JPH0537026A - Led lamp and led display wherein led lamp is used and led display panel wherein led lamp is used - Google Patents
Led lamp and led display wherein led lamp is used and led display panel wherein led lamp is usedInfo
- Publication number
- JPH0537026A JPH0537026A JP3190184A JP19018491A JPH0537026A JP H0537026 A JPH0537026 A JP H0537026A JP 3190184 A JP3190184 A JP 3190184A JP 19018491 A JP19018491 A JP 19018491A JP H0537026 A JPH0537026 A JP H0537026A
- Authority
- JP
- Japan
- Prior art keywords
- led
- lead
- bonding
- led lamp
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、２個以上のＬＥＤチ
ップを１つのパッケ−ジに封止したＬＥＤランプ及びこ
れを使用したＬＥＤ表示器とＬＥＤディスプレイパネル
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED lamp in which two or more LED chips are sealed in one package, an LED display using the same, and an LED display panel.
【０００２】[0002]
【従来の技術】一般に、ＬＥＤディスプレイパネルはパ
ネルに縦，横，或いは縦横に複数のＬＥＤ表示器が配置
されてなっているが、このＬＥＤ表示器は図５に示すよ
うに、プリント基板２１に複数のＬＥＤランプ２２が縦
横のマトリクス状（例えば４×４ドット）に配置されて
なっている。図中の符号２３はマスクである。2. Description of the Related Art Generally, an LED display panel has a plurality of LED indicators arranged vertically, horizontally, or vertically and horizontally on the panel. This LED indicator is mounted on a printed circuit board 21 as shown in FIG. A plurality of LED lamps 22 are arranged in a vertical and horizontal matrix (for example, 4 × 4 dots). Reference numeral 23 in the drawing is a mask.
【０００３】ところでＬＥＤランプ２２は、従来、図６
及び図７に示すように構成され、赤色ＬＥＤチップ２４
と緑色ＬＥＤチップ２５からなる２個のＬＥＤチップを
有している。各ＬＥＤチップ２４，２５はマウント用導
出リ−ド２６のＬＥＤマウント部２７に固着され、この
マウント用導出リ−ド２６の両側に位置するボンディン
グ用導出リ−ド２８，２９にボンディングワイヤ３０，
３１により接続されている。尚、図６中の符号３２は封
止用樹脂部材である。By the way, the LED lamp 22 is conventionally shown in FIG.
And the red LED chip 24 configured as shown in FIG.
And two green LED chips 25. The LED chips 24 and 25 are fixed to the LED mount portion 27 of the mounting lead-out lead 26, and the bonding lead-out leads 28 and 29 located on both sides of the mounting lead-out lead 26 are bonded to the bonding wires 30 and 30.
It is connected by 31. Reference numeral 32 in FIG. 6 is a sealing resin member.
【０００４】この場合、図示のように各ＬＥＤチップ２
４，２５の中心を結ぶ直線Ｂと各導出リ−ド２８，２９
の整列方向Ｃが一致している。又、図５において各ＬＥ
Ｄランプ２２間のピンチが少ないため、プリント基板２
１に複数のＬＥＤランプ２２を縦横のマトリクス状に実
装してＬＥＤ表示器を構成する際に、図５（ｃ）に示す
ように上下方向（ｙ方向）に対して導出リ−ド２８，２
９の整列方向を４５°傾けている。これにより、導出リ
−ド２８，２９がぶつかることなく高密度に而もマトリ
クス状にＬＥＤランプ２２を配置することが出来る。こ
のようなＬＥＤ表示器をパネル上に縦横に隙間なく配置
することにより、面，或いは縦一列，横一列のみのＬＥ
Ｄディスプレイパネルが形成される。In this case, as shown in the drawing, each LED chip 2
A straight line B connecting the centers of 4, 25 and the derived leads 28, 29
The aligning directions C of are aligned. Moreover, in FIG.
Since there is little pinch between the D lamps 22, the printed circuit board 2
When a plurality of LED lamps 22 are mounted in a vertical and horizontal matrix in 1 to form an LED display, as shown in FIG. 5 (c), the derived leads 28, 2 are arranged in the vertical direction (y direction).
The alignment direction of 9 is inclined by 45 °. As a result, the LED lamps 22 can be arranged in a matrix with high density without the lead-out leads 28 and 29 colliding with each other. By arranging such LED displays on the panel vertically and horizontally without any gap, LEs having only one surface or one row and one row
A D display panel is formed.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記の
ような従来のＬＥＤランプを使用した場合、各ＬＥＤチ
ップ２４，２５の中心を結ぶ直線Ｂと導出リ−ド２８，
２９の整列方向Ｃが一致しているため、図５のｙ軸を中
心としてＬＥＤ表示器を回転（又は測定器を回転）させ
た場合の指向性は図８（ａ），（ｂ）のように赤色と緑
色で異なる。そのため、赤色ＬＥＤランプ２４と緑色Ｌ
ＥＤランプ２５を同時点灯し、橙色表示をさせた場合に
は、混色が変化するためにディスプレイパネルを形成し
た際に水平方向で色調が変化することになり、問題にな
っている。又、ディスプレイパネルの鉛直方向の色調に
ついては人間が見る場合、一定の高さから見ることにな
る。従って、ＬＥＤランプを用いたディスプレイパネル
で一番問題となるのは、水平方向の色調の変化である。However, when the conventional LED lamp as described above is used, the straight line B connecting the centers of the LED chips 24, 25 and the lead-out lead 28,
Since the alignment directions C of 29 are the same, the directivity when the LED display is rotated (or the measuring device is rotated) around the y-axis of FIG. 5 is as shown in FIGS. 8A and 8B. Different in red and green. Therefore, the red LED lamp 24 and the green L
When the ED lamp 25 is simultaneously turned on to display an orange color, the color tone changes in the horizontal direction when the display panel is formed because the color mixture changes, which is a problem. In addition, the color tone in the vertical direction of the display panel is viewed from a certain height by humans. Therefore, the biggest problem in the display panel using the LED lamp is the change of the color tone in the horizontal direction.
【０００６】この発明は、以上のような不都合を解決す
るものであり、ＬＥＤ表示器やディスプレイパネル構成
時に水平方向の色調変化を少なくしたＬＥＤランプ及び
これを使用したＬＥＤ表示器とＬＥＤディスプレイパネ
ルを提供することを目的とする。The present invention has been made to solve the above-mentioned inconveniences, and provides an LED lamp and an LED display and an LED display panel using the same, in which a change in color tone in the horizontal direction is reduced when the LED display or the display panel is constructed. The purpose is to provide.
【０００７】[0007]
【課題を解決するための手段】この発明は、一端にＬＥ
Ｄマウント部を有するマウント用導出リ−ドと、上記Ｌ
ＥＤマウント部に一直線上に固着された複数のＬＥＤチ
ップと、この各ＬＥＤチップにそれぞれ接続され整列配
置された複数のボンディング用導出リ−ドと、上記マウ
ント用導出リ−ド，ＬＥＤチップ，及びボンディング用
導出リ−ドを封止固定する封止用樹脂部材とを具備し、
上記各ＬＥＤチップを結ぶ直線が上記ボンディング用導
出リ−ドの整列方向と斜めに交差しているＬＥＤランプ
である。又、この発明は、プリント基板と、このプリン
ト基板上に縦横のマトリクス状に配置され，各ＬＥＤチ
ップを結ぶ直線が上記マトリクスの行又は列と平行に設
定され，更にボンディング用導出リ−ドの整列方向が上
記マトリクスの行又は列と斜めに交差している上記の複
数のＬＥＤランプとを具備するＬＥＤ表示器である。更
に、この発明は、パネルと、このパネルに縦，横，或い
は縦横に配置された上記の複数のＬＥＤ表示器とを具備
するＬＥＤディスプレイパネルである。SUMMARY OF THE INVENTION The present invention has an LE at one end.
A lead-out lead for mounting having a D mount portion, and the above L
A plurality of LED chips fixed in a straight line to the ED mount portion, a plurality of lead-out leads for bonding which are respectively connected to and aligned with the respective LED chips, the lead-out lead for mount, the LED chip, and And a sealing resin member for sealing and fixing the lead-out lead for bonding,
In the LED lamp, a straight line connecting the LED chips intersects obliquely with the alignment direction of the bonding lead-out lead. Further, according to the present invention, a printed circuit board and a matrix arranged vertically and horizontally on the printed circuit board, the straight lines connecting the respective LED chips are set in parallel with the rows or columns of the matrix, and further, a lead wire for bonding is provided. An LED display comprising the above-mentioned plurality of LED lamps whose alignment direction diagonally intersects a row or a column of the matrix. Furthermore, the present invention is an LED display panel comprising a panel and a plurality of the above-mentioned LED displays arranged vertically, horizontally, or vertically and horizontally on the panel.
【０００８】[0008]
【作用】この発明によれば、ＬＥＤ表示器やディスプレ
イパネル構成時に水平方向の色調変化を小さくすること
が出来る。According to the present invention, the color tone change in the horizontal direction can be reduced when the LED display or the display panel is constructed.
【０００９】[0009]
【実施例】以下、図面を参照して、この発明の一実施例
を詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.
【００１０】即ち、この発明によるＬＥＤランプは図１
に示すように構成され、図中の符号１はマウント用導出
リ−ドである。このマウント用導出リ−ド１の一端に
は、楕円形のＬＥＤマウント部２が一体に設けられてい
る。このＬＥＤマウント部２上には、２個のＬＥＤチッ
プ例えば赤色ＬＥＤチップ３と緑色ＬＥＤチップ４が、
楕円の長軸に沿わない位置に固着されている。更に、マ
ウント用導出リ−ド１の両側には、ボンディング用導出
リ−ド５，６が所定間隔で配設されている。これらボン
ディング用導出リ−ド５，６は、それぞれ赤色ＬＥＤチ
ップ３と緑色ＬＥＤチップ４にボンディングワイヤ７，
８を介して接続されている。That is, the LED lamp according to the present invention is shown in FIG.
The reference numeral 1 in the drawing is a lead-out lead for mounting. An elliptical LED mount portion 2 is integrally provided at one end of the mounting lead-out lead 1. Two LED chips, for example, a red LED chip 3 and a green LED chip 4, are mounted on the LED mount 2.
It is fixed at a position that does not follow the major axis of the ellipse. Further, on both sides of the mounting lead-out lead 1, bonding lead-out leads 5 and 6 are arranged at predetermined intervals. These lead-out leads 5 and 6 for bonding are connected to the red LED chip 3 and the green LED chip 4, respectively, by bonding wires 7 and 7.
8 are connected.
【００１１】この場合、図示のように各ＬＥＤチップ
３，４の中心を結ぶ直線ｙ1 と各導出リ−ド１，５，６
の整列方向Ａとは、斜めに交差している。この実施例で
は、斜めの角度が略４５°に設定されている。In this case, as shown in the drawing, a straight line y 1 connecting the centers of the LED chips 3 and 4 and the derived leads 1, 5, 6
It intersects with the alignment direction A of diagonally. In this embodiment, the oblique angle is set to about 45 °.
【００１２】尚、この発明の場合も、マウント用導出リ
−ド１、ＬＥＤチップ３，４、及びボンディング用導出
リ−ド５，６は、従来例（図６）と同様に図示しない封
止用樹脂部材により封止固定されていることは、言うま
でもない。Also in the case of the present invention, the mounting lead-out lead 1, the LED chips 3 and 4, and the bonding lead-out leads 5 and 6 are not shown, as in the conventional example (FIG. 6). Needless to say, it is sealed and fixed by the resin member for use.
【００１３】上記のようなこの発明のＬＥＤランプを用
いて、図５と同様に、プリント基板上に複数のＬＥＤラ
ンプを縦横のマトリクス状に実装してＬＥＤ表示器を構
成する。この場合、図５のｙ軸と図１の直線ｙ1 とが一
致する。これにより、赤色と緑色の発光パタ−ン、つま
りｙ軸を中心にしてＬＥＤ表示器を回転させた場合の指
向性は、赤色、緑色共に左右対称に近いパタ−ンとな
り、同時点灯時の混色についても左右で変化が少なくな
る。その結果、色調の変化が小さくなる。Using the LED lamp of the present invention as described above, a plurality of LED lamps are mounted on a printed circuit board in a matrix in the vertical and horizontal directions to form an LED display, as in FIG. In this case, the y-axis in FIG. 5 and the straight line y 1 in FIG. 1 coincide with each other. As a result, the red and green light emitting patterns, that is, the directivity when the LED display is rotated around the y-axis, becomes a pattern in which both red and green are nearly symmetrical, and the colors are mixed at the same time. There is less change between left and right. As a result, the change in color tone becomes small.
【００１４】このようなＬＥＤ表示器をパネル上に縦横
に隙間なく配置することにより、面，或いは縦一列，横
一列のみのＬＥＤディスプレイパネルが形成される。こ
の場合、ｙ軸をＬＥＤディスプレイパネルの鉛直方向に
向けることにより、水平方向の色調変化が小さくなる。
つまり、この発明のＬＥＤディスプレイパネルでは、各
ＬＥＤランプの各ＬＥＤチップ３，４の中心を結ぶ直線
ｙ1 が、パネル正面から向かって鉛直方向に配列されて
いる訳である。By arranging such LED displays on the panel vertically and horizontally without a gap, a surface or an LED display panel having only one vertical line and one horizontal line is formed. In this case, by directing the y axis in the vertical direction of the LED display panel, the change in color tone in the horizontal direction is reduced.
That is, in the LED display panel of the present invention, the straight line y 1 connecting the centers of the LED chips 3 and 4 of the LED lamps is arranged vertically from the front of the panel.
【００１５】尚、上記実施例では２個のＬＥＤチップ
３，４を有するＬＥＤランプについて述べたが、図２に
示すように３個のＬＥＤチップ３，４，９を有し、ＬＥ
Ｄチップ９にボンディングワイヤ１０を介して接続され
たボンディング用導出リ−ド１１を有するＬＥＤランプ
でも良い。この場合は、赤色，緑色，青色の３原色によ
り表示が可能である。そして、このＬＥＤランプを用い
てＬＥＤ表示器を構成した場合、直線ｙ2 が図５のｙ軸
と一致する。Although the LED lamp having the two LED chips 3 and 4 has been described in the above embodiment, the LED lamp has the three LED chips 3, 4 and 9 as shown in FIG.
An LED lamp having a bonding lead-out lead 11 connected to the D chip 9 via a bonding wire 10 may be used. In this case, it is possible to display in three primary colors of red, green and blue. When an LED display is constructed using this LED lamp, the straight line y 2 coincides with the y axis in FIG.
【００１６】又、マウント用導出リ−ド１のＬＥＤマウ
ント部の形状も、図３に示すようにＬＥＤチップ３，４
を固着し易いように、各導出リ−ド１，５，６の整列方
向に対して４５°傾いた直線上に長軸を持つ楕円状ＬＥ
Ｄマウント部１２であっても良い。そして、このＬＥＤ
ランプを用いてＬＥＤ表示器を構成した場合、各導出リ
−ド１，５，６の整列方向ｙ3 が図５のｙ軸と一致す
る。更に、ＬＥＤ表示器の後方に、駆動回路基板を設け
ても良い。Further, the shape of the LED mount portion of the mounting lead-out lead 1 is also as shown in FIG.
The elliptical LE having a long axis on a straight line inclined by 45 ° with respect to the alignment direction of the lead-out leads 1, 5, 6 so that
It may be the D mount portion 12. And this LED
When the LED display is constructed by using the lamp, the alignment direction y 3 of each lead-out lead 1, 5, 6 coincides with the y-axis in FIG. Further, a drive circuit board may be provided behind the LED display.
【００１７】[0017]
【発明の効果】この発明によれば、ＬＥＤ表示器やディ
スプレイパネル構成時に水平方向の色調変化を小さくす
ることが出来る。According to the present invention, it is possible to reduce a change in color tone in the horizontal direction when an LED display or a display panel is constructed.
【図１】この発明の一実施例に係るＬＥＤランプを示す
平面図。FIG. 1 is a plan view showing an LED lamp according to an embodiment of the present invention.
【図２】この発明の他の実施例に係るＬＥＤランプを示
す平面図。FIG. 2 is a plan view showing an LED lamp according to another embodiment of the present invention.
【図３】この発明の別の他の実施例に係るＬＥＤランプ
を示す平面図。FIG. 3 is a plan view showing an LED lamp according to another embodiment of the present invention.
【図４】この発明のＬＥＤランプにおける赤色と緑色の
発光パタ−ンを示す特性曲線図。FIG. 4 is a characteristic curve diagram showing red and green emission patterns in the LED lamp of the present invention.
【図５】（ａ），（ｂ），（ｃ）は一般的なＬＥＤ表示
器を示す平面図、側面図、裏面図。5A, 5B, and 5C are a plan view, a side view, and a rear view showing a general LED display.
【図６】従来のＬＥＤランプを示す斜視図。FIG. 6 is a perspective view showing a conventional LED lamp.
【図７】従来のＬＥＤランプを示す平面図。FIG. 7 is a plan view showing a conventional LED lamp.
【図８】従来のＬＥＤランプにおける赤色と緑色の発光
パタ−ンを示す特性曲線図。FIG. 8 is a characteristic curve diagram showing red and green emission patterns in a conventional LED lamp.
１…マウント用導出リ−ド、２…ＬＥＤマウント部、
３，４…ＬＥＤチップ、５，６…ボンディング用導出リ
−ド。1 ... Lead-out lead for mounting, 2 ... LED mounting part,
3, 4 ... LED chips, 5, 6 ... Lead-out leads for bonding.
Claims (3)
ト用導出リ−ドと、上記ＬＥＤマウント部に一直線上に
固着された複数のＬＥＤチップと、この各ＬＥＤチップ
にそれぞれ接続され整列配置された複数のボンディング
用導出リ−ドと、上記マウント用導出リ−ド，ＬＥＤチ
ップ，及びボンディング用導出リ−ドを封止固定する封
止用樹脂部材とを具備し、 上記各ＬＥＤチップを結ぶ直線が上記ボンディング用導
出リ−ドの整列方向と斜めに交差していることを特徴と
するＬＥＤランプ。1. A mounting lead-out lead having an LED mount portion at one end, a plurality of LED chips fixed in a straight line to the LED mount portion, and a plurality of LED chips connected to and aligned with each of the LED chips. Of the bonding lead wire, the mounting lead wire, the LED chip, and a sealing resin member that seals and fixes the bonding lead wire, and a straight line connecting the LED chips is formed. An LED lamp, characterized in that it intersects diagonally with the alignment direction of the lead-out lead for bonding.
縦横のマトリクス状に配置され，各ＬＥＤチップを結ぶ
直線が上記マトリクスの行又は列と平行に設定され，更
にボンディング用導出リ−ドの整列方向が上記マトリク
スの行又は列と斜めに交差している請求項１記載の複数
のＬＥＤランプとを、 具備することを特徴とするＬＥＤ表示器。2. A printed circuit board and a matrix arranged vertically and horizontally on the printed circuit board, wherein a straight line connecting each LED chip is set parallel to a row or a column of the matrix, and a lead wire for bonding is aligned. 2. A plurality of LED lamps according to claim 1, the directions of which intersect diagonally with the rows or columns of the matrix.
縦横に配置された請求項３記載の複数のＬＥＤ表示器と
を、 具備することを特徴とするＬＥＤディスプレイパネル。3. An LED display panel comprising: a panel; and a plurality of LED indicators according to claim 3, which are arranged vertically, horizontally, or vertically and horizontally on the panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3190184A JP2801800B2 (en) | 1991-07-30 | 1991-07-30 | LED display and LED display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3190184A JP2801800B2 (en) | 1991-07-30 | 1991-07-30 | LED display and LED display panel |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10109667A Division JPH10260645A (en) | 1998-04-20 | 1998-04-20 | Led lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0537026A true JPH0537026A (en) | 1993-02-12 |
| JP2801800B2 JP2801800B2 (en) | 1998-09-21 |
Family
ID=16253851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3190184A Expired - Lifetime JP2801800B2 (en) | 1991-07-30 | 1991-07-30 | LED display and LED display panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2801800B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005136224A (en) * | 2003-10-30 | 2005-05-26 | Asahi Kasei Electronics Co Ltd | Light-emitting diode illumination module |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6431473A (en) * | 1987-07-27 | 1989-02-01 | Sharp Kk | 2-color light emitting element |
| JP3034258U (en) * | 1996-07-31 | 1997-02-14 | 株式会社ケイテオプチカ | Lens fastening structure for rimless glasses |
-
1991
- 1991-07-30 JP JP3190184A patent/JP2801800B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6431473A (en) * | 1987-07-27 | 1989-02-01 | Sharp Kk | 2-color light emitting element |
| JP3034258U (en) * | 1996-07-31 | 1997-02-14 | 株式会社ケイテオプチカ | Lens fastening structure for rimless glasses |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005136224A (en) * | 2003-10-30 | 2005-05-26 | Asahi Kasei Electronics Co Ltd | Light-emitting diode illumination module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2801800B2 (en) | 1998-09-21 |
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