JPH0530399B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to an IC card and a conduction switch used therein, and particularly to an IC card with a built-in power supply and a conduction switch suitable therefor.

(Prior Art) In recent years, IC cards with built-in microprocessors have become popular. Figure 2 shows the conventional general
The configuration of the IC card is shown. This IC card consists of a plate-shaped card body 1, an arithmetic unit 2 and a storage device 3 embedded therein, and contact electrodes 4 exposed on the surface of the card body 1. Components indicated by broken lines in the figure are elements built into the card body 1. Arithmetic device 2, storage device 3, and contact electrode 4
are mutually wired, but these wires are omitted in FIG. Figure 3 is the IC shown in Figure 2.
FIG. 3 is a cross-sectional view of the card. The card body 1 is composed of a core part 5 and a sheet part 6 made of plastic. A computing device 2 is embedded in the core section 5 .
The storage device 3 is similarly embedded in the core section 5. The wiring layer 7 is provided on the upper surface of the core portion 5, and is connected to the arithmetic device 2, the memory device 3, and the contact electrode 4 as described above.
interconnecting between The sheet part 6 is the card body 1
It is provided on both sides of the film and acts as a protective layer.

This IC card has a function of exchanging information when inserted into a reader/writer device. In this case, an electrode on the reader/writer device comes into contact with the contact electrode 4 exposed on the surface, and power is supplied therefrom and data is input/output at the same time.

(Problems to be Solved by the Invention) Conventional IC cards do not have a built-in power supply, as shown in FIG. 2, and operate by receiving power from the reader/writer device. For this reason, the IC card cannot operate on its own, and the IC card cannot perform operations such as calculations and data display on its own.

In recent years, ultra-thin batteries have been developed, but when such batteries are built into IC cards, the following problems arise in practical use.

(1) If a switch is not installed between the battery and the circuit inside the IC card, the actual IC
A problem arises in that the battery is exhausted by the time the card is issued.

(2) When conventional mechanical switches are used, the sealing performance is very poor, and the power can be turned on and off accidentally due to vibration or impact, making them unsuitable for IC cards. Furthermore, in manufacturing, assembly of mechanical parts becomes complicated, resulting in high cost, and it is not suitable for thinning. Furthermore, if the user inadvertently turns off the power after the card is issued, an accident such as loss of data in the storage device may occur, which is undesirable from the standpoint of stability.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an economical IC card with a built-in power supply that is less likely to malfunction, and a conduction switch suitable for the IC card.

[Structure of the invention]

(Means and effects for solving the problems) The first feature of the present invention is that an IC card includes a plate-shaped card body, a calculation device or storage device embedded in the card body, and a calculation device or storage device embedded in the card body. A power supply device embedded in the card body to supply power to the device, and a normally open switch installed on the power supply path of the power supply device, which causes plastic deformation by applying physical external force to supply power. a conduction switch that closes the path and conducts it;
The key point is that we have created an IC card with a built-in power supply that is less likely to malfunction.

A second feature of the present invention is an intermediate layer made of an insulating material in which a large number of conductive particles are embedded and can be plastically deformed by a predetermined stress, and a first electrode layer provided with this intermediate layer sandwiched therebetween. and a second electrode layer to form a conduction switch, thereby realizing a conduction switch suitable for an IC card with a built-in power supply.

A third feature of the present invention is that conduction is established through the first conductor layer, the insulating layer formed on the first conductor layer, and the second conductor layer formed on the insulating layer. By configuring the switch and applying a predetermined stress in the direction perpendicular to the formation direction of each layer,
The insulating layer is destroyed and the first conductor layer and the second conductor layer are configured to be electrically connected, and the built-in power supply type
This realizes a continuity switch suitable for IC cards.

(Example) The present invention will be described below based on an illustrated example. FIG. 1 is a perspective view of an embodiment of an IC card according to the present invention. Similar to the conventional IC card shown in FIG. 2, a calculation device 2 and a storage device 3 are embedded in the card body 1, and a contact electrode 4 exposed on the surface of the card body 1 and the calculation device 2 and the storage device 3 are embedded in the card body 1. Wiring (not shown) is provided between the two. The present invention is further characterized by a power supply battery 8,
The power of this battery 8 is transferred to the computing device 2 and the storage device 3.
A power supply path 9 for supplying power to the card body 1 and a conduction switch 10 provided on the power supply path 9 are embedded within the card body 1. Continuity switch 1
0 is a switch that is normally in an open state and causes plastic deformation by applying physical external force from the surface of the IC card to close the circuit. When the circuit is closed, it undergoes plastic deformation, so once it is closed, it will not open again. It is preferable that the state of this plastic deformation can be observed with the naked eye from the surface of the IC card.

With such a configuration, an economical IC card with a built-in power supply that is less likely to malfunction can be realized. That is,
If the conduction switch 10 is shipped in an open state during the manufacture of the IC card, unnecessary power consumption can be suppressed until the card is used. Moreover, when a card issuing company issues this IC card to a general user, it is only necessary to apply a physical external force from the surface of the IC card and close the conduction switch 10. Therefore, no other parts are required, making it convenient for card issuers to handle. After that, power is constantly supplied, and vibration or shock can cause the power to be inadvertently turned off.
Since the power is not turned off, and the user will not accidentally turn off the power, there is no risk of damage to the data stored in the storage device 3.
Whether the conduction switch 10 is open or closed can be confirmed by observing the surface of the IC card to see if plastic deformation has occurred.

FIG. 4 is a sectional view showing a specific example of the configuration of the conduction switch 10, and shows a cross section of a portion of the IC card where the conduction switch 10 is formed. Electrode layers 9a, 9b and an intermediate layer 11 are formed on the top of the plastic core 5. The electrode layers 9a and 9b are provided at symmetrical positions with the intermediate layer 11 in between. The intermediate layer 11 is thicker than the electrode layers 9a and 9b, and a plastic support layer 1 is provided on the electrode layers 9a and 9b to compensate for this difference in thickness.
2a and 12b are formed. Plastic sheet portions 6 are formed as protective layers on both sides of each of these layers.

Note that the electrode layers 9a and 9b may be formed on the same plane, and the intermediate layer 11 may be formed above or below these. In short, any structure may be used as long as the two electrode layers are electrically connected by pressing the intermediate layer.

The intermediate layer 11 is made of an insulating material that can be plastically deformed, such as a polymeric material, and is made of a metal (copper, gold, etc.).
Alternatively, it has a structure in which a large number of conductive particles 13 such as meltable metal (solder, etc.) are embedded. Since the conductive particles 13 are embedded with such a distribution density that they do not touch each other, the electrode layers 9a and 9b are electrically insulated in the state shown in FIG. 4. That is, the conduction switch 10 is in an open state. Here, when pressing the intermediate layer 11 from above while applying a predetermined stress and heating, the intermediate layer 11
is plastically deformed as shown in FIG. middle layer 11
If the distribution density of the conductive particles 13 in the electrode layers 9a and 9b is appropriately selected, the conductive particles 13 will come into contact with each other due to such plastic deformation, and the electrode layers 9a, 9b
A current path may be formed between them. That is, the conduction switch 10 is in a closed state.
Since the intermediate layer 11 remains plastically deformed, the conduction switch 10 remains closed. Since the sheet portion 6 is formed on the surface of the IC card, this conduction switch 10 has extremely good sealing properties, and therefore there is no risk that the elements and wiring inside the IC card will corrode after long-term use. do not have. The issuer of the IC card can perform the above-described pressing operation using some kind of crimping jig. Furthermore, since a recess is formed on the surface of the IC card after pressing, it can be confirmed with the naked eye that the conduction switch 10 is in the closed state.

It is convenient if this pressing operation is performed at the same time as the step of embossing predetermined characters such as a customer's name, membership number, etc. on the IC card by heat stamping.

FIG. 6 is a sectional view showing another example of the configuration of the conduction switch 10. A first conductor layer 14 is formed on the top of the plastic core 5, an insulating layer 15 is formed on top of the first conductor layer 14, and a second conductor layer 15 is formed on top of the first conductor layer 14.
A conductor layer 16 is formed. Further, an electrode layer 17a for wiring is connected to the first conductor layer 14, and an electrode layer 17b for wiring is connected to the second conductor layer 16, respectively. A support layer 18 is formed on the other upper part of the core part 5, and a plastic sheet part 6 is formed as a protective layer on both sides of each of these layers.

The conductor layers 14 and 16 may be made of metal such as copper, gold, or aluminum, and the insulating layer 15 may be made of an insulator that is susceptible to stress fracture such as glass or plastic. In the state shown in Figure 6,
Since the conductor layers 14 and 16 are insulated by the insulating layer 15, the electrode layers 17a and 17b are not electrically connected, and the conduction switch 10 is in an open state. When a predetermined stress is applied and pressed from above the conductor layer 16, the conductor layers 14 and 16 are plastically deformed as shown in FIG. At this time, if the stress resistance strength of the insulating layer 15 is appropriately selected, the insulating layer 15 will undergo stress fracture due to such plastic deformation, and cracks will occur. The conductor layer 14,1 is formed by plastic deformation.
6 penetrates into this crack, so that the conductor layer 1
A current path is formed between 4 and 16 through this crack. That is, the conduction switch 10 is in a closed state. The plastically deformed conductor layers 14 and 16 are
In order to maintain this state, the conduction switch 10 remains closed. Similar to the embodiment shown in FIG. 4, this conduction switch also has excellent sealing performance, and the closed state can be confirmed with the naked eye by the recess formed after pressing.

The present invention has been described above based on several embodiments, but in short, the IC card according to the present invention is a conductive card having the property of causing plastic deformation and maintaining a closed state by applying a physical external force. This can be realized using any switch structure as long as it is a switch.

Furthermore, although this embodiment has been described using an example of an IC card that incorporates both an arithmetic unit and a storage device, it is also applicable to an IC card that incorporates only one of them.

〔Effect of the invention〕

As described above, according to the present invention, the conduction switch that causes plastic deformation and maintains the closed state by applying a physical external force is embedded in the IC card. IC cards will become possible.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an embodiment of an IC card according to the present invention, FIG. 2 is a perspective view of an example of a conventional IC card, FIG. 3 is a partial sectional view of the IC card shown in FIG. The figure is a sectional view of one embodiment of the conduction switch according to the present invention, FIG. 5 is a cross-sectional view of the conduction switch shown in FIG. 4 in a closed state, and FIG. 6 is another embodiment of the conduction switch according to the present invention. An example cross-sectional view, FIG. 7, is a cross-sectional view of the conduction switch shown in FIG. 6 in a closed state. DESCRIPTION OF SYMBOLS 1...Card body, 2...Arithmetic device, 3...Storage device, 4...Contact electrode, 5...Core part, 6...
Sheet portion, 7... Wiring layer, 8... Power supply battery, 9
...Power supply path, 10...Continuity switch, 11...
...Middle layer, 12a, 12b...Support layer, 13...
Conductive particles, 14...first conductive layer, 15...
Insulating layer, 16... second conductive layer, 17a, 17b
...Wiring electrode layer, 18...Support layer.

Claims (1)

[Scope of Claims] 1. A plate-shaped card body, an integrated circuit embedded in the card body, a power supply device embedded in the card body for supplying power to the integrated circuit, and a normally open card body. a power supply path connecting the integrated circuit and the power supply device via a switch;
An IC card characterized in that the normally open switch is a conduction switch that causes plastic deformation by applying a physical external force to close the power supply path and make it conductive. 2. The IC card according to claim 1, wherein the integrated circuit includes at least one of an arithmetic unit and a storage device. 3. The IC card according to claim 1 or 2, wherein the conduction switch is provided near the surface of the card body and is configured to be closed by physical external force from the surface of the card body. . 4. The IC card according to claim 3, wherein the conduction switch is configured such that when plastic deformation occurs, the deformation state can be observed from the surface of the card body. 5. A plate-shaped card body, an integrated circuit embedded in the card body, a power supply device embedded in the card body for supplying power to the integrated circuit, and a normally open switch that connects the integrated circuit to the card body. and a power supply path connecting the circuit and the power supply device.
1. A method for issuing an IC card, the method comprising: applying a physical external force to cause plastic deformation in the normally open switch to close the power supply path and make it conductive. 6. The IC card according to claim 5, wherein the step of causing the normally open switch to undergo plastic deformation is performed simultaneously with the step of pressurizing the card body to emboss predetermined characters necessary for the IC card. How to issue. 7. The IC card issuing method according to claim 6, wherein the step of causing plastic deformation in the normally open switch is performed under heating. 8. An intermediate layer made of an insulating material in which a large number of conductive particles are embedded and can be plastically deformed by a predetermined stress;
A conduction switch characterized by comprising a first electrode layer and a second electrode layer that are provided with the intermediate layer narrowed therebetween. 9. The conduction switch according to claim 8, wherein the first electrode layer, the second electrode layer, and the intermediate layer are formed on the same plane. 10. The conduction switch according to claim 9, wherein the first electrode layer and the second electrode layer are provided at symmetrical positions with respect to the intermediate layer. 11. The conduction switch according to claim 10, wherein the thickness of the intermediate layer is greater than the thickness of the first electrode layer and the second electrode layer. 12. The conduction switch according to claim 8, wherein the first electrode layer and the second electrode layer are formed on the same plane, and the intermediate layer is formed above or below them. . 13 Claims 8 to 12, characterized in that the insulating material of the intermediate layer is made of a polymeric substance.
Continuity switch described in any of paragraphs. 14. The conduction switch according to any one of claims 8 to 13, wherein the insulating material is a substance that can be plastically deformed by applying stress under heating. 15. The conduction switch according to any one of claims 8 to 14, wherein the conductive particles of the intermediate layer are made of metal. 16. The conduction switch according to claim 15, characterized in that copper or gold is used as the metal. 17. The conduction switch according to claim 15, characterized in that a meltable metal is used as the metal. 18. The conduction switch according to claim 17, wherein the meltable metal is solder. 19 A first conductor layer, an insulating layer formed on the first conductor layer, and a second conductor layer formed on the insulating layer, perpendicular to the direction in which each of the layers is formed. By applying a predetermined stress in a direction, the first conductor layer and the second conductor layer undergo plastic deformation, and the insulating layer is destroyed, causing the first conductor layer and the second conductor layer to deform. A conduction switch characterized in that it is configured to be electrically conductive. 20. The conduction switch according to claim 19, wherein the first conductor layer and the second conductor layer each have a wiring electrode layer. 21 The first conductor layer and the second conductor layer are made of copper,
21. The conduction switch according to claim 19 or 20, characterized in that it is made of gold or aluminum. 22. The conduction switch according to any one of claims 19 to 21, wherein the insulating layer is made of glass or plastic.