JPH05303023A - Connecting structure between optical waveguide element and optical fiber - Google Patents

Connecting structure between optical waveguide element and optical fiber

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Publication number
JPH05303023A
JPH05303023A JP9129892A JP9129892A JPH05303023A JP H05303023 A JPH05303023 A JP H05303023A JP 9129892 A JP9129892 A JP 9129892A JP 9129892 A JP9129892 A JP 9129892A JP H05303023 A JPH05303023 A JP H05303023A
Authority
JP
Japan
Prior art keywords
optical
optical waveguide
optical fiber
end face
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP9129892A
Other languages
Japanese (ja)
Inventor
Masaaki Iwasaki
正明 岩崎
Original Assignee
Nec Corp
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp, 日本電気株式会社 filed Critical Nec Corp
Priority to JP9129892A priority Critical patent/JPH05303023A/en
Publication of JPH05303023A publication Critical patent/JPH05303023A/en
Application status is Withdrawn legal-status Critical

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B6/00Light guides
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques

Abstract

PURPOSE: To realize the connecting structure for securing optical axis alignment of high accuracy, and simultaneously, improving productivity and reliability, at the time of connecting an optical waveguide element and an optical fiber.
CONSTITUTION: In a circular metallic pad 20 of an end face of an optical waveguide element 10, spherical projection solder 17 called a solder bump is formed, a circular metallic pad 21 of an end face of an optical fiber terminal 13 is adhered through this bump, and by a self-alignment action by surface tension of molten solder, an optical waveguide 12 and an optical fiber 14 can be coupled by non-adjustment. In such a way, by forming the metallic pad 21 to a circle being the same shape as a cross section of the spherical solder bump, the bump without a variance can be formed with good reproducibility and with high accuracy.
COPYRIGHT: (C)1993,JPO&Japio

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は光通信等において光波の変調、光路の切り替え等を行う光通信モジュールを構成する光導波路素子と光ファイバ端末を接続する構造に関するものである。 The present invention relates is related to the structure for connecting the optical waveguide element and an optical fiber terminal constituting the optical communication module for modulating the light wave, the optical path switching like in optical communications or the like.

【0002】 [0002]

【従来の技術】光通信システムの実用化が進み、大容量や多機能をもつさらに高度のシステムへと開発が進められている。 Practical application of the Prior Art An optical communication system progresses, the development into more sophisticated systems with large capacity and multi-function has been promoted. 光伝送路網の交換機能、光データバスにおける端末間の高速接続、切り替え等の新たな機能が求められており、それらを可能にする光通信ネットワークの必要性が高まっている。 Switching function of the optical transmission line network, a high speed connection between terminals in an optical data bus, and a new function is required such as switching, the need for optical communication network enabling them is increasing.

【0003】このような大容量、広帯域の特長を有する光伝送の実現において、例えば、現在実用されている光スイッチは、プリズム、ミラー、ファイバ等を機械的に移動させるものであり、低速であること、信頼性が不十分なこと、形状が大きくマトリクス化に不適なこと等の欠点がある。 Such a large-capacity, in the implementation of optical transmission with broadband characteristics, for example, the optical switch in practical use at present, which are moved prisms, mirrors, and fiber or the like mechanically, is slow it, it reliability is insufficient, there is a drawback such that unsuitable to form a large matrix of. これを解決する手段として開発が進められているものは基板上に設置した光導波路を用いた導波形の光スイッチであり、高速、多素子の集積化が可能、高信頼性等の特徴がある。 This what is is advanced developed in order to solve is a light switch conductive waveform using an optical waveguide placed on the substrate, fast, integrated multi-element can, is characterized with high reliability such as . 特にLinb0 3結晶等の強誘電体材料を用いたものは、光吸収が小さく低損失であることと大きな電気光学効果を有しているため高効率である等の特長があり、光伝送、光交換などの分野への適用が期待されている。 Particularly LiNbO 3 those using a ferroelectric material of the crystal or the like, there are features of like is highly efficient because it has a large electro-optic effect as the light absorption is small low loss, optical transmission, optical applied to areas such as the exchange is expected.

【0004】このような導波路型光デバイスと光伝送網との接続では、温度変動等の周囲の環境変動に対して安定、光損失が小さいことが要求され、そのため光導波路−光ファイバ間の高精度(1〜10μm)の位置合わせ、固定が必要とされており、最も単純な構造として光導波路端面と光ファイバ端面との突き合わせにより実現されている。 [0004] In connection with such a waveguide type optical device and the optical transmission network, stable with respect to the surrounding environmental changes such as temperature variations, it is required optical loss is small, therefore the optical waveguide - between the optical fiber alignment of high precision (1 to 10 [mu] m), fixed are required, it is realized by butt of the optical waveguide end face and the optical fiber end surface as the simplest structure.

【0005】従来、この種の光導波路素子と光ファイバとの接続構造としては図3に示すものがある。 As a conventional connection structure of the optical waveguide device and the optical fiber of this kind is that shown in FIG. 図3 Figure 3
(a)は従来の接続構造により接続された導波路素子と光ファイバの斜視図である。 (A) is a perspective view of a connected waveguide element and the optical fiber by the conventional connecting structure. 図3(a)において、光導波路素子30は基板21上に光導波路22が形成されたもので、保持ブロック、すなわち光ファイバ端末23に配列された光ファイバ24を光軸調整により、光導波路22に突き合わせ、その状態を保持しながらUV硬化樹脂などの接着剤25で光ファイバ端末23を基板21に固定する。 3 (a), the optical waveguide element 30 is intended to optical waveguide 22 is formed on the substrate 21, the holding block, i.e. the optical axis adjustment of the optical fiber 24 arranged in the optical fiber terminal 23, the optical waveguide 22 the butt, the optical fiber terminal 23 is fixed to the substrate 21 with an adhesive 25 such as a UV curable resin while maintaining its state. 固定方法に関しては、接着剤の他に半田溶接、レーザ溶接がある。 Regarding the fixing method, in addition to the solder welding adhesives, there is a laser welding. また、図3(b)は、他の従来例のもので光導波路素子10及び光ファイバ端末13の接続前の接続面を示す斜視図である。 Further, FIG. 3 (b) is a perspective view showing the connection surface of the front connection of the optical waveguide device 10 and the optical fiber terminal 13 in others conventional example. 各々の端面にそれぞれ対となる数十〜数百μm角程度の金属パッド16, Number the respective pair on the end face of each ten to several hundred μm square about the metal pad 16,
18を備え、この金属パッド16にはんだバンプを形成し、このバンプを介して光導波路素子10と光ファイバ端末13との端面結合が無調整で精度良く光軸位置合わせが図れる。 18 comprises a, the solder bumps on the metal pads 16 are formed, the end face coupling between the optical waveguide device 10 and the optical fiber terminal 13 via the bumps can be achieved is precisely aligned optical axis position without adjustment.

【0006】 [0006]

【発明が解決しようとする課題】上述したように光導波路素子と光ファイバ端末とを高精度で位置合わせ、固定をする必要がある。 [SUMMARY OF THE INVENTION The optical waveguide device and the optical fiber terminal as described above aligned with high precision, it is necessary to fixed. しかしながら、従来の光軸調整、固定方法では、固着時の位置ずれ、経時変化が大きいので、長期安定性を要求されるものには不適であり、生産性も悪い。 However, the conventional optical axis adjustment, the fixing method, positional deviation at the time of fixation, the time change is large, long-term stability is unsuitable for those required, bad productivity. レーザ溶接を用いた場合でも、高精度の光軸調整を要求される課題は解消されない。 Even with laser welding challenges that require optical axis adjustment of high accuracy can not be solved. また、バンプを用いた結合方法では、バンプの形状が球(円)でパッドが四角という形状の違いからパッド上に形成されるバンプにばらつきが生じ、高精度位置合わせを妨げている。 Further, the binding method using bumps, variations in bump shapes of bumps are formed on the pad from a difference pad shape of a square with a sphere (circle) occurs, which hinders accurate positioning.
今後、光デバイスモジュールに対してより以上の高精度化、光損失低減の要求が予想され、光実装における光軸合わせの簡略化、高精度化が課題となっている。 In the future, more than the high precision with respect to the optical device module, the request of the light loss reduction is expected, simplification of the optical axis alignment in the optical implementation, high accuracy has been a problem.

【0007】 [0007]

【課題を解決するための手段】本発明の光導波路素子と光ファイバとの接続構造は、光導波路素子に形成された複数本の光導波路の端面と保持ブロックにより配列された複数本の光ファイバの端面とがそれぞれ完全に端面結合するようにした前記光導波路素子と前記保持ブロックとの接続構造において、前記光導波路素子と前記保持ブロックの接続端面にそれぞれ対をなす複数組の円形の金属バットを備えこの金属パッド間をはんだバンプを用いて接合している。 Connecting structure between the optical waveguide device and the optical fiber of the present invention According to an aspect of the of the plurality of arranged by the holding block and the end face of the plurality of optical waveguides formed in the optical waveguide element optical fiber in the end face of the can and the optical waveguide element so as to completely end surface respectively coupled connection structure between the holding block, a plurality of sets of circular metal bat forming each pair connection end face of the retaining block and the optical waveguide device are bonded with solder bumps between the metal pad comprises a.

【0008】 [0008]

【作用】はんだバンプとよばれる球状の突起はんだを四角い金属パッド上に形成すると、金属パッドの余分な四隅のいずれかにはんだバンプが流れ、形成されたバンプの高さにばらつきが生じるが、金属パッドをバンプの断面と同一形状である円にすることにより金属パッドの余分な部分を取り除け、はんだの不要パッド部への流出が抑えられ、ほとんどばらつき無いバンプを再現性よく高精度で形成できる。 SUMMARY OF Once formed on the spherical projections solder a square metal pad called solder bumps, flow extra solder bumps to one of the four corners of the metal pad, although variations in the height of the formed bump occurs, metal rid the excess portion of the metal pad by the pad in a circular a cross-sectional the same shape of the bump, is suppressed outflow to unwanted pad of the solder can be formed with good reproducibility high accuracy most variations without bumps. 従って、光実装における高精度光軸合わせが実現する。 Therefore, high-precision optical axis alignment in the optical package is realized.

【0009】 [0009]

【実施例】図1は本発明の一実施例に係るはんだバンプ用の円形金属パッドを設けた光導波路素子および光ファイバの保持ブロックである光ファイバの端末斜視図である。 DETAILED DESCRIPTION FIG. 1 is a terminal perspective view of an optical fiber is a holding block of the optical waveguide device and an optical fiber having a circular metal pads for solder bumps according to an embodiment of the present invention. 光導波路素子10及び光ファイバ端末13の端面にそれぞれ対となる円形金属パッド20,21を形成している。 Forming a circular metal pads 20 and 21 become respectively paired to the end face of the optical waveguide device 10 and the optical fiber terminal 13. 基板11の表面に光導波路12が形成された光導波路素子10の端面には、直径数十〜数百μm程度の円形金属パッド20、およびはんだバンプ17が形成されている。 The end face of the optical waveguide element 10 an optical waveguide 12 is formed on the surface of the substrate 11, a circular metal pads 20 and the solder bumps 17, the tens to hundreds of μm order diameter is formed. パッド20の金属材料は、用いるはんだバンプ17の材料により異なるが、PbsnはんだであればC Metallic material of the pad 20 may vary depending on the material of the solder bumps 17 used, C if Pbsn solder
r−Ni、AuSnはんだならばCr−Auでよい。 r-Ni, may be if the AuSn solder Cr-Au. はんだバンプの高さは数十〜数百μm程度がよい。 The height of the solder bump good is several tens to several hundreds of μm about. 光ファイバ14が配列された光ファイバ端末13の端面にも光導波路素子と同様の円形金属パッド21が形成されている。 Circular metal pad 21 similar to the optical waveguide element to the end face of the optical fiber terminal 13 the optical fiber 14 are arranged is formed. 光ファイバ14の円形金属パッド21との位置関係は、光導波路12と金属パッド20との位置関係に一致するようになっている。 Positional relationship between the circular metal pad 21 of the optical fiber 14 is adapted to match the positional relationship between the optical waveguide 12 and the metal pad 20.

【0010】図2は図1による光導波路素子と光ファイバ端末とをはんだバンプを介して端面結合する時の工程図である。 [0010] FIG. 2 is a process view when coupled to the end surface via a solder bump and an optical waveguide device and the optical fiber terminal according to FIG. 先ず、図2(a)から図2(b)に示すように、光導波路素子10に光ファイバ端末13を仮接続する。 First, as shown in FIG. 2 (b) from FIG. 2 (a), temporarily connected to the optical fiber terminal 13 into the optical waveguide element 10. このときの位置合わせは、光ファイバ端末13端面の金属パッド21の一部がはんだバンプ17に接触する程度でよいので、従来要求されていた高精度の位置合わせは不要となる。 Positioning at this time, since a good degree of contact with the optical fiber terminal 13 end surface of the bump 17 which partially solder metal pads 21, the high precision alignment which is conventionally required becomes unnecessary. 次に、バンプ17を溶融させると、図2(c),(d)に示すように溶融はんだ19の表面張力によるセルファライメント効果で、光導波路12と光ファイバ14との高精度位置合わせが自動的に行われ、 Automatic Next, to melt the bump 17, FIG. 2 (c), the at self-alignment effect due to surface tension of the molten solder 19 (d), the high precision alignment between the optical waveguide 12 and the optical fiber 14 is effected,
同時に固定することができる。 It can be fixed at the same time.

【0011】なお、はんだバンプ17を光ファイバ端末13に設けられた金属パッド21に形成した場合にも同様な効果が期待できる。 [0011] Incidentally, it is possible to anticipate the same effect even when in the metal pad 21 provided with solder bumps 17 to the optical fiber terminal 13.

【0012】 [0012]

【発明の効果】以上説明したように本発明は、光導波路素子および光ファイバ端末のそれぞれの端面に設けられた接続用の金属パッドとが円形であるので、接続の際、 The present invention described above, according to the present invention, since the metal pads for connection provided on each end face of the optical waveguide element and the optical fiber terminal is circular, when connecting,
光導波路と光ファイバとの光軸位置合わせを高精度に保ち接続でき、同時に接続の生産性、信頼性も向上するという効果がある。 The optical axis alignment between the optical waveguide and the optical fiber held can be connected with high precision, at the same time connecting the productivity, there is an effect that reliability can be improved.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の一実施例における接続前の光導波路素子および光ファイバ端末の斜視図である。 1 is a perspective view of an optical waveguide element and the optical fiber terminal before connection in an embodiment of the present invention.

【図2】図1の接続工程を示す工程図である。 2 is a process diagram showing the connection process of FIG.

【図3】(a)は従来例の構造を示す斜視図、(b)は他の従来例の構造を示す斜視図である。 3 (a) is a perspective view showing a structure of a conventional example, is a perspective view showing the (b) is another conventional structure.

【符号の説明】 DESCRIPTION OF SYMBOLS

10 光導波路素子 11 基板 12 光導波路 13 光ファイバ端末 14 光ファイバ 15 接着剤 16,18 金属パッド 17 はんだバンプ 19 溶融はんだ 20,21 円形金属パッド 10 optical waveguide device 11 substrate 12 optical waveguide 13 optical fiber terminal 14 the optical fiber 15 adhesive 16, 18 metal pad 17 solder bumps 19 melt solder 20, 21 circular metal pads

Claims (1)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 光導波路素子に形成された複数本の光導波路の端面と保持ブロックにより配列された複数本の光ファイバの端面とがそれぞれ完全に端面結合するようにした前記光導波路素子と前記保持ブロックとの接続構造において、前記光導波路素子と前記保持ブロックの接続端面にそれぞれ対をなす複数組の円形の金属バットを備えこの金属パッド間をはんだバンプを用いて接合することを特徴とする光導波路素子と光ファイバとの接続構造。 [Claim 1 wherein said end surface of the plurality of optical fibers arranged by the end face and the holding block of the plurality of optical waveguides formed in the optical waveguide element and the said optical waveguide element so as to completely end face coupled respectively in the connection structure of the holding block, characterized by bonding with a plurality of sets of circular with a metal butt solder bumps between the metal pad forming each pair connection end face of the retaining block and the optical waveguide device connecting structure between the optical waveguide device and the optical fiber.
JP9129892A 1992-04-13 1992-04-13 Connecting structure between optical waveguide element and optical fiber Withdrawn JPH05303023A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9129892A JPH05303023A (en) 1992-04-13 1992-04-13 Connecting structure between optical waveguide element and optical fiber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9129892A JPH05303023A (en) 1992-04-13 1992-04-13 Connecting structure between optical waveguide element and optical fiber

Publications (1)

Publication Number Publication Date
JPH05303023A true JPH05303023A (en) 1993-11-16

Family

ID=14022568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9129892A Withdrawn JPH05303023A (en) 1992-04-13 1992-04-13 Connecting structure between optical waveguide element and optical fiber

Country Status (1)

Country Link
JP (1) JPH05303023A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07168059A (en) * 1993-12-14 1995-07-04 Nec Corp Coupling method of arrayed optical elements
EP0726477A2 (en) * 1995-02-09 1996-08-14 AT&T IPM Corp. An arrangement for interconnecting an optical fiber to an optical component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07168059A (en) * 1993-12-14 1995-07-04 Nec Corp Coupling method of arrayed optical elements
EP0726477A2 (en) * 1995-02-09 1996-08-14 AT&T IPM Corp. An arrangement for interconnecting an optical fiber to an optical component
EP0726477A3 (en) * 1995-02-09 1997-07-30 At & T Corp An arrangement for interconnecting an optical fiber to an optical component

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