JPH05326586A - Manufacture of ic - Google Patents

Abstract

PURPOSE:To enable the assembling to be performed easily by carrying an IC with a rail for guiding the lateral side face of a mold even if it is the SOP-type IC where the mold is long sideways. CONSTITUTION:When cutting off an IC from a lead frame after assembling the IC in lead frame condition, a plurality of ICs 11 and 12 are cut off in the condition of being coupled by the coupling part 13 consisting of resin. Since it is long in the condition that they are coupled, the carriage of ICs becomes possible, and the assembling becomes easy. After that, the coupling part 13 is cut off, whereby it becomes individual ICs.

Description

Detailed Description of the Invention

[0001]

The present invention relates to SOP (Smale Outlin).
e Package) type IC manufacturing method, especially in the dimension of the mold part, the mold length, which is the dimension perpendicular to the direction in which the external lead leads are drawn, is larger than the mold width, which is the dimension in the same direction as the external lead leads. The present invention relates to a method for manufacturing a short SOP type IC.

[0002]

2. Description of the Related Art A conventional SOP type IC (hereinafter simply referred to as I
In the manufacturing method of (C), first, the IC elements are die-bonded to the lead frame, and the individual IC elements are molded with resin.
It is separated into pieces and assembled in the state of individual IC pieces. After separating the ICs one by one from the lead frame, it is necessary to carry the individual ICs in the subsequent steps. The carrying is performed by using rails that guide the cross-sectional shape of the IC in the mold width direction. In many cases For example,
There is a rail for supplying the IC to the measurement site and for discharging and transporting the IC from the measurement site in the IC characteristic measuring apparatus. Also, in the case of a tube that stores a large number of individual ICs, the inner shape of the tube itself becomes a rail, and
The C is stored in the tube and discharged from the tube.

[0003]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention High-density packaging type I
The shape of C has the same number of external drawers as the length of the side surface of the mold from which the external drawer leads are drawn becomes shorter as the pitch of the external drawer leads becomes narrower or the width of the external drawer leads themselves becomes smaller. The mold length is shorter than that of an IC having leads and not yet densified. Therefore, particularly in the case of a high-density type IC having a small number of external lead-outs, the mold length may be shorter than the mold width, resulting in a horizontally long shape. The assembling of the horizontally long IC does not pose a problem in the process of assembling in the lead frame state, but causes a problem in the assembling process after the lead frame is separated into individual ICs. That is, when an IC in an individual state is conveyed by a rail that guides the cross-sectional shape in the mold width direction, in the case of an IC having a horizontally long shape, if the IC is inclined with respect to the guide direction of the rail, the direction correction is performed. Since the self-help is small, there is a problem that the IC is easily caught on the rail and it becomes difficult to carry the IC on the rail.

This problem will be described with reference to the drawings. FIG. 4 shows a schematic view of a horizontally long IC1 having eight external lead-outs, which is oblique to the rail guide direction and is caught in the middle of the rails 5, 5. Further, FIG. 5 shows a schematic view of a vertically elongated IC 2 in which the mold length is longer than the mold width, in a similar state. As can be seen by comparing these figures, the guide width 3 of the rails 5 and 5 is slightly larger than the mold width 4, but I
Even if C is slanted and comes into contact with the guides 5 and 5, a difference occurs between the guide direction of the rail and the mold length direction. Since the angle 6 of the vertically long IC 2 is small, the self-help of the direction correction is large, and the IC can be easily transported in the rail.
On the other hand, in the horizontally long IC1, since the angle 7 is large, the self-help of the direction correction is small, and it is difficult to carry the IC inside the rail. An object of the present invention is to provide an IC manufacturing method that facilitates rail transportation of an IC having a dimension in the width direction larger than that in the length direction.

[0005]

According to the present invention, after resin molding is performed in a lead frame state to assemble ICs, a plurality of ICs are connected in a mold length direction by a connecting portion formed of resin of resin molding. A step of separating the lead frame from the lead frame in this state, and assembling using a rail that guides the cross-sectional shape in the width direction of the mold in the same state, and then cutting the connecting portion to finally separate the ICs one by one. including.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 shows a first embodiment of the present invention, in which (a)-
(C) is a plan view, a side view, and a front view, respectively. Here, two ICs 1 each having eight external lead-outs 14
The ICs 1 and 12 have a resin-molded shape in which the dimension in the width direction perpendicular to the lengthwise direction of the leads 14 is larger than the dimension in the lengthwise direction. In the above, the connection portion 13 made of the same resin as the resin mold is connected in the longitudinal direction to be integrated.

In this state, assembly is performed after the lead frame is separated. As an example, the IC characteristics are measured by supplying the IC to the measurement site and discharging the IC from the measurement site by using rail transportation, and storing in the IC storage tube used during the assembly process. Discharge from the tube in this state. Then, before the IC is put into the shipping and packaging state, the connecting portion 13 is cut to remove the ICs 11 and 12 from each other.
Are separated, and finally each IC is made. The final IC shape is shown in the plan view of FIG.

As a method of cutting the connecting portion 13, a process of removing the connecting portion 13 with a mold may be used.
Further, since the shape of the connecting portion 13 is determined by the design of the lead frame and the design of the resin sealing mold, it is possible to select the optimum shape. Items to be considered in determining the shape of the connecting portion 13 include the overall rigidity in the connected state and the ease of processing when separating the connecting portion 13 into each IC.

FIG. 3 is a plan view of a second embodiment of the present invention. Here, three ICs 15, 16 and 17 having eight external lead-outs 14 are connected by a connecting portion 18 made of the same resin as the resin mold. It is a top view of the state where it was connected and separated from the lead frame. The side view and the bottom view are omitted. Assembling after separating from the lead frame and finally making ICs one by one are the same as in the first embodiment.

[0010]

As described above, according to the present invention, several pieces are connected to each other when they are separated from the lead frame. Therefore, as a whole shape in the connected state, the dimension of the resin mold is longer than the width direction. Direction becomes large. As a result, the IC conveyance in the rail that guides the cross-sectional shape in the mold width direction is the same as that of the vertically long IC, the rail conveyance becomes easy, and when the assembly after separation from the lead frame is the vertically long IC. It is possible to use the transportation method as it is.

[Brief description of drawings]

FIG. 1 shows a first embodiment of the present invention, in which (a) to (c) are a plan view, a side view, and a front view, respectively.

FIG. 2 is a plan view of the IC of FIG. 1 in a cut state.

FIG. 3 is a plan view of a second embodiment of the present invention.

FIG. 4 is a plan view showing a state in which a conventional horizontally long IC is transported by rail.

FIG. 5 is a plan view showing a conventional vertically-oriented IC on a rail transport state.

[Explanation of symbols]

 11, 12 IC 13 connecting part 14 lead 15 to 17 IC 18 connecting part

Claims (1)

[Claims] 1. A resin molding is performed in a lead frame state to assemble ICs, and then a plurality of ICs are connected to each other in a mold length direction by a connecting portion formed of a resin of the resin mold, and then from the lead frame. The manufacturing of an IC characterized in that after separating and assembling using a rail that guides the cross-sectional shape in the width direction of the mold in the same state, the connecting portion is cut and finally separated into individual ICs. Method.