JPH0532811Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an endoscope using a solid-state image sensor.

[Conventional technology]

In recent years, endoscopes using solid-state imaging devices have been proposed as observation means. This device incorporates a solid-state image sensor inside the distal end of the endoscope, and monitors signals from the solid-state image sensor outside the endoscope.

If the built-in solid-state image sensing device of the endoscope is not electrically shielded, noise will appear on the monitor screen, making observation impossible, especially if electrical equipment such as high-frequency treatment instruments is used with this endoscope. It may happen.

Therefore, it is necessary to shield the solid-state image sensor from noise such as high frequencies, but it is possible to shield the solid-state image sensor from noise such as high frequencies by surrounding the solid-state image sensor with a conductive shield enclosing member. is possible.

Although JP-A-59-90544 assumes that the noise is X-rays, there is a description of an endoscope in which a solid-state imaging device is surrounded by a shielding surrounding member made of a conductive material.

This endoscope uses the tip component main body made of an alloy such as lead as an X-ray shield, and a solid-state image sensor is fixed to this X-ray shield via an insulating plate. Insulates the body and
The solid-state image sensor is shielded from X-rays.

However, in an endoscope that uses a solid-state image sensor as an observation means, as shown in Japanese Patent Application Laid-open No. 55-54933, electric circuits such as amplifiers that amplify signals from the solid-state image sensor together with the solid-state image sensor are required. It is common to place the unit at the tip of the endoscope. On the other hand, the endoscope described in the above-mentioned Japanese Patent Application Laid-Open No. 59-90544 has only a solid-state image pickup device installed at the distal end.

Moreover, the endoscope described in JP-A-59-90544 is a type that has a solid-state image sensor and an electric circuit built into the tip of the endoscope, as can be seen from the drawings included therein. Even though the endoscope is not a standard type, the tip has a larger diameter than the insertion part of the endoscope, which causes problems such as causing pain to the patient when inserting it into the patient's body. Practically unfavorable.

Therefore, the solid-state imaging device is surrounded by a shielding enclosing member, the solid-state imaging device and the electric circuit are incorporated into the endoscope tip, and the diameter of the endoscope tip is reduced to the size of the insertion section. This is necessary.

Generally, the solid-state image sensor incorporated into the tip of the endoscope is fixed to the surface of a substrate called a package that has conductive through holes, and the lands from the solid-state image sensor are connected to the through holes. has been done.

Lead pins electrically connected to the through holes are fixed to the back side of the package, and a circuit board constituting the electric circuit is fixed to the lead pins, and the electronic components on the circuit board are fixed to the lead pins. Conductively connected to the lead pin.

According to the above technology, it is possible to incorporate an electric circuit section together with a solid-state image sensor at the tip of the endoscope. However, since it is necessary to provide a through hole in the package, the external size of the package inevitably becomes large, and the It becomes difficult to reduce the diameter of the part.

[Problems to be Solved by the Invention] Therefore, in the above-mentioned conventional technology, the solid-state image sensor is surrounded by a shielding enclosing member to shield noise, and the solid-state image sensor and the electric circuit section are connected to each other through an endoscope. An endoscope that can be incorporated into the distal end and that can simultaneously reduce the diameter of the endoscope distal end to the size of the insertion section has not been obtained.

The present invention was developed with a focus on the above-mentioned problems, and it ensures good observation without noise appearing on the monitor screen even when using electrical equipment such as high-frequency treatment instruments, and also improves solid-state imaging due to short circuits. It is an object of the present invention to provide an endoscope in which a solid-state image sensor and an electric circuit section can be compactly incorporated while preventing destruction of the device.

[Means and effects for solving the problems] In order to solve the above problems and achieve the purpose, the present invention has a solid-state image sensor, a package to which the solid-state image sensor is attached, and a solid-state image sensor that passes through the side of the package. An imaging section consisting of a land connected to the imaging device and an electric circuit section connected to the solid-state imaging device via the land, a shielding member for shielding the imaging section from noise such as high frequency, and the shielding member. The distal end portion of the endoscope is provided with a covering insulating member that electrically insulates the land from the land.

With the above configuration, the present invention ensures good observation without noise appearing on the monitor screen even when using electrical equipment such as high-frequency treatment instruments, and also prevents damage to the solid-state image sensor due to short circuits. At the same time, the solid-state image sensor and electric circuit section are compactly incorporated into the tip.

〔Example〕

1 to 4 show a first embodiment of the present invention.

The distal end portion 3 of the insertion section 2 in this endoscope 1 is configured as shown in FIG. That is,
This distal end portion 3 is provided with a distal end component main body 5 connected to the distal end of a curved tube 4 that is connected to the distal end of a flexible tube (not shown) of the insertion section 2. Various parts are now being incorporated. Although the tip component body 5 is made of metal, it may also be made of synthetic resin or ceramic. Further, the bending tube 4 is formed by covering the outer periphery of a core member formed by rotatably connecting a plurality of bending pieces 6 with an electrically insulating synthetic resin outer skin 8 via a blade 7. .

A tip cover 11 made of an electrically insulating material is tightly fitted onto the outer peripheral surface of the tip component main body 5. Furthermore, an objective observation unit 12, which will be described later, is detachably attached to the tip structure main body 5. Further, an illumination lens 13 is airtightly provided in the tip structure main body 5 alongside the objective observation unit 12, and the tip of a light guide 15 made of an optical fiber bundle is connected to the inside of the illumination lens 13. The tip of the light guide 15 passes through the tip structure main body 5 and is fixed to the tip structure main body 5. Further, the illumination lens 13 is connected to the tip cover 1.
1 and is hermetically fitted into a hole 16 provided through the hole 16 and bonded to the hole 16.

Further, the tip component main body 5 is provided with an air/water supply nozzle 18 that penetrates the tip cover 11 and protrudes to the outside. It is connected. The support member 20 of the air/water supply nozzle 18 is made of an electrically insulating material.

Furthermore, the tip structure main body 5 has a channel hole 2.
2 is passed through, which is connected to the channel tube 28. These form an insertion channel 29 through which various treatment tools, such as a high-frequency cutting tool, can be inserted.

On the other hand, the objective observation unit 12 is composed of an imaging section, a coaxial cable 36, and an objective lens system 33.

The imaging section includes a solid-state image sensor 34, a package 55 to which the solid-state image sensor 34 is attached, a land 58 connected to the solid-state image sensor 34 through the side surface of the package 55, and a solid-state image sensor via the land 58. It consists of the element 34 and an electrical circuit section connected to it.

Further, the electric circuit section includes the solid-state image sensor 3.
This board 3 consists of a first board 35 and a second board 35 on which the electronic components of the attached circuit of No. 4 are attached.
A plurality of coaxial cables 36 as signal lines are connected to 5 and 35. Electronic components such as transistors, capacitors, and resistors are attached to the substrate 35, for example. In addition, objective lens system 3
3, a plurality of lenses 37 are airtightly adhesively fixed in a metal (conductive) lens frame 38, and an observation cover lens 39 is attached and fixed to the tip of the lens frame 38. Further, an electrically insulating insulating frame 41 is fitted onto the outer periphery of the lens frame 38 and is hermetically bonded. Furthermore, the observation cover lens 3
The space between the periphery of 9 and the tip of the insulating frame 41 is sealed by filling an electrically insulating potting material 43.

Further, the outer periphery of the insulating frame 41 is tightly fitted into a through hole 45 formed in the tip component main body 5, so that the insulating frame 41 can be detachably attached. That is, a circumferential groove 47 into which the O-ring 46 is fitted is formed in the outer peripheral surface of the insulating frame 41. In other words,
The lens frame cover 41 is hermetically fitted into the through hole 45 with an O ring 46. Further, the insulating frame 41 is fixed in a fixed position by a retaining screw 48 screwed into the side wall of the tip component main body 5. The mounting position of the retaining screw 48 is hermetically sealed from the outside by filling an electrically insulating potting material 49.

Note that the lens frame cover 41 and the element frame 5 described later
Resin 5 is placed on the outer periphery of 1 and in the gap between the above two members.
0 to form a seal around and between them.

On the other hand, the solid-state image sensor 34 is made of metal and is attached to the inner wall at the rear end of a cylindrical device frame 51 .
The outer diameter of the solid-state image sensor mounting portion of the element frame 51 is larger than the outer diameter of the insulating frame 41. The tip end of the element frame 51 is joined to the outer periphery of the lens frame 38 and is adhesively fixed with a conductive adhesive.

Further, the substrate 3 connected to the solid-state image sensor 34
5 and 35 are surrounded by a shield pipe 52 screwed to the rear end of the element frame 51. The shield pipe 52 is made of metal and is electrically connected to the element frame 51. That is, the element frame 51 and the shield pipe 52 are electrically connected to each other and constitute a long cylindrical shield member 54.

As a result, the solid-state image sensor 3 disposed inside
4. Shield the entire electrical components such as the board 35.
The shield pipe 52 is the core wire 3 of the coaxial cable 36
It extends rearward to include the connecting end portion of 0. A metal cable fixing frame 53, which will be described later, is connected to the rear end of the shield pipe 52 by adhesive using a conductive adhesive, and this cable fixing frame 53 is electrically connected to the shield pipe 52. Here, according to this embodiment, the shield member 54
Since the lens frame 38 and the cable fixing frame 53 are electrically connected to each other, a shield enclosing member that is actually longer than the shield member 54 is formed to obtain good shielding characteristics. be able to. Further, the outer peripheries of the shield pipe 52 and the cable fixing frame 53 are covered with an electrically insulating heat-shrinkable tube 52a.

The solid-state image sensor 34 is configured as shown in FIG. 2, for example. That is, a chip 56 is attached to the center of the front surface of a circular package 55, and a cover glass 57 is attached to the front surface of the package 55 so as to cover the chip 56.
Furthermore, a plurality of lands 58 are electrically connected to the chip 56.
is exposed on the side circumference of the package cage 55, and
They are electrically connected to lead pins 59 protruding from the back surface of the package 55, respectively.

Further, the solid-state image sensor 34 has its entire side peripheral surface covered with a covering insulating member 60 as shown in FIG. That is, the covering insulating member 60 is electrically insulating and is made of, for example, a silicon tube or an insulating tape, and is fitted onto the solid-state image pickup device 34 so as to completely cover the side circumferential surface thereof, and is adhesively fixed thereto.

The solid-state image sensor 34 is tightly fitted and adhesively fixed to the inner wall of the rear end of the element frame 51 with the insulating covering member 60 fitted thereon. In other words,
The solid-state image sensor 34 is attached and fixed to the element frame 51 via a covering insulating member 60.

Thus, the solid-state image sensor 34 and the land 58 connecting the solid-state image sensor 34 and the electric circuit section,
The image pickup section includes a substrate 35, 35, which serves as an electric circuit section to which electronic components of the circuit attached to the solid-state image pickup device 34 are attached, and an element frame 51, a shield pipe 5,
It is surrounded and shielded by a shield member 54 consisting of two parts. Therefore, even if a high-frequency treatment tool such as an electric scalpel is inserted through the insertion channel 29 of the endoscope 1 and used, the electric circuit section is not affected by high-frequency noise.

Furthermore, each land 58 of the solid-state image sensor 34
are each covered by the covering insulating member 60, so that the land 58 is covered with the shield member 54.
The solid-state image sensor 3
4 can be prevented from being destroyed.

On the other hand, a wire protection tube 61 is connected to the outer periphery of the rear end of the cable fixing frame 53. Each coaxial cable 36 is connected to a wire protection tube 61.
It is guided to the proximal side of the endoscope 1 through the inside, and is further connected to a video processing circuit (not shown) outside the endoscope 1.

By the way, each of the above-mentioned coaxial cables 36 is twisted around a linear inclusion 62 as shown in FIG.
A thread 63 for preventing fraying is wrapped around the outer periphery. Furthermore, each coaxial cable 36 has an inclusion 62
The thread 63 for preventing fraying is wound in the opposite direction to the winding direction. Furthermore, each of the coaxial cables 36 and the thread 6
A thread 64 for preventing fraying, which is different from the thread 63, is tied around the outer periphery of the bundle No. 3. And this thread 6
4 and the thread 63 are coated with an adhesive 65 for fixing them together. The inclusion 62 is made of an insulating material such as cotton thread. Further, each coaxial cable 36 is composed of, from the inside, a core wire 30 as an inner conductor, an insulator 67, a shield wire 71 as an outer conductor, and a protective coating 69, as shown in FIG.

In the configuration of the above embodiment, the objective observation unit 12 and the shield member 54 have a single unit structure. Therefore, it can be attached to and detached from the tip component main body 5 during assembly, repair, etc., and the work is simple.

FIG. 6 shows a second embodiment of the present invention. This embodiment has the same basic configuration as the first embodiment, but in particular, the shield pipe 5
A closing wall 70 is integrally formed at the rear end of the cable 2, and the coaxial cable 36 passes through this closing wall 70.

[Effect of idea]

As explained above, according to the present invention, the land connecting the solid-state image sensor and the electric circuit section is passed through the side surface of the package, and the imaging section made of the solid-state image sensor etc. is provided inside the shield member made of a conductive material. , has a covering insulating member that electrically insulates the land and the shielding member, so it shields the imaging section from noise such as high frequencies, and even if the imaging section consisting of a solid-state imaging device is compactly incorporated, solid state due to short circuits may occur. It is possible to reduce the diameter of the endoscope tip while preventing destruction of the image sensor.

[Brief explanation of the drawing]

FIG. 1 is a side cross-sectional view of the distal end of an endoscope in a first embodiment of the present invention, FIG. 2 is a perspective view of a solid-state image sensor in the same embodiment, and FIG. 4 is a perspective view of a coaxial cable bundle according to the same embodiment, FIG. 5 is a partially cutaway perspective view of a coaxial cable according to the same embodiment, and FIG. 6 is an internal view of a second embodiment of the present invention. This is a side cross section of the distal end of the endoscope. 1... Endoscope, 5... Tip component main body, 34...
...Solid-state image sensor, 54...Shield member, 60...
...Coated insulating member.

Claims (1)

[Claims for Utility Model Registration] A solid-state image sensor, a package to which the solid-state image sensor is attached, a land connected to the solid-state image sensor through the side of the package, and a land connected to the solid-state image sensor via the land. An imaging section consisting of an electric circuit section, a shielding member for shielding the imaging section from noise such as high frequency waves, and a covering insulating member for electrically insulating the shielding member and the land are attached to the tip of the endoscope. An endoscope having: