JPH0531230U - Capillary - Google Patents
CapillaryInfo
- Publication number
- JPH0531230U JPH0531230U JP079633U JP7963391U JPH0531230U JP H0531230 U JPH0531230 U JP H0531230U JP 079633 U JP079633 U JP 079633U JP 7963391 U JP7963391 U JP 7963391U JP H0531230 U JPH0531230 U JP H0531230U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- capillary
- present
- application example
- ball
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4845—Details of ball bonds
- H01L2224/48451—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
- H01L2224/78303—Shape of the pressing surface, e.g. tip or head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10161—Shape being a cuboid with a rectangular active surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】
【目的】ボンディングを安定化させる。
【構成】ボール・ボンダーに使用するキャパラリー１の
ボンディング面を溝１１を有して、ボンディングの場合
にボンディグワイヤのホールド性を高める。
(57) [Summary] [Purpose] To stabilize bonding. [Structure] A bonding surface of a capillary 1 used for a ball bonder has a groove 11 to enhance the holdability of a bonding wire in the case of bonding.
Description
【０００１】[0001]
本考案はボール・ボンディングに使用するキャピラリーに関する。 The present invention relates to capillaries used for ball bonding.
【０００２】[0002]
従来、この種のキャピラリーは、ボンディング面の形状がフラット形状か、又 はテーパー形状か、もしくはＲ形状となっていた。 Conventionally, in this type of capillary, the bonding surface has a flat shape, a tapered shape, or an R shape.
【０００３】[0003]
上述した従来のキャヒラリーは、ボンディング面の形状がフラット形状か、又 はテーパー形状か、もしくは、Ｒ形状となっているので、超音波エネルギー及び 荷重を効果的にボンディング点に伝えることができず、被ボンディング面が汚染 されている、もしくは、平坦性がないところでは、ボンディングがつきにくく、 はがれやすいという欠点がある。 Since the bonding surface of the above-mentioned conventional cachary has a flat shape, a tapered shape, or an R shape, ultrasonic energy and load cannot be effectively transmitted to the bonding point. However, when the surface to be bonded is contaminated or has no flatness, it is difficult to bond and easily peels off.
【０００４】[0004]
本考案のキャピラリーは、ボール・ボンダーに使用するキャピラリーにおいて 、ボンディング面に溝を有している。 The capillary of the present invention has a groove on the bonding surface in a capillary used for a ball bonder.
【０００５】[0005]
次に、本考案について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
【０００６】 図１は本考案の一実施例を示し、（ａ）は本実施例の斜面図、（ｂ）は（ａ） に示すＡ部の拡大断面図、（ｃ）は（ｂ）のＢ方向から見た底面図である。FIG. 1 shows an embodiment of the present invention. (A) is a perspective view of this embodiment, (b) is an enlarged cross-sectional view of part A shown in (a), and (c) is (b). It is a bottom view seen from the B direction.
【０００７】 図１において、本実施例のキャピラリー１は先端Ａ部の底面にキャピラリー１ の中心軸を中心とした円周に凹状の溝１１を有した構造となっている。In FIG. 1, the capillary 1 of this embodiment has a structure in which a concave groove 11 is provided on the bottom surface of the tip A portion in the circumference around the center axis of the capillary 1.
【０００８】 図２は図１に示す本実施例の一適用例を示す図、図３および図４はそれぞれ図 ２に示す本適用例におけるボンディングの第１および第２工程を示す図、図５は 図２に示す本適用例におけるボンディングワイヤの接続状態を示す図である。FIG. 2 is a diagram showing one application example of the present embodiment shown in FIG. 1, FIGS. 3 and 4 are diagrams showing first and second bonding steps in the present application example shown in FIG. 2, respectively. FIG. 9 is a diagram showing a connection state of bonding wires in the application example shown in FIG. 2.
【０００９】 次に、本実施例の使用方法について図２〜図５を用いて説明する。Next, a method of using this embodiment will be described with reference to FIGS.
【００１０】 図２において、本適用例は、超音波ボール・ボンダー（図示省略）に取り付け られたホーン４の先端に本実施例のキャピラリー１が装着されてあり、ＩＣのペ レット２とリード端子３間をキャピラリー１を通ったボンディングワイヤ５で接 続する構成となっている。In FIG. 2, in this application example, the capillary 1 of this embodiment is attached to the tip of a horn 4 attached to an ultrasonic ball bonder (not shown), and the pellet 2 and the lead terminal of the IC are mounted. A bonding wire 5 passing through the capillary 1 connects between the three.
【００１１】 図３において、先ず、ボンディングの第１工程として、キャピラリー１を通っ たボンディングワイヤ５はキャピラリー１の先端で超音波ボール・ボンダーによ ってボール５が自動的に形成され、ペレット２へボンディング（１ｓｔボンディ ング）が行なわれる。In FIG. 3, first, as the first step of bonding, the bonding wire 5 passing through the capillary 1 is automatically formed into a ball 5 by an ultrasonic ball bonder at the tip of the capillary 1 and the pellet 2 Bonding (1st bonding) is performed.
【００１２】 このとき、ホーン４から超音波加圧がキャピラリー１に伝えられ、ボール６が 溝１１によってホールドされた状態で、図３に示すようにペレット２とボール６ との接合が行われる。At this time, ultrasonic pressure is transmitted from the horn 4 to the capillary 1 and the pellets 2 and the balls 6 are joined as shown in FIG. 3 in a state where the balls 6 are held by the grooves 11.
【００１３】 次に、第２の工程として、図４に示すように、上述の第１の工程と同じ方法で ペレット２に接合したワイヤ５とリード端子３との接合（２ｎｄボンディング） が行われる。この結果、図５に示すように、ペレット２とリード端子３とがボン ディングワイヤ５を介して接続される。Next, as a second step, as shown in FIG. 4, the wire 5 bonded to the pellet 2 and the lead terminal 3 are bonded (2nd bonding) by the same method as the above-described first step. .. As a result, as shown in FIG. 5, the pellet 2 and the lead terminal 3 are connected via the bonding wire 5.
【００１４】[0014]
以上説明したように本考案は、キャピラリーのボンディング面に溝を有するこ とにより、ボンディングワイヤーのホールド性を高めるので、ボール・ボンダー 本体からの超音波エネルギー及び加圧力を効果的にボンディング点に伝えること ができ、被ボンディング面が汚染されているか、もしくは平坦性のない部分でも 、ボンディングを安定させることができる効果がある。 As described above, the present invention has a groove on the bonding surface of the capillary to enhance the holdability of the bonding wire, so that ultrasonic energy and pressure from the ball bonder body are effectively transmitted to the bonding point. Therefore, the bonding surface can be stabilized even if the surface to be bonded is contaminated or has no flatness.
【図１】本考案の一実施例を示し、（ａ）は本実施例の
側面図、（ｂ）は（ａ）に示すＡ部の拡大断面図、
（ｃ）は（ｂ）のＢ方向から見た底面図である。1 shows an embodiment of the present invention, (a) is a side view of this embodiment, (b) is an enlarged sectional view of a portion A shown in (a), FIG.
(C) is a bottom view seen from the B direction in (b).
【図２】図１に示す本実施例の一適用例を示す図であ
る。FIG. 2 is a diagram showing an application example of the present embodiment shown in FIG.
【図３】図２に示す本適用例におけるボンディングの第
１工程を示す図である。FIG. 3 is a diagram showing a first bonding step in the present application example shown in FIG. 2;
【図４】図２に示す本適用例におけるボンディングの第
２工程を示す図である。FIG. 4 is a diagram showing a second bonding step in the application example shown in FIG. 2;
【図５】図２に示す本適用例におけるボンディングワイ
ヤの接続状態を示す図である。FIG. 5 is a diagram showing a connection state of bonding wires in the application example shown in FIG.
１ キャピラリー ２ ペレット ３ リード端子 ４ ホーン ５ ボンディングワイヤ ６ ボール １１ 溝 1 Capillary 2 Pellet 3 Lead terminal 4 Horn 5 Bonding wire 6 Ball 11 Groove
Claims (1)
ーにおいて、ボンディング面に溝を有することを特徴と
するキャピラリー。1. A capillary used in a ball bonder, wherein the bonding surface has a groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP079633U JPH0531230U (en) | 1991-10-01 | 1991-10-01 | Capillary |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP079633U JPH0531230U (en) | 1991-10-01 | 1991-10-01 | Capillary |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0531230U true JPH0531230U (en) | 1993-04-23 |
Family
ID=13695493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP079633U Pending JPH0531230U (en) | 1991-10-01 | 1991-10-01 | Capillary |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0531230U (en) |
-
1991
- 1991-10-01 JP JP079633U patent/JPH0531230U/en active Pending
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