JPH05309303A - Apparatus for coating hard substrate - Google Patents

Apparatus for coating hard substrate

Info

Publication number
JPH05309303A
JPH05309303A JP14096892A JP14096892A JPH05309303A JP H05309303 A JPH05309303 A JP H05309303A JP 14096892 A JP14096892 A JP 14096892A JP 14096892 A JP14096892 A JP 14096892A JP H05309303 A JPH05309303 A JP H05309303A
Authority
JP
Japan
Prior art keywords
substrate
suction rod
suction
stopper
bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14096892A
Other languages
Japanese (ja)
Inventor
Shinya Yamazaki
信哉 山崎
Hiroshi Matsuoka
寛 松岡
Hirofumi Kumagai
広文 熊谷
Masabumi Ozaki
正文 尾崎
Tatsuya Emoto
辰弥 江本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Holdings Corp
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Priority to JP14096892A priority Critical patent/JPH05309303A/en
Publication of JPH05309303A publication Critical patent/JPH05309303A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask

Landscapes

  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To transfer a substrate smoothly when an excessive liquid is removed by a suction rod by installing a controller which transfers the substrate with a substrate stopper made free by contacting a press roller with the substrate while the coated substrate being stopped by the substrate stopper. CONSTITUTION:The following parts are installed: a pass roll 12 which transfers a substrate 10; a suction rod 22 having a suction opening at its upper part; a substrate detecting sensor 34 and a substrate stopper 36 which are installed in the transfer direction of the substrate 10 apart from the suction rod 22; a press roller 38 which contacts and separates the upper surface of the substrate 10; a suction pump which actuates the suction rod 22. By a controller, the substrate 10 is transferred while the coated substrate being stopped by a substrate stopper 36 according to the output of the substrate detecting sensor 34, the suction rod 22 being contacted with the substrate 10 at around its rear end to draw the substrate 10, the press roller 38 being contacted with the substrate 10, and the substrate stopper 36 being made free.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ガラス基板を用いた液
晶表示板などの製造に用いられ、フォトレジストなどの
塗布液を硬基板に薄く均一に塗布するための硬基板塗布
装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hard substrate coating apparatus used for manufacturing a liquid crystal display panel or the like using a glass substrate and for coating a coating liquid such as a photoresist thinly and uniformly on a hard substrate. is there.

【0002】[0002]

【従来の技術】液晶板の製造工程の中には、ガラス基板
などの硬基板にフォトレジストなどの塗布液を薄く均一
な厚さに塗布する工程がある。例えばカラー液晶板の製
造においては、透明電極を予め形成したガラス基板に、
フォトレジストの機能を有する赤のカラーモザイク液を
均一に塗布した後、露光して赤に対応するカラーモザイ
クを硬化させ、余分の液を除去することにより赤のカラ
ーモザイクを形成している。そしてこれと同様な処理を
緑、青などの他の色について繰り返している。このよう
にフォトレジストとなる塗布液を塗布する場合、この液
は均一な厚さ(例えば2μ±5%程度)に厳密に管理し
て薄く塗布する必要がある。この塗布の厚さが不均一で
あると、光の透過率のむらが生じ、品質の低下を招くこ
とになるからである。
2. Description of the Related Art In the process of manufacturing a liquid crystal plate, there is a process of coating a hard substrate such as a glass substrate with a coating liquid such as photoresist in a thin and uniform thickness. For example, in the manufacture of a color liquid crystal plate, a glass substrate on which a transparent electrode is preformed,
A red color mosaic liquid having a photoresist function is uniformly applied, and then exposed to cure the color mosaic corresponding to red, and the excess liquid is removed to form a red color mosaic. Then, the same processing is repeated for other colors such as green and blue. In the case of applying a coating liquid that becomes a photoresist in this way, it is necessary to strictly control this liquid to have a uniform thickness (for example, about 2 μ ± 5%) and apply it thinly. This is because if the coating thickness is non-uniform, the light transmittance will be uneven and the quality will be deteriorated.

【0003】従来はこの塗布のためにスピンコータが用
いられていた。このスピンコータは回転させた基板の回
転中心付近に塗布液を滴下し、この液を遠心力を利用し
て飛散させることにより塗布するものである。しかしこ
のスピンコータを用いる方法では基板の交換に手間取り
作業能率が悪くなるばかりでなく、飛散して捨てられる
液の量が増えることになる。このためコストアップにな
るという問題があった。
Conventionally, a spin coater has been used for this coating. This spin coater is one in which a coating liquid is dropped near the center of rotation of a rotated substrate and the liquid is scattered by utilizing centrifugal force to apply the liquid. However, in the method using this spin coater, not only the labor efficiency for the replacement of the substrate becomes poor, but also the amount of the liquid scattered and discarded increases. Therefore, there is a problem that the cost is increased.

【0004】そこで水平に配設された上下一対のローラ
間に基板を挟んで塗布する装置を用いることが考えられ
ている。この装置は下のローラとなるバーの下部を塗布
液に浸漬し、このバーとこの上方に位置する押圧ロ−ル
との間に基板を挟んで送りながら、バーにより基板の下
面に塗布するものである。
Therefore, it is considered to use an apparatus for sandwiching a substrate between a pair of upper and lower rollers arranged horizontally and applying the substrate. In this device, the lower part of the bar that serves as the lower roller is immersed in the coating solution, and the substrate is sandwiched between this bar and the pressing roll located above this bar and fed while the bar is used to coat the lower surface of the substrate. Is.

【0005】[0005]

【従来技術の問題点】しかしこの場合基板の終端がバー
から離れる際に、塗布液の表面張力や粘性のために塗布
液が基板に厚く残り、基板終端付近で厚塗りになる性質
があった。この厚塗り部分は、正規の塗布厚さに対して
設定された露光、洗浄などの種々の処理工程では適切な
処理ができず、この厚塗り部分の未処理による破片や屑
などの残留物が後の工程において塗布液に混入し、不良
製品を生む原因となっていた。このため製品の歩留まり
が低下するという問題があった。
However, in this case, when the terminal end of the substrate separates from the bar, the coating liquid remains thick on the substrate due to the surface tension and viscosity of the coating liquid, resulting in thick coating near the substrate end. .. This thick coating part cannot be properly treated in various processing steps such as exposure and cleaning set for the regular coating thickness, and residues such as debris and debris due to untreatment of this thick coating part In the subsequent process, it was mixed with the coating liquid, which caused a defective product. Therefore, there is a problem that the yield of the products is reduced.

【0006】そこでこの基板後端付近の厚塗り部分に吸
引ロッドを接触させて余分な液を負圧により吸引するこ
とが考えられている(特願平3−12543号参照)。
すなわち長手方向に沿った吸引口を有する吸引ロッドを
移動中の基板の後端付近に接触させるものである。
Therefore, it has been considered that a suction rod is brought into contact with the thick coating portion near the rear end of the substrate to suck the excess liquid by negative pressure (see Japanese Patent Application No. 3-12543).
That is, the suction rod having the suction port along the longitudinal direction is brought into contact with the vicinity of the rear end of the moving substrate.

【0007】しかしこの場合には吸引ロッド自身に付着
する液の粘性により基板の搬送が円滑にできなくなると
いう問題があった。また吸引ロッドが吸引しながら厚塗
り部に接触するため、厚塗り部の液を全幅に亘って同時
に均一に吸引できず、僅かな時間的なバラツキが発生す
る。このため基板後端付近に筋が発生し不均一な塗布状
態になるという問題があった。
However, in this case, there is a problem that the substrate cannot be transported smoothly due to the viscosity of the liquid adhering to the suction rod itself. Further, since the suction rod comes into contact with the thick coating portion while sucking, the liquid in the thick coating portion cannot be sucked uniformly uniformly over the entire width, and a slight time variation occurs. Therefore, there is a problem that streaks occur near the rear end of the substrate and the coating state becomes non-uniform.

【0008】[0008]

【発明の目的】本発明はこのような事情に鑑みなされた
ものであり、吸引ロッドを厚塗り部分に接触させて余分
な液を除去する場合に、基板の搬送を円滑にできるよう
にした硬基板塗布装置を提供することを第1の目的とす
る。また厚塗り部分の吸引を均一に行ってこの付近の塗
布状態を良好にすることができる硬基板塗布装置を提供
することを第2の目的とする。
SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is a hard disk capable of smoothly transferring a substrate when an excess liquid is removed by bringing a suction rod into contact with a thick coating portion. A first object is to provide a substrate coating device. It is a second object of the present invention to provide a hard substrate coating apparatus capable of uniformly sucking the thick coating portion and improving the coating state in the vicinity thereof.

【0009】[0009]

【発明の構成】本発明によれば第1の目的は、下部が塗
布液槽に浸漬されたバーと、このバーの上方に対向配置
された押圧ロ−ルとの間に硬基板を挟んで送ることによ
り、前記硬基板の下面に塗布液を塗布する硬基板塗布装
置において、前記基板を搬送するパスロ−ルと、前記バ
ーから前記硬基板の送り方向に離れて前記硬基板の下方
に昇降可能に配設され、少なくとも上部に長手方向に沿
った吸引口を有する吸引ロッドと、この吸引ロッドより
基板の送り方向に配設された基板検出センサおよび基板
ストッパと、前記吸引ロッドより基板送り方向にあって
前記基板の上面に転接・離隔する押えローラと、前記吸
引ロッド内を吸引する吸引ポンプと、塗布した基板を前
記基板検出センサの出力に基づき前記基板ストッパで停
止させた状態で前記吸引ロッドを基板の後端付近に接触
させて吸引しつつ前記基板に前記押えローラを転接させ
かつ基板ストッパを解放して基板を移動させるコントロ
ーラとを備えることを特徴とする硬基板塗布装置により
達成される。
According to the present invention, a first object is to sandwich a hard substrate between a bar whose lower portion is immersed in a coating liquid tank and a pressing roller which is disposed above the bar so as to face each other. In a hard substrate coating device that coats the coating liquid on the lower surface of the hard substrate by feeding, the path roll for transporting the substrate and the bar is lifted below the hard substrate in the feeding direction of the hard substrate. A suction rod having a suction port extending in the longitudinal direction at least in the upper part, a substrate detection sensor and a substrate stopper arranged in the substrate feeding direction from the suction rod, and a substrate feeding direction from the suction rod. In the state where the pressing roller that comes into contact with and separates from the upper surface of the substrate, the suction pump that sucks the inside of the suction rod, and the substrate that has been applied are stopped by the substrate stopper based on the output of the substrate detection sensor. A hard substrate coating apparatus comprising: a controller that brings a suction rod into contact with the vicinity of the rear end of the substrate to suck the substrate and rolls the pressing roller onto the substrate and releases the substrate stopper to move the substrate. To be achieved.

【0010】また第2の目的は吸引ロッドを基板の後端
付近に接触させてしばらく吸引せずに静止させ、一定時
間後に吸引を開始することにより達成される。
The second object is achieved by bringing the suction rod into contact with the vicinity of the rear end of the substrate, allowing the suction rod to stand still without suction for a while, and starting suction after a fixed time.

【0011】[0011]

【作用】基板は基板ストッパにより所定の位置に停止さ
れ、この基板後端付近の厚塗り部分に吸引ロッドが接触
される。そして基板は上から下降する押えローラによっ
てパスロ−ルとの間に挾まれて、基板ストッパの解放と
共に強制的に送られる。
The substrate is stopped at a predetermined position by the substrate stopper, and the suction rod is brought into contact with the thick coating portion near the rear end of the substrate. Then, the substrate is sandwiched between the pass roller and the pressing roller which descends from above, and is forcibly fed together with the release of the substrate stopper.

【0012】また吸引ロッドは非吸引状態で厚塗り部分
に接触し、一定時間静止される。この間に厚塗り部分の
余分な液は表面張力により吸引ロッドの表面に沿ってそ
の長手方向に均一に付着する。この状態で吸引ロッドの
吸引を始めると、吸引ロッド全長に亙り均一に付着して
いる余分な液が同時に均一に吸引される。
The suction rod is brought into contact with the thick coating portion in a non-suction state and is kept stationary for a certain period of time. During this period, the excess liquid in the thick coating portion is uniformly attached along the surface of the suction rod in the longitudinal direction due to the surface tension. When suction of the suction rod is started in this state, the excess liquid uniformly attached over the entire length of the suction rod is simultaneously and uniformly sucked.

【0013】[0013]

【実施例】図1は本発明の一実施例の全体配置図、図2
はその要部の動作説明図、図3は吸引ロッドの実施例を
示す図、図4は動作を説明するタイムチャート図であ
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an overall layout drawing of one embodiment of the present invention, and FIG.
Is an operation explanatory view of the main part thereof, FIG. 3 is a view showing an embodiment of the suction rod, and FIG. 4 is a time chart view explaining the operation.

【0014】図1において符号10はガラス基板、12
はパスロ−ルであり、ガラス基板10はその下面の左右
の縁をパスロ−ル12のローラに載せた状態で図上左か
ら右へ送られる。パスロ−ル12の途中には塗布部14
が配設されている。この塗布部14は小径で断面円形な
バー16と、その上方に対向する大径の押圧ロ−ル18
と、バー16の上部を残してほぼ全体が入る塗布液槽2
0とを有する。
In FIG. 1, reference numeral 10 is a glass substrate, and 12 is a glass substrate.
Is a pass roll, and the glass substrate 10 is fed from the left to the right in the drawing with the left and right edges of the lower surface of the glass substrate 10 placed on the rollers of the pass roll 12. In the middle of the path roll 12, a coating section 14
Are arranged. The coating portion 14 includes a bar 16 having a small diameter and a circular cross section, and a large-diameter pressing roll 18 facing above the bar 16.
And the coating liquid tank 2 in which almost the entire area of the bar 16 is left behind
Has 0 and.

【0015】ここにバー16は、断面円形のロッドの表
面に細い金属線を密着するように巻き付けたものであ
り、金属線間の溝による毛細管現象を利用して塗布液を
塗布するものである。
Here, the bar 16 is formed by winding a thin metal wire on the surface of a rod having a circular cross section so as to be in close contact with it, and applies the coating liquid by utilizing a capillary phenomenon due to a groove between the metal wires. ..

【0016】塗布液槽20は、基板10の送り方向に直
交する方向に長く、ここには給液パイプから新しい液が
供給される一方、排液口から塗布液が排出される。この
塗布液の深さは図示しない液面センサにより監視され、
常に一定に管理される。
The coating liquid tank 20 is long in a direction orthogonal to the feeding direction of the substrate 10, and a new liquid is supplied to the coating liquid tank 20 from a liquid supply pipe while the coating liquid is discharged from a drain port. The depth of this coating liquid is monitored by a liquid level sensor (not shown),
It is constantly managed.

【0017】バー16はその上部が液から露出するよう
に水平に保持され、その一端(図1における奥側の端)
は塗布液槽20より後方へ突出し、この突出端は着脱自
在な継手によって電動モータに接続されている。この電
動モータはガラス基板10の送り速度がパスロ−ル12
と等速になるようにその回転が管理されている。前記押
圧ロ−ル18の表面は導電性ゴムで作られ、バー16と
の間にガラス基板10を挟んだ状態でガラス基板10に
所定の挟圧力を付与するように保持されている。
The bar 16 is held horizontally so that the upper part thereof is exposed from the liquid, and one end thereof (the end on the far side in FIG. 1).
Protrudes rearward from the coating liquid tank 20, and the protruding end is connected to the electric motor by a detachable joint. In this electric motor, the feed speed of the glass substrate 10 is the pass roll 12
The rotation is controlled so that the speed becomes constant. The surface of the pressing roll 18 is made of conductive rubber, and is held so that a predetermined clamping pressure is applied to the glass substrate 10 with the glass substrate 10 sandwiched between it and the bar 16.

【0018】22は吸引ロッドである。この吸引ロッド
22はバー16よりも基板送り方向に設けられ、基板1
0の下方で昇降可能である。例えばエアシリング24
(図1)により昇降可能とされ、上昇時には基板10の
下面に接触する。
Reference numeral 22 is a suction rod. The suction rod 22 is provided in the substrate feeding direction with respect to the bar 16, and the substrate 1
It can be raised and lowered below 0. For example, air silling 24
It can be moved up and down by (FIG. 1) and contacts the lower surface of the substrate 10 when rising.

【0019】この吸引ロッド22は例えば図3に示す断
面構造のものが使用できる。図3(A)に示す吸引ロッ
ド22Aは、6つの各辺が内側へ湾曲した6角形の筒2
6の外周に金属細線28を巻き付け、6角の各辺に多数
の小孔30を筒26の長手方向に等間隔に形成したもの
である。
The suction rod 22 may have a sectional structure shown in FIG. 3, for example. The suction rod 22A shown in FIG. 3 (A) is a hexagonal tube 2 having six sides curved inward.
A thin metal wire 28 is wound around the outer circumference of 6 and a large number of small holes 30 are formed on each side of the hexagon at equal intervals in the longitudinal direction of the cylinder 26.

【0020】図3(B)に示す吸引ロッド22Bは、6
角筒26Bの上辺だけに小孔30を長手方向に等間隔に
多数設けたものである。図3(C)に示す吸引ロッド2
2Cは、6角筒26Cの上辺およびこれに隣接する基板
送り側の斜め上の辺との2辺だけに小孔30を形成する
一方、斜めの辺の下部を囲むカバー32を設けたもので
ある。
The suction rod 22B shown in FIG.
A large number of small holes 30 are provided at equal intervals in the longitudinal direction only on the upper side of the rectangular tube 26B. Suction rod 2 shown in FIG.
In 2C, the small holes 30 are formed only in two sides, that is, the upper side of the hexagonal tube 26C and the diagonally upper side of the substrate feeding side adjacent to the hexagonal cylinder 26C, while the cover 32 surrounding the lower portion of the diagonal side is provided. is there.

【0021】吸引ロッド22は吸引ポンプ33(図2の
(C))により吸引され、吸引ロッド22の筒26(2
6B、26C)内を負圧にする。この結果金属細線28
間から外気あるいは液を筒26内に吸引しポンプ33を
経て排出することができる。外気は排出されるが、液は
途中トラップビンでトラップされる。このポンプ33は
後記コントローラ40により制御される。
The suction rod 22 is sucked by a suction pump 33 ((C) of FIG. 2), and a cylinder 26 (2) of the suction rod 22.
6B, 26C) is made negative pressure. As a result, the metal wire 28
Outside air or liquid can be sucked into the cylinder 26 from the space and discharged through the pump 33. The outside air is discharged, but the liquid is trapped in the trap bin on the way. The pump 33 is controlled by the controller 40 described later.

【0022】34は基板検出センサ、36は基板ストッ
パである。基板ストッパ36は吸引ロッド22からほぼ
基板20の長さ離れた位置に設けられる。この基板スト
ッパ36は例えば電磁プランジャで構成され、そのプラ
ンジャが基板10の搬送路内へ進退可能とされる。この
基板ストッパ36の作動時にはプランジャが基板10の
前縁に係合して基板10を停止させ、その解放時にはプ
ランジャが搬送路から送出して基板10を移送可能にす
る。なお基板ストッパ36に基板10を停止させた時に
は基板10の後端付近の下面が吸引ロッド22の上方に
位置する。
Reference numeral 34 is a substrate detection sensor, and 36 is a substrate stopper. The substrate stopper 36 is provided at a position substantially away from the suction rod 22 by the length of the substrate 20. The substrate stopper 36 is composed of, for example, an electromagnetic plunger, and the plunger can be moved back and forth into the conveyance path of the substrate 10. When the substrate stopper 36 is operated, the plunger engages with the front edge of the substrate 10 to stop the substrate 10, and when the substrate stopper 36 is released, the plunger sends out the substrate 10 from the transport path so that the substrate 10 can be transferred. When the substrate 10 is stopped by the substrate stopper 36, the lower surface near the rear end of the substrate 10 is located above the suction rod 22.

【0023】基板検出センサ34はこの基板ストッパ3
6よりバー16側に位置し、基板10の前縁および後縁
を検出する。すなわちこのセンサ34が基板10の前縁
を検出すると後記コントローラ40は基板ストッパ36
を作動させ基板10を停止可能な状態にする。
The substrate detection sensor 34 is the substrate stopper 3
It is located closer to the bar 16 than 6 and detects the front and rear edges of the substrate 10. That is, when the sensor 34 detects the front edge of the substrate 10, the controller 40 described later causes the substrate stopper 36 to move.
Is activated to bring the substrate 10 into a stoppable state.

【0024】38は昇降可能な押えローラであり、基板
ストッパ36に停止した基板10の上面を押圧するもの
である。この押えローラ38が基板10を押圧すること
により基板10とローラコンベア12との接触圧力を増
大し、基板10を送る力を増大する。
Reference numeral 38 denotes a pressing roller which can be raised and lowered, and presses the upper surface of the substrate 10 stopped by the substrate stopper 36. The pressing roller 38 presses the substrate 10 to increase the contact pressure between the substrate 10 and the roller conveyor 12 and increase the force for feeding the substrate 10.

【0025】40はコントローラである。このコントロ
ーラ40は基板検出センサ34の出力に基づいて基板ス
トッパ36を作動させる一方、吸引ロッド22および押
えローラ38を予め決めたタイミングで昇降させ、また
吸引ポンプ33を作動・停止させる。以下その動作を図
2、4を用いて説明する。
Reference numeral 40 is a controller. The controller 40 operates the substrate stopper 36 based on the output of the substrate detection sensor 34, moves the suction rod 22 and the pressing roller 38 up and down at a predetermined timing, and activates / stops the suction pump 33. The operation will be described below with reference to FIGS.

【0026】基板10はバー16により下面に液が塗布
されながら右へ移動する。この時には吸引ロッド22は
下降し、押えローラ38は上昇し、基板ストッパ36は
解放状態である(図2(A)、図4(A)の状態)。な
おこの時には吸引ポンプ33は作動中であり、吸引ロッ
ド22を清浄にして後の吸引動作のために待機してい
る。
The substrate 10 moves to the right while the lower surface is coated with the liquid by the bar 16. At this time, the suction rod 22 descends, the pressing roller 38 rises, and the substrate stopper 36 is in the released state (states shown in FIGS. 2A and 4A). At this time, the suction pump 33 is in operation, and the suction rod 22 is cleaned and stands by for the subsequent suction operation.

【0027】基板10の前縁が基板検出センサ34で検
出されると、コントローラ40はストッパ36を作動さ
せてプランジャを突出させると共に、吸引ポンプ33を
停止させる(図2(B)、図4(B)の状態)。この間
にも基板10は塗布されて右へ移動しているから、基板
10の先端がストッパ36のプランジャに当接して停止
する。
When the front edge of the substrate 10 is detected by the substrate detection sensor 34, the controller 40 actuates the stopper 36 to cause the plunger to project and stop the suction pump 33 (FIG. 2 (B), FIG. State of B)). During this time, the substrate 10 is coated and moved to the right, so that the tip of the substrate 10 contacts the plunger of the stopper 36 and stops.

【0028】コントローラ40は基板10がストッパ3
6に当って停止するのに十分な時間(図4の例では
(B)の期間は2秒に設定されている)を経過すると、
吸引ポンプ33を停止したまま吸引ロッド22を上昇さ
せて塗布面の終端付近の厚塗り部分42(図2(B)参
照)に接触させる(図2(C))。この時押えローラ3
8も同時に下降させて基板10をパスロ−ル12との間
に挾む。
In the controller 40, the board 10 is the stopper 3
After a sufficient time to stop at 6 (in the example of FIG. 4, the period of (B) is set to 2 seconds),
While the suction pump 33 is stopped, the suction rod 22 is raised and brought into contact with the thick coating portion 42 (see FIG. 2B) near the end of the coating surface (FIG. 2C). Presser roller 3 at this time
8 is also lowered at the same time, and the substrate 10 is sandwiched between the substrate 10 and the pass roll 12.

【0029】この状態は図4(C)に示す期間(この例
では4秒)保持される。このように図4(C)の期間で
は吸引ロッド22を吸引することなく厚塗り部42に接
触させて暫時静止するから、厚塗り部42の液が吸引ロ
ッド22に沿って集まり、液の表面張力によって長さ方
向に均等に分布する。
This state is held for the period shown in FIG. 4C (4 seconds in this example). As described above, during the period of FIG. 4C, the suction rod 22 is brought into contact with the thick coating portion 42 without being sucked, and is temporarily stopped, so that the liquid of the thick coating portion 42 collects along the suction rod 22 and the surface of the liquid is collected. Evenly distributed in the length direction due to tension.

【0030】この図4(C)の静止時間を過ぎると、コ
ントローラ40は吸引ポンプ33を作動させて厚塗り部
44の液の吸引を開始する(図2(C)、図4
(D))。一定時間(この例では図4(D)の期間は4
秒)が過ぎると、コントローラ40はストッパ36を解
放する。このため基板10はパスロ−ル12と押えロー
ラ38とに挾まれて移動を開始する(図2(D)、図4
(E))。
After the rest time in FIG. 4C, the controller 40 operates the suction pump 33 to start sucking the liquid in the thick coating portion 44 (FIG. 2C, FIG. 4).
(D)). A fixed time (in this example, the period of FIG.
Seconds, the controller 40 releases the stopper 36. Therefore, the substrate 10 is sandwiched between the pass roll 12 and the pressing roller 38 and starts moving (FIG. 2 (D), FIG. 4).
(E)).

【0031】このように押えローラ38で押えることに
より、吸引ロッド22に基板10の後端が付着しても基
板10を確実に吸引ロッド22から引き離して移動させ
ることができる。この時吸引ポンプ33は作動している
から、吸引ロッド22が吸引を続けている状態で基板1
0の後端は吸引ロッド22から離れる。このため厚塗り
部42の液の吸引が確実に行われる。そして基板10が
所定時間送られ(図2(E)、図4(F))センサ34
が基板10の後端を検出すると、押えローラ38が上昇
し最初の状態(図4(A))に復帰する。
By pressing with the pressing roller 38 in this way, even if the rear end of the substrate 10 adheres to the suction rod 22, the substrate 10 can be reliably moved away from the suction rod 22. At this time, the suction pump 33 is operating, so that the substrate 1 is kept in a state where the suction rod 22 continues to suck.
The rear end of 0 moves away from the suction rod 22. Therefore, the suction of the liquid in the thick coating portion 42 is surely performed. Then, the substrate 10 is sent for a predetermined time (FIG. 2 (E), FIG. 4 (F)) sensor 34.
When the rear end of the substrate 10 is detected, the pressing roller 38 moves up and returns to the initial state (FIG. 4A).

【0032】[0032]

【発明の効果】請求項1の発明は以上のように、基板を
ストッパで停止させてその後端厚塗り部に吸引ロッドを
接触させて吸引する一方、基板を押えローラで押えるか
ら基板とパスロ−ルとの接触圧が増加し、パスロ−ルに
よる基板の移送力が増加する。このためストッパの解放
と同時に基板は確実に吸引ロッドから引き離されてパス
ロ−ルによって移動される。従って基板の搬送が円滑に
なる。
As described above, according to the first aspect of the present invention, the substrate is stopped by the stopper and the suction rod is brought into contact with the thickened portion at the rear end of the substrate to suck the substrate, while the substrate is pressed by the pressing roller. The contact pressure with the roller is increased, and the transfer force of the substrate by the path roll is increased. Therefore, at the same time when the stopper is released, the substrate is reliably separated from the suction rod and moved by the path roll. Therefore, the substrate can be transported smoothly.

【0033】また請求項2の発明によれば、吸引ロッド
は厚塗り部に接触してから所定時間経過してから吸引を
開始するから、吸引開始前に厚塗り部の液が吸引ロッド
全体に均等に広がって安定するのを待って吸引すること
になる。このため全幅に亘って均等な条件で吸引でき、
塗布面に筋などの塗布むらが発生するのを一層確実に防
止することができる。
According to the second aspect of the present invention, since the suction rod starts suctioning after a predetermined time has elapsed since it contacted the thick coating portion, the liquid in the thick coating portion spreads over the entire suction rod before starting suction. You will need to wait for it to spread evenly and stabilize before you inhale. For this reason, it is possible to suction under uniform conditions over the entire width,
It is possible to more reliably prevent uneven application such as streaks on the application surface.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例の全体図FIG. 1 is an overall view of an embodiment of the present invention

【図2】要部の動作説明図FIG. 2 is an operation explanatory diagram of a main part.

【図3】吸引ロッドの実施例を示す断面図FIG. 3 is a sectional view showing an embodiment of a suction rod.

【図4】タイムチャート図[Fig. 4] Time chart diagram

【符号の説明】[Explanation of symbols]

10 基板 12 パスロ−ル 16 バー 18 押圧ロ−ル 20 塗布液槽 22 吸引ロッド 34 基板検出センサ 36 基板ストッパ 38 押えローラ 40 コントローラ 10 Substrate 12 Pass Roll 16 Bar 18 Pressing Roll 20 Coating Liquid Tank 22 Suction Rod 34 Substrate Detection Sensor 36 Substrate Stopper 38 Presser Roller 40 Controller

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 H01L 21/027 (72)発明者 尾崎 正文 神奈川県綾瀬市小園1005番地 富士マイク ログラフイックス株式会社内 (72)発明者 江本 辰弥 神奈川県綾瀬市小園1005番地 富士マイク ログラフイックス株式会社内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification number Reference number in the agency FI Technical indication location H01L 21/027 (72) Inventor Masafumi Ozaki 1005 Kozoen, Ayase City, Kanagawa Prefecture Fuji Micrographix Co., Ltd. (72) Inventor Tatsuya Emoto 1005 Kozono, Ayase City, Kanagawa Prefecture Fuji Micrographix Co., Ltd.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 下部が塗布液槽に浸漬されたバーと、こ
のバーの上方に対向配置された押圧ロ−ルとの間に硬基
板を挟んで送ることにより、前記硬基板の下面に塗布液
を塗布する硬基板塗布装置において、前記基板を搬送す
るパスロ−ルと、前記バーから前記硬基板の送り方向に
離れて前記硬基板の下方に昇降可能に配設され、少なく
とも上部に長手方向に沿った吸引口を有する吸引ロッド
と、この吸引ロッドより基板の送り方向に配設された基
板検出センサおよび基板ストッパと、前記吸引ロッドよ
り基板送り方向にあって前記基板の上面に転接・離隔す
る押えローラと、前記吸引ロッド内を吸引する吸引ポン
プと、塗布した基板を前記基板検出センサの出力に基づ
き前記基板ストッパで停止させた状態で前記吸引ロッド
を基板の後端付近に接触させて吸引しつつ前記基板に前
記押えローラを転接させかつ基板ストッパを解放して基
板を移動させるコントローラとを備えることを特徴とす
る硬基板塗布装置。
1. A hard substrate is sandwiched between a bar whose lower part is immersed in a coating liquid tank and a pressing roller which is arranged above the bar so as to face the bar, whereby the lower surface of the hard substrate is coated. In a hard substrate coating apparatus for coating a liquid, a path roller for transporting the substrate and a bar which is separated from the bar in the feeding direction of the hard substrate and is vertically movable below the hard substrate, and at least in the longitudinal direction. A suction rod having a suction port along the substrate, a substrate detection sensor and a substrate stopper arranged in the substrate feeding direction from the suction rod, and rolling contact with the upper surface of the substrate in the substrate feeding direction from the suction rod. A pressing roller that separates, a suction pump that sucks the inside of the suction rod, a state where the applied substrate is stopped by the substrate stopper based on the output of the substrate detection sensor, and the suction rod is placed near the rear end of the substrate. A hard substrate coating apparatus comprising: a controller for rolling the pressing roller onto the substrate while contacting and sucking the substrate, and releasing the substrate stopper to move the substrate.
【請求項2】 前記コントローラは、前記基板ストッパ
により停止した基板の後端付近に前記吸引ロッドを接触
させてから所定時間遅れて吸引ポンプを起動させる請求
項1の硬基板塗布装置。
2. The hard substrate coating apparatus according to claim 1, wherein the controller starts the suction pump with a predetermined time delay after the suction rod is brought into contact with the vicinity of the rear end of the substrate stopped by the substrate stopper.
JP14096892A 1992-05-06 1992-05-06 Apparatus for coating hard substrate Pending JPH05309303A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14096892A JPH05309303A (en) 1992-05-06 1992-05-06 Apparatus for coating hard substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14096892A JPH05309303A (en) 1992-05-06 1992-05-06 Apparatus for coating hard substrate

Publications (1)

Publication Number Publication Date
JPH05309303A true JPH05309303A (en) 1993-11-22

Family

ID=15281019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14096892A Pending JPH05309303A (en) 1992-05-06 1992-05-06 Apparatus for coating hard substrate

Country Status (1)

Country Link
JP (1) JPH05309303A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200028149A (en) * 2018-09-06 2020-03-16 세메스 주식회사 Substrate processing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200028149A (en) * 2018-09-06 2020-03-16 세메스 주식회사 Substrate processing apparatus

Similar Documents

Publication Publication Date Title
KR930010306B1 (en) Coating apparatus and method
EP0401513B1 (en) Thin film bonding method and apparatus having structure for removing wetting agents
JPH05309303A (en) Apparatus for coating hard substrate
JP2533812B2 (en) Glass dry plate manufacturing method and apparatus
JP3498122B2 (en) Veneer coating equipment
JP3395152B2 (en) Film sticking method and apparatus
JP3093455B2 (en) Conveyor device for double-sided coated printed wiring boards
JPH07275786A (en) Intermittent coating method
JP2823173B2 (en) Hard substrate coating device
JP2889748B2 (en) Hard substrate coating device
JPH10264248A (en) Film affixing device
JPH0524358U (en) Screen printing machine
JP2003341010A (en) Screen printing machine and screen printing method
JPH0496291A (en) Method and apparatus for cleaning printed wiring board
JP2888698B2 (en) Hard substrate coating device
JPH0671632A (en) Method for sticking tile
JPH10119225A (en) Method and apparatus for sticking wet type film
JPH10277464A (en) Coating device and coating method using same
JP2002301417A (en) Coating device and method
JPH0649956B2 (en) Substrate surface treatment method
JP2533149B2 (en) Wet etching method
JPH058605Y2 (en)
JPH09173933A (en) Coating liquid feeder
JP4064675B2 (en) Substrate cleaning device and cleaning method
JPH0938554A (en) Method and apparatus for coating rigid substrate