JPH05326588A - Semiconductor manufacture device - Google Patents

Abstract

PURPOSE:To quickly remove the undesired armor resin part by the inferiority in charge of fused resin from of lead frame. CONSTITUTION:In an object the principal part of which is molded with armor resin by shifting a long hoop-shaped lead frame 1 in fixed direction, and fastening the lead frame 1 with top and bottom forces 4 and 5 and charging fused resin in the middle of its carriage, it is checked whether there is any inferiority in charge of the armor resin part 6 of the lead frame 1 or not after molding the lead frame. And a resin inferiority detecting means 13 being the translucent photosensor consisting of a projector 15 and a light receiver 16 and a defective element removing means 14 consisting of a punch 17 and a die 18, for removing the armor resin part 6 inferior in charge being selected by the resin inferiority detecting means 13, are arranged.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus,
More specifically, the present invention relates to a semiconductor manufacturing apparatus that is used for manufacturing a resin-molded semiconductor device and molds a major portion of a long hoop-shaped lead frame that is transported in a fixed direction with an exterior resin.

[0002]

2. Description of the Related Art For example, mini-mold type semiconductor devices are generally manufactured in a lump by using a long metal hoop-shaped lead frame. The main manufacturing steps of this type of semiconductor device are a pellet mounting step of mounting a semiconductor pellet on a lead frame, a wire bonding step of electrically connecting the semiconductor pellet and the lead with a fine metal wire, and a main part including the semiconductor pellet. And a resin molding step of molding the resin with an exterior resin such as an epoxy resin.

A manufacturing line comprising a series of steps in the above semiconductor device will be described with reference to FIG.

In this production line, a long lead wire (1) in the shape of a hoop is stretched at a constant tension and is fed in a fixed direction (in the direction of the arrow in the figure) by a feed mechanism (not shown). To do. Although not shown, in the pellet mounting step, the semiconductor pellet (2) is mounted on the lead frame (1), and in the wire bonding step, the semiconductor pellet (2) and the lead (not shown) are connected to the thin metal wire (3). To electrically connect. Then, the lead frame is supplied to the resin molding process.

In this resin molding process, a manufacturing facility consisting of upper and lower molds (4) and (5) is used, and the lead frame (1) on which wire bonding has been completed is transferred to the upper and lower molds (4).
Although not shown, the upper and lower molds (4) are clamped by (5).
The main part including the semiconductor pellet (2) on the lead frame (1) is resin-molded with the molten resin injected into the cavity from the pot and cull of (5) through the runner and the gate.

The lead frame (1) taken out after the resin molding is hardened to an undesired portion corresponding to the gate which is a connecting portion between the runner and the outer resin portion (6) in addition to the outer resin portion (6). Since the resin (7) is attached, the undesired cured resin (7) is separated and removed from the lead frame (1) after the resin molding.

The separation of the unnecessary cured resin (7) is divided into
The third rollers (8) to (10) are arranged, and the transferred lead frame (1) is bent along the peripheral surfaces of the first to third rollers (8) to (10) in order. This is done by turning around. That is, in the first roller (8), the flexible lead frame (1) bends and turns to the diagonally upper direction in the drawing, whereas the unnecessary cured resin (7) causes the lead frame (1) to move. Is thick and hard, the unnecessary curing resin (7) tries to go straight without going along the first roller (8). As a result, the unnecessary cured resin (7) is separated and removed from the lead frame (1) by being torn off at the connecting portion with the exterior resin portion (6). After that, the lead frame (1) is transferred to the subsequent process through the second and third rollers (9) and (10).

In the subsequent step, the unnecessary cured resin (7) remaining on the lead frame (1) is attached to the lead frame (1) by removing it with equipment including a punch (11) and a die (12). The unnecessary cured resin (7) is completely separated and removed. The lead frame (1) thus obtained is wound around a reel (not shown).

[0009]

By the way, in the resin molding process described above, the lead frame (1) is clamped by the upper and lower molds (4) and (5), and the lead frame (1) is clamped.
The outer resin portion (6) is formed by filling the molten resin into the cavity in which the main part including the semiconductor pellet (2) is arranged.

However, foreign matter such as dust is present in the cavity, and the temperature distribution in the upper and lower molds (4) and (5) varies, which causes defective filling of the molten resin. However, an undesired exterior resin part (6) in which the main part including the semiconductor pellet (2) is not completely covered is formed, and such an exterior resin part (6) is formed.
A semiconductor device having the above is a defective product. Conventionally, the exterior resin portion (6) of the lead frame (1) wound on a reel was visually inspected in a separate process later, but once,
There was a problem that the lead frame (1) stored on the reel had to be unwound and the exterior resin part (6) had to be checked, which was troublesome and workability was extremely poor.

Therefore, the present invention has been proposed in view of the above problems, and an object thereof is to manufacture a semiconductor capable of promptly removing an undesired exterior resin portion due to defective filling of molten resin from a lead frame. To provide a device.

[0012]

As a technical means for achieving the above object, the present invention transfers a long hoop-shaped lead frame in a fixed direction, and during the transfer, the lead frame is moved to the upper and lower molds. In the case where the main part is molded with the exterior resin by clamping with the mold and filling the molten resin, a resin defect that detects the presence or absence of filling failure of the exterior resin part of the lead frame after resin molding the lead frame It is characterized in that the detecting means and the defective element removing means for removing the defective packaging resin portion selected by the resin defective detecting means are arranged.

Further, the resin defect detecting means is composed of a transmissive optical sensor which is arranged in a direction orthogonal to the transfer direction of the lead frame, and the defective element removing means punches out the exterior resin portion having a defective filling. It is preferably composed of a punch and a die.

[0014]

In the semiconductor manufacturing apparatus according to the present invention, it is possible to easily detect the defective filling resin portion by the resin defect detecting means, and further, to detect the defective filling resin portion by the defective element removing means. It can be easily removed from the lead frame, and the finally obtained lead frame has no exterior resin portion with defective filling.

[0015]

Embodiments of the present invention will be described with reference to FIGS. It should be noted that the same or corresponding parts as those in FIG.

A feature of the present invention is that, as shown in FIG. 1, a resin defect detection is performed after the lead frame (1) is resin-molded to detect whether or not there is a filling defect in the exterior resin portion (6) of the lead frame (1). The means (13) and the defective element removing means (14) for removing the defectively filled exterior resin portion (6) selected by the resin failure detecting means (13) are arranged.

Specifically, the resin defect detecting means (13)
Are arranged above and below the lead frame (1) to which the unnecessary cured resin (7) is separated and removed by the first to third rollers (8) to (10), and the projector (15) and its projector ( It is a transmissive optical sensor consisting of a light receiver (16) facing the 15). In this optical sensor (13), the light emitted from the light projector (15) is received by the light receiver (16) via the exterior resin portion (6) of the lead frame (1). The light from the light projector (15) is not shown in the figure, but is the exterior resin part (6).
By using a mask having an opening corresponding to the shape and size of the above, it is set to irradiate only the outer shape region of the exterior resin part (6).

In this optical sensor (13), the lead resin (1) to be transferred is irradiated with light from the projector (15) to the exterior resin part (6), and the transmitted state of the light is received by the receiver. Detect in (16). That is, as shown in FIG. 2A, if the exterior resin part (6) is normal without any defective filling of the molten resin during resin molding, the light irradiation area and the exterior part of the exterior resin part (6) are normal. Since and substantially coincide with each other, the light from the light projector (15) is not incident on the light receiver (16). On the other hand, FIG.
As shown in (b), if the exterior resin portion (6) has a defective filling of the molten resin during resin molding, the light irradiation area and the outer shape of the exterior resin portion (6) do not match, and the projector ( Part of the light from 15) is incident on the light receiver (16). This allows
A resin filling defect in the exterior resin part (6) can be detected, and a defective element removing means (14) described later is operated based on the detection signal from the optical sensor (13).

Next, the defective element removing means (14) is arranged in the subsequent stage of the punch (11) and die (12) for removing the unnecessary cured resin (7) remaining in the lead frame (1), and The lead frame (1) is composed of a punch (17) for punching out the exterior resin part (6) and a die (18). In addition, the punch (17) and the die (18) are separately provided with the punch (11) and the die (12) for removing the remaining unnecessary cured resin (7), and an equipment integrally provided with both. It is also possible to

In this defective element removing means (14), when the defectively filled exterior resin portion (6) is transferred, the punch (17) is based on the detection signal from the optical sensor (13) as described above. Also, the die (18) is operated, and thereby the exterior resin portion (6) is punched out from the lead frame (1). As a result, the lead frame (1) that is subsequently wound around the reel or the like does not have the exterior resin portion (6) that is defectively filled, and only the exterior resin portion (6) that is a good product is stored. Become.

In the above embodiment, the optical sensor (13) was described as the resin defect detecting means, but the present invention is not limited to this, and for example, image recognition by a camera can be applied. is there.

[0022]

According to the present invention, the resin defect detecting means and the defective element removing means are arranged in the middle of the transfer line after the resin molding of the hoop-shaped lead frame. The parts can be reliably detected and removed, the workability is greatly improved and the reliability of the product is dramatically improved, and its practical value is great.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing an embodiment of a semiconductor manufacturing apparatus according to the present invention.

2A and 2B are partial plan views showing a good exterior resin portion, and FIG. 2B is a partial plan view showing a poorly filled exterior resin portion in a detection state by the optical sensor of FIG.

FIG. 3 is a schematic configuration diagram showing a conventional example of a semiconductor manufacturing apparatus.

[Explanation of symbols]

 1 Lead frame 4 Upper mold 5 Lower mold 6 Exterior resin part 13 Resin defect detection means [optical sensor] 14 Defective element removal means

Claims (3)

[Claims] 1. A long hoop-shaped lead frame is transferred in a fixed direction, and during the transfer, the lead frame is clamped by upper and lower molds and filled with molten resin, so that a main part thereof is molded with an exterior resin. In the following, after the resin molding of the lead frame, a resin defect detecting means for detecting the presence or absence of filling failure of the exterior resin portion of the lead frame, and the exterior resin portion with poor filling selected by the detecting means are removed. A semiconductor manufacturing apparatus characterized in that defective element removing means is arranged. 2. The semiconductor manufacturing apparatus according to claim 1, wherein the resin defect detecting means is composed of a transmissive optical sensor arranged in a direction orthogonal to the transfer direction of the lead frame. 3. The semiconductor manufacturing apparatus according to claim 1, wherein the defective element removing means is composed of a punch and a die for punching out the exterior resin portion having a defective filling.