JPH0536319Y2 - - Google Patents
Info
- Publication number
- JPH0536319Y2 JPH0536319Y2 JP1985193788U JP19378885U JPH0536319Y2 JP H0536319 Y2 JPH0536319 Y2 JP H0536319Y2 JP 1985193788 U JP1985193788 U JP 1985193788U JP 19378885 U JP19378885 U JP 19378885U JP H0536319 Y2 JPH0536319 Y2 JP H0536319Y2
- Authority
- JP
- Japan
- Prior art keywords
- film
- metal
- electromagnetic shielding
- dispersed
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 239000000843 powder Substances 0.000 claims description 15
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 238000005266 casting Methods 0.000 claims description 10
- 238000010894 electron beam technology Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 8
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 5
- 230000000694 effects Effects 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 6
- 229920005749 polyurethane resin Polymers 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Processes Of Treating Macromolecular Substances (AREA)
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
この考案は、各種電子機器等に好適に使用しう
る電磁波シールド効果の良好な電磁波シールドテ
ープに関する。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to an electromagnetic shielding tape that has a good electromagnetic shielding effect and can be suitably used in various electronic devices.
コンピユータなどの各種電子機器のコネクタ
ー、コード、配線部分などを電磁波シールドする
ために、従来より種々の電磁波シールドテープが
提案されている。これら電磁波シールドテープと
しては、アルミニウムや銅などの金属箔と樹脂フ
イルムとのラミネートフイルムの一方の表面に粘
着剤を塗布して粘着層を設けたものが代表的であ
つた。このシールドテープは比較的良好な電磁波
シールド効果を有するものの小型コネクターなど
の小型部品をこれで被覆しようとすると、テープ
自体の腰が強く、可撓性が不足し、部品に沿わせ
てうまくテープを粘着させることができない不満
があつた。
BACKGROUND ART Various electromagnetic shielding tapes have been proposed to shield connectors, cords, wiring parts, etc. of various electronic devices such as computers from electromagnetic waves. A typical example of these electromagnetic shielding tapes is one in which an adhesive layer is provided by applying an adhesive to one surface of a laminate film of a metal foil such as aluminum or copper and a resin film. Although this shielding tape has a relatively good electromagnetic shielding effect, when trying to cover small parts such as small connectors with it, the tape itself is stiff and lacks flexibility, and the tape does not fit well along the parts. I was dissatisfied with not being able to make it stick.
一方、金属粉末を熱可塑性樹脂に混練し、押出
成形してフイルムとし、このフイルムの一方の面
に粘着剤を塗布してなる電磁波シールドテープも
ある。このものは、十分な可撓性を持つものが得
られるが、押出成形を行うことから金属粉末の混
合量の上限が15％程度となり、電磁波シールド効
果が不足すると云う問題があつた。 On the other hand, there is also an electromagnetic shielding tape made by kneading metal powder into a thermoplastic resin, extruding it to form a film, and applying an adhesive to one side of the film. Although this product has sufficient flexibility, since it is extruded, the upper limit of the amount of metal powder mixed is about 15%, which causes the problem that the electromagnetic shielding effect is insufficient.
さらに、これら従来のシールドテープは、難燃
性、耐熱性の点でも不満があつた。 Furthermore, these conventional shielding tapes were also unsatisfactory in terms of flame retardancy and heat resistance.
そこで、この考案にあつては、ウレタン樹脂液
に金属粉末を分散してキヤステイングによつて金
属分散フイルムを得、これに電子線照射を行い、
導電性粘着層を設けることにより、多量の金属粉
末の混合を可能にして高い電磁波シールド効果を
発揮し、かつ薄膜化を可能として高い可撓性を付
与し、しかも耐熱性、難燃性も改善するようにし
た。
Therefore, in this invention, metal powder was dispersed in a urethane resin liquid and a metal dispersed film was obtained by casting, which was then irradiated with an electron beam.
By providing a conductive adhesive layer, it is possible to mix a large amount of metal powder, exhibiting a high electromagnetic shielding effect, and making it possible to make the film thinner, giving it high flexibility, and improving heat resistance and flame retardancy. I decided to do so.
図面は、この考案の電磁波シールドテープの一
例を示すものである。図中符号１は、この考案に
よる電磁波シールドテープ（以下、シールドテー
プと呼ぶ。）であり、このシールドテープ１は、
金属分散フイルム２と導電性粘着層３と離型紙４
とから構成されている。 The drawing shows an example of the electromagnetic shielding tape of this invention. Reference numeral 1 in the figure is an electromagnetic shielding tape (hereinafter referred to as shielding tape) according to this invention, and this shielding tape 1 is
Metal dispersion film 2, conductive adhesive layer 3, and release paper 4
It is composed of.
金属分散フイルム２は、ポリウレタン樹脂液に
金属粉末を混合、分散し、この混合物をキヤステ
イング法によつてフイルムとし、このフイルムに
電子線照射を施して架橋構造としたものである。
ポリウレタン樹脂としては、ポリエーテル、ポリ
エステルなどのポリオールとジイソシアネートと
を反応させた液状のものが用いられ、これが硬化
する以前に金属粉末が混合、攪拌される。この金
属粉末としては、特に限定されず、種々のものが
用いられるが、ニツケル粉末、スズ粉末などが好
ましい。混合量は、ウレタン樹脂分に対して20〜
40重量％の範囲で、テープとして要求される電磁
波シールド効果等を考慮して決められる。金属粉
末の粒径は、平均粒径で0.05〜0.3μm程度とされ、
ポリウレタン樹脂液に対する分散性を高めるた
め、種々の表面処理を施しておくこともできる。
この考案では金属分散フイルム２をキヤステイン
グ法で得るようにしているので、金属粉末を多量
に混合、分散することができる。 The metal-dispersed film 2 is made by mixing and dispersing metal powder in a polyurethane resin liquid, forming the mixture into a film by a casting method, and irradiating the film with an electron beam to form a crosslinked structure.
The polyurethane resin used is a liquid obtained by reacting a polyol such as polyether or polyester with a diisocyanate, and metal powder is mixed and stirred before the resin is cured. This metal powder is not particularly limited and various types can be used, but nickel powder, tin powder, etc. are preferable. The mixing amount is 20 to 20% of the urethane resin content.
The content is determined within the range of 40% by weight, taking into consideration the electromagnetic shielding effect required for the tape. The average particle size of the metal powder is approximately 0.05 to 0.3 μm,
In order to improve the dispersibility in the polyurethane resin liquid, various surface treatments can be applied.
In this invention, since the metal dispersion film 2 is obtained by a casting method, a large amount of metal powder can be mixed and dispersed.
金属粉末分散ウレタン樹脂液のキヤステイング
は、常法により、ガラス板などの平滑で水平な離
型材表面に流延することによつて行われる。キヤ
ステイング時の粘度を調節し、仕上りフイルムの
厚さを調整するため有機溶剤を適量加えることも
できる。また、キヤステイング時、軽く流延物を
加熱し、ウレタンの硬化反応を促進してもよい。
キヤステイングされた金属分散フイルムの厚さ
は、通常取扱いなどの点から20〜100μm程度とさ
れるが、特に限定されることはない。 Casting of the metal powder-dispersed urethane resin liquid is carried out by casting on the smooth and horizontal surface of a mold release material such as a glass plate by a conventional method. An appropriate amount of organic solvent can be added to adjust the viscosity during casting and the thickness of the finished film. Further, during casting, the cast material may be slightly heated to promote the curing reaction of the urethane.
The thickness of the cast metal-dispersed film is usually about 20 to 100 μm from the viewpoint of handling, but is not particularly limited.
ついで、得られた金属分散フイルムに電子線照
射を行い、ポリウレタン樹脂を架橋する。電子線
照射は、５〜10×ガラツドの電子線を10秒前後照
射することにより行われる。これによつてフイル
ムの耐熱性、耐燃性が改善される。 Next, the obtained metal-dispersed film is irradiated with an electron beam to crosslink the polyurethane resin. The electron beam irradiation is performed by irradiating an electron beam of 5 to 10 times Galad for about 10 seconds. This improves the heat resistance and flame resistance of the film.
この電子線照射された金属分散フイルム２の一
方の面には、導電性粘着剤が塗布されて、導電性
粘着層３が設けられる。導電性粘着剤としては、
ポリアクリル酸エステル、天然ゴムなどを主成分
とする公知の粘着剤に導電性カーボン、金属粉な
どの導電性フイラーを混合、分散したものが使わ
れる。塗布は、通常のロールコータなどを用いて
行われる。導電性粘着層３の厚さは５〜50μm程
度とされる。この粘着層３が設けられた金属分散
フイルム２は、その粘着層３に離型紙４を重ねて
積層し、そのままあるいは所定の幅にスリツトさ
れたのち巻き取られて目的のシールドテープ１と
される。離型紙４としては、通常のシリコーン樹
脂で表面処理したものが使われる。なお、離型紙
４を用いることなく、金属分散フイルム２の他方
の面に離型処理を施して、そのまま巻き取つても
よい。 A conductive adhesive is applied to one surface of the metal-dispersed film 2 irradiated with the electron beam to provide a conductive adhesive layer 3 . As a conductive adhesive,
The adhesive used is a mixture and dispersion of a conductive filler such as conductive carbon or metal powder into a known adhesive whose main ingredients are polyacrylic acid ester or natural rubber. Coating is performed using a normal roll coater or the like. The thickness of the conductive adhesive layer 3 is approximately 5 to 50 μm. The metal dispersion film 2 provided with the adhesive layer 3 is laminated with a release paper 4 on the adhesive layer 3, and is wound up as it is or after being slit to a predetermined width to form the desired shielding tape 1. . As the release paper 4, one whose surface is treated with ordinary silicone resin is used. Note that, without using the release paper 4, the other surface of the metal-dispersed film 2 may be subjected to a release treatment and then wound up as it is.
このようなシールドテープ１にあつては、金属
分散フイルム２をキヤステイング法によりフイル
ム化するようにしているので多量の金属粉末を混
合分散することができ、高い電磁波シールド効果
を発揮する。また、金属粉末を分散したフイルム
であるので、テープ１としての可撓性がよく、小
型部品などにもよく密着し、剥れることがない。
また、粘着層３も導電性を有しているので、この
粘着層３も電磁波シールド効果に寄与する。ま
た、フイルム２が架橋されているので、耐熱性、
耐燃性が良好である。また、テープ１が導電性で
あるので、静電気除去効果も有する。 In the case of such a shielding tape 1, since the metal dispersion film 2 is made into a film by a casting method, a large amount of metal powder can be mixed and dispersed, and a high electromagnetic wave shielding effect is exhibited. Further, since the film is made of metal powder dispersed therein, the tape 1 has good flexibility, adheres well to small parts, etc., and does not peel off.
Moreover, since the adhesive layer 3 also has conductivity, this adhesive layer 3 also contributes to the electromagnetic wave shielding effect. In addition, since the film 2 is crosslinked, it has excellent heat resistance and
Good flame resistance. Furthermore, since the tape 1 is conductive, it also has the effect of removing static electricity.
ポリウレタン樹脂液（エステルタイプ）にニツ
ケル粉末（平均粒径0.2μm）を樹脂分に対して30
重量％混合し、よく攪拌してガラス板上に流延し
てキヤステイングし、厚さ50μmのフイルムを得
た。このフイルムを電子線照射したのち、一方の
面にカーボン入り粘着剤（カーボン含有量50重量
％）を塗布し、厚さ15μmの導電性粘着層を設け、
これを離型紙に積層し、電磁波シールドテープと
した。
Add nickel powder (average particle size 0.2μm) to polyurethane resin liquid (ester type) at a ratio of 30% to the resin content.
They were mixed in weight percent, stirred thoroughly, and casted onto a glass plate to obtain a film with a thickness of 50 μm. After this film was irradiated with an electron beam, a carbon-containing adhesive (carbon content 50% by weight) was applied to one side to form a conductive adhesive layer with a thickness of 15 μm.
This was laminated on release paper to form an electromagnetic shielding tape.
この電磁波シールドテープの機械的特性、電気
的特性を測定したところ、次の結果を得た。 When the mechanical properties and electrical properties of this electromagnetic shielding tape were measured, the following results were obtained.
・破断強度 130kg／cm2
・破断伸度 115％
・導電性 フイルム 5.5×10-3Ω／□
粘着層 1.0×105Ω／□
・電磁波シールド性（at500MHz）
電界 52dB
磁界 22dB
また、この電磁波シールドテープを幅1/2イン
チとし、径0.5mmのビニール線を３本束ねたもの
に巻きつけたところ、よく密着し剥離することが
なかつた。また、耐熱性は190℃であり、耐燃性
は酸素指数で25％であり、いずれも良好な結果を
示した。 - Breaking strength 130kg/cm 2 - Breaking elongation 115% - Conductive film 5.5×10 -3 Ω/□ Adhesive layer 1.0×10 5 Ω/□ - Electromagnetic shielding (at500MHz) Electric field 52dB Magnetic field 22dB Also, this electromagnetic shielding When the tape was made 1/2 inch wide and wrapped around a bundle of three vinyl wires with a diameter of 0.5 mm, it adhered well and did not peel off. Furthermore, the heat resistance was 190°C, and the flame resistance was 25% in oxygen index, both of which showed good results.
以上説明したように、この考案の電磁波シール
ドテープは、金属粉末を分散したウレタン樹脂液
をキヤステイングしてなる金属分散フイルムに電
子線照射を行つて架橋し、導電性粘着層を設けた
ものであるので、多量の金属粉末を混合、分散す
ることができ、高い電磁波シールド効果が得られ
る。また、テープ自体の可撓性が高く、小型のコ
ネクターや細径のコードなどにもよく密着する。
さらに、耐熱性、耐燃性が良好であるので、この
電磁波シールドテープを適用した電子機器等の耐
熱性、耐燃性を低下せしめるようなこともない。
As explained above, the electromagnetic shielding tape of this invention is a metal-dispersed film made by casting a urethane resin liquid containing metal powder dispersed therein, crosslinked by electron beam irradiation, and provided with a conductive adhesive layer. Therefore, a large amount of metal powder can be mixed and dispersed, and a high electromagnetic shielding effect can be obtained. Additionally, the tape itself is highly flexible and adheres well to small connectors and thin-diameter cords.
Furthermore, since the tape has good heat resistance and flame resistance, the heat resistance and flame resistance of electronic devices and the like to which this electromagnetic shielding tape is applied will not be reduced.
図面は、この考案の電磁波シールドテープの一
例を示す斜視図である。
１……電磁波シールドテープ、２……金属分散
フイルム、３……導電性粘着層。
The drawing is a perspective view showing an example of the electromagnetic shielding tape of this invention. 1... Electromagnetic shielding tape, 2... Metal dispersion film, 3... Conductive adhesive layer.
Claims (1)
イングしてなる金属分散フイルムに電子線照射を
行つて架橋し、その少なくとも一方の面に導電性
粘着層を設けてなる電磁波シールドテープ。 An electromagnetic shielding tape comprising a metal-dispersed film formed by casting a urethane resin liquid containing metal powder dispersed therein, which is crosslinked by electron beam irradiation, and a conductive adhesive layer is provided on at least one surface of the metal-dispersed film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985193788U JPH0536319Y2 (en) | 1985-12-17 | 1985-12-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985193788U JPH0536319Y2 (en) | 1985-12-17 | 1985-12-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62101300U JPS62101300U (en) | 1987-06-27 |
| JPH0536319Y2 true JPH0536319Y2 (en) | 1993-09-14 |
Family
ID=31150141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985193788U Expired - Lifetime JPH0536319Y2 (en) | 1985-12-17 | 1985-12-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0536319Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59189846U (en) * | 1983-06-03 | 1984-12-17 | 日立化成工業株式会社 | conductive adhesive tape |
-
1985
- 1985-12-17 JP JP1985193788U patent/JPH0536319Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62101300U (en) | 1987-06-27 |
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