JPH0536275Y2 - - Google Patents
Info
- Publication number
- JPH0536275Y2 JPH0536275Y2 JP1988159576U JP15957688U JPH0536275Y2 JP H0536275 Y2 JPH0536275 Y2 JP H0536275Y2 JP 1988159576 U JP1988159576 U JP 1988159576U JP 15957688 U JP15957688 U JP 15957688U JP H0536275 Y2 JPH0536275 Y2 JP H0536275Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- conductor
- package
- semiconductor
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 28
- 239000004065 semiconductor Substances 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000035882 stress Effects 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 230000006378 damage Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988159576U JPH0536275Y2 (US06252093-20010626-C00008.png) | 1988-12-08 | 1988-12-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988159576U JPH0536275Y2 (US06252093-20010626-C00008.png) | 1988-12-08 | 1988-12-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0189752U JPH0189752U (US06252093-20010626-C00008.png) | 1989-06-13 |
| JPH0536275Y2 true JPH0536275Y2 (US06252093-20010626-C00008.png) | 1993-09-14 |
Family
ID=31440912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988159576U Expired - Lifetime JPH0536275Y2 (US06252093-20010626-C00008.png) | 1988-12-08 | 1988-12-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0536275Y2 (US06252093-20010626-C00008.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016048728A (ja) * | 2014-08-27 | 2016-04-07 | 株式会社村田製作所 | 導電性ポスト、及び、導電性ポストを用いた積層基板の製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5559746A (en) * | 1978-10-27 | 1980-05-06 | Hitachi Ltd | Semiconductor device and its mounting circuit device |
| JPS5743452A (en) * | 1980-08-28 | 1982-03-11 | Mitsubishi Electric Corp | Mounting structure for integrated circuit substrate |
| JPS5791586A (en) * | 1980-11-29 | 1982-06-07 | Tokyo Shibaura Electric Co | Hybrid integrated circuit device |
| JPS57121256A (en) * | 1981-01-21 | 1982-07-28 | Hitachi Ltd | Ceramic multilayer wiring structure |
| JPS57181144A (en) * | 1981-05-01 | 1982-11-08 | Toshiba Corp | Semiconductor device |
-
1988
- 1988-12-08 JP JP1988159576U patent/JPH0536275Y2/ja not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5559746A (en) * | 1978-10-27 | 1980-05-06 | Hitachi Ltd | Semiconductor device and its mounting circuit device |
| JPS5743452A (en) * | 1980-08-28 | 1982-03-11 | Mitsubishi Electric Corp | Mounting structure for integrated circuit substrate |
| JPS5791586A (en) * | 1980-11-29 | 1982-06-07 | Tokyo Shibaura Electric Co | Hybrid integrated circuit device |
| JPS57121256A (en) * | 1981-01-21 | 1982-07-28 | Hitachi Ltd | Ceramic multilayer wiring structure |
| JPS57181144A (en) * | 1981-05-01 | 1982-11-08 | Toshiba Corp | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0189752U (US06252093-20010626-C00008.png) | 1989-06-13 |
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