JPH0540454Y2 - - Google Patents
Info
- Publication number
- JPH0540454Y2 JPH0540454Y2 JP10425988U JP10425988U JPH0540454Y2 JP H0540454 Y2 JPH0540454 Y2 JP H0540454Y2 JP 10425988 U JP10425988 U JP 10425988U JP 10425988 U JP10425988 U JP 10425988U JP H0540454 Y2 JPH0540454 Y2 JP H0540454Y2
- Authority
- JP
- Japan
- Prior art keywords
- spring
- plunger
- barrel
- tin
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000523 sample Substances 0.000 claims description 18
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000007689 inspection Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000013020 steam cleaning Methods 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10425988U JPH0540454Y2 (enrdf_load_stackoverflow) | 1988-08-05 | 1988-08-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10425988U JPH0540454Y2 (enrdf_load_stackoverflow) | 1988-08-05 | 1988-08-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0225872U JPH0225872U (enrdf_load_stackoverflow) | 1990-02-20 |
| JPH0540454Y2 true JPH0540454Y2 (enrdf_load_stackoverflow) | 1993-10-14 |
Family
ID=31335819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10425988U Expired - Lifetime JPH0540454Y2 (enrdf_load_stackoverflow) | 1988-08-05 | 1988-08-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0540454Y2 (enrdf_load_stackoverflow) |
-
1988
- 1988-08-05 JP JP10425988U patent/JPH0540454Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0225872U (enrdf_load_stackoverflow) | 1990-02-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0504601A2 (en) | Substrate soldering in a reducing atmosphere | |
| KR20040013010A (ko) | 도전성 접촉자 | |
| WO2010065851A2 (en) | Electroless palladium plating solution and method of use | |
| CN101359008B (zh) | 电阻测量方法及元件检验过程 | |
| JPH0540454Y2 (enrdf_load_stackoverflow) | ||
| US4196839A (en) | Methods of fabricating printed circuit boards | |
| US6774652B2 (en) | Cantilever type probe card and method for production thereof | |
| Martens et al. | An investigation of the electrical contact resistance of corroded pore sites on gold plated surfaces | |
| DE69512216T2 (de) | Potentiometrische Messung der Substratoxidation und Überzugsporosität | |
| JP2002168879A (ja) | 絶縁被覆プローブピン | |
| CN1499191A (zh) | 一种焊接品质检测方法 | |
| KR960043071A (ko) | 반도체 장치의 검사방법 | |
| JPH0829475A (ja) | 実装基板検査装置のコンタクトプローブ | |
| Melton et al. | Lead‐free Tin Surface Finish for PCB Assembly | |
| JPH10282142A (ja) | 回路試験プローブ | |
| Tellefsen | SIR and ECM testing of soldering materials vs. soldering processes | |
| Canumalla et al. | A study on ranking of commercial fluxes for electrochemical migration (ECM) propensity for Cu, Sn and Ag surface finishes | |
| Lea et al. | Blowholing in PTH Solder Fillets: Part 1 Assessment of the Problem | |
| Reed | Risk Assessment of Printed Wiring Board Alternative Finishes | |
| Hitchens et al. | Ageing properties of organic solderable preservatives. | |
| JPH09232057A (ja) | Ｉｃソケット | |
| JPH0661321A (ja) | コンタクトプローブピンおよび半導体検査装置 | |
| DeVore | Solderability and surface mounting | |
| KR20050123309A (ko) | 반도체 장치 탐침용 프로브핀 | |
| TW201329443A (zh) | 電路板孔內焊錫之測試方法 |