JPH05302821A - Printed circuit board inspection device - Google Patents

Printed circuit board inspection device

Info

Publication number
JPH05302821A
JPH05302821A JP3074088A JP7408891A JPH05302821A JP H05302821 A JPH05302821 A JP H05302821A JP 3074088 A JP3074088 A JP 3074088A JP 7408891 A JP7408891 A JP 7408891A JP H05302821 A JPH05302821 A JP H05302821A
Authority
JP
Japan
Prior art keywords
image
inspection
printed circuit
circuit board
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3074088A
Other languages
Japanese (ja)
Inventor
Hisao Yamasato
久雄 山里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ezel Inc
Sharp Corp
Original Assignee
Ezel Inc
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ezel Inc, Sharp Corp filed Critical Ezel Inc
Priority to JP3074088A priority Critical patent/JPH05302821A/en
Publication of JPH05302821A publication Critical patent/JPH05302821A/en
Pending legal-status Critical Current

Links

Landscapes

  • Closed-Circuit Television Systems (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

PURPOSE:To enable saving man power for inspection of printed circuit board, improving inspection accuracy and making repair work easy. CONSTITUTION:Provided are a first memory 205 registering the image of a printed circuit board properly loaded with parts as standard board, an input device 1 for taking in the image of the printed board to be an inspection object, a preprocessor circuit 203 for preprocessing the image taken in the input device 1, a second memory 204 for reserving the image processed with the preprocessor circuit 203, a comparison circuit 202 for comparing the images in the first and the second memories 205 and 204 to judge the coincidence of the two, and a display 4 for indicating the inspection result based on the output of the comparison circuit 202.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、プリント基板の検査
装置に係り、特にプリント基板のパーツ装着状況を検査
するための検査装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board inspection apparatus, and more particularly to an inspection apparatus for inspecting the mounting condition of parts on a printed circuit board.

【0002】[0002]

【従来技術】従来、プリント基板のパーツ装着状態の検
査は、目視検査あるいは電気的な検査によって行ってい
た。前者においては作業者の養成、確保が容易でなく、
また検査精度の安定性、速度に欠けるという問題があっ
た。また後者においては、半製品状態で検査を行うため
には、治具、検査プログラムの作成等の作業が必要であ
り、製品に近い状態での検査は、不良品の補修作業のコ
ストが大となる。
2. Description of the Related Art Conventionally, the inspection of the mounting state of parts on a printed circuit board has been conducted by visual inspection or electrical inspection. In the former, it is not easy to train and secure workers,
Further, there is a problem that the inspection accuracy is not stable and the speed is insufficient. In the latter case, in order to inspect in a semi-finished product state, it is necessary to create jigs, inspection programs, etc., and inspection in a state close to the product is costly for repairing defective products. Become.

【0003】[0003]

【発明が解決しようとする課題】この発明はこのような
従来の問題点を解消すべく創案されたもので、省力化、
検査制度の向上、および補修作業の容易化を可能にす
る、プリント基板の検査装置を提供することを目的とす
る。
The present invention was devised to solve the above-mentioned problems of the prior art.
An object of the present invention is to provide an inspection device for a printed circuit board, which can improve an inspection system and facilitate repair work.

【0004】[0004]

【課題を解決する手段】この発明に係るプリント基板の
検査装置は、適性にパーツ装着が行われた基板と、被検
査基板とを画像として比較し、両者の一致度に基づいて
被検査基板の良否を判定するものである。この発明に係
る検査装置によれば、目視検査や電気的な検査は一切不
要となる。
A printed circuit board inspection apparatus according to the present invention compares a board on which parts are properly mounted with a board to be inspected as an image, and determines the board to be inspected based on the degree of coincidence between the boards. The quality is determined. According to the inspection device of the present invention, no visual inspection or electrical inspection is required.

【0005】[0005]

【実施例】次に、この発明に係る検査装置の1実施例を
図1及び図2に基づいて説明する。図1において、検査
装置は入力系であるビデオカメラ1、画像処理部2、端
末装置3及び出力系である表示装置4から構成されてい
る。画像処理部2は、さらに制御回路201、中央処理
装置202、前処理回路203、メモリ204、基準値
メモリ205及びインターフェイス206から成る
DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, one embodiment of the inspection device according to the present invention will be described with reference to FIGS. In FIG. 1, the inspection device is composed of a video camera 1 which is an input system, an image processing section 2, a terminal device 3, and a display device 4 which is an output system. The image processing unit 2 further includes a control circuit 201, a central processing unit 202, a preprocessing circuit 203, a memory 204, a reference value memory 205, and an interface 206.

【0006】まず、ステップ101で、明瞭な複数のマ
ーキングが施されたプリント基板の画像がカメラ1を通
じて取り込まれる。次に、ステップ102で、この画像
に対して前処理回路203において微分処理等がなされ
エッジが抽出される。これにより、マーキングの抽出が
確実になされる。ステップ103では、中央処理装置2
02において、抽出されたマーキングが適正位置に取り
込まれているか否かを判断する。
First, in step 101, an image of a printed circuit board having a plurality of clear markings is captured by the camera 1. Next, in step 102, the preprocessing circuit 203 performs differentiation processing on this image to extract edges. This ensures that the marking is extracted. In step 103, the central processing unit 2
In 02, it is judged whether or not the extracted marking has been taken into the proper position.

【0007】そして、ステップ104では、マーキング
が適正位置と判断された画像に対して、前処理回路20
3においてノイズ除去を行う。これにより、検査を行う
に適切なプリント基板の画像を得ることが可能となる。
そして、ステップ105では、前処理回路203と接続
しているメモリ204にノイズ処理結果を格納する。
Then, in step 104, the preprocessing circuit 20 is applied to the image for which the marking is judged to be the proper position.
Noise removal is performed in 3. This makes it possible to obtain an image of the printed circuit board that is suitable for the inspection.
Then, in step 105, the noise processing result is stored in the memory 204 connected to the preprocessing circuit 203.

【0008】逆に、マーキングが不適正位置と判断され
た画像については、カメラ1の絞りや撮影アングルを制
御回路201を通じて修正し、適正なマーキング位置が
得られるように撮影条件を設定する。この場合、カメラ
1が正しい位置に設定されるまで、ステップ101から
スッテプ103の処理が繰り返されことになる。あるい
は、そのままの画像を一旦メモリ204に格納し、その
後、マーキングの位置をメモリ204上で修正してもよ
い。
On the contrary, with respect to the image in which the marking is judged to be an inappropriate position, the diaphragm and the photographing angle of the camera 1 are corrected through the control circuit 201, and the photographing condition is set so that the proper marking position can be obtained. In this case, the processing from step 101 to step 103 is repeated until the camera 1 is set at the correct position. Alternatively, the image as it is may be temporarily stored in the memory 204 and then the position of the marking may be corrected on the memory 204.

【0009】ステップ101からステップ105の処理
は、まず、適正にパーツ装着が行われたプリント基板に
ついて行われ、その結果は予め基準値メモリ205に格
納されている。
The processing from step 101 to step 105 is first performed on the printed circuit board on which the parts are properly mounted, and the result is stored in the reference value memory 205 in advance.

【0010】ステップ106において、既に基準値メモ
リ205に格納されている基準プリント基板の画像と被
検査プリント基板の画像とを中央処理装置202で比較
し、その一致度を算出する。即ち、中央処理装置は比較
回路としての機能を有する。
In step 106, the central processing unit 202 compares the image of the reference printed circuit board and the image of the printed circuit board to be inspected, which are already stored in the reference value memory 205, and the degree of coincidence is calculated. That is, the central processing unit has a function as a comparison circuit.

【0011】ここに一致度としては以下のようなパラメ
ータを採用し得る。 1.2値画像において、同一濃度を有する対応画素の個
数と全画素数の比率。 2.多値画像において濃度差が一定値以下の対応画素の
個数と全画素数の比率。 または、正規化したヒストグラムにおいて、分散の比較
を行ってもよい。
Here, the following parameters can be adopted as the degree of coincidence. The ratio between the number of corresponding pixels having the same density and the total number of pixels in a 1.2-value image. 2. The ratio of the number of corresponding pixels whose density difference is less than a certain value and the total number of pixels in a multi-value image. Alternatively, the variances may be compared in a normalized histogram.

【0012】上記の正規化とは、基準値メモリ205に
登録された画像と被検査画像の画素数の最大値および高
度範囲が等しくなるようにヒストグラムを修正する操作
をいう。
The above normalization is an operation of correcting the histogram so that the maximum value of the number of pixels and the altitude range of the image registered in the reference value memory 205 and the image to be inspected become equal.

【0013】画像処理部2で行われる処理は、コンピュ
ータ等の端末装置3から指示を受け、ステップ106で
算出した結果をインターフェイス206を介して表示部
4に出力し、ステップ107で、一致度等に基づき被検
査プリント基板の良否を判断する。このように画像デー
タの処理によるパーツ装着の適否判定を行えば、高速の
検査が可能であり、省力化も実現し得る。
The processing performed by the image processing unit 2 receives an instruction from the terminal device 3 such as a computer, and outputs the result calculated in step 106 to the display unit 4 via the interface 206. The quality of the printed circuit board to be inspected is determined based on. By thus determining the suitability of mounting parts by processing image data, high-speed inspection is possible and labor saving can be realized.

【0014】[0014]

【発明の効果】以上のように本発明によれば、プリント
基板の良否検査において、省力化、検査精度の向上、お
よび補修作業を容易化し得る装置を提供するという効果
を得られる。
As described above, according to the present invention, it is possible to provide an apparatus capable of saving labor, improving inspection accuracy, and facilitating repair work in a quality inspection of a printed circuit board.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の構成を示すブロック図である。FIG. 1 is a block diagram showing a configuration of the present invention.

【図2】本発明の実施例を説明するフローチャートであ
る。
FIG. 2 is a flowchart illustrating an example of the present invention.

【符号の説明】 1 カメラ 4 表示装置 202 中央処理装置 203 前処理回路 204 メモリ 205 基準値メモリ[Description of Reference Signs] 1 camera 4 display device 202 central processing unit 203 preprocessing circuit 204 memory 205 reference value memory

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】適正にパーツが装着されたプリント基板の
画像を基準基板として登録する第1のメモリと、検査対象
となるプリント基板の画像を取込む入力装置と、この入
力装置で取込まれた画像を前処理する前処理回路と、こ
の前処理回路で処理された画像を保持する第2のメモリ
と、第1、第2のメモリの画像を比較し両者の一致度を
求める比較回路と、この比較回路の出力に基づいて検査
結果を表示する表示装置とを備えているプリント基板の
検査装置。
1. A first memory for registering an image of a printed board on which parts are properly mounted as a reference board, an input device for taking in an image of a printed board to be inspected, and an input device for taking in the image. A pre-processing circuit that pre-processes the image, a second memory that holds the image processed by the pre-processing circuit, and a comparison circuit that compares the images in the first and second memories and obtains the degree of coincidence between them. And a display device for displaying the inspection result based on the output of the comparison circuit.
JP3074088A 1991-03-13 1991-03-13 Printed circuit board inspection device Pending JPH05302821A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3074088A JPH05302821A (en) 1991-03-13 1991-03-13 Printed circuit board inspection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3074088A JPH05302821A (en) 1991-03-13 1991-03-13 Printed circuit board inspection device

Publications (1)

Publication Number Publication Date
JPH05302821A true JPH05302821A (en) 1993-11-16

Family

ID=13537078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3074088A Pending JPH05302821A (en) 1991-03-13 1991-03-13 Printed circuit board inspection device

Country Status (1)

Country Link
JP (1) JPH05302821A (en)

Similar Documents

Publication Publication Date Title
US11189019B2 (en) Method for detecting defects, electronic device, and computer readable medium
CN113077416A (en) Welding spot welding defect detection method and system based on image processing
CN112802017B (en) Method and device for detecting product external qualification based on workbench
KR20220026439A (en) Apparatus and method for checking whether a part is inserted in PCB
JPH05302821A (en) Printed circuit board inspection device
JP3179874B2 (en) Teaching method and teaching device for image inspection device
KR100286041B1 (en) Method and device for setting teaching data of automatic PCB inspection device
JP2501076B2 (en) Fastener-Automatic inspection method and inspection device
TWI748184B (en) Defect detecting method, electronic device, and computer readable storage medium
CN112967224A (en) Electronic circuit board detection system, method and medium based on artificial intelligence
KR100227421B1 (en) Insert inspection device and method of printed board
JP3771329B2 (en) Electronic component mounting direction inspection method
JPH04357444A (en) Apparatus for inspecting printed circuit board
JPH0310107A (en) Inspecting method utilizing gradation pattern matching
JPH04367079A (en) Inspecting device for printed wiring board
JP3557814B2 (en) Image inspection apparatus and method
JPS62298750A (en) Inspecting device for printed circuit board
JPH038400A (en) Positional correction of printed substrate
JPH04161841A (en) Optical printed board inspecting apparatus
KR100249808B1 (en) Ic leadframe lead spacing automatic visual inspection system
CN114428082A (en) Electronic component image capturing method and capacitor polarity determination method using same
KR19990087848A (en) Inspection Region Preparing Method and Visual Inspection Method
CN115825102A (en) Automatic detection method and system for extension socket connection
CN116256313A (en) Distributed PCB defect intelligent detection system based on machine vision
JPH10143673A (en) Picture processor

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees