JPH0534653A - Press-fixing device for glass substrate - Google Patents

Abstract

PURPOSE:To provide the simple press-fixing device for glass substrates which can uniformly pressurize and press-fixe substrate surfaces without contact, can decrease the generation of defects and facilitates the process for production of optical fiber display devices. CONSTITUTION:The peripheral parts of substrate polymers 1 to 4 are held by hollow members 5, 6 via vacuum packings 8 form the top and bottom of the substrate polymers 1 to 4. The hermetic spaces created in the peripheral parts of the substrate polymers 1 to 4 by the hollow members 5, 6, the vacuum packings 8 and the substrate polymers 1 to 4 are evacuated from a discharge port 9 provided in a part of the hollow members 5, 6 to lower the atm. pressure in the substrate polymers so that the substrate polymers 1 to 4 are press-fixed by the pressure difference between the atm. pressure on the outside of the substrate polymers and the atm. pressure in the substrate polymers.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION This invention relates to a glass substrate pressure bonding device,
In particular, the present invention relates to a crimping device used for manufacturing a liquid crystal display element having an electrode pattern and consisting of a pair of upper and lower glass substrates joined by a sealing material.

[0002]

2. Description of the Related Art In the conventional pressure-bonding process of a liquid crystal display element, a pressure-bonding method using a pressure-bonding device using a diaphragm system or the like is generally adopted.

FIG. 3 is a sectional view showing a crimping device using a conventional diaphragm method. In the figure, 1 is an upper electrode substrate of a liquid crystal display element, 2 is a lower electrode substrate of the liquid crystal element,
3 is a spacer that forms a gap between the two electrode substrates,
Reference numeral 4 is a liquid crystal sealing material, 11 is a heating stage of the crimping device, 12 is a diaphragm of the crimping device, and 13 is an intake port for applying pressure to the diaphragm with an air cylinder or the like.

The conventional diaphragm type crimping device is constructed as described above. The crimping method is such that the superposed substrate polymers (upper and lower electrode substrates 1, 2, spacers 3 and sealing members 4) are aligned based on the alignment mark. Is placed on the heating stage 11 of the above-mentioned pressure bonding device, and while being heated, the air pressure inside the diaphragm 12 is raised by an air pump or the like through the intake port 13, and the flexibility of the diaphragm 12 uniformly applies it to the substrate polymer surface. It was a method of pressure bonding.

[0005]

However, when the substrate polymer is pressure-bonded using the above-mentioned pressure-bonding device, the substrate surface is directly contacted with the diaphragm, resulting in contamination of the substrate surface and foreign substances between the substrate surface and the diaphragm. There was a problem due to contact such as scratches on the surface of the substrate due to the entry of scratches. Further, when this substrate is a substrate for an active matrix LCD, and a semiconductor element is formed on the surface of the substrate, the static electricity generated by the contact between the substrate and the diaphragm causes destruction or change in characteristics of the semiconductor element formed inside the substrate. Had a problem.

On the other hand, another crimping device is disclosed in Japanese Patent Laid-Open No. 62-2.
There is one disclosed in Japanese Patent No. 31928, in which, in a manufacturing process in which upper and lower electrode substrates constituting a liquid crystal display device are superposed and pressure-bonded, a sealing material is applied or printed outside the sealing material pattern so as to surround the pattern. The pressure between the doubled seal patterns is reduced to pressurize the upper and lower substrates, but this method requires double formation of the seal patterns. However, there is a problem in that the number of extra steps such as the cutting of an extra substrate of the above increases. Further, it was very difficult to connect the superposed substrates to the vacuum pump.

The present invention has been made in order to solve the above-mentioned problems. It is possible to uniformly press-press the substrate surface in a non-contact manner, reduce the occurrence of defects, and reduce the manufacturing process of the liquid crystal display device. An easy and simple glass substrate crimping device is provided.

[0008]

A glass substrate crimping apparatus according to the present invention is provided in a part of a hollow member by sandwiching a peripheral portion of the substrate polymer with a hollow member from above and below the substrate polymer via vacuum packing. From the exhaust port, the hollow member, the vacuum packing, and the substrate polymer are evacuated to a closed space formed in the peripheral portion of the substrate polymer to lower the atmospheric pressure inside the substrate polymer, The substrate polymer is pressure-bonded by the pressure difference between the atmospheric pressure and the atmospheric pressure inside the substrate polymer.

[0009]

In the present invention, since the portion of the substrate polymer that is in direct contact with the surface of the substrate is only the portion that is in contact with the vacuum packing in the peripheral portion of the substrate, the substrate can be treated like other diaphragm-type crimping devices. The substrate polymer can be uniformly pressure-bonded without directly contacting the entire surface with the pressure part of the pressure-bonding device. Further, since the atmospheric pressure inside the substrate polymer is lowered by using a hollow member having an exhaust port, the substrate polymer is pressure-bonded by the pressure difference between the atmospheric pressure outside the substrate polymer and the atmospheric pressure inside the substrate polymer, The process can be simplified and vacuum exhaust can be easily performed regardless of the pattern of the sealing material.

[0010]

【Example】

Example 1. Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a sectional structure of a pressure bonding apparatus used in a method for manufacturing a liquid crystal display element according to an embodiment of the present invention, and FIG. 2 shows a schematic plan view of the pressure bonding apparatus. Note that FIG. 1 is a cross section taken along the line AA of FIG. In these figures, reference numerals 5 and 6 are upper and lower hollow members constituting a main part of the crimping device, which are attached to the peripheral portion of the substrate polymer. Upper side 5 and lower side 6 of the hollow member
Are superposed on each other via an O-ring 7. further,
Inside the hollow member, a substrate polymer composed of a pair of glass substrates 1 and 2 having an electrode pattern, a spacer 3 and a sealing material 4 is closely supported from above and below via an O-ring 8. Further, an exhaust port 9 is provided in a part of the hollow member, which is connected to a vacuum pump.

Next, the operation will be described. In the electrode substrates 1 and 2 to be pressure-bonded by this device, after the liquid crystal orientation treatment is performed on the electrode substrate surface in advance, the spacers 3 are scattered on the entire surface of one electrode substrate and the outer periphery of the other electrode substrate is sealed. The material 4 is formed by printing or coating, and the respective substrates are arranged so as to face each other, and are superposed with high precision with reference to the alignment marks by an overlaying device equipped with an appropriate optical system to form a substrate polymer. To be done.

As shown in FIG. 1, the substrate polymers superposed with high precision as described above are sandwiched from above and below by a pair of upper and lower hollow members 5 and 6 with an O-ring 8 sandwiched therebetween, and they are closely fixed. The hollow members of are also faced to each other with the O-ring 7 interposed therebetween. At this time, a closed space surrounded by the substrate polymer, the upper and lower hollow members 5, 6, and the O-rings 7, 8 is formed, and this space is provided between the substrate polymer gap through the liquid crystal injection port 10 of the substrate polymer sealant. It becomes the same closed space as the space, and the inside of the substrate polymer is completely shielded from the outside atmosphere.

Next, when the air pressure inside the closed space is reduced by using a vacuum pump or the like through the exhaust port 9 provided in the hollow member, the air pressure inside the substrate polymer is also reduced accordingly. , The pressure is applied by pressure due to the pressure difference from the atmospheric pressure outside the substrate polymer.

[0014]

As described above, according to the present invention, the peripheral portion of the substrate polymer is sandwiched by the hollow members from above and below the substrate polymer through the vacuum packing, and the exhaust port is provided in a part of the hollow member. The hollow space, the vacuum packing, and the substrate polymer are evacuated from a closed space formed around the substrate polymer to lower the air pressure inside the substrate polymer, and the air pressure outside the substrate polymer and the substrate. Since the substrate polymer is pressure-bonded by the pressure difference from the atmospheric pressure inside the polymer, uniform pressure is applied to the substrate surface, and the gap amount between the upper and lower electrode substrates can be uniformly controlled. In addition, since the portion that directly contacts the substrate surface is only the peripheral portion of the substrate, contamination of the substrate surface,
Eliminates scratches on the substrate surface due to foreign matter entering between the substrate surface and the crimping section, and damage such as destruction of semiconductor elements formed inside the substrate and characteristic changes due to static electricity generated by contact between the substrate and diaphragm There is an effect that can be. Further, there is an effect that the process can be simplified and the vacuum can be easily evacuated regardless of the pattern of the sealing material.

[Brief description of drawings]

FIG. 1 is a schematic sectional view showing a first embodiment of the present invention.

FIG. 2 is a schematic plan view showing the first embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view showing a conventional glass substrate pressure bonding device.

[Explanation of symbols]

 1 Upper Electrode Substrate 2 Lower Electrode Substrate 4 Sealing Material 5 Hollow Member 6 Hollow Member 8 O Ring 9 Exhaust Port

Claims (1)

Claims: What is claimed is: 1. A substrate polymer which constitutes a liquid crystal display element, and which has a pair of upper and lower electrode substrates each having an electrode pattern on the surface thereof, which are superposed with a coated or printed sealing material interposed therebetween. In a glass substrate crimping device for crimping, a hollow member sandwiching a peripheral portion of the substrate polymer from above and below the substrate polymer through a vacuum packing and a part of the hollow member, the hollow member and the vacuum packing. An exhaust port for exhausting a closed space formed around the substrate polymer by the substrate polymer and the substrate polymer, the atmospheric pressure inside the substrate polymer is lowered through the exhaust port, and the atmospheric pressure outside the substrate polymer and the substrate A glass substrate pressure bonding apparatus, wherein a substrate polymer is pressure bonded by a pressure difference from the atmospheric pressure inside the polymer.