JPH0534319B2 - - Google Patents

Info

Publication number
JPH0534319B2
JPH0534319B2 JP62296006A JP29600687A JPH0534319B2 JP H0534319 B2 JPH0534319 B2 JP H0534319B2 JP 62296006 A JP62296006 A JP 62296006A JP 29600687 A JP29600687 A JP 29600687A JP H0534319 B2 JPH0534319 B2 JP H0534319B2
Authority
JP
Japan
Prior art keywords
diamond
film
substrate
nucleation
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62296006A
Other languages
Japanese (ja)
Other versions
JPH01138198A (en
Inventor
Kazutaka Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP62296006A priority Critical patent/JPH01138198A/en
Publication of JPH01138198A publication Critical patent/JPH01138198A/en
Publication of JPH0534319B2 publication Critical patent/JPH0534319B2/ja
Granted legal-status Critical Current

Links

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明はダイヤモンド膜の製造方法に関し、特
にダイヤモンド結晶の高速緻密化によつてダイヤ
モンドを高速に製膜する方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a diamond film, and more particularly to a method for rapidly forming a diamond film by rapidly densifying diamond crystals.

[従来の技術とその問題点] ダイヤモンド結晶の核発生速度は、通常のシリ
コン、モリブデン等の基板上では、非常に遅いた
め、通常は基板をダイヤモンド粒子で荒らすこと
によつて、核発生密度を高め、膜状ダイヤモンド
を得ている。従つて、配線あるいは半導体回路が
組み込まれた基板は、使用できないという欠点を
有していた。
[Conventional technology and its problems] The nucleation rate of diamond crystals is extremely slow on a substrate made of ordinary silicon, molybdenum, etc., so the nucleation density is usually reduced by roughening the substrate with diamond particles. Higher and membranous diamonds are obtained. Therefore, a board on which wiring or semiconductor circuits are incorporated has the disadvantage that it cannot be used.

また、基板表面をプラズマないしイオンで衝撃
を与えることによつてダイヤモンドの核発生密度
を高めるという方法もあるが、この方法では、基
板のプラズマ損傷等の問題がある。
Another method is to increase the diamond nucleation density by bombarding the substrate surface with plasma or ions, but this method has problems such as plasma damage to the substrate.

本発明の目的は、このような従来の欠点を除去
せしめ、ダイヤモンド結晶を高速で緻密化するこ
とができるダイヤモンド膜の製造方法を提供する
ことにある。
An object of the present invention is to provide a method for manufacturing a diamond film that can eliminate these conventional drawbacks and densify diamond crystals at high speed.

[問題点を解決するための手段] 本発明は、平均粒径が0.1μm以下のダイヤモン
ド微結晶を含有するカーボン膜を基板上に予備製
膜した後、ダイヤモンドの製膜を行うことを特徴
とするダイヤモンド膜の製造方法である。
[Means for solving the problem] The present invention is characterized in that a carbon film containing diamond microcrystals with an average particle size of 0.1 μm or less is preliminarily formed on a substrate, and then a diamond film is formed. This is a method for manufacturing a diamond film.

ダイヤモンド微結晶の大きさは、緻密化を考慮
すると小さい程良く、実用上は0.1μm以下である
ことが好ましい。
The smaller the size of the diamond microcrystal, the better in consideration of densification, and in practice it is preferably 0.1 μm or less.

[作用] 欠陥のない基板上では、ダイヤモンド結晶の核
発生位置が少ないので、核発生密度も小さくな
る。そこで本発明では、基板の核発生位置に関係
なく析出できるカーボン膜を析出させ、核発生位
置をこのカーボン膜とすることによつて、ダイヤ
モンド微結晶をカーボン膜析出と同時に大量に核
発生させた後に、良質のダイヤモンド結晶を製膜
する。
[Operation] On a defect-free substrate, the number of diamond crystal nucleation positions is small, so the nucleation density is also low. Therefore, in the present invention, by depositing a carbon film that can be deposited regardless of the nucleation position on the substrate and by setting the nucleation position to this carbon film, a large amount of diamond microcrystals can be nucleated at the same time as the carbon film is deposited. Afterwards, a film of high quality diamond crystal is formed.

上記方法により、ダイヤモンドを高速に製膜で
きる。
By the above method, diamond can be formed into a film at high speed.

[実施例] 次に本発明の一実施例について説明するが、本
発明の方法はこれに限定されるものではない。
[Example] Next, an example of the present invention will be described, but the method of the present invention is not limited thereto.

約2000℃以上に加熱したフイラメントにメタン
および水素の混合ガスを衝突させ、フイラメント
直下の加熱された無欠陥のシリコン基板上にダイ
ヤモンドを析出させた。メタンの体積率が高いほ
どダイヤモンドの結晶性が悪化することが知られ
ているので、予備製膜条件としてメタン濃度を
0.5%から5%と変化させて10分間成長させ、そ
の後メタン濃度を0.5%として、良質なダイヤモ
ンド結晶を成長させた。
A mixed gas of methane and hydrogen was bombarded with a filament heated to over 2000 degrees Celsius, and diamond was deposited on the heated defect-free silicon substrate directly below the filament. It is known that the higher the volume fraction of methane, the worse the crystallinity of diamond.
The methane concentration was varied from 0.5% to 5% and grown for 10 minutes, and then the methane concentration was increased to 0.5% to grow high-quality diamond crystals.

その結果、予備製膜をしない場合にはほとんど
ダイヤモンドの核発生は観察されなかつた。一
方、予備製膜を行つた場合、メタン濃度が1%未
満では予備製膜を行わない時と同じ程度の核発生
数であつたが、1%以上では1時間以内にダイヤ
モンド結晶が緻密化し、膜状ダイヤモンドとなつ
た。
As a result, almost no diamond nucleation was observed when no preliminary film formation was performed. On the other hand, when preliminary film formation was performed, when the methane concentration was less than 1%, the number of nuclei generated was about the same as when no preliminary film formation was performed, but when the methane concentration was over 1%, the diamond crystals became dense within 1 hour. It became a membrane diamond.

また、メタン濃度を1%以上とした予備製膜に
おいては、平均粒径0.1μm以下のダイヤモンド微
結晶を含有するカーボン膜が形成されていること
が確認された。
In addition, in preliminary film formation at a methane concentration of 1% or more, it was confirmed that a carbon film containing diamond microcrystals with an average particle size of 0.1 μm or less was formed.

[発明の効果] 以上説明したように、本発明によれば基板の表
面状態に依存せずにダイヤモンド膜を高速に製膜
できるので、配線を施された基板、半導体回路が
組み込まれた基板等の上に直接ダイヤモンド膜を
高速に製膜することが可能である。従つてダイヤ
モンドの高熱伝導性、高電気絶縁性等を従来にな
く種々の基板に生かすことができ、その実用的価
値は極めて大きい。
[Effects of the Invention] As explained above, according to the present invention, a diamond film can be formed at high speed without depending on the surface condition of the substrate, so it is possible to form a diamond film at high speed without depending on the surface condition of the substrate. It is possible to form a diamond film directly on the diamond film at high speed. Therefore, diamond's high thermal conductivity, high electrical insulation properties, etc. can be utilized in a variety of substrates like never before, and its practical value is extremely great.

Claims (1)

【特許請求の範囲】[Claims] 1 平均粒径が0.1μm以下のダイヤモンド微結晶
を含有するカーボン膜を基板上に予備製膜した
後、ダイヤモンドの製膜を行うことを特徴とする
ダイヤモンド膜の製造方法。
1. A method for producing a diamond film, which comprises preliminarily forming a carbon film containing diamond microcrystals with an average grain size of 0.1 μm or less on a substrate, and then forming a diamond film.
JP62296006A 1987-11-26 1987-11-26 Production of diamond film Granted JPH01138198A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62296006A JPH01138198A (en) 1987-11-26 1987-11-26 Production of diamond film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62296006A JPH01138198A (en) 1987-11-26 1987-11-26 Production of diamond film

Publications (2)

Publication Number Publication Date
JPH01138198A JPH01138198A (en) 1989-05-31
JPH0534319B2 true JPH0534319B2 (en) 1993-05-21

Family

ID=17827912

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62296006A Granted JPH01138198A (en) 1987-11-26 1987-11-26 Production of diamond film

Country Status (1)

Country Link
JP (1) JPH01138198A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04219396A (en) * 1988-07-02 1992-08-10 Sumitomo Metal Mining Co Ltd Formation of diamond film
WO1994016125A1 (en) * 1993-01-14 1994-07-21 Sumitomo Electric Industries, Ltd. Process for vapor-phase diamond synthesis
EP0844319A4 (en) * 1996-06-12 2001-09-05 Matsushita Electric Ind Co Ltd Diamond film and process for preparing the same
JP4009090B2 (en) * 2001-11-08 2007-11-14 株式会社神戸製鋼所 Method for producing diamond-coated non-diamond carbon member
JP6772995B2 (en) * 2017-09-25 2020-10-21 株式会社Sumco Manufacturing method of SOI wafer and SOI wafer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61106494A (en) * 1984-10-29 1986-05-24 Kyocera Corp Member coated with diamond and its production
JPS61146793A (en) * 1984-12-21 1986-07-04 Toshiba Corp Substrate
JPS62256795A (en) * 1986-04-30 1987-11-09 Kyocera Corp Production of diamond film

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61106494A (en) * 1984-10-29 1986-05-24 Kyocera Corp Member coated with diamond and its production
JPS61146793A (en) * 1984-12-21 1986-07-04 Toshiba Corp Substrate
JPS62256795A (en) * 1986-04-30 1987-11-09 Kyocera Corp Production of diamond film

Also Published As

Publication number Publication date
JPH01138198A (en) 1989-05-31

Similar Documents

Publication Publication Date Title
JPS5983997A (en) Formation of hetero structure containing epitaxial multi-component material
US3341361A (en) Process for providing a silicon sheet
JPH0864527A (en) Composite construction for electronic part
JPH0534319B2 (en)
JPH08310900A (en) Thin-film single crystal of nitride and its production
JPH0658891B2 (en) Thin film single crystal diamond substrate
Claassen et al. The Nucleation of CVD Silicon on SiO2 and Si3 N 4 Substrates: II. The System
JP3194547B2 (en) Method for manufacturing polycrystalline silicon layer
JPH0370123A (en) Formation of crystalline semiconductor film
JP2814503B2 (en) Method for producing single crystal diamond film composite
JPH01132116A (en) Crystal product, preparation thereof, and semiconductor device prepared thereby
JP2701809B2 (en) Silicon single crystal substrate
CN114717654B (en) Method for controlling grain boundary angle of two-dimensional material and application thereof
JPH107492A (en) Formation of single crystal diamond film
JPH038798A (en) Production of polycrystal silicon film
CN1045815A (en) The selective vapor growth of diamond film
JPH02202018A (en) Manufacture of polycrystalline silicon thin film
JPH0574720A (en) Manufacture of semiconductor particulate dispersed film
JPH0513337A (en) Manufacture of semiconductor film
JPH01256130A (en) Semiconductor substrate
JPH02199098A (en) Production of single crystal diamond
JPS58184740A (en) Formation of single crystal silicon film
JPS59127841A (en) Manufacture of semiconductor device
JPH0195513A (en) Manufacture of semiconductor crystal film
JPH03197382A (en) Crystal growth