JPH0536838U - Semiconductor manufacturing boat - Google Patents

Semiconductor manufacturing boat

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Publication number
JPH0536838U
JPH0536838U JP8303491U JP8303491U JPH0536838U JP H0536838 U JPH0536838 U JP H0536838U JP 8303491 U JP8303491 U JP 8303491U JP 8303491 U JP8303491 U JP 8303491U JP H0536838 U JPH0536838 U JP H0536838U
Authority
JP
Japan
Prior art keywords
boat
wafer
wafers
dummy
quartz
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8303491U
Other languages
Japanese (ja)
Inventor
紀夫 飯塚
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP8303491U priority Critical patent/JPH0536838U/en
Publication of JPH0536838U publication Critical patent/JPH0536838U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】 【構成】 本考案の半導体製造用石英ボートは、石英ボ
ートと一体型の石英ダミー1,1を、製品ウェーハ設置
用溝2,2…列の端に形成したことを特徴とするもので
ある。 【効果】 上記の構成によると、製品ウェーハ設置用溝
列の端に設置された製品ウェーハでも熱およびプラズマ
が他の溝列に設置したウェーハと同等に加わるようにな
り、ウェーハ間均一性を良くすることができる。また、
石英ボートの出入れ時の振動等が何度も続いてもパーテ
ィクルの発生はなく、ダミーウェーハ交換等の工数を省
くことができる。
(57) [Summary] [Structure] The quartz boat for semiconductor production of the present invention is characterized in that quartz dummies 1 and 1 integrated with the quartz boat are formed at the ends of the product wafer installation grooves 2 and rows. It is what [Effects] According to the above configuration, heat and plasma are added to the product wafers installed at the ends of the product wafer installation groove arrays in the same manner as the wafers installed in the other groove arrays, and the wafer-to-wafer uniformity is improved. can do. Also,
No particles are generated even if vibrations and the like during the loading and unloading of the quartz boat continue many times, and the number of man-hours for exchanging dummy wafers can be saved.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial application]

この考案は半導体製造治具に関し、特にプラズマアッシャー等に使用するボー トの構造に関する。 The present invention relates to a semiconductor manufacturing jig, and more particularly to the structure of a boat used for a plasma asher or the like.

【0002】[0002]

【従来の技術】[Prior Art]

従来、この種のボートは図2の斜視図に示すように、石英よりなりダミーウェ ーハ設置用溝3および製品ウェーハ設置用溝2を有して形成されている。製品ウ ェーハ設置用溝例の端に設置したウェーハは熱およびプラズマがウェーハ全面に 加わるため、レジスト等をアッシングする際、ハクリレートが他の溝列に設置し たウェーハより高くなり、ウェーハ間均一性が悪くなってしまうという理由で、 ダミーウェーハ設置用溝3にダミーウェーハ(図示せず)を設置して使用してい た。 Conventionally, this type of boat is made of quartz and has a dummy wafer installation groove 3 and a product wafer installation groove 2 as shown in the perspective view of FIG. Since the heat and plasma are applied to the entire wafer surface of the wafer installed at the edge of the groove for installing the product wafer, the acrylate rate becomes higher than that of wafers installed in other groove rows when ashing resist, etc. As a result, the dummy wafer (not shown) was installed in the dummy wafer installation groove 3 and used.

【0003】 また、ウェーハのローディング枚数の多い長尺のボートでは、機械的強度増大 のため、長さ方向の中途に支持棒間の補強部材(図示せず)を結合一体化してお り、この補強部材の部分にはウェーハがローディングできないため、その前後に もダミーウェーハを設置して使用していた。In addition, in a long boat with a large number of wafers loaded, a reinforcing member (not shown) between support rods is integrally connected in the middle of the length direction in order to increase mechanical strength. Since wafers cannot be loaded on the reinforcing member, dummy wafers were installed and used before and after that.

【0004】 さらに、ボートの材質は石英のみならず、SiCまたは石英被覆SiC等であ ってもよい。Further, the material of the boat is not limited to quartz, but may be SiC, quartz-coated SiC, or the like.

【0005】[0005]

【考案が解決しようとする課題】[Problems to be solved by the device]

ところで、上記の従来の石英ボートは、ダミーウェーハ設置用溝にダミーウェ ーハを設置して使用すると、石英ボートの出入れ時の振動等が何度も続くと、ダ ミーウェーハと石英がこすれパーティクル発生の原因となる。そのため、ダミー ウェーハを定期的に交換する必要があり、工数およびダミーウェーハの材料費が かかるという欠点があった。 By the way, when the above-mentioned conventional quartz boat is used with the dummy wafer installed in the dummy wafer installation groove, if the vibration during the loading and unloading of the quartz boat continues many times, the dummy wafer and the quartz will rub against particles. It causes the occurrence. Therefore, it is necessary to regularly replace the dummy wafer, which has a drawback that man-hours and material cost of the dummy wafer are increased.

【0006】[0006]

【課題を解決するための手段】[Means for Solving the Problems]

この考案の半導体製造用ボートは、上記の課題を解決するために、ボートと一 体型のダミーを製品ウェーハ設置用溝列の端に形成したことを特徴とするもので ある。 In order to solve the above-mentioned problems, the semiconductor manufacturing boat of the present invention is characterized in that a dummy integrated with the boat is formed at the end of the row of grooves for installing product wafers.

【0007】[0007]

【作用】[Action]

上記の構成によると、製品ウェーハ設置用溝列の端に設置された製品ウェーハ でも熱およびプラズマ等が他の溝列に設置したウェーハと同等に加わるようにな り、ウェーハ間均一性を良くすることができる。 According to the above configuration, heat and plasma are added to the product wafers installed at the end of the product wafer installation groove array in the same manner as the wafers installed in other groove arrays, improving the wafer-to-wafer uniformity. be able to.

【0008】 また、ボートの出入れ時の振動等が何度も続いてもパーティクルの発生はなく 、ダミーウェーハ交換等の工数を省くことができる。[0008] Further, particles are not generated even when vibrations and the like when the boat is moved in and out continue many times, and the man-hours for exchanging dummy wafers can be omitted.

【0009】[0009]

【実施例】【Example】

以下、この考案について図面を参照して説明する。 The present invention will be described below with reference to the drawings.

【0010】 図1はこの考案の一実施例の6インチウェーハ用石英ボートの斜視図である。 図において、1,1は一体型石英ダミー、2,2は製品ウェーハ設置用溝である 。一体型石英ダミー1,1の高さ(h)は6インチ製品ウェーハを製品ウェーハ 設置用溝2,2…列に並べたときの高さと同じであり、厚さ(t)は8〜15mm 程度である。また、製品ウェーハ設置用溝2,2…の溝間距離は約5mmで等間隔 で並んでおり、一体型石英ダミーと製品ウェーハ設置用溝との距離は5〜10mm 程度とした。FIG. 1 is a perspective view of a quartz boat for a 6-inch wafer according to an embodiment of the present invention. In the figure, 1 and 1 are integrated quartz dummies, and 2 and 2 are grooves for installing product wafers. The height (h) of the integrated quartz dummies 1, 1 is the same as the height when the 6-inch product wafers are arranged in the product wafer installation grooves 2, 2 ... Rows, and the thickness (t) is about 8 to 15 mm. Is. Further, the distance between the product wafer mounting grooves 2, 2 is about 5 mm and the grooves are arranged at equal intervals, and the distance between the integrated quartz dummy and the product wafer mounting groove is set to about 5 to 10 mm.

【0011】 上記の構成によれば、製品ウェーハ設置用溝2,2…列の端に設置された製品 ウェーハでも、熱およびプラズマ等が他の溝列に設置したウェーハと同等に加わ るようになり、ウェーハ間均一性を良くすることができる。According to the above configuration, even in the product wafers installed in the end of the product wafer installation grooves 2, 2 ... Rows, heat and plasma are applied in the same manner as the wafers installed in other groove rows. Therefore, the uniformity between wafers can be improved.

【0012】 また、石英ボートの出入れ時の振動等が何度も続いてもパーティクルの発生は なく、ダミーウェーハ交換等の工数を省くことができる。[0012] Furthermore, even if vibrations and the like at the time of loading and unloading the quartz boat are repeated many times, particles are not generated, and the man-hours for exchanging dummy wafers can be omitted.

【0013】 なお、長さ方向の中途に補強部材を一体に結合した長尺のボートにおいては、 補強部材の部分をダミーを兼ねるように構成すればよい。In a long boat in which a reinforcing member is integrally connected in the middle of the length direction, the reinforcing member may be configured to also serve as a dummy.

【0014】[0014]

【考案の効果】[Effect of the device]

以上説明したように、この考案は一体型ダミーによって製品ウェーハ設置用溝 列の端に設置された製品ウェーハでも熱およびプラズマ等が他の溝列に設置した ウェーハと同等に加わるようになり、ウェーハ間均一性を良くすることができる 効果がある。 As explained above, this invention makes it possible for a product wafer installed at the end of a groove array for product wafer installation by an integrated dummy to add heat and plasma to the same level as wafers installed in other groove arrays. There is an effect that it is possible to improve the uniformity.

【0015】 また、ボートの出入れ時の振動等が何度も続いてもパーティクルの発生はなく 、ダミーウェーハ交換等の工数を省くことができる効果がある。Further, particles are not generated even when vibrations and the like when the boat is put in and out continue many times, and there is an effect that man-hours such as replacement of dummy wafers can be omitted.

【図面の簡単な説明】[Brief description of drawings]

【図1】 この考案の一実施例の石英ボートの斜視図FIG. 1 is a perspective view of a quartz boat according to an embodiment of the present invention.

【図2】 従来の石英ボートの斜視図FIG. 2 is a perspective view of a conventional quartz boat.

【符号の説明】[Explanation of symbols]

1 一体型石英ダミー 2 製品ウェーハ設置用溝 1 integrated quartz dummy 2 groove for product wafer installation

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】ボートと一体型のダミーを製品ウェーハ設
置用溝列の端に形成したことを特徴とする半導体製造用
ボート。
1. A boat for semiconductor production, wherein a dummy integrated with the boat is formed at an end of a row of grooves for installing product wafers.
【請求項2】前記ダミーを、ボートの長さ方向の両端と
中途部に形成し、中途部のダミーがボートの補強部材を
兼ねる請求項1記載の半導体製造用ボート。
2. The boat for semiconductor manufacturing according to claim 1, wherein the dummy is formed at both ends in the length direction of the boat and in the middle of the boat, and the dummy in the middle also serves as a reinforcing member of the boat.
JP8303491U 1991-10-14 1991-10-14 Semiconductor manufacturing boat Pending JPH0536838U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8303491U JPH0536838U (en) 1991-10-14 1991-10-14 Semiconductor manufacturing boat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8303491U JPH0536838U (en) 1991-10-14 1991-10-14 Semiconductor manufacturing boat

Publications (1)

Publication Number Publication Date
JPH0536838U true JPH0536838U (en) 1993-05-18

Family

ID=13790944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8303491U Pending JPH0536838U (en) 1991-10-14 1991-10-14 Semiconductor manufacturing boat

Country Status (1)

Country Link
JP (1) JPH0536838U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0220830U (en) * 1988-07-28 1990-02-13
JPH02123736A (en) * 1988-11-02 1990-05-11 Tel Sagami Ltd Wafer boat for longitudinal heat treatment furnace

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0220830U (en) * 1988-07-28 1990-02-13
JPH02123736A (en) * 1988-11-02 1990-05-11 Tel Sagami Ltd Wafer boat for longitudinal heat treatment furnace

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