JPH05323351A - Connecting structural body for liquid crystal panel or the like and thermocompression fixing device for tab - Google Patents

Abstract

PURPOSE:To provide the thermocompression fixing device which improves the reliability of connection by TAB-IC, etc., and is inexpensive without generating an overshoot, etc. CONSTITUTION:The input terminals 105 of the TAB-IC 103 are arranged in the direction perpendicular to the arranging direction of output terminals in the connecting structural body. These terminals are otherwise electrically and electrically connected by an insulating adhesive resin via the rugged parts made to remain without soft etching to the connecting parts exposed after films are removed. The electrical connecting parts of a first circuit board are otherwise electrically connected by a first adhesive to the conductor lead patterns of a second circuit board on the side slightly inner than the ends of the second circuit board and the second circuit board parts on the side outer than these parts are fixed by a second adhesive to the connecting parts of the first circuit board where the flexible insulating films are not removed. The heaters of the device having the heaters for thermocompression fixing of the TAB-IC 103 to a liquid crystal panel are installed by dividing the heaters in compliance with the shapes and number of the adherends.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal driving TAB (Tape Automet) between a liquid crystal panel and its external circuit.
ed Bonding) -IC connection structure and T
The present invention relates to a TAB thermocompression bonding device for thermocompression bonding an AB-IC to a liquid crystal panel, and further to a connection structure using an anisotropic conductive adhesive film in which conductive particles are dispersed in an insulating resin or an insulating adhesive.

[0002]

2. Description of the Related Art In recent years, liquid crystal display devices have come to be used in many places by taking advantage of features such as thinness and low power consumption. TAB for driving liquid crystal used in liquid crystal display device
Since the IC uses a high-priced tape carrier, the ratio of the tape carrier in the cost of the liquid crystal driving TAB-IC is large, and it is not possible to reduce the area of the tape carrier used in the liquid crystal driving TAB-IC. Drive TA
It leads to cost reduction of B-IC. For this reason, the arrangement direction of the input terminals of the liquid crystal driving TAB-IC is
It is often parallel to the direction of arrangement of the output terminals.

Conventionally, as shown in FIG. 13, a liquid crystal panel is connected to an external drive circuit by a film carrier tape in which a copper foil pattern is formed on a flexible insulating film 151 on which a drive IC is mounted, for example. The connection electrode 152 and the ITO electrode 153 of the liquid crystal panel are opposed to each other, and an adhesive agent in which metal particles or resin particles plated with metal are dispersed, that is, an anisotropic conductive film 154 is used to bond the connection electrode 152 and the ITO electrode 153 by thermocompression bonding. A method for establishing a physical and electrical connection is widely known.

Further, the glass substrate of the liquid crystal display device and the TA
As a method for connecting a liquid crystal display element driving circuit board (tape carrier package: hereinafter referred to as TCP) formed by the B method, stress due to thermal expansion, heat shrinkage, etc. of an insulating film is reduced at a TCP connection portion. For,
There is a method in which the insulating film in the connection portion is removed, the conductor lead is exposed, and the anisotropic conductive adhesive film is used for connection.

Further, conventionally, as a TAB thermocompression bonding apparatus for thermocompression bonding a TAB-IC to a liquid crystal panel, one having a structure shown in FIG. 14 is known. In the figure, 250 is a heater body, 251 is a temperature controller, 252, 253 are heater heat sources, 254 is a thermocouple, 255 is a tool, 256 is a thermocompression bonding part, 257 is a TAB-IC, and 258 is a liquid crystal panel.

[0006]

However, when the input terminals of the liquid crystal driving TAB-IC are arranged parallel to the arrangement direction of the output terminals as described above, there are the following problems. That is, in a high-definition liquid crystal display with a large number of pixels, the electrode terminal interval provided in the peripheral portion of the glass substrate of the liquid crystal panel becomes narrower, and accordingly, the terminal interval of the output terminals of the liquid crystal driving TAB-IC also becomes narrower. The width of the liquid crystal driving TAB-IC and the interval between the liquid crystal driving TAB-ICs connected to the liquid crystal panel are narrowed. In such a case, as shown in FIG. 15 and FIG.
The input terminals 351 of the AB-IC 257 are arranged in parallel with the arrangement direction of the output terminals of the liquid crystal driving TAB-IC at the optimum terminal intervals such that short-circuiting and non-connection will not occur in connection with the wiring board. Then, the total length of the arrangement dimension of the input terminals 351 becomes larger than the dimension in the arrangement direction of the output terminals of the output terminal arrangement portion of the liquid crystal driving TAB-IC. When such a liquid crystal driving TAB-IC is used in the above high-definition liquid crystal display, the input terminals of the liquid crystal driving TAB-IC overlap each other and cannot be connected to the wiring board. In addition, as shown in FIG. 16, a liquid crystal driving TAB-I.
If the terminals of the input terminals 351 of the C257 are narrowed and arranged in parallel to the arrangement direction of the output terminals of the liquid crystal driving TAB-IC 257, a problem such as a short circuit or a non-connection may occur in the connection with the wiring board. There is. Note that FIG.
In FIG. 17, 353 is an IC chip, 551 is a liquid crystal panel, and 553 is its electrode terminal.

Further, in the case of a large-sized liquid crystal display, since the cumulative pitch of the electrode terminals provided in the peripheral portion of the liquid crystal panel becomes large, as shown in FIG. 18, the liquid crystal driving TAB-IC is provided to the electrode terminals. Wiring board 65
1 also increases in the arrangement direction of the electrode terminals of the liquid crystal panel, and the dimensional error accordingly increases. As a result, there is a problem in that the input side terminal 351 of the liquid crystal driving TAB-IC and the land 653 of the wiring board 651 are displaced, and the contact area 655 necessary for connection cannot be secured.

On the other hand, in the method of mechanically and electrically connecting by thermocompression bonding through the anisotropic conductive film of FIG.
There is a problem that conductive particles are inevitably present in the space where electrical insulation between adjacent terminals is required, which lowers the reliability of electrical insulation between adjacent terminals. Furthermore, there is a risk that conductive particles between adjacent terminals may be crushed by dust mixed in during thermocompression bonding, or the particles may be lined up continuously to jeopardize insulation between adjacent terminals.

As a means for solving such a problem, as shown in FIG. 19, a film carrier connecting electrode 1 is used.
There is also known a method of electrically and mechanically connecting the 52 and the liquid crystal panel connecting electrode 153 via an insulating and photocurable resin 171. However, the film carrier connecting electrode 152 is soft-etched. It is problematic in connection reliability to keep the connection between the copper foil surface and the liquid crystal panel connection electrode 153 against the residual stress of the film carrier only by the contraction stress of the resin.

On the other hand, in the method of connecting TCP using an anisotropic conductive adhesive film, the connection terminal density of TCP is 10 or less.
When the number is more than this / mm, there is a problem that the strength of the connection lead portion is reduced, and when a force is applied to the TCP from the outside, the connection lead portion is broken.

Further, in the conventional TAB thermocompression bonding apparatus, in order to prevent a decrease in the amount of heat at the end of the thermocompression bonding portion, the heater main body 2
The heater heat source in 50 is divided into 252, 253 and 252, and the heater 253 at the center has a lower heat capacity than the heater 252 at the end. The temperature of the heater divided into three is controlled by the value of the thermocouple 254 installed only in the central portion of the tool 255.

Therefore, in the conventional device, (1)
The three-divided heaters 252 and 253 are used as one temperature controller 25.
Since the temperature is controlled by one and one thermocouple 254, when the heater power is turned on, the central heater 253 reaches the set temperature without overshooting the temperature.
Temperature overshoot occurs at the end heaters 252 and therefore the entire heater 250 and tool 25.
It takes time for the whole 5 to stabilize at the set temperature,
(2) Due to the overshoot of the temperature of the heater 252 at the end portion, only the end portion of the heater body 250 thermally expands to avoid the overshoot, and the heater body itself and the tool 2
55, it is difficult to ensure the flatness of the thermocompression bonding portion 256. (3) Since the heater main body 250 in the tool has a three-divided heat source, it becomes special and the cost per heater main body is high. There are problems such as

The present invention has been made in view of the problems in the above-mentioned conventional example, and is a TAB (Tape Automated B) for driving a liquid crystal between a liquid crystal panel and an external circuit thereof.
onding) -to solve problems in connection such as connection by IC. That is, firstly, in such a connection, it is to prevent a short circuit, a non-connection, a connection failure, etc., and improve the connection reliability. Secondly, it is to provide a thermocompression bonding apparatus in which the temperature quickly reaches the set temperature without a local overshoot when the power is turned on, the flatness of the crimping portion of the tool is maintained and secured, and the cost is low. ..

[0014]

In order to achieve the first object, in the first invention, an output terminal is connected to an electrode terminal provided in a peripheral portion of a liquid crystal panel and an input terminal is wired to the liquid crystal panel. A plurality of liquid crystal driving Ts connected to the substrate
In a connection structure provided with an AB-IC, a TAB-IC
The input terminals of are arranged in a direction perpendicular to the arrangement direction of the output terminals. Here, in the TAB-IC, it is preferable that the dimension in the arrangement direction of the portion where the input terminals are arranged is larger than the dimension in the arrangement direction of the portion where the output terminals are arranged.

According to the second aspect of the invention, the film is removed by exposing the connection electrode led out from the liquid crystal panel and the film carrier on which the liquid crystal driving IC is mounted, and the connection part is exposed. It is characterized in that it is provided with a connection electrode to a liquid crystal panel having an uneven portion left without soft etching, and an insulating adhesive resin electrically and mechanically connecting both connection electrodes. .. Here, the insulating adhesive resin has, for example, a sheet shape and is arranged between both connection electrodes.

According to a third aspect of the present invention, there is provided a flexible insulating film, which is a connecting portion located at an end of the first wiring board, and a plurality of conductor lead patterns formed on the flexible insulating film. In the connecting portion, the flexible insulating film is removed and the connecting portion located at the end portion of the second wiring board connected to the connecting portion of the first wiring board, A connecting structure having a plurality of conductor lead patterns formed on the first wiring board and an adhesive for connecting and connecting the connecting portions of the first wiring board and the second wiring board. Is electrically connected to the conductor lead pattern of the second wiring board by the first adhesive at a position slightly inside the end portion of the second wiring board. Second distribution Substrate portion is characterized in that it is adhered and fixed by the second adhesive to the flexible insulating film is not removed connected portion of the first wiring board. Here, for example, the first wiring substrate is formed by the TAB method using the flexible insulating film as a film carrier to form a conductor pattern on the film carrier, and mounting a semiconductor chip and separating the chips. The second wiring board is a semiconductor device for driving a liquid crystal display element, and
It is a transparent substrate of a liquid crystal display element. As the first adhesive, for example, an insulating resin or an anisotropic conductive adhesive film in which conductive particles are dispersed in the insulating adhesive can be used. The first adhesive may be the same as the second adhesive.

In order to achieve the second object, in the fourth invention, in a TAB thermocompression bonding apparatus provided with a heater for thermocompression bonding the TAB-IC to the liquid crystal panel, the heater has a shape and a number of objects to be bonded. It is characterized by being installed separately according to. Here, it is preferable that each of the heaters has a thermal temperature controller and the temperature can be controlled independently.

[0018]

According to the structure of the first aspect of the invention, the input terminals of the TAB-IC are arranged at right angles to the arrangement direction of the output terminals, so that the intervals between the input terminals of the TAB-IC are short-circuited in connection with the wiring board. It can be set to an optimum size that does not cause non-connection. In addition, as the size of the liquid crystal panel increases, the contact area required to connect the input terminal of the TAB-IC and the land of the wiring board increases even if the dimensional tolerance of the total length of the wiring board in the electrode terminal arrangement direction of the liquid crystal panel increases. Is secured. Therefore, the connection between the TAB-IC and the wiring board is performed reliably and with high reliability.

Further, according to the structure of the second invention, the film carrier having the liquid crystal driving IC mounted thereon is provided, and the connecting portion has a so-called overhang structure in which the film is exposed by being removed by punching or the like, and The exposed part has a connection electrode to the liquid crystal panel which has a concavo-convex part left without being soft-etched, and is electrically and mechanically connected by thermocompression bonding using an insulating adhesive resin. The electric connection with the connection electrode of the liquid crystal panel is made and the adhesive force is enhanced by the exposed concavo-convex portion of the connection electrode portion, for example, 2 to 3 μm, which is present on the adhesive surface side with the flexible film. In addition, since there is no conductive substance between the adjacent connection electrodes, the electrical insulation between the adjacent connection electrodes is maintained with high reliability.

According to the structure of the third invention, the electrically connecting portion of the first wiring board is first bonded to the conductor lead pattern of the second wiring board slightly inside the end portion of the second wiring board. The second wiring board portion outside the electrical connection portion is bonded to the connection portion of the first wiring board where the flexible insulating film is not removed by the second adhesive while being electrically connected by the agent. Since it is fixed so that even if a force is applied to the first wiring board from the outside,
The fixing of the second adhesive prevents the force from being applied to the electrical connection portion, and the electrical connection is maintained with high reliability.

Further, according to the structure of the fourth invention, the temperature adjustment of the heater at the end is performed by the temperature adjuster provided at the end, and the temperature adjustment of the heater at the center is provided at the heater at the center. A temperature controller operates to separately heat the heaters at each location in the tool. Therefore, the local temperature overshoot generated in the conventional heater is eliminated. Therefore, the time required to stabilize the set temperature of the heater body is shortened, and since the overshoot is eliminated, the flatness of the crimp portion of the tool is maintained and secured. Further, the heater body itself does not need to be a special one such as a heat source divided into three, and the cost per heater is low.

[0022]

Embodiments of the present invention will be described below with reference to the drawings. Example 1 FIG. 1 is a schematic view showing a liquid crystal device connected by a liquid crystal driving TAB-IC constituting a connection structure according to a first example of the present invention. In this device, the liquid crystal panel 1
Electrode terminal 102 provided on the periphery of the glass substrate 01
On the other hand, a liquid crystal driving TAB-having the IC chip 106
The output terminal of the IC 103 is connected via an anisotropic conductive film (not shown), and the wiring board 104 is connected to the input terminal 105 of the liquid crystal driving TAB-IC 103 by soldering or the like.

By the way, conventionally, as shown in FIG. 5, in a liquid crystal driving TAB-IC 257 such as used for a high definition liquid crystal panel 551 having a large number of pixels, a liquid crystal driving TA is used.
The terminal interval of the output terminals of the B-IC is narrowed, the width of the TAB-IC 257 for driving the liquid crystal is narrowed, and the electrode terminals 5 provided on the periphery of the glass substrate of the liquid crystal panel 551 are arranged.
Since the interval between the liquid crystal driving TAB-ICs 257 connected to the 53 is narrowed, the terminal intervals of the input terminals 351 of the liquid crystal driving TAB-ICs are short-circuited to the connection with the wiring board 651.
TAB for liquid crystal drive at the optimum interval that does not cause disconnection
It was not possible to arrange them in parallel to the arrangement direction of the output terminals of IC257.

However, even in such a case, according to the configuration of the present embodiment, the liquid crystal driving TAB-IC 103 is used.
The input terminal 105 of the electrode terminal 10 of the liquid crystal panel 101.
Since the liquid crystal driving TAB-IC 103 to be connected to the output terminals 2 is arranged so as to be perpendicular to the arrangement direction of the output terminals, the terminal intervals of the input terminals 105 are set to the wiring board 1.
It is possible to arrange them with the optimum size so as not to cause a short circuit, a non-connection or the like in the connection with 04. In addition, by arranging the input terminals 105 in a plurality of columns as shown in FIG.
The area of the B-IC 103 can be suppressed to be small, and the cost can be reduced.

Further, conventionally, when the liquid crystal panel 551 is, for example, a large 24-inch liquid crystal panel, the liquid crystal panel 55 is used.
Since the cumulative pitch of the electrode terminals 553 provided in the peripheral portion of No. 1 becomes large, the liquid crystal driving TAB-
The wiring board 354 connected via the IC 257 also becomes large in the arrangement direction of the electrode terminals 553 of the liquid crystal panel, and the dimensional error of the total length of the wiring board 651 in the arrangement direction of the electrode terminals 553 of the liquid crystal panel becomes so large that it cannot be ignored. The liquid crystal driving T in which the arrangement direction of the input terminals 351 is arranged parallel to the arrangement direction of the output terminals on the wiring board 651.
When the AB-IC257 is connected, X2-X2 'in FIG.
As shown in FIG. 18, which is a cross-sectional view, the distance between the contact portion 655 of the input terminal 351 and the land 653 in the electrode terminal arrangement direction of the liquid crystal panel is reduced by the error in the position of the land 653 of the wiring board 651. For example, the contact area when soldered by the soldering tool is (contact area) = {(land width)-(positional error)} × (soldering tool width). However, (land outline) = (input terminal outline).

However, even in such a case, according to this embodiment, as shown in FIG. 2, the liquid crystal driving TAB in which the arrangement direction of the input terminals 105 is arranged at right angles to the arrangement direction of the output terminals. Since the IC 103 is used, as shown in FIG. 3 which is a cross-sectional view taken along line X1-X1 ′ of FIG.
Even if an error occurs in the position of, the error direction of the position of the land is the longitudinal direction of the input terminal 105 and the land 107, and moreover, the width of the soldering tool relative to the longitudinal dimension of the input terminal 105 and the land 107. Is sufficiently small, the distance between the contact portion 108 of the input terminal 105 and the land 107 in the arrangement direction of the electrode terminals 102 of the liquid crystal panel does not change,
The dimensional error of the wiring board 104 depends on the input terminal 105 and the land 1.
It does not affect the connection of 07.

As described above, the TAB-IC for driving the liquid crystal
When the arrangement direction of the input terminals 105 of the liquid crystal display device 103 is arranged at a right angle to the arrangement direction of the output terminals, the liquid crystal driving TAB-ICs 103 connected to the electrode terminals 102 provided on the periphery of the glass substrate of the liquid crystal panel 101. Even if the interval is narrow or the dimensional tolerance of the total length of the wiring board 104 in the arrangement direction of the electrode terminals 102 of the liquid crystal panel becomes large, the liquid crystal driving T
It is possible to arrange the terminal intervals of the input terminals 105 of the AB-IC 103 in an optimum dimension that does not cause a short circuit, a non-connection or the like in connection with the wiring board 104, and to connect the land between the input terminal 105 and the wiring board 104. It is possible to provide a liquid crystal driving TAB-IC 103 that can secure a necessary contact area and can reliably and reliably connect the input terminal 105 of the liquid crystal driving TAB-IC 103 and the wiring board 104. it can.

Embodiment 2 FIG. 4 is a perspective view showing a connection portion of a connection structure according to a second embodiment of the present invention, and FIG. 5 is a sectional view taken along line XX ′ of FIG. As shown in these drawings, in this connection portion, the connection electrode portion of the film carrier 401 on which the drive circuit 410 is mounted has a so-called overhang structure in which the flexible film 401 is removed to expose the copper foil pattern 402. Has become. In addition, the adhesive surface of the copper foil pattern 402 to the flexible film 401 is 2 to increase the adhesive force to the flexible film 401 without soft etching.
The unevenness 506 of 3 μm is left.

Then, the exposed side of the connection electrode portion of the copper foil pattern 402 to the flexible film 401 is made to face the liquid crystal panel connection electrode 403, and both are heated via the insulating adhesive resin 405. Electrical and mechanical connections are made by crimping. As a result, the unevenness 506 of 2 to 3 μm for increasing the adhesive force of the copper foil 402 to the flexible film 401 has the liquid crystal panel connection electrode 40.
3 plays a role of a minute contact point, and high connection reliability can be obtained.

It has been confirmed by a thermal shock test that this connection reliability is higher than the connection reliability when the copper foil 402 is connected using the side opposite to the adhesive surface of the copper foil 402 to the flexible film 401. Further, when the same connection is performed using the surface of the copper foil 402 that is soft-etched, the connection reliability of the connection electrode having the overhang structure is the same as that of the connection electrode having the structure in which the flexible film is left in the connection portion. It was also confirmed by a thermal shock test that the connection reliability was higher than when used.

The insulating adhesive 405 is preferably in the form of a sheet from the viewpoint of workability. Insulating adhesive 405
Is preferably located between the film carrier and the liquid crystal panel connection electrode 403. For example, it is possible to position the insulating adhesive 405 on the side of the film carrier that does not face the liquid crystal panel and bond the insulating adhesive 40.
It has been confirmed by an experiment that the connection reliability is higher when 5 is located between the film carrier and the liquid crystal panel connection electrode 403.

Further, the unevenness 50 of 2 to 3 μm on the adhesion surface of the exposed electrode used for connection here to the film carrier.
No. 6 is inevitably present in the production of the film carrier and does not cause any cost increase.

Embodiment 3 FIG. 6 is a schematic sectional view showing a connecting portion of a connecting structure according to a third embodiment of the present invention. At this connecting portion, the insulating film 603 of the liquid crystal driving semiconductor device, in which the semiconductor chip 106 is mounted by the TAB method and separated individually, is removed and the conductor lead 604 is exposed.
Part is positioned inside the end of the glass substrate 601 of the liquid crystal display element, and the exposed conductor lead 604 and the electrode terminal 602 formed on the glass substrate 601 of the liquid crystal display element are electrically conductive particles in the insulating adhesive 605. The anisotropic conductive adhesive film 615 in which 606 is dispersed is used to electrically connect to the A portion, and the end portion of the glass substrate 601 and the conductor lead 604 are electrically connected.
The portion B held by the insulating film 603 is adhesively fixed by an insulating adhesive 607. Reference numeral 610 is a protruding electrode, and 609 is a sealing resin.

According to this, since the glass substrate 601 and the liquid crystal driving semiconductor device are adhered and fixed to the portion B by the adhesive 607, even if external force is applied to the liquid crystal driving semiconductor device, It is possible to prevent breakage of the conductor lead 604 without being added to the conductor lead 604 of the portion A.

Although the conductor lead 604 of the semiconductor device and the electrode terminal 602 on the glass substrate are connected by thermocompression bonding through the anisotropic conductive adhesive film 615 at the portion A, a thermosetting insulating adhesive is used. It is also possible to connect by thermocompression bonding via an agent. In addition, as shown in FIG. 7, the insulating film 603 side of the semiconductor device may be arranged so as to face the glass substrate 601 side.

Further, as shown in FIGS. 8 and 9, the adhesives used in the parts A and B can be the same kind.
Further, even if the electrode terminal 602 extends to the B part, the connection structure of the present invention is possible. In that case, in the configuration of FIGS. 6 and 8, the B part can also be electrically connected. You can

Embodiment 4 FIG. 10 shows the construction of a TAB thermocompression bonding apparatus (TAB thermocompression bonding heater) according to a fourth embodiment of the present invention. In the figure, 900 is a heater, 901 is a temperature controller, 902 is a thermocouple, 903 is a tool, 904 is a thermocompression bonding part, and 905 is T.
AB-IC, 906 is a liquid crystal panel.

Next, the features of the fourth embodiment will be described. The heater 900 is the adherend TAB-IC905.
, Or more, and the temperature control of those heaters is performed by a temperature controller 901 and a thermocouple 902. In addition, the temperature controller 901 and the thermocouple 902 are independently installed in each heater, and each heater is optimally temperature-controlled, and when the heater power is turned on, the temperature at the end is the same as in the conventional heater. No overshoot will occur. In addition, since this overshoot does not occur, the time required to stabilize the set temperature of the entire tool is shortened. For the same reason, the excessive thermal expansion due to the overshoot at the temperature of the end of the conventional heater is eliminated, and the flatness of the tool 903 and the thermocompression bonding portion 904 is improved. Further, since the heater 900 does not need a special one such as the conventional heat source divided into three parts type, the cost is low and the heater 900 can be easily replaced even when the heater is broken.

Embodiment 5 FIG. 11 shows a fifth embodiment of the present invention. In the figure,
The same or corresponding members as in FIG. 10 are designated by the same reference numerals. This embodiment is particularly suitable for the case where the temperature drop is remarkable in the edge portion direction 907 of the thermocompression bonding portion 903 when the apparatus of the fourth embodiment is used, and the number of heaters to be bonded is increased by adding a heater in the edge direction. This is intended to prevent the temperature drop occurring in the above-mentioned edge direction by increasing the number of TAB-IC905s that are the objects.

Embodiment 6 FIG. 12 shows a sixth embodiment of the present invention. In the figure, members designated by the same reference numerals as those in FIG. 10 are common to those in FIG.
This embodiment is used when there is a material 310 to which the pressure is not applied such as a projection or a material such as a tape-like material to which heat is not applied 310 on the liquid crystal panel 906 of the adherend in the fourth embodiment. The heater 900 is provided only in the place where the tool is concave and thermocompression bonded. This makes it possible to distinguish between the environment of the crimped portion and the non-crimped portion (where no pressure or heat is applied), and thermocompression bonding is possible without being restricted by the shape or property of the crimped object. Figure 1
In 2, the reference numeral 309 is a concave tool.

[0041]

As described above, according to the present invention, it is possible to solve problems such as reliability in a connection structure such as a connection between a liquid crystal panel and its external circuit by a liquid crystal driving TAB-IC.

That is, according to the first invention, the TAB-IC
Each input terminal interval of, short circuit in the connection with the wiring board,
It is possible to set an optimum size that does not cause non-connection. In addition, as the size of the liquid crystal panel increases, the contact area required to connect the input terminal of the TAB-IC and the land of the wiring board increases even if the dimensional tolerance of the total length of the wiring board in the electrode terminal arrangement direction of the liquid crystal panel increases. Can be secured. Therefore, the reliability and reliability of the connection between the TAB-IC and the wiring board can be improved.

Further, according to the second aspect of the present invention, the exposed connection electrode portion, for example, a concavo-convex portion having a thickness of, for example, 2 to 3 μm, which is present on the adhesive film side with the flexible film, electrically connects with the connection electrode of the liquid crystal panel. By taking a connection, the adhesive strength is increased,
In addition, since there is no conductive substance between the adjacent connection electrodes, the electrical insulation between the adjacent connection electrodes can be maintained with high reliability.

Further, according to the third invention, even when a force is applied to the first wiring board from the outside, the force is prevented from being applied to the electrical connection portion by the fixing portion by the second adhesive. Therefore, the electrical connection can be maintained with high reliability.

Further, according to the fourth aspect of the invention, the temperature control for the heater in the tool of the thermocompression bonding machine is optimized as a whole, and it is possible to prevent the occurrence of temperature overshoot in a part when the heater power is turned on. By preventing the temperature overshoot from occurring, it is possible to shorten the time required for the tool to reach the set temperature and stabilize, and to prevent the temperature overshoot from occurring at the location of the tool. As a result, the expansion of the entire tool due to heat becomes uniform, the flatness of the tool and the thermo-compression bonding part at the tool tip end becomes good, and the heater itself does not need to be of a special shape like a conventional heater, and a single heater is used. It is possible to reduce the cost per hit, and in the case of the conventional heater, all the heaters should be replaced when a disconnection occurs in the heater. It is necessary, in the embodiment of the present invention, the corner only to exchange only occurred heater disconnection, heater exchange is facilitated.

[Brief description of drawings]

1 and 2 are schematic views showing a liquid crystal device connected by a liquid crystal driving TAB-IC forming a connection structure according to a first embodiment of the present invention.

FIG. 3 is a sectional view taken along line X1-X1 ′ of FIG.

FIG. 4 is a perspective view showing a connection portion of a connection structure according to a second embodiment of the present invention.

5 is a cross-sectional view taken along line X-X ′ of FIG.

6 to 9 are schematic cross-sectional views showing a connection portion of a connection structure according to a third embodiment of the present invention.

FIG. 10 is a schematic view of a thermocompression bonding heater according to a fourth embodiment of the present invention.

FIG. 11 is a schematic view of a thermocompression bonding heater according to a fifth embodiment of the present invention.

FIG. 12 is a schematic view of a thermocompression bonding heater according to a sixth embodiment of the present invention.

FIG. 13 is a cross-sectional view showing a conventional connection structure using an anisotropic conductive film.

FIG. 14 is a schematic view of a conventional TAB thermocompression bonding heater.

FIG. 15 is a schematic view showing a conventional liquid crystal driving TAB-IC.

FIG. 16 is a schematic view showing another conventional liquid crystal driving TAB-IC.

17 is a schematic diagram showing an example of a large-sized liquid crystal display device using the liquid crystal driving TAB-IC of FIG.

18 is a cross-sectional view taken along line X2-X2 ′ of FIG.

FIG. 19 is a cross-sectional view showing a connection structure using another conventional anisotropic conductive film.

[Explanation of symbols]

101: liquid crystal panel, 102: electrode terminal, 103: liquid crystal driving TAB-IC, 104: wiring board, 105: input terminal, 106: IC chip, 107: land, 108:
Contact part, 401: flexible film, 402: copper foil pattern, 403: liquid crystal panel connection electrode, 405: adhesive resin,
410: drive circuit, 506: unevenness, 601: glass substrate, 602: electrode terminal, 603: insulating film, 60
4: conductor lead, 605: insulating adhesive, 606: conductive particles, 607: adhesive, 615: anisotropic conductive adhesive film, 9
00: heater body, 901: temperature controller, 902: heater heat source, 903: heater heat source, 904: thermocouple, 90
5: Tool, 906: Thermocompression bonding part, 907: TABIC,
908: Liquid crystal panel, 900: Heater, 901: Temperature controller, 902: Thermocouple, 903: Tool, 904: Thermocompression bonding part, 905: TABIC, 906: Liquid crystal panel, 90
7: Edge of thermocompression bonding portion, 908: Heater (sub), 30
9: concave tool, 390: non-thermocompression protrusion or tape.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takao Miyamoto 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc.

Claims (12)

[Claims] 1. A plurality of liquid crystal driving TAB-in which an output terminal is connected to an electrode terminal provided in a peripheral portion of a liquid crystal panel and an input terminal is connected to a wiring board to the liquid crystal panel.
A connection structure including an IC, wherein the input terminals of the TAB-IC are arranged in a direction perpendicular to the arrangement direction of the output terminals. 2. The connection structure according to claim 1, wherein in the TAB-IC, the dimension of the portion where the input terminals are arranged in the arrangement direction is larger than the dimension of the portion where the output terminals are arranged in the arrangement direction. 3. A connection electrode led out from the liquid crystal panel,
It is provided on a film carrier that has a liquid crystal drive IC, and the connection part is exposed by removing the film.
And a connecting electrode to the liquid crystal panel having a concavo-convex portion left on the exposed portion without soft etching, and an insulating adhesive resin electrically and mechanically connecting both these connecting electrodes. A connection structure characterized by the above. 4. The connection structure according to claim 3, wherein the insulating adhesive resin has a sheet shape. 5. The connection structure according to claim 3, wherein the insulating adhesive resin is arranged between both connection electrodes. 6. A connecting portion located at an end of the first wiring board, which has a flexible insulating film and a plurality of conductor lead patterns formed thereon, and has an electrical connecting portion. The flexible insulating film is removed, and the connecting portion located at the end portion of the second wiring substrate connected to the connecting portion of the first wiring substrate is formed on the insulating substrate and the connecting portion. A connection structure comprising a plurality of conductor lead patterns and an adhesive for connecting and connecting the connection portions of the first wiring board and the second wiring board to electrically connect the first wiring board. The portion is electrically connected to the conductor lead pattern of the second wiring board by the first adhesive slightly inside the end portion of the second wiring board, and the second wiring board outside this electrical connection portion is formed. Part is the first wiring A connection structure, wherein the flexible insulating film of the substrate is adhered and fixed by a second adhesive to the connection portion where the flexible insulating film is not removed. 7. The first wiring board is formed by the TAB method using the flexible insulating film as a film carrier to form a conductor pattern on the film carrier, and mounting a semiconductor chip and separating each chip. 7. The connection structure according to claim 6, wherein the connection structure is a semiconductor device for driving a liquid crystal display element, and the second wiring board is a transparent substrate of the liquid crystal display element. 8. The connection structure according to claim 6, wherein the first adhesive is an insulating resin. 9. The connection structure according to claim 6, wherein the first adhesive is an anisotropic conductive adhesive film in which conductive particles are dispersed in an insulating adhesive. 10. The connection structure according to claim 6, wherein the first adhesive is the same as the second adhesive. 11. An apparatus comprising a heater for thermocompression bonding a TAB-IC to a liquid crystal panel, wherein the heater is divided and installed according to the shape and number of objects to be adhered. TAB thermocompression bonding device. 12. The thermocompression bonding apparatus according to claim 11, wherein each of the heaters has a thermal temperature controller, and the temperature can be controlled independently.