JPH05331675A - Laminated jig for multilayered printed circuit board - Google Patents

Abstract

PURPOSE:To provide the lamination jig for a multilayered printed circuit board to which prepregs are hardly stickable and which has good pressing and supporting characteristics and excellent durability. CONSTITUTION:This lamination jig 10 to be used for holding the laminated material in the case of production of the multilayered printed circuit board by laminating the materials for the multilayered printed circuit board, such as copper foil or copper clad laminated plate for an outside layer, prepreg and copper clad laminated plate for an inside layer, in proper order and heating the laminate under pressurization is the lamination jig for the multilayered printed circuit board constituted by forming a composite plating film 14 composed of a metal and fluorine compd. formed by uniformly dispersing fluorine compds. into a metallic matrix on the surface of the lamination jig plate 11 on at least the side facing the laminated material mentioned above.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a multilayer printed circuit board material such as a copper foil or a copper clad laminate for outer layer, a prepreg, and a copper clad laminate for inner layer which are laminated in an appropriate order and heated under pressure. The present invention relates to a laminating jig used for sandwiching the above-mentioned laminated material when manufacturing a multilayer printed circuit board.

[0002]

2. Description of the Related Art Conventionally, after laminating a copper foil or a copper clad laminate for outer layers, a prepreg, a copper clad laminate for inner layers, etc. in a predetermined order between laminating jigs,
A multilayer printed circuit board is manufactured by pressurizing and heating.

FIG. 3 shows an example of the production of such a multilayer printed circuit board. In the figure, 1 is a copper foil or a copper clad laminate for outer layers, 2 is a copper clad laminate for inner layers, 3 is a prepreg, 4 Is a laminating jig, 5 is a release film, 6 is a cushion sheet, 7
Is a hot press plate.

In this case, a metal plate such as a mirror-finished stainless steel plate is mainly used as the stacking jig.

However, in this type of conventional laminating jig, the prepreg protrudes from between the laminated plates during pressurizing and heating, and the protruding prepreg adheres to the laminating jig to form a multilayer print. There is a problem of deteriorating the peeling property when peeling from the substrate, and this point is that the prepreg that sticks out often sticks even when the stacking jig is arranged with a release film interposed as shown in the drawing. It is still not enough to make the surface of a metal plate such as a stainless steel plate a mirror surface. Furthermore, the adhesion of the protruding prepreg to the laminating jig is
Shorten the life of the stacking jig.

The present invention has been made in order to improve the above situation, and provides a multilayer jig for a multilayer printed circuit board, in which the prepreg is less likely to adhere and which has excellent durability.

[0007]

In order to achieve the above object, the present invention provides a copper foil or a copper clad laminate for outer layer, a prepreg,
In a laminating jig used for sandwiching the laminated material when laminating materials for multilayer printed boards such as an inner layer copper clad laminate in an appropriate order, and manufacturing a multilayer printed board by pressurizing and heating the material, A multi-layer printed circuit board comprising a metal-fluorine compound composite plating film in which fine particles of a fluorine compound are uniformly dispersed in a metal matrix, on at least the surface of the laminate jig plate facing the above-mentioned laminate material. To provide a laminating jig for use.

[0008]

According to the laminating jig of the present invention, since the composite plating film in which the fine particles of the fluorine compound are uniformly dispersed is formed on at least the surface of the laminating jig plate facing the laminating material, good peeling can be achieved. The composite plating film has a good supporting property because the matrix is a metal, and the prepreg that has a good adhesive property is hard to adhere to the protruding prepreg, and the composite plating film is evenly laminated without causing distortion when pressing the laminated material. The material can be pressed, and a multilayer printed circuit board having the same quality as when a conventional laminating jig is used can be obtained.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will now be described with reference to FIGS.
More detailed description will be made with reference to FIG.
Means that the fluorine compound fine particles 13 are uniformly dispersed in the metal matrix 12 over the entire surface of the laminating jig plate 11,
The metal-fluorine compound composite plating film 14 is formed on the surface of which some fine particles 13a are exposed.

Here, as the laminated jig plate 11,
Metallic materials such as steel, stainless steel, aluminum can be used.

As the matrix 12 of the composite plating film 14, nickel-based alloys such as nickel, nickel-phosphorus alloys, nickel-boron alloys and nickel-iron alloys are preferably used, but the matrix 12 is not limited thereto. Absent.

Further, as the fluorine compound particles 13 dispersed in the matrix 12, fluorine resin particles such as polytetrafluoroethylene or fluorinated graphite particles can be used. The average particle size of the fine particles 13 is appropriately selected, but is 0.05 to 30 μm, and particularly 0.1 to 30 μm.
It is preferably 10 μm. Further, the dispersion amount of the fine particles 13 in the matrix 12 is preferably 5 to 45% by volume, and particularly preferably 15 to 35% by volume, and the dispersion amount is 5%.
If the amount is less than the above range, the prepreg adhesion inhibiting effect may not be sufficiently exerted, and if it exceeds 45%, the strength of the composite plating film may be impaired and the composite plating film may become brittle when pressed and the film may fall off.

Such a composite plating film 14 can be formed by a known composite plating method. In this case, the composite plating may be an electroplating method or an electroless plating method.

The laminating jig of the present invention is not limited to the one shown in the figure, and for example, the composite plating film may be formed only on one surface of the plate facing the laminated material. Further, if necessary, the surface of the composite plating film may be polished after the composite plating.

The stacking jig of the present invention thus obtained can be used in the same manner as a known stacking jig.

Next, the effects of the laminating jig of the present invention will be concretely shown by experimental examples.

[Experimental Example] A steel plate was pretreated by a conventional method, and then plated under the following conditions using a plating solution having the following composition, and nickel was used as a matrix on the entire surface of the steel plate. A 10 μm composite plating film having 0.2 μm polytetrafluoroethylene fine particles uniformly dispersed therein was formed.

Composition / Conditions 1 (electroplating) Nickel sulfamate 400 g / l Nickel chloride 50 g / l Boric acid 40 g / l Brightening agent 1 ml / l PTFE particles 50 g / l Dispersion aid 10 ml / l Cathode current density 2 A / dm ² Temperature 40 ° C PTFE particles in the precipitate (coating 1) about 35% by volume

Composition / Condition 2 (electroplating) nickel sulfate 300 g / l nickel chloride 50 g / l boric acid 40 g / l brightener 1 ml / l PTFE particles 50 g / l dispersion aid 10 ml / l cathode current density 2 A / dm ² temperature 50 ° C Amount of PTFE particles in the precipitate (Film 2) About 20% by volume

Composition / Condition 3 (electroless plating) Nickel sulfate (as nickel) 4.5 g / l Sodium hypophosphite 20 g / l Complexing agent 35 g / l PTFE particles 5 g / l Dispersion aid Proper amount pH 4. 5 Temperature 90 ° C. Amount of PTFE particles in the precipitate (coating 3) about 20% by volume It should be noted that this coating 3 is a nickel-phosphorus alloy and contains about 8% by weight of phosphorus.

Next, a glass cloth-epoxy resin sheet was sandwiched between two steel plates (upper jig and lower jig) on which this composite plating film was formed, and the ones fixed with eyeball clips at 170 ° C. Heated for hours.

Then, a string was applied to the ends of both the jigs and pulled in the 90 ° direction, and the force at the time of peeling off one of the jigs was measured by a spring meter (measurement 1). The results are shown in Table 1.

Further, the force required to peel off the remaining other jig was measured in the same manner (measurement 2). The results are also shown in Table 1.

[0024]

[Table 1]

From the above results, it is recognized that the jig of the present invention has an excellent peeling force.

[0026]

INDUSTRIAL APPLICABILITY The laminating jig for a multilayer printed circuit board of the present invention is such that the prepreg is difficult to adhere to it, and it has good pressure supportability and excellent durability.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is a partially omitted enlarged cross-sectional view of the same example.

FIG. 3 is a side view illustrating an example of manufacturing a multilayer printed circuit board.

[Explanation of symbols]

 1 Copper foil or copper clad laminate for outer layer 2 Copper clad laminate for inner layer 3 Prepreg 4 Laminating jig 7 Heat press plate 10 Laminating jig 11 Laminating jig plate 12 Metal matrix 13 Fluorine compound particles 14 Composite plating film

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification number Reference number within the agency FI technical display location // B29K 105: 08 (72) Inventor Jiro Okuda 1 1-2, Torigoe, Taito-ku, Tokyo Uemura Industrial branch company Tokyo branch office

Claims (1)

[Claims] 1. A multilayer printed board is manufactured by laminating materials for a multilayer printed board such as a copper foil or a copper clad laminate for an outer layer, a prepreg and a copper clad laminate for an inner layer in an appropriate order and pressurizing and heating them. In this case, in a laminating jig used for sandwiching the above-mentioned laminated material, metal-fluorine in which fluorine compound fine particles are uniformly dispersed in a metal matrix on at least the surface of the laminated jig plate facing the above-mentioned laminated material. A multilayer jig for a multilayer printed circuit board, which is formed by forming a compound composite plating film.