JPH0537116A - Laminate circuit board device - Google Patents

Laminate circuit board device

Info

Publication number
JPH0537116A
JPH0537116A JP18861291A JP18861291A JPH0537116A JP H0537116 A JPH0537116 A JP H0537116A JP 18861291 A JP18861291 A JP 18861291A JP 18861291 A JP18861291 A JP 18861291A JP H0537116 A JPH0537116 A JP H0537116A
Authority
JP
Japan
Prior art keywords
circuit board
sub
fitted
fixing frame
portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18861291A
Other languages
Japanese (ja)
Inventor
Hideaki Ishikawa
英明 石川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP18861291A priority Critical patent/JPH0537116A/en
Publication of JPH0537116A publication Critical patent/JPH0537116A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure

Landscapes

  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE:To provide a title device wherein the cost is reduced and a circuit board is effectually prevented from being separated without reduction of a mounting area to realize a high density laminate circuit board. CONSTITUTION:A convex portion 11a of a sub-circuit board 11 is fitted in an elongated hole 13a in a circuit board fixing frame 13, and a convex portion 11b of the sub-circuit board 11 is fitted in an elongated hole 14a in a circuit board fixing frame 14. Further, opposite portions of the circuit board fixing frame 13 are fitted to concave portions 12a, 12b in a main circuit board 12 while opposite portions of the circuit board fixing frame 14 is fitted in the concave portions 12c, 12d in the main circuit board 12, whereby the sub-circuit board 11 is separated and fixed to the main circuit board 12.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電子装置に使用する積
層回路基板装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated circuit board device used in electronic devices.

【0002】[0002]

【従来の技術】図4は、従来の積層回路基板装置を示し
ている。
2. Description of the Related Art FIG. 4 shows a conventional laminated circuit board device.

【0003】図4において、1はサブ回路基板であり、
2はメイン回路基板である。サブ基板1にコネクタ1
a、1bが設けられ、このコネクタ1a、1bに対向
し、且つ接続するようにメイン回路基板2にコネクタ2
a、2bが設けられている。
In FIG. 4, 1 is a sub-circuit board,
2 is a main circuit board. Connector 1 on sub-board 1
a, 1b are provided, and the connector 2 is provided on the main circuit board 2 so as to face and connect to the connectors 1a, 1b.
a and 2b are provided.

【0004】3a、3bはスペーサであり、サブ基板1
とメイン回路基板2との間に配置されるとともに螺子4
a、4bでサブ基板1に固定され、また螺子5a、5b
でメイン回路基板2に固定されている。
3a and 3b are spacers, and the sub-board 1
Between the main circuit board 2 and the screw 4
a and 4b are fixed to the sub-board 1, and screws 5a and 5b
It is fixed to the main circuit board 2.

【0005】6は、シールドケースであり、積層された
サブ基板1とメイン回路基板2を、内部に螺子7で固定
する。
Reference numeral 6 denotes a shield case, which fixes the laminated sub-board 1 and main circuit board 2 inside with a screw 7.

【0006】次に、上記構成の機能について説明する。
サブ回路基板1とメイン回路基板2とが、コネクタ1
a、1bとコネクタ1a、1bが接続されるとともに、
スペーサ3a、3bで離間して螺子4a、4bおよび螺
子5a、5bで固定される。
Next, the function of the above configuration will be described.
The sub circuit board 1 and the main circuit board 2 are connectors 1
a and 1b and the connectors 1a and 1b are connected,
The spacers 3a and 3b are separated from each other and fixed by screws 4a and 4b and screws 5a and 5b.

【0007】このように上記従来の積層回路基板装置で
も、組立完成後に直接振動、衝撃が加わった場合でもス
ペーサ3a、3bおよび螺子螺子4a、4bおよび螺子
5a、5bで固定されているため、サブ回路基板1の外
れを防止できる。
As described above, even in the above-mentioned conventional laminated circuit board device, even if a direct vibration or impact is applied after the assembly is completed, it is fixed by the spacers 3a, 3b and the screw screws 4a, 4b and the screws 5a, 5b. The detachment of the circuit board 1 can be prevented.

【0008】[0008]

【発明が解決しようとする課題】しかしながら、上記従
来の積層回路基板装置では、スペーサ3a、3bをサブ
回路基板1とメイン回路基板2との中に固定するため、
この部分だけ部品の実装面積が小さくなり、近時の回路
基板の集密化実装に対応できなくなる。また、螺子螺子
4a、4bおよび螺子5a、5bが必要であり、組立工
数が増加してコストが嵩むという問題があった。
However, in the above-mentioned conventional laminated circuit board device, since the spacers 3a and 3b are fixed in the sub circuit board 1 and the main circuit board 2,
The mounting area of the component is reduced only in this portion, and it becomes impossible to cope with the recent dense packaging of the circuit board. Further, the screw screws 4a and 4b and the screws 5a and 5b are required, which causes a problem that the number of assembling steps increases and the cost increases.

【0009】本発明は、上記課題を解決するものであ
り、コストが低減し、実装面積が低減することなく、回
路基板のはずれを有効に阻止して高密度積層回路基板化
が達成できるとともに安定した動作が得られる優れた積
層回路基板装置を提供することを目的とする。
The present invention is intended to solve the above-mentioned problems, and it is possible to effectively prevent the circuit board from being detached from the circuit board without reducing the cost and the mounting area, and to achieve a high-density laminated circuit board and to stabilize the circuit board. It is an object of the present invention to provide an excellent laminated circuit board device that can achieve the above operation.

【0010】[0010]

【課題を解決するための手段】上記課題を達成するため
に、本発明の積層回路基板装置は、少なくとも二つの側
面に一つの凸部及び二つの凹部が設けられる第1、第2
の回路基板と、凸部に開口部が嵌め込まれるとともに、
二つの凹部に両側部位が嵌め込まれて、第1の回路基板
と第2の回路基板を離間して固定する固定枠とを備える
ものである。
In order to achieve the above object, the laminated circuit board device of the present invention has first and second convex portions and two concave portions provided on at least two side surfaces.
Along with the circuit board and the opening is fitted into the convex part,
Both side portions are fitted in the two recesses, and a fixing frame for fixing the first circuit board and the second circuit board with a space therebetween is provided.

【0011】[0011]

【作用】したがって、本発明の積層回路基板装置によれ
ば、第1の回路基板あるいは第2の回路基板の凸部が離
間して固定枠の開口部に嵌め込まれるとともに、第1の
回路基板あるいは第2の回路基板の二つの凹部が離間し
て固定枠の両側部位に嵌めこんで固定されているため、
コストが低減し、実装面積が低減することなく、回路基
板のはずれを有効に阻止して高密度積層回路基板化が達
成できるとともに安定した動作が得られる。
Therefore, according to the laminated circuit board device of the present invention, the convex portions of the first circuit board or the second circuit board are separated from each other and are fitted into the openings of the fixing frame, and the first circuit board or Since the two concave portions of the second circuit board are spaced apart and are fitted into both side portions of the fixed frame to be fixed,
The cost is reduced and the mounting area is not reduced, so that the circuit board can be effectively prevented from coming off and a high-density laminated circuit board can be achieved, and stable operation can be obtained.

【0012】[0012]

【実施例】以下、本発明の積層回路基板装置の実施例を
添付の図面を参照して説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of a laminated circuit board device of the present invention will be described below with reference to the accompanying drawings.

【0013】図1は実施例の構成を示している。図1に
おいて、11はサブ回路基板であり、両端に凸状部11
a、11bが設けられている。
FIG. 1 shows the configuration of the embodiment. In FIG. 1, reference numeral 11 denotes a sub-circuit board, which has convex portions 11 at both ends.
a and 11b are provided.

【0014】12はメイン回路基板であり、長手方向の
両側中央部に2つづつの凹部12a、12b、12c、
12dが形成されている。サブ基板11にコネクタ11
m、11nが配置され、このコネクタ11m、11nに
対向し、且つ接続するようにメイン回路基板12にコネ
クタ12m、12nが配置されている。
Reference numeral 12 denotes a main circuit board, which has two recesses 12a, 12b, 12c at the center of both sides in the longitudinal direction.
12d is formed. Connector 11 on sub-board 11
m and 11n are arranged, and the connectors 12m and 12n are arranged on the main circuit board 12 so as to face and connect to the connectors 11m and 11n.

【0015】13、14は回路基板固定枠であり、この
回路基板固定枠13、14は、それぞれ長孔13a、1
4aが設けられている。回路基板固定枠13の長孔13
aはサブ回路基板11の凸状部11aが嵌め込まれ、ま
た、回路基板固定枠14の長孔14aにサブ回路基板1
1の凸状部11bが嵌め込まれる。さらに、回路基板固
定枠13の両側の部位は、メイン回路基板12の凹部1
2a、12bに嵌め込まれ、同様に回路基板固定枠14
の両側の部位は、メイン回路基板12の凹部12c、1
2dに嵌め込まれる。
Reference numerals 13 and 14 denote circuit board fixing frames, and the circuit board fixing frames 13 and 14 are elongated holes 13a and 1 respectively.
4a is provided. Slot 13 of circuit board fixing frame 13
The convex portion 11a of the sub-circuit board 11 is fitted in a, and the sub-circuit board 1 is inserted into the long hole 14a of the circuit-board fixing frame 14.
The convex portion 11b of No. 1 is fitted. Further, the portions on both sides of the circuit board fixing frame 13 are provided in the concave portion 1 of the main circuit board 12.
2a, 12b, and similarly, the circuit board fixing frame 14
The parts on both sides of the concave portions 12c of the main circuit board 12 are
It is fitted in 2d.

【0016】16は、シールドケースであり、積層され
たサブ基板11とメイン回路基板12とを内部に収納し
て螺子17で固定する。
Reference numeral 16 denotes a shield case, in which the laminated sub-board 11 and main circuit board 12 are housed inside and fixed by screws 17.

【0017】図2は、回路基板固定枠14の長孔14a
にサブ回路基板11の凸状部11bが嵌め込まれ、さら
に回路基板固定枠14の両側の部位が、メイン回路基板
12の凹部12c、12dに嵌め込まれた状態を示して
いる。
FIG. 2 shows a long hole 14a of the circuit board fixing frame 14.
The convex portion 11b of the sub-circuit board 11 is fitted in, and the portions on both sides of the circuit board fixing frame 14 are fitted in the concave portions 12c and 12d of the main circuit board 12.

【0018】このようにして、メイン回路基板12に回
路基板固定枠13が固定される。なお、上記の部材は、
一枚の基板材から作製することができる。
In this way, the circuit board fixing frame 13 is fixed to the main circuit board 12. The above members are
It can be manufactured from a single substrate material.

【0019】図3は、この一枚の基板材から作製する際
の構成を示しており、サブ基板11、メイン回路基板1
2および回路基板固定枠13、14がミシン目で区分さ
れている。
FIG. 3 shows the structure when the substrate is manufactured from this one substrate material. The sub-board 11 and the main circuit board 1 are shown in FIG.
2 and the circuit board fixing frames 13 and 14 are divided by perforations.

【0020】この場合、一枚の基板材で、所望の部材が
一度に作製できる。次に、上記構成の機能について説明
する。
In this case, a desired member can be manufactured at once with one substrate material. Next, the function of the above configuration will be described.

【0021】サブ回路基板11とメイン回路基板12j
は、コネクタ11m、11nとコネクタ12m、12n
が接続されるとともに、回路基板固定枠13、14で固
定される。この場合、組立完成後に直接振動、衝撃が加
わった場合でも回路基板固定枠13、14 dサブ回路
基板1の外れを防止できることになる。
Sub circuit board 11 and main circuit board 12j
Are connectors 11m and 11n and connectors 12m and 12n
Are connected and fixed by the circuit board fixing frames 13 and 14. In this case, it is possible to prevent the circuit board fixing frames 13 and 14d from coming off from the sub circuit board 1 even if a direct vibration or impact is applied after the assembly is completed.

【0022】このように上記実施例によれば、サブ回路
基板11の凸状部11aが回路基板固定枠13の長孔1
3aに嵌め込まれ、また、サブ回路基板11の凸状部1
1bが回路基板固定枠14の長孔14aに嵌め込まれる
のみで、メイン回路基板12にサブ回路基板11が固定
されるため、サブ回路基板11およびメイン回路基板1
2の回路パターン内にスペーサ等が配置されず、部品実
装面積が減少することなく、集密化実装を達成できる。
さらに、サブ回路基板11、メイン回路基板12の余白
部分を活用することにより、スペーサ等の専用部品を必
要とせず、コスト上昇を抑えることができる。また、上
記実施例によれば、サブ回路基板11、メイン回路基板
12、回路基板固定枠13、14のクリアランスによ
り、固定するためコネクタ11m、11nとコネクタ1
2m、12nの接合部に、負荷がかからず、接合部の信
頼性が向上する。
As described above, according to the above-described embodiment, the convex portion 11a of the sub-circuit board 11 has the elongated hole 1 of the circuit board fixing frame 13.
3a, and the convex portion 1 of the sub circuit board 11
Since the sub circuit board 11 is fixed to the main circuit board 12 only by fitting 1b into the elongated hole 14a of the circuit board fixing frame 14, the sub circuit board 11 and the main circuit board 1
Spacers and the like are not arranged in the circuit pattern of No. 2, and the dense mounting can be achieved without reducing the component mounting area.
Furthermore, by utilizing the marginal portions of the sub circuit board 11 and the main circuit board 12, it is possible to suppress cost increase without the need for dedicated parts such as spacers. Further, according to the above-mentioned embodiment, the connectors 11m and 11n and the connector 1 for fixing the sub-circuit board 11, the main circuit board 12, and the circuit board fixing frames 13 and 14 are fixed by the clearances.
No load is applied to the joint portions of 2 m and 12 n, and the reliability of the joint portions is improved.

【0023】又、ビス等の金属を使用しないため、高周
波機器では、アース部のパターン変化、高周波まわり込
みの影響を受けずに安定に動作する。
Further, since metal such as screws is not used, the high-frequency equipment can operate stably without being affected by the pattern change of the grounding portion and the high-frequency wraparound.

【0024】なお、サブ回路基板11に凸状部11a、
11bを設け、メイン回路基板12に凹12a、12
b、12c、12dを設けているが、これに限らず、ど
のように組み合わせで設けても良い。
The sub-circuit board 11 has convex portions 11a,
11b is provided, and the main circuit board 12 is provided with recesses 12a, 12a.
Although b, 12c, and 12d are provided, the invention is not limited to this, and any combination may be provided.

【0025】[0025]

【発明の効果】上記説明から明らかなように、本発明の
積層回路基板装置は、第1の回路基板あるいは第2の回
路基板の凸部が離間して固定枠の開口部に嵌め込まれる
とともに、第1の回路基板あるいは第2の回路基板の二
つの凹部が離間して固定枠の両側部位に嵌めこんで固定
されているため、コストが低減し、実装面積が低減する
ことなく、回路基板のはずれを有効に阻止して高密度積
層回路基板化が達成できるとともに安定した動作が得ら
れるという効果を有する。
As is apparent from the above description, in the laminated circuit board device of the present invention, the convex portions of the first circuit board or the second circuit board are spaced apart from each other and are fitted into the openings of the fixing frame. Since the two concave portions of the first circuit board or the second circuit board are spaced apart and are fitted and fixed to both side portions of the fixing frame, the cost is reduced and the mounting area is not reduced. It is possible to effectively prevent the disconnection, achieve a high-density laminated circuit board, and obtain stable operation.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の積層回路基板装置の実施例における構
成を示す拡散斜視図
FIG. 1 is a diffusion perspective view showing a configuration in an embodiment of a laminated circuit board device of the present invention.

【図2】実施例の要部を示す斜視図FIG. 2 is a perspective view showing a main part of the embodiment.

【図3】実施例における製作時の説明のための平面図FIG. 3 is a plan view for explaining a manufacturing process according to the embodiment.

【図4】従来の積層回路基板装置のの構成を示す拡散斜
視図
FIG. 4 is a diffusion perspective view showing a configuration of a conventional laminated circuit board device.

【符号の説明】[Explanation of symbols]

11 サブ回路基板 11a、11b 凸状部 12 メイン回路基板 12a、12b、12c、12d 凹部 11m、11n、12m、12n コネクタ 13、14 回路基板固定枠 13a、14a 長孔 11 Sub Circuit Board 11a, 11b Convex Part 12 Main Circuit Board 12a, 12b, 12c, 12d Recess 11m, 11n, 12m, 12n Connector 13, 14 Circuit Board Fixing Frame 13a, 14a Long Hole

Claims (1)

【特許請求の範囲】 【請求項1】 少なくとも二つの側面に一つの凸部及び
二つの凹部が設けられる第1、第2の回路基板と、上記
凸部に開口部が嵌め込まれるとともに、二つの凹部に両
側部位が嵌め込まれて、上記第1の回路基板と第2の回
路基板とを離間して固定する固定枠とを備える積層回路
基板装置。
Claims: 1. First and second circuit boards having at least two side surfaces provided with one convex portion and two concave portions, and an opening portion fitted into the convex portion and two A laminated circuit board device comprising: a fixing frame having both side portions fitted in a recess and fixing the first circuit board and the second circuit board so as to be separated from each other.
JP18861291A 1991-07-29 1991-07-29 Laminate circuit board device Pending JPH0537116A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18861291A JPH0537116A (en) 1991-07-29 1991-07-29 Laminate circuit board device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18861291A JPH0537116A (en) 1991-07-29 1991-07-29 Laminate circuit board device

Publications (1)

Publication Number Publication Date
JPH0537116A true JPH0537116A (en) 1993-02-12

Family

ID=16226728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18861291A Pending JPH0537116A (en) 1991-07-29 1991-07-29 Laminate circuit board device

Country Status (1)

Country Link
JP (1) JPH0537116A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007234736A (en) * 2006-02-28 2007-09-13 Icom Inc Circuit board
JP2015139284A (en) * 2014-01-22 2015-07-30 住友重機械工業株式会社 Power conversion apparatus for work vehicle, and work vehicle

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007234736A (en) * 2006-02-28 2007-09-13 Icom Inc Circuit board
JP4690224B2 (en) * 2006-02-28 2011-06-01 アイコム株式会社 Circuit board
JP2015139284A (en) * 2014-01-22 2015-07-30 住友重機械工業株式会社 Power conversion apparatus for work vehicle, and work vehicle

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