JPH0538926U - Light emitting diode - Google Patents
Light emitting diodeInfo
- Publication number
- JPH0538926U JPH0538926U JP094998U JP9499891U JPH0538926U JP H0538926 U JPH0538926 U JP H0538926U JP 094998 U JP094998 U JP 094998U JP 9499891 U JP9499891 U JP 9499891U JP H0538926 U JPH0538926 U JP H0538926U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- emitting chip
- emitting chips
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
(57)【要約】
【目的】同一面上に正負一対の電極部が形成された発光
チップを用いＬＥＤを製造する場合発光チップの電極部
が接続される部材の加工が簡単で、製造が容易なＬＥＤ
を提供することにある。
【構成】プリント基板２上に同一面に正負一対の電極部
が形成された発光チップ４と上下面に一対の電極部を有
する発光チップ５、６が設けられており、その周囲には
発光チップ４、５、６の光を上方に反射するための反射
板が接着されており、このプリント基板２と反射板３に
より形成される凹部に発光チップ４、５、６を封止する
ための封止樹脂が注入・硬化されている。さらに、発光
チップ４、５、６、反射板３と封止樹脂８を覆うように
散乱材を配合したエポキシ樹脂からなるレンズ部材９が
設けられている。
(57) [Abstract] [Purpose] When manufacturing an LED using a light-emitting chip in which a pair of positive and negative electrode parts are formed on the same surface, it is easy to process the member to which the electrode part of the light-emitting chip is connected, and easy to manufacture. LED
To provide. A light emitting chip 4 having a pair of positive and negative electrode portions formed on the same surface and light emitting chips 5 and 6 having a pair of electrode portions on the upper and lower surfaces are provided on a printed circuit board 2, and light emitting chips are provided around the light emitting chips. A reflection plate for reflecting the light of 4, 5, and 6 upward is adhered, and a seal for sealing the light emitting chips 4, 5, and 6 in a recess formed by the printed board 2 and the reflection plate 3. Resin has been injected and cured. Further, a lens member 9 made of an epoxy resin mixed with a scattering material is provided so as to cover the light emitting chips 4, 5, 6, the reflection plate 3 and the sealing resin 8.
Description
【０００１】[0001]
本考案は、発光ダイオードに関するものであり、特に、同一面に正負一対の電 極部が形成された発光チップを用いた発光ダイオードに関するものである。 The present invention relates to a light emitting diode, and more particularly, to a light emitting diode using a light emitting chip having a pair of positive and negative electrode parts formed on the same surface.
【０００２】[0002]
従来のこの種の発光ダイオード（以下「ＬＥＤ」という）はリードフレームの 端面に複数の発光チップを配設して接合した後、樹脂封止した多色ＬＥＤ（実開 昭５９−１９５７５７）が知られている。 This type of conventional light-emitting diode (hereinafter referred to as "LED") is known as a multicolor LED (actually developed 59-195757) that is resin-sealed after a plurality of light-emitting chips are arranged and joined to the end surface of the lead frame. Has been.
【０００３】 この多色ＬＥＤは、上下両面上に正又は負の電極部が形成された発光チップが 使用されており、リード端子を減少させる発光チップの平面的な配置が考案され ている。This multicolor LED uses a light emitting chip in which positive or negative electrode portions are formed on both upper and lower surfaces, and a planar arrangement of the light emitting chips for reducing lead terminals has been devised.
【０００４】[0004]
しかし、上記公報に記載された発光チップを接合して構成された多色ＬＥＤで は、通常、その使用に際してリードフレームを折り曲げ加工等して使用すること が必要であり、実装される場合には相当の面積を必要としていた。 However, in the case of the multicolor LED formed by joining the light emitting chips described in the above publication, it is usually necessary to bend the lead frame before use, and when it is mounted, It required a considerable area.
【０００５】 また、同一面上に正負一対の電極部が形成された発光チップを用いる場合につ いては、リードフレーム間に発光チップを載置し、それぞれのリードフレームに 電気的に接続する必要があるが、この発光チップの電極間は非常に狭くリードフ レームの加工が難しいという問題があった。Further, in the case of using a light emitting chip in which a pair of positive and negative electrode parts are formed on the same surface, it is necessary to mount the light emitting chip between lead frames and electrically connect to each lead frame. However, there is a problem in that the space between the electrodes of this light emitting chip is very narrow and it is difficult to process the lead frame.
【０００６】 そこで本考案は、上記課題を解決するたに成されたものであり、その目的とす るところは、同一面上に正負一対の電極部が形成された発光チップを用いＬＥＤ を製造する場合、発光チップの電極部が接続される部材の加工が簡単で、製造が 容易なＬＥＤを提供することにある。Therefore, the present invention has been made to solve the above problems, and an object thereof is to manufacture an LED using a light emitting chip in which a pair of positive and negative electrode portions are formed on the same surface. In this case, it is an object of the present invention to provide an LED in which the member to which the electrode portion of the light emitting chip is connected is easily processed and which is easy to manufacture.
【０００７】[0007]
上記課題を解決するための考案の構成は、同一面上に正負一対の電極部が形成 された発光チップと、発光チップが配設され電気配線を有する基板と、発光チッ プを封止する封止樹脂を有することを特徴とする。 The configuration of the device for solving the above problems is a light emitting chip having a pair of positive and negative electrode portions formed on the same surface, a substrate having the light emitting chip disposed thereon and having electrical wiring, and a seal for sealing the light emitting chip. It is characterized by having a stop resin.
【０００８】[0008]
本考案においては、電気配線を有する基板上に発光チップを載置し、電気的に 接続する構成と成っているので、リードフレームの加工の様な機械加工を必要と せず、プリント基板のエッチングのように微細加工が容易な加工方法を利用でき 製造が容易となる。 In the present invention, the light emitting chip is mounted on a substrate having electric wiring and electrically connected, so that there is no need for machining such as processing of a lead frame, and etching of a printed circuit board is not required. As described above, a processing method that facilitates fine processing can be used, which facilitates manufacturing.
【０００９】[0009]
以下、本考案を具体的な実施例に基づいて説明する。 図１は本考案の具体的な一実施例に係る多色ＬＥＤの縦断面図、図２は図１の 多色ＬＥＤの発光チップが載置され接合されるプリント基板を示した正面図、図 ３は図２のプリント基板の裏面図、図４は青色発光チップを示した縦断面図、図 ５は赤色発光チップを示した縦断面図、図６は緑色発光チップを示した縦断面図 である。 Hereinafter, the present invention will be described based on specific embodiments. 1 is a vertical sectional view of a multicolor LED according to a specific embodiment of the present invention, and FIG. 2 is a front view showing a printed circuit board on which the light emitting chips of the multicolor LED of FIG. 1 are mounted and joined. 3 is a rear view of the printed circuit board of FIG. 2, FIG. 4 is a vertical sectional view showing a blue light emitting chip, FIG. 5 is a vertical sectional view showing a red light emitting chip, and FIG. 6 is a vertical sectional view showing a green light emitting chip. is there.
【００１０】 図１及び図２に示すように、本考案の実施例の多色ＬＥＤ１は、両面がプリン ト配線されたプリント基板２上の中央部付近に複数種類の発光チップ４，５、６ が載置されプリント基板２上に設けられたランド１４ａ、１４ｂ、１５ａ、１５ ｂ、１６ａ、１６ｂに電気的に接続されている。発光チップ４は、ＧａＮ青色発 光チップであり図４に示すように同一面に正負一対の電極が設けられており、電 極面を下にして図２の破線で示す位置に対角線上に２個、電極部４４、４５がラ ンド１４ａ，１４ｂ電気的に接続されるように取付けられている。また、発光チ ップ５、６は、図５、図６に示すように上下面上に正負一対の電極部をもつＧａ Ｐ赤色発光チップ及びＧａＰ緑色発光チップであり、ランド１５ｂ及びランド１ ６ｂ上に一種の電極部５４、６４が電気的に接続されるように取付けられている 。そして、発光チップ５、６の上部の＋極の電極部５３，６３は、金ワイヤ１０ により、ランド１５ａ，１６ａに電気的に接続されている。As shown in FIGS. 1 and 2, a multicolor LED 1 according to an embodiment of the present invention has a plurality of types of light emitting chips 4, 5, 6 near a central portion on a printed circuit board 2 having both sides printed. Are mounted and electrically connected to the lands 14a, 14b, 15a, 15b, 16a, 16b provided on the printed circuit board 2. The light-emitting chip 4 is a GaN blue light-emitting chip, and has a pair of positive and negative electrodes provided on the same surface as shown in FIG. 4, and the electrode surface is faced down, and two electrodes are diagonally arranged at positions indicated by broken lines in FIG. The electrodes 44 and 45 are attached so as to be electrically connected to the lands 14a and 14b. Further, the light emitting chips 5 and 6 are a GaP red light emitting chip and a GaP green light emitting chip having a pair of positive and negative electrode portions on the upper and lower surfaces as shown in FIGS. 5 and 6, and are a land 15b and a land 16b. A kind of electrode parts 54 and 64 are mounted on the top so as to be electrically connected. Then, the positive electrode portions 53, 63 on the upper portions of the light emitting chips 5, 6 are electrically connected to the lands 15a, 16a by the gold wire 10.
【００１１】 これらのランド１４ａ、１４ｂ、１５ａ、１５ｂ、１６ａ、１６ｂはプリント 基板２の両面に形成された配線１３及びスルーホール１２ａ、１２ｂ、１２ｃに よりスルーホール１１ａ、１１ｂ、１１ｃ、１１ｄに電気的に接続され、スルー ホール１１ａは青色発光チップ４の−極が、スルーホール１１ｂは赤色発光チッ プ５の−極が、スルーホール１１ｃは緑色発光チップ６の−極が、スルーホール １１ｄはそれぞれの発光チップ４、５、６の＋極がつながっている。このスルー ホール１１ａ、１１ｂ、１１ｃ、１１ｄにはリード線７が挿入され、ハンダにて 固定されている。These lands 14a, 14b, 15a, 15b, 16a, 16b are electrically connected to the through holes 11a, 11b, 11c, 11d by the wiring 13 and the through holes 12a, 12b, 12c formed on both sides of the printed circuit board 2. , The through-hole 11a is the negative pole of the blue light-emitting chip 4, the through-hole 11b is the negative pole of the red light-emitting chip 5, the through-hole 11c is the negative pole of the green light-emitting chip 6, and the through-hole 11d is respectively. The + poles of the light emitting chips 4, 5, and 6 are connected. The lead wire 7 is inserted into the through holes 11a, 11b, 11c and 11d and fixed with solder.
【００１２】 この、発光チップ４、５、６が載置されたプリント基板２上には、図１に示す ように発光チップ４、５、６、の光を反射するための反射板３が発光チップ４、 ５、６の周囲に設けられている。この反射板３は、略円筒状をなし、内周面がプ リント基板２側の内径が小さく、上方にいくに従って大きくなるようなテイパー 面状となっており、発光チップ４、５、６の光を上方へ有効に反射するようにな っている。On the printed circuit board 2 on which the light emitting chips 4, 5 and 6 are placed, a reflecting plate 3 for reflecting the light of the light emitting chips 4, 5 and 6 emits light as shown in FIG. It is provided around the chips 4, 5, and 6. The reflector 3 has a substantially cylindrical shape, and the inner peripheral surface thereof has a taper surface shape in which the inner diameter on the side of the print substrate 2 is small and increases toward the upper side. It effectively reflects light upward.
【００１３】 そして、このプリント基板２と反射板３によって形成された凹部には、発光チ ップ４、５、６を封止するための封止樹脂が注入・硬化されている。さらに、発 光チップ４、５、６、反射板３、封止樹脂８を覆うようにレンズ部材９が設けら れている。Then, a sealing resin for sealing the light emitting chips 4, 5, 6 is injected and cured in the recess formed by the printed board 2 and the reflection plate 3. Further, a lens member 9 is provided so as to cover the light emitting chips 4, 5, 6, the reflection plate 3, and the sealing resin 8.
【００１４】 つぎに、この多色ＬＥＤ１の製造方法について説明する。 まずはじめに、両面にプリント配線及びスルーホールが形成されたプリント基 板２のフラックスが塗布されたランド１４ａ、１４ｂに、電極部４４、４５にハ ンダバンプが設けられた青色発光チップ４が２個載置され 、リフロー炉に投入 しプリント基板２上に電気的に接続し固定する。次に、洗浄後ランド１５ｂ、１ ６ｂに銀ペーストを塗布後、赤色発光チップ５、緑色発光チップ６の−極の電極 部５４、６４を接続するように載置し、銀ペーストを硬化させ、その後＋極の電 極部５３、６３をランド１５ａ、１６ａに電気的に接続するためにそれぞれ金ワ イヤー１０をワイヤーボンディングする。そして、プリント基板２上に反射板３ を接着材により接着するとともに、プリント基板２の裏面側よりリード線７をハ ンダにより接続固定する。このプリント基板２と反射板３によって形成される凹 部に封止樹脂８を注入し、硬化させる。さらに、樹脂封止された発光チップ４、 ５、６をレンズ部材を注入して成形するためのプラ型に挿入し、散乱材（シリカ ）を１ｗｔ％含んだエポキシ樹脂を注入し硬化させレンズ部材を形成する。Next, a method of manufacturing the multicolor LED 1 will be described. First, two blue light-emitting chips 4 having solder bumps on the electrode portions 44 and 45 are mounted on the flux-coated lands 14a and 14b of the printed board 2 having printed wiring and through holes formed on both sides. The printed circuit board 2 is placed in a reflow furnace and electrically connected and fixed on the printed circuit board 2. Next, after washing, after applying silver paste to the lands 15b and 16b, the lands 15b and 16b are placed so as to connect the negative electrode portions 54 and 64 of the red light emitting chip 5 and the green light emitting chip 6, and the silver paste is cured. After that, the gold wire 10 is wire-bonded to electrically connect the positive electrode portions 53 and 63 to the lands 15a and 16a, respectively. Then, the reflection plate 3 is adhered onto the printed board 2 with an adhesive material, and the lead wire 7 is connected and fixed from the rear surface side of the printed board 2 with solder. The sealing resin 8 is injected into the recess formed by the printed board 2 and the reflection plate 3 and is cured. Further, the resin-sealed light emitting chips 4, 5 and 6 are inserted into a plastic mold for injecting and molding a lens member, and an epoxy resin containing 1 wt% of a scattering material (silica) is injected and cured to make the lens member. To form.
【００１５】 このよう製造された多色ＬＥＤは、それぞれのスルーホール１１ａ、１１ｂ、 １１ｃ、１１ｄに接続されたリード線７に所定の電流を流すことにより発光チッ プ４からは青色光、発光チップ５からは赤色光、発光チップ６からは緑色光がそ れぞれ放射される。そして、２種類の発光チップに電流を流すことにより赤紫色 、黄色、青緑色の発光色を得ることができ、全ての発光チップを発光させること により白色を得ることができる。また、流す電流を変化させることにより赤、青 、緑の三原色の発光が制御できる。即ち、それぞれのリード線７に流す電流を制 御することで任意の色を発光させることができる。また、本実施例では現在、赤 色、緑色に比較して充分な輝度が得られていないＧａＮ青色発光チップを対角線 上に２個設けることにより、全体としてバランスの良い発光色を得ることができ る。The multicolor LED manufactured in this way is designed so that blue light is emitted from the light emitting chip 4 by emitting a predetermined current to the lead wires 7 connected to the through holes 11a, 11b, 11c and 11d. The red light is emitted from 5 and the green light is emitted from the light emitting chip 6. Then, by applying an electric current to the two types of light emitting chips, red, purple, yellow, and blue green light emitting colors can be obtained, and by making all the light emitting chips emit light, white can be obtained. In addition, the emission of the three primary colors of red, blue and green can be controlled by changing the flowing current. That is, an arbitrary color can be emitted by controlling the current flowing through each lead wire 7. In addition, in the present embodiment, by providing two GaN blue light-emitting chips, which do not have sufficient brightness as compared with red and green, on the diagonal line, a well-balanced emission color can be obtained as a whole. It
【００１６】 さらに、３種類の発光チップ４、５、６の表面からでた光に加えて、それら３ 種類の発光チップ４、５、６の端面からでた光も反射板３により反射されて多色 ＬＥＤ１の前方へ照射される。また、レンズ部材９中には散乱材が混入されてお り複数種類の発光チップが発光している場合には、それぞれの光を混合し均一な 発光色を得ることができる。Furthermore, in addition to the light emitted from the surfaces of the three types of light emitting chips 4, 5, and 6, the light emitted from the end faces of the three types of light emitting chips 4, 5, and 6 is also reflected by the reflection plate 3. It is irradiated in front of the multicolor LED 1. Further, when a scattering material is mixed in the lens member 9 and a plurality of types of light emitting chips are emitting light, respective lights can be mixed to obtain a uniform emission color.
【００１７】 本実施例においては、レンズ部材９の中に散乱材を１ｗｔ％配合させたが、こ の多色ＬＥＤ１の使用方法（視認距離と明るさの関係）に応じ、１ｗｔ％〜１． ５ｗｔ％の範囲で変化させることが好ましい。即ち、多色ＬＥＤ１を近くで視認 するような場合（数十センチ位）には、散乱材を多め（１．５ｗｔ％）としてそ れぞれの発光チップ４、５、６の発光色が良く混合されるようすることが好まし く、多色ＬＥＤ１をある程度離れた状態で視認する場合（数メーター程度、多数 個配置しディスプレー等に用いる場合）には、それぞれの発光色が十分に混合さ れなくてもよいため、散乱材を少なめ（１ｗｔ％）としてそれぞれの発光を有効 に利用し、全体として明るい多色ＬＥＤを得ることが好ましい。この場合、１ｗ ｔ％以下であると、発光色が十分に混合されずそれぞれの発光チップ４、５、６ が直接視認され多色ＬＥＤとしては好ましくない。また、１．５ｗｔ％以上の場 合には、多色ＬＥＤ１が全体として暗くなり過ぎ、それぞれの発光チップ４、５ 、６の発光を有効に利用すことができない。In this embodiment, 1% by weight of the scattering material was mixed in the lens member 9, but 1% by weight to 1% by weight, depending on the method of use of this multicolor LED 1 (relationship between visible distance and brightness). It is preferable to change in the range of 5 wt%. That is, when the multicolor LED 1 is viewed in the vicinity (several tens of centimeters), a large amount of scattering material (1.5 wt%) is used, and the emission colors of the respective light emitting chips 4, 5, 6 are good. It is preferable to mix them, and when the multicolor LEDs 1 are viewed at some distance from each other (several meters, when many LEDs are arranged and used for display, etc.), the respective emission colors are sufficiently mixed. Since it does not have to be provided, it is preferable to obtain a bright multicolor LED as a whole by using a small amount of the scattering material (1 wt%) and effectively utilizing each light emission. In this case, if it is 1 wt% or less, the emission colors are not sufficiently mixed and the respective light emitting chips 4, 5, 6 are directly visually recognized, which is not preferable as a multicolor LED. On the other hand, in the case of 1.5 wt% or more, the multicolor LED 1 becomes too dark as a whole and the light emission of the respective light emitting chips 4, 5, 6 cannot be effectively utilized.
【００１８】 また、本実施例では、レンズ部材９中に散乱材を配合したが、封止樹脂８中に 散乱材を配合してしてもよい。この場合は、散乱材が、発光チップ４、５、６近 傍に設けられるので、１．５ｗｔ％〜２ｗｔ％が好ましく、その理由は上記のレ ンズ部材９中に散乱材を配合したもの同様である。Further, in this embodiment, the scattering material is mixed in the lens member 9, but the scattering material may be mixed in the sealing resin 8. In this case, the scattering material is provided in the vicinity of the light emitting chips 4, 5, and 6, so 1.5 wt% to 2 wt% is preferable because the reason is the same as the case where the scattering material is mixed in the lens member 9 described above. Is.
【００１９】 さらに、本実施例では、プリント基板を用いたが、セラミック板にリード線等 の電極端子を固定し、電気配線をメッキ及びエッチングにより設けたものを使用 してもよい。Further, although the printed circuit board is used in this embodiment, a ceramic plate to which electrode terminals such as lead wires are fixed and electric wiring is provided by plating and etching may be used.
【図１】図１は本考案の実施例の多色発光ダイオードの
縦断面図である。FIG. 1 is a vertical cross-sectional view of a multicolor light emitting diode according to an embodiment of the present invention.
【図２】図２は図１の多色発光ダイオードの発光チップ
が載置され接合されるプリント基板を示した正面図であ
る。FIG. 2 is a front view showing a printed circuit board on which the light emitting chips of the multicolor light emitting diode of FIG. 1 are mounted and joined.
【図３】図３は図２のプリント基板の裏面図である。FIG. 3 is a rear view of the printed circuit board shown in FIG.
【図４】図４は青色発光チップを示した縦断面図であ
る。FIG. 4 is a vertical cross-sectional view showing a blue light emitting chip.
【図５】図５は赤色発光チップを示した縦断面図であ
る。FIG. 5 is a vertical cross-sectional view showing a red light emitting chip.
【図６】図６は緑色発光チップを示した縦断面図であ
る。FIG. 6 is a vertical cross-sectional view showing a green light emitting chip.
１ 多色発光ダイオード ２ プリント基板 ３ 反射板 ４ 発光チップ（青色） ５ 発光チップ（赤色） ６ 発光チップ（緑色） ８ 封止樹脂 ９ レンズ部材 １０ 金ワイヤー 1 Multicolor Light Emitting Diode 2 Printed Circuit Board 3 Reflector 4 Light Emitting Chip (Blue) 5 Light Emitting Chip (Red) 6 Light Emitting Chip (Green) 8 Sealing Resin 9 Lens Member 10 Gold Wire
Claims (1)
た発光チップと、 前記発光チップが配設され電気配線を有する基板と、 前記発光チップを封止する封止樹脂とを有することを特
徴とする発光ダイオード1. A light emitting chip having a pair of positive and negative electrode portions formed on the same surface, a substrate on which the light emitting chip is disposed and having electric wiring, and a sealing resin for sealing the light emitting chip. Light emitting diode characterized by
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP094998U JPH0538926U (en) | 1991-10-22 | 1991-10-22 | Light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP094998U JPH0538926U (en) | 1991-10-22 | 1991-10-22 | Light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0538926U true JPH0538926U (en) | 1993-05-25 |
Family
ID=14125526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP094998U Withdrawn JPH0538926U (en) | 1991-10-22 | 1991-10-22 | Light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0538926U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007036251A (en) * | 2005-07-26 | 2007-02-08 | Samsung Electro-Mechanics Co Ltd | Led package with diffuser and method of manufacturing the same |
-
1991
- 1991-10-22 JP JP094998U patent/JPH0538926U/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007036251A (en) * | 2005-07-26 | 2007-02-08 | Samsung Electro-Mechanics Co Ltd | Led package with diffuser and method of manufacturing the same |
| US7790482B2 (en) | 2005-07-26 | 2010-09-07 | Samsung Led Co., Ltd. | Light emitting diode package with diffuser and method of manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19960208 |