JPH05330068A - Liquid jet recording head and production thereof - Google Patents

Abstract

PURPOSE:To obtain a liquid jet recording head having preciseness and high resolving power and enabling the high density mounting of nozzles by providing a substrate provided with recording liquid droplet emitting energy generating elements, a photosensitive resin layer having ink passages formed thereto and composed of a heat-crosslinkable positive resist material and the top plate laminated on the photosensitive resin layer. CONSTITUTION:As a substrate 1, one functioning as a part of a member constituting liquid passages or the support of a photosensitive material layer can be used. A desired number of liquid emitting energy generating elements 2 such as electrothermal conversion elements or piezoelectric elements are arranged on the substrate 1. Next, a heat-crosslinkable positive resist layer 3 is formed on the substrate 1 and patterning exposure is applied to the layer 3 using the electron beam from an ionizing radiation irradiation part 4 in order to form ink liquid passages. A top plate 7 is bonded to the layer 3 subjected to patterning exposure and a photosensitive resin material is subjected to cutting processing to form ink supply orifices 9. Next, the recording head substrate is cut to elute the resist forming ink liquid passage parts to form not only ink passages 10 but also ink emitting orifices 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid jet recording head and a method of manufacturing the same, and more particularly to a liquid jet recording head for generating recording droplets and a method of manufacturing the same.

[0002]

2. Description of the Related Art A liquid jet recording head applied to an ink jet recording system (liquid jet recording system) generally produces a fine ink discharge port, a liquid flow path and a liquid discharge energy generated in a part of the liquid flow path. And a section. Conventionally, as a method of manufacturing such a liquid jet recording head, for example, a plate of glass or metal was used, and after forming fine grooves in the plate by a processing means such as cutting or etching, the grooves were formed. A method is known in which a plate is joined to another suitable plate to form a liquid flow path.

However, in the liquid jet recording head manufactured by such a conventional method, the roughness of the inner wall surface of the liquid flow path to be cut is too large, or the liquid flow path is distorted due to the difference in etching rate. However, there is a problem in that it is difficult to obtain a liquid flow path having a constant flow path resistance, and variations in the recording characteristics of the manufactured liquid jet recording head are likely to occur. Further, there is a problem in that the plate is likely to be chipped or cracked during cutting, resulting in poor manufacturing yield. In addition, when the etching process is performed, there are many manufacturing steps, and there is a disadvantage that the manufacturing cost is increased. Further, as a problem common to the above-mentioned conventional methods, a grooved plate having a liquid flow path and a driving element such as a piezoelectric element or an electrothermal conversion element for generating ejection energy for ejecting a recording liquid droplet There is also a problem that it is difficult to align these plates when they are attached to the lid plate provided with, and the mass productivity is insufficient.

In addition, the liquid jet recording head normally has a recording liquid (generally an ink liquid which is mainly water and not neutral in many cases, or an ink which is mainly organic solvent) under the environment of use. Liquid etc.) is in constant contact. Therefore, the material of the head that constitutes the liquid jet recording head does not deteriorate in strength under the influence of the recording liquid, and conversely, it is harmful to the recording liquid such that it deteriorates the suitability of the recording liquid. Materials that do not give components are desired, but in the above-mentioned conventional methods, it was not always possible to select materials that meet these purposes due to restrictions such as processing methods.

In order to solve these problems, an ink ejection energy generating element is formed using a photosensitive resin material as described in JP-A-57-208255 and JP-A-57-208256. A method has been considered in which a nozzle including an ink flow path and an orifice portion is formed on a substrate by patterning, and a lid such as a glass plate is bonded onto the nozzle.

At present, it is desired to improve the recording quality and it is necessary to form a large number of nozzles on the substrate with high density. However, in the method of manufacturing a liquid jet recording head using the above-mentioned photosensitive resin, a material having a negative type property (the light irradiation portion is photocured and becomes a side wall of the nozzle when immersed in a developer) is generally used. It is used, and there is a limit to its densification.

The liquid jet recording head needs to be patterned to have an extremely thick film thickness, unlike a resist for manufacturing an IC or LSI, and the patterned resist has high strength, solvent resistance, and heat resistance as a constituent material of a nozzle. It is required to have characteristics such as sex. Particularly, in a negative resist, there is a limit to forming a fine pattern in a thick film due to swelling of the resist during development.

Further, in the above method, the ink flow path is formed by adhering a top plate such as glass coated with an adhesive to the photosensitive resin on which the ink flow path pattern is formed. In some cases, the adhesive may flow into the ink flow path portion, block the flow path, change the shape of the flow path, or the like.

Further, in the above method, the substrate is cut to form the ink ejection port after the top plate is joined, but when the cutting is performed, cutting waste may enter the ink flow path portion, or the cutting portion may be chipped or the like. This may cause a decrease in yield.

[0010]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems and is inexpensive, precise, highly reliable and has a high resolution, and nozzles are mounted at a high density. Another object of the present invention is to provide a liquid jet recording head and a manufacturing method thereof.

Further, according to the present invention, the liquid flow path can be accurately and accurately
It is also an object of the present invention to provide a novel liquid jet recording head having a microfabricated structure with high yield and a method for manufacturing the same.

Still another object of the present invention is to provide a novel liquid jet recording head which has little mutual influence with a recording liquid and is excellent in mechanical strength and chemical resistance, and a manufacturing method thereof.

[0013]

In order to achieve such an object, a liquid jet recording head of the present invention comprises a substrate provided with an ejection energy generating element for ejecting recording liquid droplets,
A photosensitive resin layer made of a thermally crosslinkable positive resist material provided on the substrate and having an ink path formed thereon, and a top plate laminated on the photosensitive resin layer. ..

Further, according to the method of manufacturing a liquid jet recording head of the present invention, 1) a photosensitive resin layer made of a heat-crosslinking positive resist material on a substrate on which ejection energy generating elements for ejecting recording droplets are formed. And 2) heat-curing the photosensitive resin layer and pattern-exposing the ink channel to the thermosetting photosensitive resin layer, and 3) forming a top plate on the photosensitive resin layer. It is characterized by including a step of laminating and 4) a step of eluting the pattern-exposed portion of the photosensitive resin layer.

The thermally crosslinkable positive resist is a functional group capable of being thermally crosslinked with a part of light or ionizing radiation degradable resin, the resist is coated on a substrate, and then the resist is heated by a heating operation. Is cured, and then the resist is exposed to light (ionizing radiation) to form a pattern.

Since this resist is a positive type, it exhibits very good resolution with respect to the formation of the above-mentioned fine punching pattern, and since the resin is hardened by a thermosetting reaction, it is expensive. It has advantages such as physical strength, solvent resistance, and adhesion to a substrate.

In the case of a negative resist, it is natural to optimize the exposure amount in order to obtain a good pattern shape, but the film thickness after development changes depending on the exposure amount, and the nozzle of the designed size is required. To form a coating film thickness,
It is necessary to examine the exposure amount in detail, and an extremely complicated optimization process is required. Further, the negative type resist develops a development residue or scum due to the swelling of the resist, and an ashing operation is required to remove them. In addition, if the residue is not completely removed by this operation, when the residue generates ink ejection energy, it may cause bubble nucleation of bubbles and cause unstable ink ejection.

On the other hand, in the heat-crosslinking positive resist, the film thickness of the unexposed portion after development hardly changes even if the exposure amount is changed.
Since it is only necessary to control the coating film thickness, the ink flow path can be formed extremely easily. Further, there are advantages that a development residue, scum, etc. are not generated, an ashing operation is not required, and the above-mentioned problems due to the development residue do not occur.

As described above, the present invention has an advantage that a fine ink flow path can be formed with a high yield by using the heat-crosslinking positive resist.

Further, in the conventional method for manufacturing a liquid jet recording head, the ink flow path is formed after the ink flow path pattern is formed, and the ink flow path is formed, causing the above-mentioned various problems. The present invention is characterized in that the heat-crosslinking positive resist is subjected to only the exposure operation and then the top plate is attached thereto.

Therefore, it is a great feature that the problem that the adhesive applied to the top plate flows into the ink flow path can be avoided.

Further, in the conventional method for manufacturing a liquid jet recording head, the ink discharge ports are formed by cutting the substrate with a dicing saw or the like after attaching the top plate. For this reason, as described above, there are problems that the ink ejection port is chipped or cutting waste enters the ink flow path. Also, in order to make the cut surface smooth,
Even when a means such as polishing is applied, there is a problem that an abrasive or the like enters the ink flow path and stains the surface of the ink ejection energy generating element.

Against these problems, in the manufacture of the liquid jet recording head according to the present invention, since the thermally crosslinkable positive resist is developed after the cutting step or after the polishing step, cutting scraps or an abrasive is used as the ink. It does not enter the flow path portion, and the substrate is not chipped or the like.

As the heat-crosslinking positive resist, many kinds can be obtained by copolymerizing a photo-degradable polymer compound with a thermosetting functional group as described above. Examples of the photodegradable polymer compound include those having a ketone in the molecular structure, polymer compounds containing SO ₂ molecules in the main chain such as polysulfone, vinyl polymer compounds other than hydrogen atom at the α-position. Examples include polymer compounds in which atoms are bonded.

As the polymer compound having a ketone in its molecular structure, a polymer compound obtained by polymerizing a ketone having a vinyl group such as methyl vinyl ketone, methyl isopropenyl ketone, ethyl vinyl ketone, tert-propenyl ketone and vinyl phenyl ketone. Is mentioned.

As the polymer compound having SO ₂ , polysulfone (UCC: U, manufactured by the reaction of bisphenol A and dichlorodiphenyl sulfone) is used.
DEL POLYSULFONE (registered trademark)), a polyether sulfone synthesized from dichlorodiphenyl sulfone (ICTR: VICTREX (registered trademark)), and a polyolefin sulfone synthesized from an olefin having an unsaturated double bond and SO ₂ ( ME
AD manufactured by Polybden-1-sulfone PBS) and the like. Of course, any other olefin such as styrene, α-methylstyrene, and propylene may be used as the polyolefin sulfone.

Examples of the vinyl-based polymer compound in which an atom other than a hydrogen atom is added to the α-position include methyl acrylate. For example, methyl methacrylate, ethyl methacrylate, propyl (n, iso) methacrylate, butyl (n, iso,
There are numerous types such as tert-) methacrylate. In addition, methacrylamide, methacryl nitrile, etc. can also be used. A photodegradation type positive resist can be produced by polymerizing the monomer having an unsaturated double bond. Further, as the α-position atom, in addition to the above-mentioned methyl group, a cyano group, chlorine, a monomer to which a halogen such as fluorine is added is generally available, and α-cyano (chloro, fluoro) acrylate, α-Cyano (chloro, fluoro) ethyl acrylate and the like can also be used. Furthermore, α-methyl (chloro, cyano, fluoro) styrene, α-methyl (chloro, cyano, fluoro) styrene hydroxy,
It is also possible to use derivatives such as methyl, ethyl, propyl, chloro and fluoro.

The above monomers alone or
A photodegradable polymer compound can be obtained by mixing and polymerizing a plurality of kinds. When the photo-degradable polymer compound is synthesized, the crosslinkable positive resist of the present invention can be synthesized by copolymerizing a monomer having a thermosetting functional group.

The thermosetting monomer having a functional group is a monomer having a functional group such as a hydroxy group, chloro, isocyanate, and epoxy, and examples thereof include hydroxy (meth) acrylate and hydroxyalkyl (eg, methyl, ethyl). , Propyl, etc.) acrylate, hydroxyalkyl methacrylate, acrylic acid chloride, methacrylic acid chloride, glycidyl (meth) acrylate and the like. By copolymerizing these heat-crosslinking functional group-containing monomers with the above-mentioned photodegradable polymer compound, the heat-crosslinking positive resist according to the present invention can be synthesized. Of course, in order to enhance the curing characteristics of these resins, it is also effective to mix or copolymerize a component having an isocyanate group and an amino group in the resin to promote the thermosetting properties of the hydroxyl group and the epoxy group.

The present inventor further studied the above-mentioned heat-crosslinking positive resist as a material for forming a nozzle of a liquid jet recording head. As a monomer to be copolymerized as a heat-crosslinking group, methacrylic acid or methacrylic acid was used. It has been found that glycidyl acid is even more preferred. When a halogen compound such as chlor is used, halogen is eluted in the ink when the head is used for a long period of time, leading to corrosion of the electrodes or heater and disconnection. Further, the system containing isocyanate has problems such as extremely low storage stability of the resist.

Methacrylic acid or glycidyl methacrylate does not have these problems and exhibits extremely good characteristics as a material for forming nozzles of liquid jet recording heads.

Further, regarding the copolymerization ratio of these heat-crosslinkable monomers and the weight average molecular weight of the resist,
The copolymerization ratio is 5 mol% or more, and the weight average molecular weight is 5
It is preferably 0000 or more. In the case of forming a nozzle wall having a large film thickness such as a liquid jet recording head, there has been a big problem that cracks are generated in the film during resist development.

In forming a thick film resist pattern,
The presence of uncrosslinked components in the resin poses a major problem. That is, in the conventionally used negative resist, the uncrosslinked components are dissolved in the developing solution and formed by reducing the thickness of the formed pattern and the coating thickness by 10 to 20%. After the uncrosslinked component is eluted, the pattern is reduced in film thickness and no internal stress is generated. On the other hand, in the heat-crosslinking positive resist, the coating is cured by baking after coating, and the three-dimensional arrangement of each constituent molecule is determined. When this coating film is dipped in a developing solution after the completion of exposure, if non-crosslinked components are present in the unexposed areas, these components are eluted and stress is generated inside the coating film. Stress is
Like a negative resist, it is not relaxed by film loss, and it is assumed that cracks will occur.

The prevention of cracks is to reduce the presence of uncrosslinked components during thermosetting. To solve this problem, the copolymerization ratio of crosslinking components is 5 mol% or more and the weight average molecular weight is 50,000 or more. Have been found to be preferable.

The coating of these heat-crosslinking positive type resists on the substrate is performed by solven-coating the resist as it is or a solution dissolved in a solvent when the resist is a solid, using a spin coater, a bar coater or the like. Is possible.

It is necessary to optimize the temperature and time of thermal crosslinking depending on the resin. Generally, the range of 50 ° C to 300 ° C is suitable. If the temperature is low, a sufficient crosslink density cannot be obtained or it takes time to crosslink, and if the temperature exceeds 300 ° C., thermal decomposition or thermal oxidation of the resist is caused, or when the temperature is returned to room temperature after the heating operation, the substrate In some cases, the resist film may be cracked due to the difference in the coefficient of thermal expansion from the above. Regarding the heating time as well, it is necessary to select the optimum conditions for the resist characteristics, but it is generally about 5 to 120 minutes. Heating at a low temperature may be performed in air, but in order to prevent thermal oxidation or the like, heating may be performed in an atmosphere of an inert gas such as nitrogen or in a vacuum.

Of course, the crosslinking group may be a two-component curing type and cured at room temperature. For example, if component A containing an epoxy group as a crosslinking component in the molecule and component B containing an amino group are mixed and then coated on a substrate, curing at room temperature is possible. The two-component curing type is used to enhance storage stability at room temperature. But,
It is considered desirable to add temperature in order to improve productivity such as shortening of curing time. As for these means, the same means can be applied to a system in which a monomer having a hydroxyl group is copolymerized and a system in which a monomer having an isocyanate group is copolymerized.

The exposure is a commonly used Deep-U.
A Xe-Hg lamp which is a V light source may be used, and far-ultraviolet light obtained by a cold mirror of 290 nm or 250 nm may be used, and any of electron beam, X-ray, excimer laser, etc. may be used. Also, any one of a batch exposure through a mask, step & repeat, and electron beam beam scanning method may be used. However, Dee
Short-wavelength light such as p-UV light or excimer laser is absorbed by the resist film, and in the case of a thick film, light may not be transmitted and uniform exposure may not be possible. For example, if an aromatic ring is present in the molecular structure of the resist, the light absorption of the resist film is particularly large and the light cannot be transmitted. In some cases, it may be necessary to avoid the use of a resist that does not contain an aromatic ring, or to use an exposure source having high transparency such as electron beam or X-ray. Considering the current form of the exposure apparatus, Dee
The p-UV exposure is considered to be the most productive because it is a batch exposure and a large exposure area can be obtained.
Line exposure is most suitable for the present invention because of its high transparency, which allows a wide range of material selection. Strengthening of light source, mask,
It can be applied if the price of the exposure apparatus is reduced.

The outline of the present invention will be described below with reference to the drawings as necessary.

FIGS. 1 to 6 are schematic views showing a basic mode of the present invention. In FIGS. 1 to 6, respectively,
An example of the configuration of a liquid jet recording head and a manufacturing procedure thereof according to the method of the present invention is shown. In this example, a liquid jet recording head having two orifices is shown, but it goes without saying that the same applies to a high density multi-array liquid jet recording head having two or more orifices.

First, in this embodiment, a substrate 1 made of glass, ceramic, plastic, metal or the like as shown in FIG. 1 is used. Note that FIG. 1 is a schematic perspective view of the substrate before forming the photosensitive material.

If the substrate 1 as described above functions as a part of a member constituting a liquid flow path and as a support for a photosensitive material layer described later, its shape, material, etc. are particularly preferable. It can be used without limitation. A desired number of liquid ejection energy generation elements 2 such as electrothermal conversion elements or piezoelectric elements are arranged on the substrate 1 (see FIG. 1).
Then, two were illustrated). Ejection energy for ejecting recording liquid droplets is applied to the ink liquid by the liquid ejection energy generation element 2 as described above, and recording is performed. Incidentally, for example, when an electrothermal conversion element is used as the liquid ejection energy generation element 2, this element heats the recording liquid in the vicinity to generate ejection energy. Also, for example, when a piezoelectric element is used, ejection energy is generated by mechanical vibration of this element.

Note that these elements 2 are connected to control signal input electrodes (not shown) for operating these elements. Further, in general, various functional layers such as a protective layer are provided for the purpose of improving the durability of these ejection energy generating elements 2, but it is of course possible to provide such functional layers in the present invention. ..

Next, as shown in FIG. 2, a thermal crosslinkable positive resist layer 3 is formed on the substrate 1. As a method for forming the heat-crosslinking positive resist layer 3, a solution in which a photosensitive material made of a heat-crosslinking positive resist material is dissolved may be applied by a solvent coating method. You may form on the board | substrate 1 by producing the applied dry film and laminating | stacking it. In this way, the positive resist film is applied, the solvent and the like are removed, and then heat curing is performed under the above conditions.

By such means, as shown in FIG. 3, the heat-crosslinking positive resist layer 3 is irradiated with deep-UV light, electron beam or the like on the ionizing radiation irradiating section 4 which is to be an ink liquid flow path. Pattern exposure is performed. The exposure means may be collective exposure through a photomask, or may be directly drawn by an electron beam or an ion beam. The exposure light source may be any as long as it can be used to pattern the thermal crosslinkable positive resist layer 3 using Deep-UV light, excimer laser, electron beam, X-ray or the like.

Conventionally, after forming a pattern on a negative resist layer, an ashing treatment with oxygen plasma is required to remove development residues and scum generated, but in the heat-crosslinking positive resist material according to the present invention. Does not generate development residues, scum, etc.,
Even if the resist pattern is developed after the cutting process, the characteristics are not deteriorated.

As described above, the thermally crosslinkable positive resist layer 3 which is a photosensitive material having the ink liquid flow path patterned and exposed.
Then, as shown in FIG. 4, the top plate 7 is joined and the photosensitive resin material or the like is cut to form the ink supply port 9. The top plate 7 is integrated with the adhesive layer 5 via the top plate resin layer 6,
Adhesion with the thermally crosslinkable positive resist layer 3 is performed. The adhesive forming the adhesive layer 5 may be an ordinary adhesive, or may be a photosensitive adhesive or a pressure sensitive adhesive. Thermal cross-linking type positive resist materials are generally De
Since it is only exposed to ep-UV light or ionizing radiation, a photosensitive adhesive such as an ultraviolet-sensitive adhesive can be generally used as the adhesive to be applied to the top plate 7, thus improving operability. It has the advantage that it can be done.

In the conventional liquid jet recording head manufacturing method, since the joining operation of the top plate 7 is performed after the ink flow path pattern is formed, there is a problem that the adhesive drips into the ink flow path. There are many. Further, if the coating film thickness of the adhesive layer 5 is reduced in order to prevent the dripping, there is a problem that the top plate 7 is peeled off. Therefore, particularly in the manufacture of a long liquid jet recording head, or in the manufacture of a liquid jet recording head that requires a fine ink flow path, prevention of this sagging and top plate peeling has become a major issue. .

In the present invention, since the ink flow path is formed after the cutting step, it is extremely effective in solving the above problems.
That is, by applying a sufficient amount of adhesive for bonding the top plate 7 and bonding them at a high temperature and a high pressure, the above-mentioned problems do not occur even in the manufacture of a long liquid jet recording head.

Next, as shown in FIG. 5, the recording head substrate is cut. The cutting may be performed by a mechanical method such as a dicing saw or may be performed by optical processing such as a laser. Further, the cut surface 8 may be polished after cutting to improve the accuracy of the distance between the planned ink discharge port and the ink discharge energy generating element. In the present invention, since the ink flow path portion is not developed, cutting wastes, abrasives, etc. do not enter the ink flow path portion as described above, and there is a problem that the substrate 1 etc. is chipped. Absent.

Finally, as shown in FIG. 6, the resist forming the ink flow path portion is eluted to form the ink flow path 10 and at the same time form the ink ejection port 11. Any solvent may be used for the development as long as it dissolves the positive resist. In particular, since the heat-crosslinkable positive resist material is hardened in the unexposed state by heat, even if a developer having a strong dissolving and removing action is used, the resist is not peeled off or the film is not reduced.

[0052]

According to the present invention, since the heat-crosslinking positive resist is used, it is only necessary to control the coating film thickness, and it is possible to form a fine ink flow path extremely easily. Further, there is no problem caused by the development residue.

Further, according to the present invention, it is possible to avoid the problem that the adhesive applied to the top plate flows into the ink flow path.

Furthermore, according to the present invention, since the ink ejection port is not chipped and cutting waste does not enter the ink flow path, the surface of the ink ejection energy generating element is not contaminated.

[0055]

The present invention will be described in more detail with reference to the following examples.

Example 1 A liquid jet recording head having the structure shown in FIG. 6 was produced according to the operation procedure shown in FIGS.

First, an 80:20 (mol) copolymer of methyl methacrylate and methacrylic acid (on a glass substrate 1 on which an electrothermal conversion element (heater made of a material HfB ₂ ) was formed as a discharge energy generating element 2 ( Polyscience) was dissolved in 20% cyclohexanone, and the resulting solution was applied using a # 70 wire bar.
After removing the solvent by heating at 80 ℃ for 1 hour, 200 ℃
And heat cured for 1 hour. The film thickness of the obtained film was 20 μm, and the film was insoluble in any solvent.

This substrate 1 was subjected to D exposure by a contact exposure method through a mask including an ink flow path pattern in an irradiation device using a Xe-Hg lamp (2 kW) manufactured by Ushio Inc.
Irradiation with eep-UV light was performed. A 250 nm cold mirror was used as the mirror, and the exposure time was 10 minutes.

Next, an acrylic negative dry film (Odeal (registered trademark) manufactured by Tokyo Ohka Kogyo Co., Ltd.) was laminated at 100 ° C. on the glass substrate 1 in which the ink supply port 9 was cut, and Canon mask aligner PLA was used. -5
Exposure was performed for 200 seconds using 01FA. The exposure operation is to form a pattern on the upper part of the ink flow path,
It was formed for the purpose of increasing the height of a portion that should be an ink flow path between the ink supply port 9 and the ejection energy generating element 2 to reduce the flow path resistance. After peeling off the base film, it was developed by immersing it in trichloroethane for 150 seconds. The film thickness of the pattern was 50 μm.

On the pattern thus formed, a photosensitive adhesive (ThreeBond 3000: manufactured by ThreeBond Co., Ltd.)
Was applied with a roll coater. The coating film thickness was 10 μm. Next, the top plate 7 was attached to the substrate 1 in vacuum.

Canon-made mask aligner PL on the substrate 1
The entire surface was exposed with A-501. The exposure time was 600 seconds. After this, in order to firmly bond the adhesive, 200 ° C
It was baked at 30 minutes.

Next, the substrate 1 was cut with a dicing saw (manufactured by Tokyo Seimitsu Co., Ltd.) to elute the heat-crosslinking positive resist. Elution was performed by immersing in methyl isobutyl ketone for 30 minutes.

Finally, an ink supply member was adhered to the ink supply port 9 to prepare a liquid jet recording head.

The liquid jet recording head thus manufactured was mounted on a recording apparatus, and recording was performed using an ink composed of pure water / glycerin / direct black 154 (water-soluble black dye) = 65/30/5. However, stable printing was obtained.

Example 2 With respect to 100 parts of benzene,
95 parts of methyl methacrylate, 7.1 parts of glycidyl methacrylate (monomer ratio = 95: 5), and 1 part of N, N′-azobisisobutyronitrile as a polymerization initiator were added, and the mixture was added in nitrogen at 60 ° C. for 2 hours. The resin was synthesized by stirring for a time.
The reaction solution was poured into cyclohexane to recover the resin. The weight average molecular weight of this resin was 100,000. Next, this resin was dissolved in toluene at a concentration of 25 wt%, and 3 parts of triethylenetetramine as a crosslinking agent was added to the solid content.

The resist solution was applied onto the substrate 1 on which the ejection energy generating element 2 was formed in the same manner as in Example 1 to a film thickness of 20 μm and heated at 200 ° C. for 30 minutes to be thermoset.

In the same manner as in Example 1, the resist film was coated with De.
The pattern exposure of the ink flow path 10 was performed by irradiating ep-UV light. The exposure time was 15 minutes.

A glass top plate 7 formed in the same manner as in Example 1 was attached onto the resist film 3 which was subjected to pattern exposure, and the adhesive was cured by light irradiation.

After the substrate 1 was cut in the same manner as in Example 1, it was immersed in methyl isobutyl ketone for 30 minutes to develop a heat-crosslinking positive resist.

In the same manner as in Example 1, when an ink supply member was attached and ink was supplied to perform printing, good printing was obtained.

(Example 3) A cyclohexanone solution of a copolymer of methyl methacrylate and methacrylic acid was placed on a No. 70 wire bar on the substrate 1 on which the discharge energy generating element 2 was formed, in the same manner as in Example 1. Applied.

After baking at 80 ° C. for 30 minutes to remove the solvent, the resin was cured by baking at 200 ° C. for 30 minutes in a nitrogen stream. The thickness of the obtained coating is 25μ
It was m.

The substrate 1 was attached to an electron beam drawing device (ELS-3300 manufactured by Elionix Co., Ltd.) and an ink flow path pattern was drawn. The exposure amount was 70 μC / cm ² .

A glass top plate 7 having a dry film pattern formed thereon and coated with a photosensitive adhesive was adhered to the resist film in the same manner as in Example 1. After baking at 200 ° C. for 30 minutes, the substrate 1 was cut and immersed in methyl isobutyl ketone for 30 minutes to develop the resist.

When an ink supply member was attached and ink was ejected in the same manner as in Example 1, good printing could be obtained.

(Others) The present invention is provided with a means (for example, an electrothermal converter or a laser beam) for generating thermal energy as energy used for ejecting ink, particularly in the ink jet recording system. The present invention provides excellent effects in a recording head and a recording apparatus of the type in which the thermal energy causes a change in ink state. This is because such a system can achieve high density recording and high definition recording.

Regarding its typical structure and principle, see, for example, US Pat. Nos. 4,723,129 and 4740.
What is done using the basic principles disclosed in 796 is preferred. This method is a so-called on-demand type,
It can be applied to any of the continuous type, but especially in the case of the on-demand type, it can be applied to the sheet holding the liquid (ink) or the electrothermal converter arranged corresponding to the liquid path. By applying at least one drive signal corresponding to the recorded information and giving a rapid temperature rise exceeding nucleate boiling, heat energy is generated in the electrothermal converter, and film boiling is caused on the heat acting surface of the recording head. Liquid (ink) corresponding to this drive signal as a result
This is effective because bubbles can be formed inside. Due to the growth and contraction of the bubbles, liquid (ink) is ejected through the ejection openings to form at least one droplet. It is more preferable to make this drive signal into a pulse shape, because the bubble growth and contraction are immediately and appropriately performed, so that the ejection of the liquid (ink) with excellent responsiveness can be achieved. As the pulse-shaped drive signal, those described in US Pat. Nos. 4,463,359 and 4,345,262 are suitable. If the conditions described in US Pat. No. 4,313,124 of the invention relating to the rate of temperature rise on the heat acting surface are adopted, more excellent recording can be performed.

As the constitution of the recording head, in addition to the combination constitution of the discharge port, the liquid passage, and the electrothermal converter (the straight liquid passage or the right-angled liquid passage) as disclosed in the above-mentioned specifications, U.S. Pat. No. 4,558,333, U.S. Pat. No. 44, which discloses a configuration in which a heat acting portion is arranged in a bending region
The configuration using the specification of No. 59600 is also included in the present invention. In addition, Japanese Unexamined Patent Publication No. 59-123670 discloses a configuration in which a common slit is used as a discharge portion of the electrothermal converter for a plurality of electrothermal converters, and an opening for absorbing a pressure wave of thermal energy is provided. The effect of the present invention is effective even if the configuration corresponding to the ejection portion is disclosed in Japanese Patent Laid-Open No. 59-138461. That is, according to the present invention, recording can be surely and efficiently performed regardless of the form of the recording head.

Further, the present invention can be effectively applied to a full line type recording head having a length corresponding to the maximum width of a recording medium which can be recorded by the recording apparatus. Such a recording head may have a configuration that satisfies the length by a combination of a plurality of recording heads or a configuration as one recording head integrally formed.

In addition, even in the case of the serial type as in the above example, the recording head fixed to the apparatus main body or the electrical connection with the apparatus main body or the ink from the apparatus main body by being attached to the apparatus main body The present invention is also effective when a replaceable chip-type recording head that can be supplied or a cartridge-type recording head in which an ink tank is integrally provided in the recording head itself is used.

Further, as the constitution of the recording apparatus of the present invention, it is preferable to add the ejection recovery means of the recording head, the preliminary auxiliary means and the like because the effects of the present invention can be further stabilized. Specifically, heating is performed by using a capping means, a cleaning means, a pressure or suction means for the recording head, an electrothermal converter or a heating element other than this, or a combination thereof. Examples thereof include a preliminary heating unit for performing the discharge and a preliminary discharge unit for performing discharge different from the recording.

Regarding the type and number of recording heads to be mounted, for example, only one is provided corresponding to a single color ink, and a plurality of inks having different recording colors and densities are supported. A plurality of pieces may be provided. That is, for example, the recording mode of the recording apparatus is not limited to the recording mode of only the mainstream color such as black, but may be either integrally formed of the recording heads or a combination of a plurality of them. The present invention is also very effective for an apparatus provided with at least one of full-color recording modes by color mixing.

In addition, in the above-described embodiments of the present invention, the ink is described as a liquid, but an ink that solidifies at room temperature or lower and that softens or liquefies at room temperature may be used. Or, in the inkjet method, it is common to adjust the temperature of the ink itself within the range of 30 ° C. or higher and 70 ° C. or lower to control the temperature so that the viscosity of the ink is within the stable ejection range. At times, a liquid ink may be used. In addition, the temperature rise due to thermal energy is positively prevented by using it as the energy for changing the state of the ink from the solid state to the liquid state, or in order to prevent the evaporation of the ink, it is solidified and heated in a standing state. You may use the ink liquefied by. In any case, by applying heat energy such as ink that is liquefied by applying heat energy according to the recording signal and liquid ink is ejected, or that begins to solidify when it reaches the recording medium. The present invention is also applicable to the case of using an ink having a property of liquefying for the first time. In this case, the ink is
JP 54-56847 A or JP 60-7.
As described in Japanese Patent No. 1260, it may be configured to face the electrothermal converter in a state of being held as a liquid or a solid in the concave portion or the through hole of the porous sheet. In the present invention, the most effective one for each of the above-mentioned inks is to execute the above-mentioned film boiling method.

In addition, as the form of the ink jet recording apparatus of the present invention, besides the one used as an image output terminal of an information processing apparatus such as a computer, a copying apparatus combined with a reader or the like, and a facsimile apparatus having a transmission / reception function are provided. It may be in a form or the like.

[0085]

The effects brought about by the present invention described above include the items listed below.

1) The main process for manufacturing the recording head is
Due to the lithographic technique using photoresist or photosensitive dry film, it is possible to form the fine parts of the recording head in a desired pattern and very easily, and also to simultaneously form a large number of recording heads with the same configuration. It can be easily processed.

2) Since the ink flow path is formed after the top plates are bonded together, a good liquid jet recording head without dripping of the adhesive into the ink flow path or peeling of the top plate can be manufactured. You can

3) Since the ink flow path is formed by the heat-crosslinking type positive resist, the liquid jet recording head having excellent adhesiveness to the substrate, heat resistance and strength can be manufactured.

4) It is possible to manufacture a liquid jet recording head which can realize good recording without cutting chips, abrasives and the like entering the ink flow path.

5) Since the ink flow path is formed by the heat-crosslinking positive resist, even if it is immersed in a developing solution having a high dissolving power such as an organic solvent for a long time, the unexposed portion is not dissolved at all. The liquid jet recording head can be stably manufactured.

6) A high density multi-array liquid jet recording head can be obtained by simple means.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of a substrate before a photosensitive material layer is formed.

FIG. 2 is a schematic perspective view of a substrate on which a thermally crosslinkable positive resist layer is formed.

FIG. 3 is a schematic perspective view showing pattern exposure performed on a heat-crosslinking positive resist layer.

FIG. 4 is a schematic cross-sectional view of a step of attaching a top plate.

FIG. 5 is a schematic sectional view of a cutting step.

FIG. 6 is a schematic cross-sectional view showing a completed state of a recording head substrate including an ink flow path formed by development and an orifice portion.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Ejection energy generating element 3 Thermal crosslinking type positive resist layer 4 Ionizing radiation irradiation part 5 Adhesive layer 6 Top plate resin layer 7 Top plate 8 Cut surface 9 Ink supply port 10 Ink flow channel 11 Ink ejection port (orifice)

Claims (2)

[Claims] 1. A substrate provided with an ejection energy generating element for ejecting recording liquid droplets, and a photosensitive resin layer made of a heat-crosslinking positive resist material provided on the substrate and having an ink path formed therein. And a top plate laminated on the photosensitive resin layer. 2. A step of 1) forming a photosensitive resin layer made of a heat-crosslinking positive resist material on a substrate on which an ejection energy generating element for ejecting recording droplets is formed, and 2) the photosensitive resin. Heat-curing the layer and pattern-exposing the ink path to the heat-cured photosensitive resin layer; 3) laminating a top plate on the photosensitive resin layer; 4) forming the photosensitive resin layer. And a step of eluting the pattern-exposed portion, the method for manufacturing a liquid jet recording head.