JPH05345296A - Board sectioning device for printed wiring board - Google Patents

Abstract

PURPOSE:To facilitate maintenance by way of reducing noise and chips by changing a mechanism of cutting an adhesive tape fixing the overlapped boards for printed wiring boards, in a board sectioning method after drilling the boards. CONSTITUTION:Conveyor belts 5 to convey a stack 1, stoppers 10 to position the stack 1 on the conveyor belts 5 and board pressers 3 having an elevation function to raise and lower the stack 1 are provided. Additionally, this device is constituted of pressing cylinders 4 to elevate the board pressers 3, substrate fixing parts 2 to fix the stack 1 by way of sandwiching the stack 1 between the board pressers 3, cutters 7 to cut adhesive tapes 6, cylinders 8 for cutter movement to move the cutters 7 along the side surface of a bottom plate of the stack 1 and cylinders 9 for cutter rotation to rotate the cutters 7 by 180 degrees.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board in which printed wiring boards stacked in a printed wiring board manufacturing process are fixed with an adhesive tape, and after completion of drilling, the adhesive tape is cut to disassemble the printed wiring board. Substrate disassembling machine.

[0002]

2. Description of the Related Art A conventional board dismantling machine for printed wiring boards is shown in FIG.
As shown in the cross-sectional view of FIG. 1, a conveyor belt 5 for horizontally conveying the stack 1, a substrate fixing portion 2 for sandwiching and fixing the conveyed stack 1 and a substrate retainer 3 that is raised and lowered by a retainer cylinder 4, and an upper plate 21, printed wiring board 20, lower plate 22
A cutting end mill 11 for cutting the adhesive tape 6 to which is adhered, a spindle 13 arranged below the cutting end mill 11 for rotating the cutting end mill 11, and a spindle moving cylinder for pressing the spindle 13 against the lower plate 22. 14 and a dust collecting hood 12 that covers the cutting end mill 11 and collects cutting chips, and the disassembling method of cutting the adhesive tape 6 with the cutting end mill 11 is employed.

[0003]

The conventional dismantling machine described above has the following drawbacks.

(1) When cutting the adhesive tape, there is a problem that the cutting noise generated between the lower plate and the end mill for cutting is large, the motivation of the worker for work is lowered, and the working environment is deteriorated.

(2) Among the chips generated from the lower plate due to cutting, the chips that cannot be collected completely adhere to the device, the printed wiring board, and the lower plate, causing early deterioration of device parts, temporary stop of the device, It causes troubles such as scratches and dents on the printed wiring board.

(3) The life of the cutting end mill is short and the running cost is high.

(4) It is difficult to adjust the angle of the end mill for cutting, there is a problem that the adhesive tape cannot be cut and the apparatus is temporarily stopped or the printed wiring board is cut.

[0008]

A printed wiring board substrate dismantling machine according to the present invention sandwiches a printed wiring board having an arbitrary number of layers for drilling processing between an upper plate and a lower plate and fixes end faces with an adhesive tape. Conveyor belt that conveys the stack consisting of
It has a stopper for positioning the conveyed stack, a substrate retainer and a substrate fixing portion that clamps and fixes the positioned stack, and a cutter that moves along the side surface of the lower plate of the stack and cuts the adhesive tape. There is.

The present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a sectional view thereof. The present invention uses the adhesive tape 6 to form the upper plate 21, the lower plate 22, and the plurality of printed wiring boards 20.
The stack 1 with the fixed stack 1, the transport belt 5 that transports the stack 1, the stopper 10 that positions the transported stack 1 on the transport belt 5, and the stack 1 that is positioned on the transport belt 5 is sandwiched and fixed. Substrate fixing part 2 and substrate retainer 3 and cutter 7 for cutting adhesive tape 6
And a cutter moving cylinder 8 for moving the cutter 7 along the conveyor belt 5, and a cutter rotating cylinder 9 for pressing the cutter 7 against the lower plate 22.

Next, the operation of the substrate disassembling machine of the present invention will be described. The stack 1 is carried in by the conveyor belt 5, and the positioning is performed by the stopper 10. After the stack 1 is conveyed and positioned, the pressing cylinder 4 shown in FIGS. 1 and 2 is driven to raise the substrate pressing member 3, and the stack 1 is sandwiched and fixed by the substrate fixing portion 2 and the substrate pressing member 3. Next, the cutter rotating cylinder 9 is driven to rotate the cutter 7 to rotate the adhesive tape 6
Press on one end of. Next, the adhesive tape 6 is cut by sliding the cutter 7 along the end surface of the lower plate 22 by the width of the adhesive tape by the cutter moving cylinder 8. After cutting, the cutter 7 rotates 180 ° and separates from the lower plate 22.

By simultaneously performing this operation at a plurality of places to which the adhesive tape 6 is attached, the lower plate 22 is separated from the printed wiring board 20 and the upper plate 21. Next, by releasing the drive of the presser cylinder 4, the substrate presser 3 is lowered and the stack 1 is positioned on the transport belt 5. The conveyor belt 5 is driven again, the stack 1 after disassembly is discharged, and the stack 1 that has not been disassembled is carried in and positioned, whereby a series of operations is completed.

[0012]

As described above, the present invention has the following effects.

(1) Since the noise during the disassembling work is small, the work environment can be improved without deteriorating the motivation of the worker for the work.

(2) Since almost no cutting chips are generated, the service life of the device parts is extended, and defects such as temporary stoppage of the device, scratches on printed wiring boards, and dents are reduced.

(3) The cutter has a longer life and a lower running cost than the conventional end mill for cutting.

(4) Even if the cutter is erroneously adjusted, only the lower plate is cut and the printed wiring board is not cut. Therefore, the cutter can be easily adjusted and the defective printed wiring board can be reduced.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a cross-sectional view of FIG.

FIG. 3 is a cross-sectional view showing a conventional dismantling machine.

[Explanation of symbols]

 1 stack 2 substrate fixing part 3 substrate retainer 4 retainer cylinder 5 conveyor belt 6 adhesive tape 7 cutter 8 cutter moving cylinder 9 cutter rotating cylinder 10 stopper 11 cutting end mill 12 dust collecting hood 13 spindle 14 spindle moving cylinder 20 printed wiring Plate 21 Upper plate 22 Lower plate

Claims (1)

[Claims] 1. A conveyor belt for horizontally conveying a stack formed by sandwiching a printed wiring board, which is stacked in an arbitrary number for punching, with an upper plate and a lower plate, and fixing an end face portion with an adhesive tape. A stopper that positions the stack,
A substrate disassembling machine for a printed wiring board, comprising: a substrate retainer and a substrate fixing portion for sandwiching and fixing the positioned stack, and a cutter that moves along a side surface of a lower plate of the stack and cuts an adhesive tape.