JPH0536683A - Manufacture of wiring device - Google Patents

Abstract

PURPOSE:To provide a wiring device manufacturing device which can easily manufacture a wiring device having a multilayered structure, such as a wiring model for evaluating a semiconductor integrated circuit device, etc., in a short time. CONSTITUTION:At the time of manufacturing a wiring model 10 having a multilayered structure, a multilayer interconnection structure composed of conductive layers 11, 13, and 15 and insulating layers 12 and 14 is formed by selectively sticking conductive ink A and insulating ink B to the surface of a wiring board 1 in accordance with a desired design pattern.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique which is effective when applied to the manufacture of a wiring device in which a desired circuit pattern is formed on a substrate. For example, a wiring having a multilayer structure such as a wiring device for evaluation of a semiconductor integrated circuit device. The present invention relates to technology effectively used for devices.

[0002]

2. Description of the Related Art A semiconductor integrated circuit device has a multilayer wiring structure, and CAD or the like is used for pattern design of such a semiconductor integrated circuit device. When manufacturing a semiconductor integrated circuit device, confirmation work (mask inspection) is performed to determine whether or not the design pattern of the signal line, power supply wiring, etc. of the semiconductor device designed above is a desired pattern. An example of such an inspection pattern is, for example, D-A.
Inspecting the design pattern created by (Design Automation) by simulation using a computer, actually prototyping a product according to the design pattern, and using this to determine whether the wiring pattern is correct, Alternatively, engineers manually perform drawing inspection based on color-coded pen plot drawings.

[0003]

However, among the conventional drawing inspection operations described above, the drawing inspection by the graphic simulator by the computer is performed at a specific position when performing a simulation such as checking the conduction state at a specific position of the wiring device. There is a problem in that the figure calculation related to the operation such as the input designation of the computer becomes complicated and it takes several days even if a large computer is used and the efficiency of the drawing inspection is not improved. Further, in the case of making a prototype wiring model of a semiconductor integrated circuit device, a metal wiring original plate of an LSI is prepared, and a metal film or an insulating film is formed on this by an etching process using a resist, or the above original plate is used. Is mechanically shaved to create a desired wiring pattern equivalent to that of an LSI, which requires a large amount of cost and a long time of several months to complete a prototype, and is not suitable for layout inspection. Further, in the case of using the pen plot diagram, it takes a lot of time and labor because the engineer manually inspects the plot diagram.

The present invention has been made in view of the above circumstances, and a wiring device for inspecting whether or not a designed pattern such as wiring of a designed semiconductor integrated circuit device is a desired pattern is provided in a short period of time. Another object of the present invention is to provide a method of manufacturing a wiring device that can be easily manufactured. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0005]

The typical ones of the inventions disclosed in the present application will be outlined below. That is, in the method for manufacturing a wiring device of the present invention, in forming a multilayer wiring structure, a conductive ink and an insulating ink are selectively adhered to the surface of the wiring substrate according to desired design patterns to form a conductive layer. And an insulating layer.

[0006]

According to the above-mentioned means, since a wiring structure having a multi-layer structure can be obtained only by attaching the conductive ink and the insulating ink to the wiring substrate, the conductive ink / insulating ink is attached. In this case, for example, the conventional printing technique can be diverted as it is, and the manufacturing of the wiring device becomes extremely easy.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings. 1 to 3 show a semiconductor integrated circuit device (LS
It is sectional drawing which shows the manufacturing process of the 1st Example at the time of forming the wiring model 10 for evaluation of I) by the wiring device manufacturing method which concerns on this invention.

The LSI evaluation wiring model 10 of this embodiment is
The wiring model 10 is manufactured on a scale several hundred times larger than that of an actual LSI. As shown in FIGS. 1 to 3, the wiring model 10 has a plurality of conductive layers stacked on the surface of a paper substrate (wiring substrate) 1. Layers or insulating layers (first to fifth layers in the illustrated example) 11, 1
It is formed by 2, 13, 14, and 15 (see FIG. 3). Of these, the first layer 11, the third layer 13 and the fifth layer 15
Is formed corresponding to the conductive layer of the LSI, and is therefore formed of conductive ink (conductive fluid of high viscosity). The second layer 12 and the fourth layer 14 are formed corresponding to the insulating layers of the LSI, and are therefore formed of insulating ink (insulating fluid with high viscosity).

The design pattern of each of the layers 11 to 15 is determined by computer processing according to an actual LSI wiring pattern (for example, a reticle pattern). For example, when creating a wiring model of an LSI designed by CAD, pattern data from the CAD system
Send directly to the pattern control device of the printing machine (see Fig. 4),
Conductive / insulating ink is selectively applied (printed) to the surface of the substrate 1 according to the above pattern.

More specifically, the application (printing) of the conductive ink / insulating ink is carried out for each layer as follows. That is, the conductive ink A is attached to the substrate 1 according to the wiring pattern of the lowermost layer of the LSI sent from the computer, for example, by a thermal transfer method to first form the conductive first layer 11 (FIG. 1). ).

Conductive ink A forming the first layer 11
After the solidification, the insulating second layer 12 is formed. This second layer 12 is an LSI sent from a computer
It is obtained by forming the insulating ink B on the upper surface of the first layer 11 in the same manner as the thermal transfer method according to the design pattern corresponding to the interlayer insulating film. The second layer 12
A hole (for example, a through hole TH) corresponding to the contact hole / through hole of the interlayer insulating film of the LSI is formed in the substrate (the state up to this point is shown in FIG. 2).

Insulating ink B forming the second layer 12
After the solidification, the conductive ink A sent from the computer according to the wiring pattern of the second layer of the LSI is attached on the upper surface by the thermal transfer method to form the conductive third layer.
Layer 13 is formed. Thereafter, similarly, the fourth layer 14 corresponding to the interlayer insulating film (contact holes /
Through hole TH is formed) insulating ink B
Then, the fifth layer 15 corresponding to the third wiring layer from the bottom of the LSI is formed on the upper surface of the conductive ink A to obtain the wiring model structure shown in FIG.

As described above, the second insulating layer 12, the fourth insulating layer 4
By forming a through hole in the layer 14, L
Similar to SI, multiple wiring layers (first, third and fifth layers)
The conduction state of is maintained.

The wiring model 1 of the LSI thus formed
As described above, in 0, not only the design pattern of the wiring layer but also the connection state between the multilayer wiring layers is reproduced, and since these wiring layers are formed by the conductive ink, the wiring layer of the model 10 ( It is possible to check the wiring connection and the like by passing a current through appropriate positions in the first, third, and fifth layers.

Further, when forming the wiring layer, a plurality of conductive inks having different resistance values are prepared, and the plurality of conductive inks are selectively selected according to the resistance value of each wiring layer of the LSI. If used, the sheet resistance of the wiring layer of the model can be changed, and a more practical inspection of the LSI design pattern becomes possible.

An appropriate current is made to flow through the conductive layer of the wiring model 10 and the temperature distribution of the wiring model is measured by an infrared camera in this state to obtain the temperature distribution of the LSI for predicting electromigration. It is also possible to simulate.

The conductive ink A may be any one as long as it has a substantially constant low resistance value and a predetermined viscosity, and one example thereof is a paste in which Al fine powder is dissolved. The organic compounds and the like are considered. The insulating ink may be one having a predetermined viscosity and not mixed with the above conductive ink, for example, sol-like polyethylene.

FIG. 4 shows a wiring model of the LSI of this embodiment,
It is explanatory drawing which shows the manufacturing system of the wiring apparatus concerning the 2nd Example which diverts and manufactures known printing technology. In this manufacturing system, a CAD computer 20, a print pattern control device 30, and a printing machine 40 having a plurality of jet nozzles are used.

More specifically, in this system, the design pattern of the LSI to be evaluated is created by CAD using the computer 20, and the data of the design pattern obtained by this CAD is sent to the print pattern control device 30. Sent directly. A printing machine 40 provided with a plurality of jet nozzles (three, 41, 42, 43 in the illustrated example) is connected to the printing pattern control device 30.
0 indicates each of the jet nozzles 41, 42, 42 according to the LSI design data sent from the pattern control device 30.
The conductive ink / insulating ink is ejected from 43 to form layers (first to third layers 51 to 53 in the illustrated example) according to the LSI design pattern on the substrate 50.

In this case, the substrate 50 is, for example, an insulating vinyl sheet, and can be moved in a horizontal direction (rightward in the figure) at a constant speed from a rolled state by a motor or the like. ing. The nozzles 41, 42, 43 of the printing machine 40 are installed so as to face the moving substrate 50. Then, the first layer 51, the second layer 52,
Depending on whether the third layer 53 is conductive or insulating,
From the three nozzles 41, 42, 43, respectively, the quick-drying conductive ink A '/ insulating ink B'is selectively ejected. In the LSI wiring model formed in this manner, electricity is applied to the appropriate position, and the electrical connection state of the LSI is inspected, as in the first embodiment.

As described in detail above, in the method of manufacturing the wiring device of this embodiment, when forming the wiring model having the multilayer structure, the conductive ink and the insulating ink are respectively designed on the surface of the wiring board as desired. Since the conductive layer and the insulating layer are selectively deposited according to the pattern, the conductive ink /
In attaching the insulating ink, for example, the conventional printing technique can be used as it is, and the manufacturing of the wiring device becomes extremely easy.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say. For example, in the above embodiment, an example in which the present invention is applied to the manufacture of a wiring model for evaluation of a semiconductor integrated circuit device is shown, but the present invention is not limited to this.
When actually manufacturing a semiconductor integrated circuit device, the manufacturing method of the present invention may be applied as it is. Further, the method of attaching the conductive ink / insulating ink to the substrate or the upper surface of another layer is not limited to the one shown in the embodiment, and for example, an electrostatic plotter or a thermal printer may be used. Good. The substrate on which the wiring model is formed may be a conductive sheet or a conductive metal plate according to the characteristics of the LSI to be evaluated. Also, the method of attaching the ink to the substrate is not limited to that of the embodiment, and for example, after the conductive / insulating ink is applied to the entire surface of the substrate, chemical etching or development processing is performed to obtain a desired wiring pattern. May be obtained.

In the above description, the invention which was mainly made by the present inventor is an application field which is the background of the LSI.
Although the case where the invention is applied to the production of the evaluation wiring model has been described, the present invention is not limited thereto, and all the devices in which the wiring is formed on the substrate, for example, the production of the printed wiring board, the production of the probe card, etc. May be applied to.

[0024]

The effects obtained by the representative one of the inventions disclosed in the present application will be briefly described as follows. That is, it is possible to easily produce a wiring pattern device having a desired design pattern in a short period of time by directly applying the conventional printing technique. For example, when a wiring device having the same wiring pattern as that of the semiconductor integrated circuit device is manufactured according to the present invention, it is possible to easily determine whether or not the design pattern of the semiconductor integrated circuit device is a desired pattern in a short time. Therefore, early development of the semiconductor integrated circuit device can be achieved.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a state in which a first layer (conductive layer) is formed on the upper surface of a substrate by the manufacturing method of the present invention.

FIG. 2 is a cross-sectional view showing a state in which a second layer (insulating layer) is formed on the upper surface of the first layer by the manufacturing method of the present invention.

FIG. 3 is a wiring model 1 for evaluation of a semiconductor integrated circuit device (LSI) formed by a wiring device manufacturing method according to the present invention.
It is sectional drawing of 0.

FIG. 4 is an explanatory diagram showing a wiring device manufacturing system according to a second embodiment that manufactures the LSI wiring model of the present embodiment by using a known printing technique.

[Explanation of symbols]

1 Wiring board 10 Wiring model for evaluation of LSI 11, 13, 15 conductive layer (first, third, fifth layer) 12, 14 Insulation layer (2nd, 4th layers) 20 CAD computer 30 Print pattern control device 40 printing machines 41, 42, 43 jet nozzle 51 wiring board A, A'conductive ink B, B'insulating ink

Claims (3)

[Claims] 1. A multi-layer wiring structure comprising a conductive layer and an insulating layer is formed by selectively adhering a conductive ink and an insulating ink to a surface of a wiring substrate in accordance with desired design patterns, respectively. Wiring device manufacturing method. 2. The method for manufacturing a wiring device according to claim 1, wherein the conductive ink or the insulating ink is attached to the wiring board by a thermal transfer method. 3. The design pattern is a design pattern of a semiconductor integrated circuit device, conductive ink is adhered according to the design pattern of the conductive layer of the semiconductor integrated circuit device, and the insulating ink is according to the design pattern of the insulating layer. The method for manufacturing a wiring device according to claim 1, wherein the wiring device is attached.