JP2000321790A - Apparatus for stripping organic resist on semiconductor wafer and cassette for treatment used in same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the amount of an organic resist stripper used for cleaning, to prolong the service life of the stripper by suppressing the evaporation of the components of the stripper and to reduce power consumption and the size of an apparatus. SOLUTION: A cassette 106 with a housed semiconductor wafer 110 is brought into close contact with a treatment vessel 201 in such a way that the cassette 106 becomes part of the vessel 201 so as to prevent the contact of an organic resist stripper stored in a chemical solution tank 210 with the outside air. The cassette 106 is used as part of a cleaning system in which a cleaning solution flows. The semiconductor wafer 110 is first cleaned with the organic resist stripper and this solution is returned to the chemical solution tank without contact with the outside air. The wafer 110 is then washed with a rinsing solution and the cassette 106 is detached from the treatment vessel 201.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer organic resist stripping apparatus for removing unnecessary resist using a resist stripper in a semiconductor wafer manufacturing process.

[0002]

2. Description of the Related Art FIG. 5 is a schematic view of an organic resist stripping apparatus using a processing tank according to the prior art for removing unnecessary resist adhering to a semiconductor wafer using a resist stripping solution in a semiconductor wafer manufacturing process. . In FIG. 5, reference numeral 501 denotes a processing tank; 502, an overflow tank;
03 is a liquid supply pipe, 504 is a current plate, and 505 is a processing tank 50.
1 and a lid of the overflow tank 502.

Conventionally, an organic resist stripping apparatus has a structure in which one or more processing tanks 501 each having an upper part opened to a gas atmosphere are provided. The stripping solution is filled in the processing tank 501, and is partially contained in the overflow tank 502. When the circulation pump 506 operates, the liquid is supplied from the overflow tank 502 to the circulation pump 506 via the liquid discharge side opening / closing valve 509.

[0004] The stripping solution is supplied to the processing tank 501 through a liquid supply pipe 503 in the processing tank 501 via a filter 507 and a liquid supply side opening / closing valve 508. The supplied stripping solution passes through the current plate 504 and processes the semiconductor wafer 110 stored in a cassette 800 (an external perspective view is shown in FIG. 8A) immersed in the stripping solution. It flows into the overflow tank 502 from the upper part of the tank 501. Through this process, the resist on the surface of the semiconductor wafer 110 was removed.

FIG. 6 is a schematic view of a conventional spray type organic resist stripping apparatus. 601 is a rotor that holds and rotates a semiconductor wafer (hereinafter referred to as a rotor);
02 is a nozzle and 603 is a chemical supply unit.

[0006] The semiconductor wafer 110 mainly has a sealed single-tank structure and is accommodated in a rotor 601 inside a processing tank 600.
Is rotated, and the liquid supplied from the chemical liquid supply unit 603 via the liquid supply side opening / closing valve 608 is sprayed from the nozzle 602 with an organic resist stripping liquid, and the semiconductor wafer 1 is rotated.
The resist adhering to No. 10 was removed.

[0007]

In the prior art shown in FIG. 5, when a process for removing unnecessary resist attached to the semiconductor wafer 110 using a resist stripper is performed, a lid 505 is placed in the processing tank 501. Improvements have been made. However, in this prior art, the processing tank 501
When the cassette 800 is taken in and out, the cover 505 must be in an open state, so that the water contained in the organic resist stripping solution evaporates and the composition of the organic resist stripping solution is removed. Changes.

For this reason, the life of the liquid is shortened,
There is a problem that the inherent advantage of reducing the amount of liquid used by circulating the liquid cannot be used. Further, in the prior art shown in FIG.
In order to prevent the components of the evaporated liquid from scattering into the apparatus and further into the clean room, it is necessary to exhaust the atmosphere around the cleaning tank 501 outside the apparatus or outside the clean room. Therefore, in this conventional technique, since an exhaust device is required to remove unnecessary resist attached to the semiconductor wafer 110, there has been a problem that the device becomes large and power consumption is increased.

Further, since the cassette 800 accommodating the semiconductor wafers 110 is put into the processing tank 501, the processing tank 5
01 had to be sufficiently larger than the cassette 800. Furthermore, with this prior art structure,
The outside of the cassette 800 that does not need to be processed is also immersed in the organic resist stripping solution, and the semiconductor wafer 11
There is also a problem that a larger amount of the resist stripping solution is required than the amount of the resist stripping solution required in process 0.

Further, in the prior art shown in FIG. 5, a rectifying plate 504 and the like are attached in order to make the flow in the processing tank 501 uniform, but the semiconductor wafer 11 which is an obstacle to the flow is provided.
0 and cassette 800, avoiding cassette 800 and processing tank 5
The flow gathers between the inner wall and the 01 inner wall. Therefore,
There is a problem that the flow of the resist stripper cannot be collected on the surface of the semiconductor wafer 110 to be processed, and a high cleaning effect cannot be expected.

Also, stagnation occurs at the center of the liquid surface above the cassette 800, and resist and dust separated from the semiconductor wafer 110 accumulate in this portion, and the semiconductor wafer 110
When the substrate is taken out of the processing tank 501, there is a problem that the peeled resist and dust adhere again. Further, a corner must be formed inside the processing tank 501 in order to attach the liquid supply pipe 503 and the rectifying plate 504 in the processing tank 501, so that turbulence and stagnation occur, and dust is generated in the processing tank 501. It had a structure to collect.

On the other hand, in the prior art shown in FIG. 6, the semiconductor wafer 110 is processed by sequentially using a plurality of types of liquids.
The liquid is disposable and consumes more liquid. Also, it is difficult for the spray to enter the gap between the semiconductor wafers 110,
There is also a problem that it is difficult to perform a uniform cleaning process, and unevenness occurs in the cleaning. Furthermore, since the processing tank 600 has a rotating part (driving part), there is a problem that dust is generated due to rubbing.

[0013] As the miniaturization and high integration of semiconductor devices have progressed, the processing liquids that enable this manufacturing have also changed. When these new treatment liquids are exposed to outside air for a long time, their components change due to evaporation and the like, and their performance cannot be sufficiently exhibited. Also, in recent years, particularly attention has been paid to the environment, and there has been a demand for an organic resist stripping apparatus for a semiconductor wafer having a structure that requires as little waste liquid as possible.

The present invention satisfies the above-mentioned problems of the prior art and social needs, requires less use of the organic resist stripping solution used for cleaning, and suppresses evaporation of the components of the stripping solution by suppressing evaporation of the components of the stripping solution. An object of the present invention is to provide a semiconductor wafer organic resist stripping apparatus capable of extending the life, further reducing the power consumption and the apparatus, and a processing cassette used in the apparatus.

[0015]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a semiconductor device for removing an unnecessary resist adhering to the surface of a semiconductor wafer held in a processing cassette by using a resist stripper. The wafer organic resist stripper has a chemical tank that stores the resist stripper,
A processing vessel that removes unnecessary resist adhering to the surface of the semiconductor wafer using a resist stripper stored in a chemical tank, and a pipe that allows the resist stripper to circulate between the chemical tank and the processing vessel. And a circulation pump attached to the liquid piping system and circulating the resist solution. The processing container includes a processing cassette holding a semiconductor wafer, and has a structure in which a resist stripping solution supplied from a chemical solution tank does not come into contact with the outside.

Further, in the processing cassette according to the present invention in which the semiconductor wafer according to the present invention is stored, the two opposing first sides are slightly wider than the diameter of the semiconductor wafer, and the opposing two sides are perpendicular to the first side. A rectangular upper opening having two second sides, a plurality of slits for holding the semiconductor wafer inserted from the upper opening, and a third side corresponding to the first side is the first side. A fourth side shorter than the side and corresponding to the second side has a rectangular lower opening having the same length as the second side. A plurality of slits are formed along the second side, and only the upper opening and the lower opening are opened.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of an apparatus for removing organic resist from a semiconductor wafer according to the present invention will be described with reference to the accompanying drawings. In the description of the present embodiment,
The same components are denoted by the same reference numerals.

Referring to FIG. 2, there is shown an external perspective view of a resist stripping apparatus according to an embodiment of the present invention. Storage cassette installation mechanism (hereinafter referred to as loader) 101
Stores the unprocessed semiconductor wafers 110 in the storage cassette 1
03 (hereinafter, referred to as an unprocessed cassette). That is, the loader 101 includes a sensor for detecting the presence or absence of the semiconductor wafer 110 therein, and also includes a mechanism for supporting the semiconductor wafer 110 and moving the semiconductor wafer 110 up and down.

More specifically, when the unprocessed semiconductor wafers 110 are stored in the unprocessed cassette 103, the loader (not shown) for supporting the semiconductor wafers 110 is located above the unprocessed cassette 103. The semiconductor wafer 110 is moved up to the opening and lowered when the semiconductor wafer 110 is carried by the carrier, and the semiconductor wafer 110 is moved to the unprocessed cassette 1.
03. When the semiconductor wafer 110 is taken out of the unprocessed cassette 103, the supporting unit is lifted up from the bottom to lift the semiconductor wafer 110 stored in the unprocessed cassette 103, and the transfer mechanism 105 described later takes out the semiconductor wafer 110. Make it easy.

A storage cassette setting mechanism (hereinafter, referred to as an unloader) 102 for storing the processed semiconductor wafers 110 is provided with a sensor for detecting the presence or absence of the semiconductor wafers 110, similarly to the loader 101. This device operates when it is stored in or taken out of a cassette 104 (hereinafter referred to as a processed cassette). That is, the unloader 102 is
Similarly to the above, a mechanism for holding the semiconductor wafer 110 therein and moving it up and down is provided.

More specifically, when the loader 102 stores the processed semiconductor wafers 110 in the processed cassette 104, the supporting portion (not shown) for supporting the semiconductor wafers 110 is connected to the upper opening of the processed cassette 104. The semiconductor wafer 110 is lowered when the semiconductor wafer 110 is carried on the carrier, and the semiconductor wafer 110 is moved to the processed cassette 104.
To be stored. When the semiconductor wafer 110 is taken out of the processed cassette 104, the supporting portion is moved upward from the bottom to lift the semiconductor wafer 110 stored in the processed cassette 104 so that the semiconductor wafer 110 can be easily taken out.

The transfer mechanism 105 is connected to the semiconductor wafer 1
The apparatus includes an arm for gripping the semiconductor wafer 10 and transfers the semiconductor wafer 110 in a horizontal movement. That is, after the unprocessed semiconductor wafer 110 stored in the unprocessed cassette 103 is lifted by the loader 101, the transfer mechanism 105 sandwiches the end surface of the unprocessed semiconductor wafer 110 from both sides into the processing cassette 106 (hereinafter, referred to as a cassette). The processed semiconductor wafer 110 stored in the processing cassette 106 is transferred to the processed cassette 104 by performing the same processing.

The cassette 106 shows an embodiment of the processing cassette according to the present invention, and FIG. 8B is a perspective view showing the appearance of the cassette. As shown in FIG.
06 is provided with a substantially square upper opening and a rectangular lower opening whose one side is smaller than the diameter of the semiconductor wafer 110. The semiconductor wafer inserted from the upper opening by narrowing the lower opening in this way. 110 is locked. That is, the side surface A of the cassette 106 extends vertically downward from the upper opening by a predetermined length so that the semiconductor wafer 110 can be stored therein, and the width is reduced so that the semiconductor wafer 110 does not fall down therefrom. It is bent in a tapered or curved shape.

Accordingly, in the cassette 106, the upper opening and the lower opening have sides (second sides) on which the semiconductor wafers are arranged.
Are the same length, but at right angles to this (first side)
Is shorter at the lower opening. Also, cassette 1
A plurality of slits 106b sandwiching the semiconductor wafer 110 from both sides are formed near the upper opening of the opposing second side in the inside of 06. Further, on the side surface B of the cassette 106, a square pillar handle 106 to be gripped when moving is formed.

Returning to FIG. 2, the transport mechanism 107 is a transport mechanism for transporting the cassette 106. The transport mechanism 107 is 3
A head 10 that can be rotated 60 ° and can move up and down.
7a, and two prismatic arms 107b attached to the head 107a. Transport mechanism 10
Reference numeral 7 designates two arms 107b as handles 10 of the cassette 106.
The cassette 106 is moved by inserting it under the handle 6a and holding the handle 106a.

The processing unit 108 is provided for the semiconductor wafer 1
This is a processing apparatus that removes unnecessary resist adhering to the surface of No. 10 using a resist stripper and then cleans it with a rinse liquid. The processing unit 108 includes the semiconductor wafer 11
The processing container 201 includes a cassette 106 in which the cassettes 0 are stored and upper and lower covers. As described above, in the present embodiment, when processing is performed, the cassette 106 is used.
Is sealed and mounted so as to become a part of the processing container 201, so that the inside of the cassette 106 is in a sealed state. Note that, in FIG.
8a shows a state in which the cassette 106 is not mounted, and the other two processing units 108 show a state in which the cassette 106 is mounted. The drying mechanism 109 includes the semiconductor wafer 1 cleaned by the processing unit 108.
10 is a device for drying.

Next, a series of operations of the semiconductor wafer organic resist stripping apparatus shown in FIG. 2 will be described below. The semiconductor wafer 110 stored in the unprocessed cassette 103 attached to the loader 101 is transferred to the transfer mechanism 1
In step 05, the processing cassette 106 is transferred. Next, the cassette 106 containing the semiconductor wafers 110 is transported to the processing unit 108 by the transport mechanism 107.

After completing the cleaning process, the semiconductor wafer 1
The cassette 106 accommodating 10 is transported from the processing unit 108 to the drying mechanism 109 by the transport mechanism 107. After the drying process, the processing cassette 106 containing the semiconductor wafer 110 is transported to the original place by the transport mechanism 107. Then, the semiconductor wafer 110 is transferred from the cassette 106 to the processed cassette 102 by the transfer mechanism 105.

FIG. 1 is a schematic diagram showing an embodiment of a processing unit of a resist stripping apparatus according to the present invention. The processing container (hereinafter, processing container) 201 includes a cassette 106 that stores the semiconductor wafer 110 and a cover (hereinafter, referred to as an upper cover) 202 that closes an upper opening of the cassette 106.
And a cover (hereinafter, referred to as a lower cover) 203 for closing the lower opening. Top cover 20
2 and the lower cover 203 are in close contact with the cassette 106, and the inside is sealed.

The rectification chamber 204 is a substantially cylindrical rectification chamber provided on the lower cover 203. The processing liquid such as the resist stripping liquid and the rinsing liquid sent from the piping system becomes a vortex in the horizontal direction in the rectification chamber 204, and the lower cover 2
The semiconductor wafer 1 stored in the cassette 106 from 03
Go to 10 The upper portion of the lower cover 203 is tapered from the rectifying chamber 204 and closely adhered to the lower opening of the cassette 106 so that a large step does not occur in the container. A uniform flow can be obtained in the container.

The contact mechanism 205 is a mechanism for bringing the cassette 106 into close contact with the upper cover 202 and the lower cover 203. The contact mechanism 205 can drive the lower cover 203 up and down. With this contact mechanism 205,
The lower cover 203 is the lowest before the cassette 106 is placed (or removed), rises after the cassette 106 is placed, and its tip reaches the upper cover 202. The lifting by the mechanism 205 stops.

The circulation pump 206 is a liquid pump that circulates the resist stripping liquid stored in the chemical liquid tank 210 and the rinsing liquid supplied by the rinsing liquid supply mechanism 211 in the liquid piping system 213 and the processing container 201. Filter 2
Reference numeral 07 denotes a filter that removes dust and the like from the resist stripping solution that is repeatedly used by circulating.

The liquid supply opening / closing valve 208 and the liquid discharging side opening / closing valve 209 are opened when the resist stripping liquid stored in the chemical tank 210 is circulated in the liquid piping system 213 and the processing vessel 201, and closed at other times. Open / close valve. The drain circuit 212 is a circuit that includes an open / close valve that opens when the rinse liquid supplied from the rinse liquid supply mechanism 211 drains the semiconductor wafer 110 in the processing container 201 after the semiconductor wafer 110 is cleaned. The recovery on-off valve 214 is connected to the processing container 2
This is an opening / closing valve that is opened when the resist stripping liquid supplied to 01 is collected.

The cassette 106 is transported to the processing unit 108 by the transport mechanism 107 shown in FIG. Here, the cassette 106 is sandwiched between the upper cover 202 and the lower cover 203 by the contact mechanism 205 and adhered to form the processing container 201. At this time, the upper cover 202 used in the processing
And the liquid in the lower cover 203 has been removed. The liquid supply side opening / closing valve 208 and the liquid discharge side opening / closing valve 209 provided in the liquid piping system 213 allow the upper cover 20 to be closed.
2 and the supply path of the liquid to the lower cover 203 is shut off.

When the circulation pump 206 is started, the resist stripping solution is sent out from the chemical liquid tank 210, passes through the supply liquid piping system 216, passes through the circulation pump 206, the filter 207, the liquid supply side opening / closing valve 209, and the circulation liquid piping system 215.
After that, the liquid is sent to the rectification chamber 204 provided in the lower cover 203. The resist stripping solution becomes a vortex in the horizontal direction in the rectification chamber 204, flows uniformly on the surface of the semiconductor wafer 110 in the processing chamber 201, and is discharged from the upper cover 202.

The resist stripping liquid discharged from the processing container 201 is returned to the chemical liquid tank 210 through the liquid piping system 213 via the discharge opening / closing valve 208, and the circulation of the resist stripping liquid is repeated during the cleaning process. When the cleaning processing is completed, the recovery opening / closing valve 214 is opened, and all the resist stripping liquid in the processing container 201 is recovered to the chemical liquid tank 210 via the circulating liquid piping system 215. Thereafter, the rinsing liquid is sent from the rinsing liquid supply mechanism 211 to the circulating liquid piping system 215, and is sent to the rectification chamber 204 provided in the lower cover 203. The rinsing liquid rectified here forms a vortex in the horizontal direction, uniformly flows on the surface of the semiconductor wafer 110 in the processing container 201, and is discharged from the upper cover 202.

The rinsing liquid discharged from the processing vessel 201 is discharged to the outside of the processing unit 108 by the drain circuit 212 through the discharge liquid piping system 218. Processing container 20
1 is discharged, the liquid supply side on-off valve 209 is discharged.
The supply of the liquid into the processing container 201 is shut off by the liquid discharge side opening / closing valve 208. Thereafter, when the lower cover 203 is lowered by the contact mechanism 205, the close contact between the cassette 106, the upper cover 202, and the lower cover 203 is released, the cassette 106 and the upper cover 202 are separated, and the cassette 106 is disposed on the lower cover 203. become. Then, the cassette 106 is removed from the processing unit 108 by the transport mechanism 107 (see FIG. 2) and transported to the original place.

FIG. 3 is a detailed structural view of the processing container 201 shown in FIG. The liquid discharge port 301 is a discharge port for discharging the resist stripping liquid and the rinsing liquid. Liquid inlet / drain 3
Reference numeral 02 denotes an injection / discharge port for injecting or discharging a resist stripping liquid and a rinsing liquid. The packing 400a is provided on the upper cover 20 to improve the adhesion to the cassette 106.
2 is a frame-shaped resinous packing attached to 2.
The packing 400b is a frame-shaped resin packing attached to the lower cover 203 in order to improve the adhesion to the cassette 106.

The connection guide 304a is connected to the upper cover 202.
This is a guide provided in the close contact mechanism 205 for guiding the cassette 106 to a fixed position. In addition, the connection guide 30
4b is a cassette 106 provided on the lower cover 203.
Is a guide for guiding to the home position.

When the cassette 106 is transported to the lower cover 203, it is guided to an optimum position by the connection guide 304 attached to the lower cover 203, and
The cassette 106 is disposed on the lower cover 203 via a packing 303b attached to the cassette 03. When the cassette 106 is placed, the lower cover 203 is pushed up by the contact mechanism 205 (see FIG.
6 rises, is guided to the connection guide 304 attached to the upper cover 202, and is brought into close contact with the gasket 400 via the packing 400 attached to the upper cover 202.

For example, as shown in FIG. 8A, a grip 801 that is gripped when the cassette 800 is transported by the transport mechanism 107 or an operator is higher than the semiconductor wafer, such as a conventional cassette that accommodates the semiconductor wafer 110 shown in FIG. If there is, there is a possibility that dust generated due to the handle 801 may be generated and foreign matters that have a significant effect on the semiconductor wafer 110 may adhere. Therefore, the cassette 10 according to the present embodiment is
6, a transfer handle 10 used for transfer to the outer side surface.
The provision of the transfer handle 106a eliminates any risk of dust generation due to the transport handle 106a in a clean room or an apparatus in which a downflow, which is an air flow path, is formed.

Returning to FIG. 3, the resist stripping liquid or the rinsing liquid injected from the liquid injection / discharge port 302 is swirled in the horizontal direction by the rectification chamber 204, and the injected liquid flows in a uniform state. To reach. FIG. 9 shows a mechanism in which a vortex in the horizontal direction is generated by the rectification chamber 204. That is, in FIG.
02 is formed at the bottom end of the rectification chamber 204. In this manner, by forming the inlet / outlet 302 at the bottom end, the liquid injected along the inner peripheral surface of the cylindrical rectifying chamber 204 rotates, and a horizontal vortex can be formed. .

FIG. 9B shows another specific example in which a vortex in the horizontal direction is generated by the rectification chamber 204. In this specific example, the inlet / outlet port 302 is
Four oblong nozzles 902 are provided at the center of the bottom of the nozzle 4 so that the injected liquid jets obliquely and rotates. In the present embodiment, the rectifying chamber 204 has a cylindrical shape, but any shape may be used as long as the vortex in the horizontal direction can be efficiently formed. Therefore, the rectification chamber 204 may be, for example, a cylinder that expands in a tapered shape so that the cross-sectional area increases from bottom to top.

Referring back to FIG. 3, after the resist stripping solution or the rinsing solution fills the rectification chamber 204, the semiconductor wafer 11
0, and reaches the liquid discharge port 301 to be discharged to the outside of the processing container 201. Also,
After the completion of the cleaning process, the resist stripping solution or the rinsing solution is discharged from the injection / discharge port 302.

FIG. 4 shows the packing 4 attached to the cover.
FIG. 7 is a diagram viewed from above (a packing in close contact with the upper cover 202 is shown in the drawing) and a cross-sectional view taken along a line AA. 4 (a) is a packing having a flat connecting surface, FIG. 4 (b) is a packing having a connecting surface projecting in an arc shape, and FIGS. 4 (c) and 4 (d) are one or a plurality of packings all around the connecting surface. Packing with book protrusions. In this manner, by forming the packing 400 in a shape of protruding in an arc shape or providing a projection, it is possible to realize higher adhesion than packing in which the connection surface is flat.

The inner surface of the cassette 106 and the cover 20
2 (203) and the inner surface of the packing 400 are formed so as to be flush with each other. In this way, by making them the same surface, it is possible to prevent the flow of the liquid in the container from being disturbed, and it is possible to prevent particles from accumulating on the protruding portion due to the misalignment of the surface. Becomes

FIG. 7 is a detailed view illustrating the processing container 201 and the contact mechanism 205 shown in FIG. Adhesion mechanism 20
5 is a processing unit base (hereinafter, referred to as a base) 70
1, a cylinder 702 that moves up and down the lower cover 203 and a support rod 703 that supports the upper cover 703.

A cylinder 702 is mounted on a base 701, and a lower cover 203 is provided at the center of the cylinder 702.
Are attached as shown in FIG. Lower cover 2
03 is the origin at the position of the state when it is lowered to the bottom. At this position, there is a space between the lower cover 203 and the upper cover 202 at a predetermined height for the transfer mechanism 107 (or a person) shown in FIG. The upper cover 202 is fixed to the base 701 with a support bar 703 so as to maintain this space. The support bar 703 also serves to prevent the centers of the lower cover 203 and the upper cover 202 from shifting.

When the cassette 106 is placed on the lower cover 203 of the processing unit 108 after the carrying process is performed by the carrying mechanism 107, the lower cover 203 is moved to the cylinder 70 after the carrying mechanism 107 is separated from the processing unit 108.
2 and the cassette 106 is brought into close contact with the upper cover 202 by scissors.

As described above in detail, according to the semiconductor wafer organic resist stripping apparatus according to the present embodiment, by suppressing the evaporation of the components in the resist stripping solution, the deterioration of the resist stripping solution is suppressed, and the life of the resist stripping solution is reduced. Can be lengthened. By suppressing the evaporation of the resist stripping solution or the rinsing solution, the exhaust capacity can be reduced, and the power of the exhaust device, the clean unit and its peripheral devices can be saved. Further, according to the present invention, it is possible to eliminate the surplus liquid that has been filled in the space between the cassette and the inner wall of the processing container, and it is possible to reduce the amount of liquid used.

[0051]

As described in detail above, when the organic resist stripping apparatus for a semiconductor wafer according to the present invention is used, the resist stripping liquid does not come into contact with the outside air, so that the evaporation of the components in the resist stripping liquid is suppressed. And the life of the resist stripping solution can be extended. Further, since the structure is such that the resist stripping solution and the rinsing solution enter only inside the cassette in which the semiconductor wafers are accommodated, there is almost no need for an excess solution other than for processing the semiconductor wafers as compared with the related art.

[Brief description of the drawings]

FIG. 1 is a schematic view showing an embodiment of a processing unit of an organic resist stripping apparatus for a semiconductor wafer according to the present invention.

FIG. 2 is a schematic view showing the entirety of an organic resist stripping apparatus for a semiconductor wafer according to the present invention.

FIG. 3 is a front view of a processing container for cleaning the semiconductor wafer shown in FIG. 1;

FIGS. 4A and 4B are a front view and a cross-sectional view showing a specific example of a packing for bringing a cassette accommodating semiconductor wafers into close contact.

FIG. 5 is a schematic diagram of an organic resist stripping apparatus according to a conventional technique using an open processing tank.

FIG. 6 is a schematic view of a conventional spray-type organic resist stripping apparatus.

FIG. 7 is a schematic diagram showing a processing container for cleaning the semiconductor wafer shown in FIG. 1 and a contact mechanism for bringing a cassette into close contact.

FIG. 8 is an external perspective view of a conventional processing cassette (a) accommodating semiconductor wafers and a processing cassette (b) used in the present embodiment.

FIG. 9 shows an injection / forming device formed at the bottom of the rectifying chamber shown in FIG. 3;
Explanatory drawing which showed the position and shape of the discharge port.

[Explanation of symbols]

101 Unprocessed semiconductor wafer storage cassette setting mechanism 102 Processed semiconductor wafer storage cassette setting mechanism 103 Unprocessed semiconductor wafer storage cassette 104 Processed semiconductor wafer storage cassette 105 Transfer mechanism 106 Processing cassette 106a Transport Handle 107 Transport mechanism 108 Processing unit 109 Drying mechanism 110 Semiconductor wafer 201 Processing container 202 Upper cover 203 Lower cover 204 Rectifying chamber 205 Adhesion mechanism 206 Circulation pump 207 Filter 208 Liquid supply-side open / close valve 209 Liquid discharge-side open / close valve 210 Chemical liquid tank 211 Rinse liquid supply mechanism 212 Drain circuit 213 Liquid piping system 301 Liquid discharge port 302 Liquid injection / discharge port 304 Installation guide 400 Packing

 ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Hiroshi Tanaka 2-3-2 Marunouchi, Chiyoda-ku, Tokyo F-term (reference) 2H096 AA25 LA01 LA03 5F046 MA10

Claims (16)

[Claims] 1. A semiconductor wafer organic resist stripper for removing unnecessary resist adhering to a surface of a semiconductor wafer held in a processing cassette using a resist stripper, wherein the resist stripper is stored. A chemical solution tank, a processing container for removing unnecessary resist attached to the surface of the semiconductor wafer using a resist stripper stored in the chemical solution tank, and a processing container between the chemical solution tank and the processing container. A liquid piping system piped so that a resist stripping liquid can be circulated; and a circulation pump attached to the liquid piping system and circulating the resist liquid, wherein the processing container holds the semiconductor wafer. A semiconductor cassette including a cassette for use, wherein the resist stripping solution supplied from the chemical solution tank does not touch the outside. Organic resist stripping apparatus Eha. 2. The resist stripping apparatus according to claim 1, wherein the processing cassette is a cassette having upper and lower openings, and the opening of the processing cassette is sealed. An organic resist stripping apparatus for a semiconductor wafer, which is mounted on the processing container. 3. The resist stripping apparatus according to claim 2, wherein the processing container includes a first cover that is in close contact with an upper opening of the processing cassette, and a second cover that is in close contact with the lower opening. An organic resist stripping apparatus for a semiconductor wafer, comprising: 4. A resist stripping apparatus according to claim 3, wherein said first cover and said second cover are provided with a cassette mounting guide for positioning at the time of mounting said processing cassette around said cassette. An organic resist stripping apparatus for a semiconductor wafer, wherein the apparatus is arranged. 5. The resist stripping apparatus according to claim 3, wherein one of the first cover and the second cover surrounding the upper opening and the lower opening of the processing cassette and in contact with the openings. Alternatively, an organic resist peeling device for a semiconductor wafer, wherein packing is provided on both. 6. The resist stripping apparatus according to claim 5, wherein the packing is a packing whose contact surface is flat or protrudes in an arc shape, and one or more projections are provided on the contact surface over the entire circumference. An organic resist stripping apparatus for a semiconductor wafer, wherein the apparatus is formed. 7. The resist removing apparatus according to claim 5, wherein the packing is formed so as to be flush with the inner peripheral surface of the cover and the cassette when the processing cassette is mounted. Organic wafer peeling device for semiconductor wafers. 8. The resist stripping apparatus according to claim 3, wherein each of the first cover and the second cover has an injection / discharge port for injecting or discharging a resist stripping liquid or a rinsing liquid. An organic resist stripper for a semiconductor wafer. 9. The resist stripping apparatus according to claim 8, wherein the second cover is provided with a cylindrical rectification chamber serving as a rectification chamber, and the rectification chamber is provided with a vortex in a horizontal direction. An organic resist stripping device for a semiconductor wafer, wherein an injection / discharge port is formed on a side surface of a bottom. 10. The semiconductor device according to claim 9, wherein said second cover has a structure in which a cross section gradually decreases in a tapered shape from a cassette connecting portion toward a rectifying chamber. Wafer organic resist stripper. 11. The resist stripping apparatus according to claim 1, wherein the resist stripping apparatus further includes a foreign substance filter for removing foreign substances from a resist stripping liquid, and an on-off valve provided in the liquid piping system. The resist stripping solution contained in the chemical solution tank is sent out by the circulation pump, supplied to the processing container via the foreign matter removing filter and the opening / closing valve, and the chemical solution discharged from the processing container is opened and closed. A resist stripping apparatus for a semiconductor wafer, wherein the resist is re-stored in a chemical solution tank via a valve. 12. The resist stripping device according to claim 11, wherein the resist stripping device includes a rinsing liquid supply mechanism that can supply at least one kind of rinsing liquid to the processing container. Treating the wafer with a resist stripper, collecting the resist stripper in a chemical tank, supplying a rinsing liquid to the processing container from the rinsing liquid supply mechanism, and rinsing the semiconductor wafer. Resist stripper. 13. The resist stripping apparatus according to claim 12, wherein when the processing cassette holding the semiconductor wafer is not mounted, the on-off valve is closed to prevent leakage of the resist stripping liquid or the rinsing liquid. A resist stripping apparatus for a semiconductor wafer, wherein the resist is stripped. 14. The resist stripping apparatus according to claim 1, wherein the resist stripping apparatus includes a first storage cassette installation mechanism storing unprocessed semiconductor wafers, and stores the processed semiconductor wafers. An installation mechanism for a second storage cassette, from the first storage cassette to the processing cassette,
A mechanism for transferring semiconductor wafers from the processing cassette to a second storage cassette; a transport robot for transporting the processing cassette to a processing container; and a drying mechanism for a processed wafer cleaned in the processing container. A semiconductor wafer resist stripping apparatus. 15. A rectangular upper opening having two opposing first sides slightly wider than the diameter of the semiconductor wafer and having two opposing second sides perpendicular to the first sides; A plurality of slits sandwiching the semiconductor wafer inserted from the upper opening, a third side corresponding to the first side is shorter than the first side, and a third side corresponding to the second side. 4 has a rectangular lower opening having the same length as the second side, and the plurality of slits are formed along the second side, and the upper opening and the lower opening are provided. A processing cassette characterized in that it is open only. 16. The processing cassette according to claim 15, wherein a handle is provided at a predetermined position on an outer surface of the processing robot so that the transport robot carries the processing cassette.