to read "1" or "0".
【0005】[0005]
【発明が解決しようとする課題】上記の様に、キャパシ
タ1個とトランジスタ1個でメモリセル1個を構成する
場合に、上記電流量の大小を判別するために読み出し動
作に於いてダミーセルが必要であり、そのため読み出し
速度が抑制される。As described above, when one memory cell is composed of one capacitor and one transistor, a dummy cell is necessary in the read operation to determine the magnitude of the current amount. Therefore, the reading speed is suppressed.
【0006】そこで、本発明は、ダミーセルが不要な、
高速読み出し可能な半導体記憶装置を提供することを目
的とする。Therefore, the present invention eliminates the need for dummy cells,
An object is to provide a semiconductor memory device capable of high-speed reading.
【0007】[0007]
【課題を解決するための手段】本発明の半導体記憶装置
は、キャパシタ1個とMOSトランジスタ2個とでメモ
リセル1個を構成し、強誘電体膜をキャパシタ絶縁膜と
して用いた前記キャパシタを設けたことを特徴とする。In the semiconductor memory device of the present invention, one memory cell is composed of one capacitor and two MOS transistors, and the capacitor using a ferroelectric film as a capacitor insulating film is provided. It is characterized by
【0008】[0008]
【作用】本発明を用いることにより、ビット線と反転ビ
ット線との電位差をセンスすることにより、ダミーセル
を介さず直接読み出し動作を行うことが可能である。According to the present invention, by sensing the potential difference between the bit line and the inverted bit line, it is possible to directly perform the read operation without using the dummy cell.
【0009】[0009]
【実施例】以下、一実施例に基づいて、本発明について
詳細に説明する。The present invention will be described in detail below based on an example.
【0010】図1は本発明の一実施例のメモリセル回路
構成を示し、図2(a),(b)は本発明の一実施例の
書き込み動作時の分極状態図を示し、図2(c),
(d)は本発明の一実施例の残留電荷を利用した読み出
し動作時の残留電荷の状態を示し、図2(e),(f)
は同分極反転を利用した読み出し動作時の分極方向を示
す。1はビット線、2は反転ビット線、3はワード線、
4,5はMOSトランジスタ、6,7はキャパシタ電
極、8は強誘電体膜(例えば、PZT膜等)を用いたキ
ャパシタ絶縁膜を示す。FIG. 1 shows a memory cell circuit configuration of an embodiment of the present invention, FIGS. 2A and 2B show polarization state diagrams at the time of a write operation of the embodiment of the present invention, and FIG. c),
FIG. 2D shows a state of the residual charge at the time of the read operation using the residual charge according to the embodiment of the present invention, and FIGS.
Indicates the polarization direction during a read operation using the same polarization inversion. 1 is a bit line, 2 is an inverted bit line, 3 is a word line,
Reference numerals 4 and 5 are MOS transistors, 6 and 7 are capacitor electrodes, and 8 is a capacitor insulating film using a ferroelectric film (for example, a PZT film or the like).
【0011】次に、「1」及び「0」の書き込み動作に
ついて説明する。まず、「1」を書き込む場合、ビット
線1をVcc(V),反転ビット線2を0(V)にす
る。このとき生じる残留電荷により、図2(a)に示す
様に、分極方向はキャパシタ電極7からキャパシタ電極
6に向かう方向となる。「0」を書き込む場合、ビット
線1を0(V),反転ビット線2をVcc(V)にす
る。このとき生じる残留電荷により図2(b)に示す様
に、分極方向はキャパシタ電極6からキャパシタ電極7
に向かう方向となる。Next, the write operation of "1" and "0" will be described. First, when writing "1", the bit line 1 is set to Vcc (V) and the inverted bit line 2 is set to 0 (V). Due to the residual charge generated at this time, the polarization direction is from the capacitor electrode 7 to the capacitor electrode 6 as shown in FIG. When writing "0", the bit line 1 is set to 0 (V) and the inverted bit line 2 is set to Vcc (V). Due to the residual charge generated at this time, the polarization direction changes from the capacitor electrode 6 to the capacitor electrode 7 as shown in FIG.
The direction is toward.
【0012】次に、残留電荷を利用した読み出し動作に
ついて説明する。まず、ビット線1及び反転ビット線2
を同電位(Vcc/2(V))にする。次に、ワード線
3をオンすると、図2(c),(d)に示す様に、残留
電荷に応じてビット線1及び反転ビット線2には、それ
ぞれ±Vr=±Qr/C(±Qrは残留電荷,Cはビッ
ト線1等の容量を示す)の電位差が生じる。その後、直
接センス動作を行うことにより、分極の向きに応じて、
「1」及び「0」の読み出しが可能となる。読み出し時
のビット線1及び反転ビット線2の初期値電位はVcc
/2(V)に限定されず、センスできれば、どの値に設
定してもよい。Next, the read operation using the residual charge will be described. First, bit line 1 and inverted bit line 2
To the same potential (Vcc / 2 (V)). Next, when the word line 3 is turned on, as shown in FIGS. 2C and 2D, ± Vr = ± Qr / C (±) on the bit line 1 and the inverted bit line 2 depending on the residual charge. Qr represents a residual charge, and C represents a capacitance of the bit line 1 etc.). After that, by directly performing the sensing operation, depending on the direction of polarization,
It is possible to read "1" and "0". The initial potentials of the bit line 1 and the inverted bit line 2 at the time of reading are Vcc
The value is not limited to / 2 (V) and may be set to any value as long as it can be sensed.
【0013】次に、他の実施例として、分極反転を利用
した読み出し動作について説明する。Next, as another embodiment, a read operation using polarization inversion will be described.
【0014】ビット線1をVcc/2(V)又は0
(V)にし、反転ビット線2をVcc(V)又はVcc
/2(V)にした後、ワード線3をオンする。図3
(a)及び(b)は、分極反転を利用し、「1」及び
「0」を読み出す動作におけるヒステリシス特性を示
す。図3(a)に示す様に、「1」を読み出す場合には
分極反転が生じ、電荷量が変化する。一方、「0」を読
み出す場合には、図3(b)に示す様に、分極反転は生
じず、電荷量はほとんど変化しない。したがって、上記
の様に分極反転を利用した場合、電荷量の変化により生
じる電流又は電位の変化により、「1」又は「0」を判
断することが可能となる。Bit line 1 is set to Vcc / 2 (V) or 0
(V) and set the inverted bit line 2 to Vcc (V) or Vcc
After setting it to / 2 (V), the word line 3 is turned on. Figure 3
(A) and (b) show hysteresis characteristics in the operation of reading "1" and "0" by utilizing polarization inversion. As shown in FIG. 3A, when "1" is read, polarization inversion occurs and the charge amount changes. On the other hand, when "0" is read, polarization inversion does not occur and the charge amount hardly changes, as shown in FIG. Therefore, when the polarization reversal is used as described above, it is possible to judge "1" or "0" by the change in the current or the potential caused by the change in the charge amount.
【0015】上記読み出し時にビット線1及び反転ビッ
ト線2に設定される電位は、本実施例に限定されず、
「1」又は「0」の一方を読み出す場合に分極反転を生
じ、他方を読み出す場合に分極反転を生じなければ実施
可能である。The potentials set on the bit line 1 and the inverted bit line 2 at the time of reading are not limited to those in the present embodiment.
It is possible if polarization inversion occurs when one of "1" and "0" is read and polarization inversion does not occur when the other is read.
【0016】[0016]
【発明の効果】以上詳細に説明した様に、本発明を用い
ることにより、ダミーセルを用いることなく直接センス
動作を行うことにより読み出し動作の高速化が図れる。
また、キャパシタ絶縁膜に強誘電体膜を用いていること
により、リフレッシュが不要の不揮発性半導体記憶装置
が得られる。As described above in detail, by using the present invention, the read operation can be speeded up by directly performing the sensing operation without using the dummy cell.
Further, by using the ferroelectric film for the capacitor insulating film, a non-volatile semiconductor memory device that does not require refreshing can be obtained.
【図1】本発明の一実施例のメモリセルの回路構成図で
ある。FIG. 1 is a circuit configuration diagram of a memory cell according to an embodiment of the present invention.
【図2】本発明の一実施例の書き込み時及び読み出し時
のキャパシタの状態図である。FIG. 2 is a state diagram of a capacitor during writing and reading according to an embodiment of the present invention.
【図3】図2における、分極反転を利用した場合の読み
出し時のヒステリシス特性図である。FIG. 3 is a hysteresis characteristic diagram at the time of reading when the polarization inversion in FIG. 2 is used.
【図4】従来の強誘電体膜を用いたメモリセルのキャパ
シタの状態図である。FIG. 4 is a state diagram of a capacitor of a memory cell using a conventional ferroelectric film.
1 ビット線 2 反転ビット線 3 ワード線 4,5 MOSトランジスタ 6,7 キャパシタ電極 8 キャパシタ絶縁膜 1 bit line 2 inverted bit line 3 word line 4,5 MOS transistor 6,7 capacitor electrode 8 capacitor insulating film
───────────────────────────────────────────────────── フロントページの続き (72)発明者 崎山 恵三 大阪市阿倍野区長池町22番22号 シヤープ 株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Keizo Sakiyama 22-22 Nagaike-cho, Abeno-ku, Osaka
Claims (1)
個とでメモリセル1個を構成する半導体記憶装置であっ
て、 強誘電体膜をキャパシタ絶縁膜として用いた前記キャパ
シタを設けたことを特徴とする半導体記憶装置。1. A capacitor and a MOS transistor 2
A semiconductor memory device comprising a memory cell and a memory cell, wherein the capacitor is provided with a ferroelectric film as a capacitor insulating film.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3220871A JPH0541502A (en) | 1991-05-28 | 1991-09-02 | Semiconductor storage device |
US07/888,856 US5357460A (en) | 1991-05-28 | 1992-05-27 | Semiconductor memory device having two transistors and at least one ferroelectric film capacitor |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12152091 | 1991-05-28 | ||
JP3-121520 | 1991-05-28 | ||
JP3220871A JPH0541502A (en) | 1991-05-28 | 1991-09-02 | Semiconductor storage device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0541502A true JPH0541502A (en) | 1993-02-19 |
Family
ID=26458869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3220871A Pending JPH0541502A (en) | 1991-05-28 | 1991-09-02 | Semiconductor storage device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0541502A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100328743B1 (en) * | 1995-11-28 | 2002-10-31 | 삼성전자 주식회사 | Ferroelectric dynamic random access memory |
WO2019045905A1 (en) * | 2017-08-31 | 2019-03-07 | Micron Technology, Inc. | Apparatuses having memory cells with two transistors and one capacitor, and having body regions of the transistors coupled with reference voltages |
CN109690680A (en) * | 2016-08-31 | 2019-04-26 | 美光科技公司 | Memory comprising one capacitor of two-transistor and the apparatus and method for for accessing the memory |
US11348932B2 (en) | 2019-03-06 | 2022-05-31 | Micron Technology, Inc. | Integrated assemblies having transistor body regions coupled to carrier-sink-structures; and methods of forming integrated assemblies |
US11574668B2 (en) | 2016-08-31 | 2023-02-07 | Micron Technology, Inc. | Apparatuses and methods including ferroelectric memory and for operating ferroelectric memory |
US11901005B2 (en) | 2017-07-13 | 2024-02-13 | Micron Technology, Inc. | Apparatuses and methods for memory including ferroelectric memory cells and dielectric memory cells |
-
1991
- 1991-09-02 JP JP3220871A patent/JPH0541502A/en active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100328743B1 (en) * | 1995-11-28 | 2002-10-31 | 삼성전자 주식회사 | Ferroelectric dynamic random access memory |
CN109690680A (en) * | 2016-08-31 | 2019-04-26 | 美光科技公司 | Memory comprising one capacitor of two-transistor and the apparatus and method for for accessing the memory |
US11574668B2 (en) | 2016-08-31 | 2023-02-07 | Micron Technology, Inc. | Apparatuses and methods including ferroelectric memory and for operating ferroelectric memory |
CN109690680B (en) * | 2016-08-31 | 2023-07-21 | 美光科技公司 | Memory including two transistors and one capacitor, and apparatus and method for accessing the same |
US11901005B2 (en) | 2017-07-13 | 2024-02-13 | Micron Technology, Inc. | Apparatuses and methods for memory including ferroelectric memory cells and dielectric memory cells |
WO2019045905A1 (en) * | 2017-08-31 | 2019-03-07 | Micron Technology, Inc. | Apparatuses having memory cells with two transistors and one capacitor, and having body regions of the transistors coupled with reference voltages |
US10381357B2 (en) | 2017-08-31 | 2019-08-13 | Micron Technology, Inc. | Apparatuses having memory cells with two transistors and one capacitor, and having body regions of the transistors coupled with reference voltages |
US10607988B2 (en) | 2017-08-31 | 2020-03-31 | Micron Technology, Inc. | Apparatuses having memory cells with two transistors and one capacitor, and having body regions of the transistors coupled with reference voltages |
US11302703B2 (en) | 2017-08-31 | 2022-04-12 | Micron Technology, Inc. | Apparatuses having memory cells with two transistors and one capacitor, and having body regions of the transistors coupled with reference voltages |
US11348932B2 (en) | 2019-03-06 | 2022-05-31 | Micron Technology, Inc. | Integrated assemblies having transistor body regions coupled to carrier-sink-structures; and methods of forming integrated assemblies |
US11910597B2 (en) | 2019-03-06 | 2024-02-20 | Micron Technology, Inc. | Integrated assemblies having transistor body regions coupled to carrier-sink-structures; and methods of forming integrated assemblies |
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