JPH0538533A - Sensing device for metallic mold - Google Patents

Abstract

PURPOSE:To facilitate the arrangement of a sensor on a metallic mold and to easily exchange the metallic mold. CONSTITUTION:In a sensing device for the metallic mold detecting miss, such as feeding miss of a lead frame 10, with optical method of photo-interrupter, etc., by dividing an optical fiber 18 at plural sensing positions in the metallic mold, projecting light parts and receiving light parts are set so as to be sensible. In all or a part of the above-mentioned sensing positions, the optical fibers 18 are set in series, and the end part of the optical fiber 18 is exposed to outer face of the metallic mold. Further, the projecting/receiving light parts 22 and a control part 24 for projecting/receiving the light, while facing to the exposed position of the above-mentioned optical fiber between outside face of the metallic mold and the optical fiber, and having the prescribed interval are provided on the setting position fitting the metallic mold.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die sensing device for detecting lead frame feed errors in a die.

[0002]

2. Description of the Related Art Since a processing machine for a lead frame or the like needs to perform extremely fine processing, a lead frame as a work piece or a package in the middle of processing is accurately positioned and processed with respect to a mold. .. For example, in the processing of a lead frame, a pilot hole is provided in the lead frame, and a feed pin is inserted into this pilot hole to feed the lead frame with a constant dimension. Here, as a method of detecting the positional deviation of the lead frame, there is a method of using an error detection pin. This method sets the error detection pin so that it is inserted into the pilot hole when the lead frame is in the normal position, and the error detection pin is set when the lead frame is not in the correct position due to feed error in the lead frame. This is a method of detecting an error because the robot will float without entering the pilot hole. As a method of detecting the movement of the error detection pin, there is a method in which a photo interrupter is installed in a mold and an error is detected when the error detection pin blocks the optical path. In addition to this, as a method of detecting the positional deviation when the individual packages are transferred, a method of detecting by an optical method is also used.

[0003]

As described above, in a processing machine such as a lead frame, a sensor for detecting an error is provided at an appropriate place in order to prevent a processing error. The number of molds increases, and the originally complicated mold becomes more complicated. In the mold using the photo interrupter described above, the photo interrupter must be provided for each sensing location, which further complicates the apparatus. Further, in the conventional mold, there is a problem that space is taken up in the mold because the amplifier of the sensor is mounted on the mold.

Further, in the conventional processing machine, the mold is exchanged and attached to the die set according to the product, but since the sensor installed in the mold and the external circuit are connected, the circuit is respectively provided in the die and the die set. By providing a connector for connection and attaching the die to the die set, the connector portions are simultaneously connected and connected. Therefore, when the die is attached to the die set without being surely attached, the connector portion will be damaged. Since the mold is heavy, there is a problem that the connector is easily damaged if the connector connection part is displaced when the mold is set. Therefore, the present invention has been made to solve the above-mentioned problems, and an object of the present invention is to simplify the arrangement of the sensors installed in the mold to easily configure the mold, and An object of the present invention is to provide a die sensing device that can facilitate the operation of attaching a die to a set.

[0005]

The present invention has the following constitution in order to achieve the above object. That is, in a mold sensing device that detects an error such as a lead frame feeding error by an optical method such as a photo interrupter,
By dividing the optical fiber at a plurality of sensing positions in the mold, the light emitting unit and the light receiving unit can be set to perform sensing, and the optical fibers are arranged in series at all or a part of the sensing positions, While exposing the end face of the optical fiber to the outer wall surface of the mold, the set part to which the mold is attached is opposed to the exposed position of the optical fiber and is spaced apart from the outer surface of the mold by a predetermined distance. It is characterized in that a projecting / receiving section for projecting / receiving light and a controller are provided.

[0006]

When a lead frame feeding error is detected, an optical fiber is provided in the mold and an optical path is set in the mold so that a plurality of sensing parts can detect the error. By dividing the optical fiber in the middle and setting the light projecting section and the light receiving section, it is possible to detect an error when the optical path is blocked between the light projecting section and the light receiving section. Further, the light emitting / receiving unit and the control unit are provided in the set unit to which the mold is attached, and the light emitting / receiving unit and the mold are not in contact with each other, so that the mold can be easily attached to the set unit.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below in detail with reference to the accompanying drawings. The mold sensing device according to the present invention detects an error by using an optical method similar to the method used in the conventional error detection. The error is detected by detecting that the optical path is blocked by the sensing unit. The optical fiber is arranged in the mold to detect this optical error, and signals are exchanged in a non-contact manner between the mold to be used for replacement and the set part to which the mold is attached. And

FIG. 1 is an explanatory view showing the configuration of an embodiment of a die sensing device. In this embodiment, the error detection pin is used to detect whether or not the lead frame is properly sent. In the figure, 10 is a lead frame of the object to be detected, and 12 is an error detection pin. The lead frame 10 is provided with a pilot hole 14 at a predetermined position, and the error detection pin 12 is urged by a spring 16 to a position immediately below the pilot hole 14 when the lead frame is transferred to the predetermined position and is vertically moved. It is movably supported. When the lead frame 10 is fed at a constant size and is transferred, the error detection pin 12 rises and enters the pilot hole 14.
When the lead frame 10 is moved to the proper position, the error detection pin 12 enters the pilot hole 14, but when the lead frame 10 is moved from the proper position, the error detection pin 12 enters the pilot hole 12. Instead, it comes into contact with the lower surface of the lead frame 10.

In order to detect the movement of the error detection pin 12, the detection rod 12a is extended from the base of the error detection pin 12, and the light projecting portion and the light receiving portion of the optical fiber 18 are located at opposite positions with the detection rod 12a interposed therebetween. To place. As a result, when the error detecting pin 12 enters the pilot hole 14, the lower end of the detecting rod 12a is deviated from the optical path of the optical fiber 18 and light passes between the light emitting and receiving fibers.
The optical path is blocked in the state in which the robot has moved down without entering the pilot hole 14. It is common to set error detection pins at multiple locations with respect to the lead frame. Regarding the other error detection pins 20, the optical fiber 18 used in the previous error detection pin 12 is used in series, and similarly, the error detection pin is set between the light emitting and receiving of the optical fiber. By arranging the optical fibers in series for a plurality of error detection pins in this manner, the lead frame 10 is positioned at the normal position when light passes through all the error detection pins. However, when the light is blocked, the lead frame 10 is displaced.

In FIG. 1, A is the mold side and B is the setting part side. As described above, the optical fibers are arranged in the mold according to the set position of the lead frame and the arranged position of the error detection pin on the mold. Since the optical path of the optical fiber can be freely set within the mold, there is an advantage that the optical fiber can be set at an appropriate position according to the structure of the mold. In addition,
Since the optical fiber 18 is used for projecting and receiving light, the end face of the optical fiber is opposed to the set portion B as shown in FIG.
Of the optical fiber 2 as a light emitting / receiving unit on the set portion while facing the end face of the optical fiber 18 while being pulled out to the outer surface of
Place 2

Here, it is assumed that the mold and the setting section are contactless at the site where they are projected and received via an optical fiber, and the mold and the setting section are set with a minute gap therebetween. At the time of processing, the mold is accurately positioned and set with respect to the set part. Therefore, the end face position of the optical fiber 18 on the mold side and the end face position of the optical fiber 22 of the set part are opposed to each other in advance. As a result, it is possible to accurately project and receive light via the optical fiber. On the side of the setting section B, a light source section for projecting light onto the optical fiber and a control section 24 such as a sensor amplifier for detecting a signal from the light receiving fiber.
To provide.

The above embodiment is an example of detecting whether or not the misdetection pin 12 is inserted into the pilot hole 14 of the lead frame 10 to detect the misfeed of the lead frame 10. Sensing as shown in FIG. 2 is also possible as a sensor for detecting the displacement. This example is used for detecting an error when the package 30 is not correctly set on the working die and one side is lifted up and the package is tilted and set. That is, the light projecting portion and the light receiving portion of the optical fiber are arranged at opposite positions on both sides of the package 30 so that the optical path passes near the upper surface of the package 30 in a normally set state, and when the package is lifted, Set so that the main body blocks the light path. The optical fiber connector portion between the mold A and the setting portion B is the same as that in the above embodiment.

Also in the case of this embodiment, the package 3 is determined depending on whether or not the optical path is blocked by the light projecting and receiving by the optical fiber.
It is possible to detect whether 0 has been legally transferred. In the embodiment shown in FIG. 2, since the optical fibers 18 are set on both sides of the package 30, the light emitting / receiving intervals of the optical fibers must be considerably long. Even when the optical fibers are set apart from each other in this way, it is possible to set them up to about 200 mm apart by using an optical lens for condensing. Further, when the distance between the optical fibers can be set to be narrow as in the embodiment shown in FIG. 1, it is possible to obtain a constant light emitting / receiving efficiency by molding the end faces of the optical fibers.

As described above, various types of error detection are necessary in machining with a die, and therefore, there are cases where one die performs several error detections at the same time. In such a case, of course, a plurality of error detections are performed by arranging an optical fiber according to each error detection.
Even in the case of the error detection by the above-described error detection pin, different series of optical fibers may be set for different feeding operations to detect the error. The setting method using the optical fiber has an advantage that the sensors can be arranged in the mold easily without interfering with each other even if a plurality of types of sensing are performed. Further, in the above example, the mold and the setting section are connected by a pair of light projecting and receiving fibers, but of course, a plurality of pairs may be connected.

Further, according to the mold sensing apparatus of the present embodiment, since the light is projected and received without contact between the mold and the set part, the connector part is mounted when the mold is attached to the set part as in the conventional case. It will not be damaged and the mold can be replaced easily. Further, by providing the control unit on the setting unit side and not mounting the amplifier on the mold, there is a margin in securing space in the mold. Further, by disposing the control unit on the setting unit side, it is possible to improve the durability of the control system as compared with the case where an amplifier or the like is placed on the mold which is the movable unit.
Furthermore, by standardizing the design of the connector part between the mold and the set part, the control part 24 can be used in common when the mold is exchanged according to the product, and the same error detection can be made even in the case of different molds. Will be possible. As a result, it is possible to automatically change the mold.

[0016]

As described above, according to the mold sensing apparatus of the present invention, the optical fiber is arranged in the mold for optical detection, so that the inside of the mold can be detected. The sensor can be easily set and the mold structure can be simplified. In addition, since the light emitting and receiving connector portions of the die and the set portion for setting the die are configured in a non-contact manner, it is possible to easily attach the die to the apparatus, and so on.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a configuration of an embodiment of a die sensing device.

FIG. 2 is an explanatory diagram showing a configuration of another embodiment of a die sensing device.

[Explanation of symbols]

 10 Lead frame 12, 20 Miss detection pin 12a Detection rod 14 Pilot hole 16 Spring 18, 22 Optical fiber 24 Control section

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Claims (1)

[Claims] 1. A mold sensing device for detecting an error such as a lead frame feeding error by an optical method such as a photo interrupter, wherein a light projecting section is formed by dividing an optical fiber at a plurality of sensing positions in the mold. And a light receiving unit is set to enable sensing, the optical fibers are arranged in series at all or a part of the sensing positions, the end face of the optical fiber is exposed on the outer wall surface of the mold, and the mold is attached. The mold is provided with a light emitting / receiving unit and a control unit that face the exposed position of the optical fiber and project and receive light with the optical fiber at a predetermined distance from the outer surface of the mold. Sensing device.