JPH05327256A - Cooling device - Google Patents

Abstract

PURPOSE:To make it possible to efficiently perform replacing of a substrate packaged in a module in a cooling device for cooling the substrate disposed in a module by a dip cooling method. CONSTITUTION:A handle 3 is formed on a storage tank 1 that stores a cooling liquid 80 in such a manner that the liquid can circulate. A pair of hooks 10A and 10B are provided to hold this handle 3 so that the tank 1 can be located in two positions, that is, a drive water level position H+ which is higher than a water level H of a module 20 and a non-drive water level position H- which is lower than the water level H of the module 20.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for cooling a substrate arranged in a module by an immersion cooling system.

[0002]

2. Description of the Related Art FIG. 3 is a schematic side sectional view showing an example of the structure of a module which is an object to be cooled, and FIGS. 4 (a) and 4 (b) show the arrangement of a conventional cooling device and a method for extracting a cooling liquid. It is a typical side view for explaining.

As shown in FIG. 3, the module 20 includes a liquid circulating portion 24 in which a cooling liquid 80 circulates and a liquid inlet for feeding the cooling liquid 80.
A case part 21 having a liquid outlet 22 for discharging the cooling liquid 80, a flange 17 for mounting the substrate 15 on which a plurality of LSIs 16 are mounted to the case part 21, and the flange 17 for the case part 21. Two kinds of gaskets 18A, 18 arranged to secure watertightness between the case portion 21 and the flange 17 and between the flange 17 and the substrate 15 with a plurality of screws 19 fixed to
Equipped with B. In the figure, 25 is a nipple formed on the outer peripheral surfaces of the liquid inlet 22 and the liquid outlet 23.

The arrangement of the conventional cooling device and the method for extracting the cooling liquid will be described below with reference to FIGS. 4 (a) and 4 (b).
4 (a) is a diagram showing the arrangement of the conventional cooling device, and FIG. 4 (b) is a diagram showing the method of extracting the cooling liquid in the conventional cooling device.

As shown in FIG. 4 (a), in the conventional cooling device, the storage tank 1A is arranged so as to secure an operating water level H + higher than the water level H of the module 20 equipped with the substrate 15. .. The water level in the storage tank 1A is higher than the water level in the module 20 as described above in order to secure the liquid amount of the cooling liquid 80 in the module 20. In the figure, 50 is a device frame in which a cooling device is arranged, 61 is a drain cock equipped in the pump 60, 70 is between the storage tank 1A and the pump 60,
Or between pump 60 and module 20, and module 20
Shown are the hoses connecting between the storage tank and the storage tank 1A.

This cooling device circulates the cooling liquid 80 stored in the storage tank 1A by operating the pump 60 in the direction of the arrow (storage tank 1A → pump 60 → module 20 → storage tank 1A) to circulate the module 20. It is a cooling device of an immersion cooling system for cooling an LSI 16 mounted on a substrate 15 therein.

In this module 20, when the substrate 15 mounted inside is replaced, the cooling liquid 80 is drained to make the inside "blank", and then the substrate 15 is replaced. The procedure for extracting the cooling liquid 80 will be described below with reference to FIG. 4 (b).

An appropriate capacity (a capacity capable of accommodating all of the cooling liquid 80 in the storage tank 1A, the cooling liquid 80 in the module 20 and the cooling liquid 80 in the hose 70) under the drain cock 61 mounted on the pump 60 ) Container 40 is prepared.

Open the drain cock 61. As a result, the cooling liquid 80 in the module 20 flows in the direction of the arrow and the container concerned
Stored within 40. When the drain cock 61 is opened, the cooling liquid 80 in the storage tank 1A merges with the cooling liquid 80 in the module 20 and flows into the container 40 in the direction of the arrow.

[0010]

In the conventional cooling device, the storage tank 1A for the cooling liquid 80 is arranged in such a manner that the operating water level H + higher than the water level H of the module 20 is secured. When the drain cock 61 is opened to remove the cooling liquid 80 inside, the cooling liquid 80 in the storage tank 1A flows out together with the cooling liquid 80 in the module 20. The cooling liquid 80 once stored in the container 40 will be returned to the storage tank 1A again after the replacement of the substrate 15, but the container 40 is prepared every time the substrate 15 is replaced, or
15 It is not easy to perform the work of returning the cooling liquid 80 withdrawn after the replacement from the container 40 to the storage tank 1A.

According to the present invention, the storage tank can be positioned at an operating water level higher than the module water level and an operation resting water level lower than the module water level, thereby significantly improving the work efficiency when exchanging substrates. It is intended to realize an improved cooling device.

[0012]

As shown in FIG. 1, a cooling device according to the present invention is provided with a handle 3 on a storage tank 1 for circulatory storage of a cooling liquid 80, and holds the handle 3 to hold the handle 3. Equipped with a pair of hooks 10A, 10B for positioning the storage tank 1 at two positions, an operating water level position H + having a water level higher than the water level H of the module 20 and an operation stop water level position H- having a water level lower than the water level H of the module 20. It is characterized by the device configuration.

[0013]

This cooling device is equipped with a pair of hooks 10A and 10B for positioning the storage tank 1 at two positions, the operating water level position H + and the operation resting water level position H-.
The replacement work of the substrate 15 arranged in the module 20 is significantly efficient.

[0014]

The present invention will be described in detail below with reference to the drawings of the embodiments. 1 (a) and 1 (b) are schematic side sectional views showing one embodiment of the present invention, and FIGS. 2 (a) and 2 (b) are schematic perspective views showing one structural example of the constituent members. The same parts as those in FIGS. 3 and 4 are designated by the same reference numerals.

As shown in FIGS. 1 (a) and 1 (b), in the cooling device according to the present invention, the handle 3 is provided in the storage tank 1 for storing the cooling liquid 80 in a circulatory manner, and the handle 3 is held. A pair of hooks 10A, 10B for positioning the storage tank 1 at two positions, that is, an operating water level position H + having a higher water level than the water level position H of the module 20 and an operation suspension water level position H- having a lower water level than the water level position H of the module 20. Is characterized in that it is arranged on the wall surface of the device frame 50. In the figure, 1a is a main body of the storage tank 1, 1b is a handle mounting portion into which the finger 3a of the handle 3 is inserted in a loosely fitted state, and 1c and 1d are joints for connecting the hose 70.

FIG. 1 (a) shows a module in which the cooling device is activated.
FIG. 3 is a diagram showing a state in which the substrate 15 placed in 20 is being cooled. At this time, the storage tank 1 is held by hooking a handle 3 on a hook 10A disposed on the upper wall surface of the device frame 50. Therefore, the water level is maintained at the operating water level position H +, which is higher than the water level position H of the module 20. The cooling liquid 80 at this time circulates in the order of storage tank 1 → pump 60 → module 20 → storage tank 1 to cool the substrate 15 in the module 20.

FIG. 1 (b) is a view showing a state in which the substrate 15 arranged in the module 20 is exchanged. At this time, first, the operation of the pump 60 is stopped, and then the storage tank 1 is moved to a position where it is held by the hook 10B arranged at the lower portion of the wall surface of the device frame 50. By moving the position to the position where the handle 3 is held by the hook 10B, the storage tank 1 is positioned at the operation stop water level H- which is lower than the water level of the module 20. Therefore, at this time, the cooling liquid 80 in the module 20 is stored in the storage tank 1 via the hose 70.

When the exchange of the substrate 15 is completed, the storage tank 1 is held by the hook 10A [FIG. 1 (a)].
[Position shown in]]. When the pump 60 is started after returning the storage tank 1 to the position shown in FIG. 1 (a), the cooling liquid 80 circulates in the order of storage tank 1 → pump 60 → module 20 → storage tank 1 according to the regular circulation course. To cool the substrate 15 in the module 20. Since the cooling device according to the present invention does not need to discharge the cooling liquid 80 in the module 20 to the outside when exchanging the substrate 15, the exchanging work of the substrate 15 is remarkably efficient.

The structure of the constituent members used in the present invention will be described below with reference to FIGS. 2 (a) and 2 (b). FIG. 2A is a schematic perspective view showing a structural example of the storage tank 1 and the handle 3 attached to the storage tank 1.

As shown in FIG. 2 (a), the handle 3 is a hook.
A hook engagement portion 3b provided corresponding to a hook portion 10c (described later) of 10A and 10B and a finger portion 3a which is engaged with the handle mounting portion 1b of the storage tank 1 in a loosely fitted state are provided as a pair. There is. The handle 3 is a member that suspends and holds the storage tank 1 that stores the cooling liquid 80, and is required to have particularly high toughness, and therefore is made of, for example, a steel rod or the like. The handle 3 is mounted such that the finger portion 3a is engaged with the handle mounting portion 1b of the storage tank 1 as shown by a dotted line.

As shown in FIG. 2 (b), each of the hooks 10A and 10B comprises a pedestal portion 10a and a column 10b provided upright from a substantially central portion of the pedestal portion 10a. It is a holding member for the tank 1. This hook 10
A and 10B are hooks provided at the tip of the column 10b.
Since the storage tank 1 is held by holding the hook engagement portion 3b of the handle 3 with 10c, a large moment acts on the column 10b. For this reason, these hooks 10A and 10B are manufactured by using a steel material or the like like the handle 3. In the figure, 10d is this hook 10A
And 10B are screw insertion holes into which fixing screws (not shown) for attaching the device 10B to the device frame 50 are inserted. These hooks 10A
The 10B and 10B have different names depending on their mounting positions, but they are the same members in terms of content.

In this cooling device, the cooling liquid 80 in the module 20 is automatically stored in the storage tank 1 by moving the storage tank 1 positioned at the operating water level position H + to the operation resting water level position H-. The cooling device is returned to the standby state by moving the storage tank 1 positioned at the operation stop water level position H- to the operation water level position H +.

[0023]

As is apparent from the above description, in the cooling device according to the present invention, the cooling liquid in the module is automatically stored by moving the storage tank from the operating water level position H + to the inactive water level position H-. Since the structure is accommodated in the tank, the work of exchanging the substrate mounted on the module is remarkably efficient.

[Brief description of drawings]

FIG. 1 is a schematic side sectional view showing an embodiment of the present invention.

FIG. 2 is a schematic perspective view showing one structural example of constituent members.

FIG. 3 is a schematic side sectional view showing a structural example of a module which is an object to be cooled.

FIG. 4 is a schematic side view for explaining a conventional arrangement of a cooling device and a method of extracting a cooling liquid.

[Explanation of symbols]

 1, 1A Storage tank 3 Handle 10A, 10B Hook 15 Board 16 LSI 17 Flange 18A, 18B Gasket 19 Screw 20 Module 21 Case part 22 Liquid inlet 23 Liquid outlet 24 Liquid circulation part 25 Nipple 40 Container 50 Device frame 70 Hose 80 Coolant H Module water level position H + Operating water level position H− Operation stop water level position

Claims (1)

[Claims] 1. A cooling device for cooling a substrate (15) arranged inside a module (20) by an immersion cooling method, wherein a grip is provided in a storage tank (1) which circulates and stores a cooling liquid (80).
(3) is provided, and while holding this handle (3), the storage tank (1) is connected to the operating water level position (H +) higher than the water level position (H) of the module (20) and the module (20). Water position
A cooling device equipped with a pair of hooks (10A, 10B) that are positioned at two positions, namely, an operation suspension water level position (H-) lower than the water level (H).